JP2005030966A - Inspection data setting method, and inspection method and device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection data setting method capable of setting an image processing parameter dispensing with the input of positional coordinate data, in a process for preparing inspection data, and an inspection device using it, and to provide an inspection data setting method for generating an image allowing a trial for defect detecting processing when setting the inspection data, in order to provide resolution the same as that in execution of inspection, and an inspection method and device using it. <P>SOLUTION: In this inspection device for conducting the inspection based on the preset inspection data, in the inspection device provided with an image pick-up part for imaging one part of a sample, and for image-processing an image of the imaged sample to inspect the sample, the sample is read in with images divided an imaging visual field by an imaging visual field, the divided images are joined together to generate one sheet of image, the generated one sheet of image is displayed, and at least one of the inspection data is set based on the displayed image. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus, and more particularly, to an inspection data setting method for inspecting an inspection object divided into a plurality of fields of view, and an inspection method and apparatus using the inspection data setting method.

In inspection apparatuses such as defect inspection apparatuses, appearance inspection apparatuses, dimension inspection apparatuses, line width measurement apparatuses, and image quality inspection apparatuses, conventionally, as inspection (measurement) data, an inspection area of an object to be inspected (hereinafter referred to as an inspection area). Image processing parameters are set for each imaging field of view. That is, the inspection data is data including the corresponding position coordinates and area coordinates for each inspection area of the object to be inspected, and image processing parameters for each inspection area (see, for example, Patent Document 1).
And since it is required when creating processing data, mounting data, etc. to be inspected, the operator actually does not know unless the information of the position and coordinates of the imaging field of view is already known. It is necessary to register the position and coordinates (hereinafter referred to as position coordinates) while confirming the actual sample to be inspected by moving to the imaging position using the operating device. The case where the imaging field of view is already known is, for example, a case where the object to be inspected is a component mounting board, and a component mounted on the component mounting board is inspected for defects. In this case, there is component mounting data for mounting the component on the component mounting board, and the position coordinates of the inspection area of the component can be known by referring to the data.

However, when there is no data for determining such position coordinates in advance, it is necessary to set an image processing parameter for each inspection area of the inspection object. For example, even if the above-mentioned component mounting board is the object to be inspected, in the case of inspection for the purpose of foreign object inspection or scratch inspection, wiring patterns or electrodes formed on or inside the component mounting board, the object to be inspected In many cases, a place (inspection area) where an object is to be inspected exists regardless of the component mounting position, and it is necessary to set an image processing parameter for each inspection area.
Furthermore, inspection devices such as defect inspection devices, appearance inspection devices, dimension inspection devices, line width measurement devices, and image quality inspection devices usually detect the size and displacement of micro-defects and micro-processed patterns. (For example, refer to Patent Document 2 and Patent Document 3). For this reason, an inspection area (that is, a place to be inspected) is enlarged, and the enlarged image is used for inspection. Therefore, one inspection area may be divided into images of a plurality of imaging fields. Thus, since one inspection area is divided into a plurality of imaging fields, setting work of inspection data corresponding to each inspection area is complicated. The image of the imaging field is the maximum image having the resolution (resolution) necessary for image processing when an enlarged image is acquired. The imaging visual field is a region to be inspected acquired by the visual field image.

JP 2002-257517A (Page 2, Page 4-5, FIGS. 3 and 5) JP-A-8-181974 Japanese Patent Application No. 2002-376020

The prior art described above has a drawback in that when there is no data for knowing the position coordinates, the image processing parameters must be set after inputting the position coordinate data for each inspection area of the inspection object. Furthermore, since one inspection area is divided into a plurality of areas (field-of-view areas), there is a disadvantage that the work of setting inspection data becomes complicated.
An object of the present invention is to eliminate the above-described drawbacks and in the process of creating inspection data, an inspection data setting method capable of setting image processing parameters without requiring input of position coordinate data, and inspection using the method To provide an apparatus.
Furthermore, in order to have the same resolution (resolution) as that at the time of inspection execution, an inspection data setting method for generating an image capable of trial of defect detection processing at the time of inspection data setting and an inspection apparatus using the method are provided. There is.

In order to achieve the above object, an inspection data setting method of the present invention includes an imaging unit that images a part of a sample, and an inspection apparatus that performs image processing of the captured image of the sample and inspects the sample. In an inspection apparatus that performs inspection based on preset inspection data, the sample is captured as an image divided for each imaging field of view, and the divided images are joined to generate a single image. One image is displayed, and at least one of the inspection data is set based on the displayed image.
Further, the inspection method of the present invention images a part of a sample, performs image processing on the image of the imaged image, and displays at least one of the image-processed data and the imaged image of the sample. In the inspection method for performing inspection based on preset inspection data, the inspection apparatus is operated based on the image displayed on the display unit, and the inspection data is created or changed in accordance with an operator instruction To do.
In order to achieve the above object, an inspection apparatus according to the present invention includes at least an imaging unit that images a part of a sample, and an image processing unit that performs image processing on the captured image of the sample and uses the result as data. And a display unit that displays at least one of data output from the image processing unit or the captured image of the sample, and an inspection apparatus that performs inspection based on preset inspection data And operating means for operating the inspection apparatus based on the image displayed on the display unit, and the operating means creates or changes the inspection data in accordance with an instruction from the operator.
Further, in order to achieve the above object, the operation means of the inspection apparatus of the present invention takes the sample as an image divided for each imaging field of view and joins the divided images to generate one image, The generated image is displayed, and at least one of the inspection data is set based on the displayed image.

According to the present invention, when setting the inspection area, even if the inspection area extends over the imaging field of view, the operator can perform this setting without being aware of the imaging field of view and stage coordinates.
In addition, since it is not necessary to be aware of the imaging field of view, it is possible to collectively set inspection data that has been set for each field of view.
Furthermore, since the enlarged image is acquired, it can be executed even when the entire image cannot be captured at once.

An embodiment of an inspection data setting method and an inspection method and apparatus using the inspection data setting method of the present invention is an inspection apparatus such as a defect inspection apparatus, an appearance inspection apparatus, a dimension inspection apparatus, a line width measurement apparatus, and an image quality inspection apparatus. An inspection apparatus includes an imaging unit capable of enlarging and photographing at least a part of a sample that is an object to be inspected, and a manipulator (operation means) for changing position coordinates of the sample to be imaged. This inspection apparatus has, for example, a function of performing image processing on a captured image, and a function of operating a manipulator by a software program. By combining these functions, a predetermined region of a sample is obtained. It is possible to detect an image obtained by imaging the (inspection area) and detect a defect.
In the inspection data setting method of the present invention, for example, in the process of creating inspection data for performing an inspection, an image of the entire sample (entire imaging visual field image) is divided and captured for each imaging visual field, and the images are joined together. A high-resolution image.
In order to perform inspection data creation operations such as setting of an inspection area and setting of image processing parameters for this generated image (hereinafter referred to as a generated image), without newly inputting the position coordinates of the inspection area, The inspection area can be set or changed. That is, the operator does not need to be aware of the position coordinates and size of the imaging field of view. Further, since the generated image has the same resolution as that at the time of executing the inspection, it is possible to try the defect detection process at the time of data setting.
In addition, the inspection apparatus of the present invention automatically calculates an imaging field including the inspection area at the time of re-acquisition of an image of the inspection area to be inspected and execution of an inspection, for example, and only an imaging field to be inspected is obtained. Take in defects. Further, a stitched image of a plurality of captured image fields is generated and displayed.

In the inspection data setting method of the present invention, for example, the entire sample is imaged by dividing it into a plurality of predetermined imaging fields of view, and the captured images are arranged and joined together by an image processing technique to generate one image. . That is, the generated image (generated image) is divided into an area (imaging field of view) with a resolution suitable for the detection accuracy, and the captured images are joined to form a single image. . The resolution of the generated image has the same resolution as that of each of the divided images. Therefore, it is possible to set image processing parameters and teach with this generated image, and work can be performed without being aware of the imaging field of view size.
The inspection range (inspection area) is set for the generated image. At this time, the operator can operate without being aware of the size and division of the inspection visual field.
Further, if the inspection is performed with an enlarged image, the enlarged images that are divided and imaged according to the imaging field size are connected to form a generated image. Therefore, the resolution of the generated image is the same as the resolution of each enlarged image.

  FIG. 4 is a diagram for explaining a schematic structure of a power amplifier as the sample 5, and is a diagram for explaining an example of the sample. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along the broken line g-g ′ in FIG. 51 is a power amplifier, 52 is a metal heat sink such as oxygen-free copper, 53 is a wiring board, 50-1 to 50-5 are semiconductor chips, 50-1 and 50-2 are FET (Field Effect Transistor) chips, 50 -3 is a diode (Di) chip, and 54 is solder for bonding the semiconductor chips 50-1 to 50-3 and a metal heat sink. The wiring pattern, wiring material, and other mounting parts of the wiring board 53 are omitted.

  As shown in FIG. 4, the semiconductor chips 50-1 to 50-3 are bonded (die-bonded) to the metal heat sink 52 by solder 54. In this bonding, the absence of bubbles in the solder 54 greatly affects the quality of the power amplifier 51, such as the electrical characteristics, heat dissipation, and reliability. Therefore, it is necessary to inspect closely at the manufacturing stage.

  An embodiment of the inspection apparatus of the present invention will be described with reference to FIG. FIG. 1 is a block diagram showing the configuration of an X-ray inspection apparatus for detecting voids (bubbles) in a die bond portion of a semiconductor chip, which is an embodiment of the inspection apparatus of the present invention.

1 is the X-ray generator, and 11 is the tip of the X-ray generator 1. The X-ray generator 1 is, for example, an X-ray tube. 2 is an X-ray camera, 2-1 is an X-ray image intensifier (X-ray fluorescence intensifier tube, hereinafter referred to as X-ray II tube) of X-ray camera 2, and 2-2 is an X-ray camera. 2 CCD camera, 12 is the input phosphor screen of X-ray II tube section 2-1. 3 is a sample table, 3-1 is an X-axis sample stage, and 3-2 is a Y-axis sample stage. 4 is a Z-axis moving mechanism that moves the X-ray camera 2 up and down to change the magnification of the captured image. 5 is a sample and 6 is an X-ray protective cabin, which is a cover to prevent X-ray leakage. The X-ray protective cabin 6 also serves as a chamber for reducing the pressure to near vacuum.
7 is a control personal computer (hereinafter referred to as a control PC), 8 is a display for the control PC 7, 9 is a stage control device, and 10 is an X-ray control device.

  The X-ray generator 1 emits X-rays radially from the tip 11. The components necessary for the operation of the X-ray generator 1 such as a high-voltage power supply unit and a vacuum pump system are not described in the description of the present invention and are omitted. Similarly, description of the mechanism for exchanging the sample 5 is omitted.

X-rays irradiated from the tip 11 of the X-ray generator 1 pass through the sample table 3 and the sample 5 fixed on the sample table 3 while spreading radially, and the transmitted X-rays are converted into X-ray II. It reaches the input phosphor screen 12 of the tube part 2-1.
X-ray II tube part 2-1 converts the incident X-rays into light with a luminance difference corresponding to the difference in X-ray intensity (visible light) and outputs it to CCD camera 2-2. CCD camera 2-2 converts the incident light into a video signal and outputs it. In this way, the X-ray camera 2 captures and outputs an X-ray image transmitted through the inspection object.
In the embodiment shown in FIG. 1, an X-ray image intensifier is used to convert X-rays into visible light. However, any device that converts X-rays into visible light, such as a scintillator, may be used. Is clear.

  Sample table 3 is placed on X-axis sample stage 3-1 and Y-axis sample stage 3-2 that move in the X-axis direction and Y-axis direction on the coordinate plane consisting of X-axis and Y-axis, respectively. Moves the sample 5 on the sample table 3 and changes the observation position of the sample 5 based on the control from the stage controller 9. Since the stage controller 9 moves the sample table to a predetermined position coordinate in conjunction with the X-axis sample stage 3-1 and the Y-axis sample stage 3-2, the X-axis sample stage 3-1 and the Y-axis are hereinafter referred to. Sample stage 3-2 is generically called the sample stage. The stage controller 9 also controls the Z-axis moving mechanism 4 to move the X-ray camera 2 (CCD camera 2-2 and X-ray II tube section 2-1) in the Z-axis direction so that the input phosphor screen 12 is moved. Move up and down in the Z-axis direction.

  An example of changing the imaging magnification will be further described with reference to FIG. FIG. 3 is an enlarged view of the input phosphor screen 12 and the sample 5 of the X-ray II tube portion 2-1 of FIG. 1 and the tip portion 11 of the X-ray generator 1. In FIG. 3, the sample table 3 and the sample stage of FIG. 1 are omitted.

1 and 3, the stage controller 9 controls the Z-axis moving mechanism 4 to move the X-ray camera 2 (CCD camera 2-2 and X-ray II tube section 2-1) in the Z-axis direction. Change the distance B between sample 5 and input phosphor screen 12, and change the imaging magnification of sample 5 as appropriate. At this time, the distance A between the tip 11 of the X-ray generator 1 and the observation sample surface 14 is fixed.
That is, the geometric enlargement ratio GM can be calculated by the equation (1). In Equation (1), Φ is the size diameter of the input phosphor screen 12 of the X-ray II tube portion 2-1, for example, Φ = 100 mm. 3B is a schematic view of the input phosphor screen 12 of FIG. 3A as viewed from the X-ray generator 1 side. The square represents the screen on which the X-ray of the CCD camera 2-2 is input, and the pixel size is a size corresponding to the horizontal Wx and the height Wy (for example, 640 pixels wide and 480 pixels high). The size diameter Φ of the input phosphor screen 12 is the diagonal length of this square.

Sx is the horizontal width of the imaging field of view of the sample observation surface 14, and Sy is the height of the imaging field. This imaging field of view is an area (area) in a quadrangle formed by a straight line 13 connecting the tip 11 of the X-ray generator 1 and the outer edge of the input phosphor screen 12 intersecting the observation sample surface 14.

従って、距離 B を Z 軸移動機構を用いて変更することによって、X 線発生装置 1 の先端部 11 から試料 5 までの距離 A 、及び、試料 5 から入力蛍光面 12 までの距離 B との相対的な値が変更され、これによって撮像倍率を変更することができる。 In addition, the geometric magnification factor GM is determined by the distance A between the tip 11 of the X-ray generator 1 and the observation sample surface 14 and the tip 11 of the X-ray generator 1 and the input phosphor screen as shown in Equation (2). It can be expressed by the ratio of the distance (A + B) to 12.

Therefore, by changing the distance B using the Z-axis moving mechanism, the distance A from the tip 11 of the X-ray generator 1 to the sample 5 and the distance B from the sample 5 to the input phosphor screen 12 are relative to each other. As a result, the imaging magnification can be changed.

A = FOD + t ‥‥‥式(3) The distance A is expressed by the following equation (3), where the minimum distance from the tip 11 to the sample 5 is FOD (Focus Object Distance), and the distance from the minimum distance FOD to the actual observation sample surface 14 is t. Can be represented.

A = FOD + t (3)

従って、幾何学拡大率 GM は、式(5)と表すことができる。

The distance B is expressed by the following equation (4) when the minimum distance between the minimum tip 11 and the input phosphor screen 12 is FFD (Focus Film Distance), and the minimum distance FFD and the actual input phosphor screen 12 distance is Zp. Can be represented.

Therefore, the geometric enlargement ratio GM can be expressed as Equation (5).

  In the embodiment of FIGS. 1 and 3, the distance A is fixed and the magnification B is controlled by changing the distance B. However, the distance A may be changed, or both the distance A and the distance B may be controlled. May be changed.

The control PC 7 inputs the video signal output from the X-ray camera 2 based on the inspection data set in advance, controls the sample stage, controls the Z-axis moving mechanism 4, and performs image processing (for example, image quality improvement). Defect selection, determination, image storage, etc.), X-ray generator 1 control, and operation panel functions. In addition, the control PC 7 has a storage unit for storing various data such as inspection data inside, but is provided with an external storage device separately, and at least one of necessary data (may include image data). It is also possible to save the unit in an external storage device.
Further, the control PC 7 changes inspection data set in advance in addition to newly setting inspection data by a method described later.

  The display for display 8 is a display for the control PC 7 and uses GUI operation with the control PC 7 or input means (pointing devices such as a keyboard and mouse) when setting or changing inspection data. If necessary, display dialogues with operators, captured X-ray transmission images, inspection data, etc.

In the embodiment shown in FIG. 1, the control PC 7 is used, and GUI operation between the control PC 7 and the operator, for example, dialogue with the operator using input means (keyboard, mouse or other pointing device) is used. As described in the operation in the form, the present invention may use an operating device (operation panel) dedicated to personal computer control such as a jog controller.
In the description of FIG. 1, the control PC 7 is used. However, it is obvious that the present invention can be realized by using a dedicated operation control means such as a sequencer, CPU, MPU or the like.

An embodiment of the inspection data setting method of the present invention will be described with reference to FIG. The inspection data setting method in FIG. 2 can be executed using, for example, the inspection apparatus described in FIG. Accordingly, the embodiment of FIG. 2 will be described with reference to the inspection apparatus of FIG. FIG. 2 is a flowchart showing an example of processing operation of an embodiment of the inspection data setting method of the present invention.
In the sample data name input step 201, when the type (identification number) of the sample to be inspected is input by the operator, the control PC 7 recognizes the input type.
In the type discrimination step 202, it is discriminated whether or not past data corresponding to the inputted sample type exists. If the past data exists, the process proceeds to the sample data reading step 206. If the past data does not exist, the process proceeds to the new sample data input step 203.

In the sample data reading step 206, data corresponding to the type of the sample is selected from the already registered data and read as inspection data, and the process proceeds to the imaging position moving / image capturing step 207. The inspection data includes, for example, a sample size, a minimum detection defect size, an acquisition reference position (coordinate offset), an imaging field size, an imaging field number, an imaging position coordinate, and the like.
The sample size Ws is the horizontal size H, the vertical size V, and the thickness T of the power amplifier 51 in FIG. The imaging field size is the horizontal width Sx and height Sy of the imaging field in FIG. 3B, and is determined by the minimum detected defect size Dmin and the image size (number of pixels Wx, Wy) of the CCD camera 2-2 (described later).

In the new sample data input step 203, the sample size, the minimum defect detection size Dmin, and the capture reference position (coordinate offset) are input, and the process proceeds to the image field size / number calculation step 204.
Next, in the image visual field size / number calculation step 204, the imaging visual field sizes Sx and Sy are obtained from the minimum detected defect size Dmin by Expression (6). Where Sx is the horizontal size, Sy is the height size, Ds is the resolution of the inspection device, Wx is the maximum horizontal size of CCD camera 2-2, and Wy is the height direction of CCD camera 2-2 Is the maximum size.

  With reference to FIG. 5, a method of calculating the imaging visual field size will be described. The imaging field size is determined by the minimum detected defect size Dmin and the image size (number of pixels Wx, Wy) of the CCD camera 2-2. FIG. 5 is a diagram for explaining the relationship between the minimum defect and the pixel size when the detected minimum defect size Dmin is 5 μm and the resolution Ds is 10. FIG.

If the resolution Ds required when inspecting the inspection target is 10, the minimum defect size (diameter 5 μm) divided by 10 is 0.5 μm, which is the minimum visual field size. Therefore, the size corresponding to the number of pixels when 0.5 μm per pixel is the imaging field size. That is, when the image size is 640 pixels wide and 480 pixels high, the imaging field size is 640 × 0.5 = 320 μm wide and 480 × 0.5 = 240 μm high. That is, each of the grids in FIG. 5 has a pixel size of one pixel. For example, the image size of the CCD camera 2-2 (or the size of the input phosphor screen 12) is 640 × 480 pixels (Wx × Wy = 640 × 480), the image is captured with the number of pixels having 640 grid sizes in the horizontal direction and 480 grid sizes in the height direction.

これらより、試料 5 全体（全撮像視野、即ち試料全体）を一定の撮像視野サイズ Sx ，Sy で分割することによってできる撮像視野の数（撮像視野数）Dn と最初の撮像視野のステージ座標 Op（ xoff ，yoff ）及び、視野ピッチを求める。撮像視野のステージ座標 Op とは、例えば、その撮像視野の中心の座標である。 Next, the geometric enlargement ratio GM is calculated by equation (2).
Further, Zp can be expressed as in Equation (7) by modifying Equation (5). Therefore, Zp can be calculated if the geometric enlargement ratio GM is obtained from equation (2).

From these, the number of imaging fields (number of imaging fields) Dn and stage coordinates Op (first imaging field) Op (which can be obtained by dividing the entire sample 5 (the entire imaging field, that is, the entire sample) with a fixed imaging field size Sx, Sy. xoff, yoff) and the visual field pitch. The stage coordinates Op of the imaging field is, for example, the coordinates of the center of the imaging field.

FIG. 6 is a diagram showing an example in which the sample (power amplifier 51) in FIG. 4 is divided into a plurality of imaging fields. From the first stage coordinates Op (xoff, yoff), the image is divided into an imaged field of view of a broken line area with a length of horizontal Sx, a height of Sy, and a field pitch.
At this time, the area of each imaging field may overlap with the surrounding imaging field. If there is an overlapped area, that is, an overlap portion, the viewing pitch is reduced by the overlap. Further, in the example of FIG. 6, the imaging field of view is set larger on the outside by a preset value so that there is no inspection omission at the end.

Next, in imaging position coordinate calculation step 205, the stage coordinates of each imaging field of view are calculated, and the process proceeds to imaging position movement / image capture step 207.
In the imaging position movement / image capturing step 207, the sample stage is moved to the corresponding stage coordinates of each imaging visual field to capture the image, and the process proceeds to the full-field imaging determination step 208.
In the all-field imaging determination step 208, it is determined whether or not the entire sample 5 image (that is, the entire imaging field-of-view image) has been captured. If all captured field-of-view images have not been captured, the process returns to the imaging position shift / image capture step 207. If all the captured visual field images are captured, the process proceeds to image generation processing step 209.
In the image generation processing step 209, all captured images are aligned and connected to generate a single image including the entire sample 5.

  Next, in the generated image display step 210, one image generated in the image generation processing step 209 is displayed on the display 8. At this time, in order to display the entire sample 5, the pixels are thinned out at a predetermined rate, and the thinned image is displayed. The image displayed on the display 8 is a thinned image, but the data actually held as one image is the resolution of the image at each divided field size (ie, the enlarged image) before joining. Since it has (resolution), image processing with high resolution can be realized.

Next, in the inspection area setting step 211, when it is determined in the model determination step 202 that it is new (no past data exists), the inspection area is set. If there is past data in the type discrimination step 202, the already set inspection area that has been read is displayed and can be selected.
When the operator designates or changes the inspection area, the display screen of display 8 is operated by GUI. For example, assuming that the inspection area is set to a rectangle, the display screen is dragged with the mouse from the lower left corner point to the upper right corner point of the rectangle to be set as the inspection area. The designated PC 7 recognizes and stores this specified area. When the operator wants to change the inspection area that has already been set, the operator drags the four corner points or four sides of the square of the inspection area to be changed.
This inspection area may straddle a plurality of divided imaging fields, and the operator can make this setting without being aware of the imaging field and stage coordinates.
In the inspection area setting step 211, the operator recognizes the field of view set in the inspection area, stores it in the control PC 7, and proceeds to the enlarged display determination step 212.

In the enlargement display determination step 212, it is determined whether or not to enlarge the inspection area desired by the operator from the inspection areas. This determination is based on an operator's designation. For example, if the operator does not enlarge the inspection area, press the enlargement path button displayed on the display 8 by GUI operation, and if the operator wants to enlarge the inspection area, press the enlargement button displayed on the display 8. Press in GUI operation. If the enlargement button is pressed, the process proceeds to the setting end step 220. If the enlargement button is pressed, it is recognized that the operator has instructed enlargement of the inspection area, and the inspection area is displayed on the display screen. A selection button for editing detection items, image processing parameters, and determination parameters to be set for each is displayed. These buttons may be displayed simultaneously with the enlargement button. The operator selects a necessary button from these, and the control PC 7 recognizes that any button has been selected, and proceeds to a partially enlarged display step 213.
When there are a plurality of inspection areas, operation buttons are displayed on the display screen of the display 8 so that the inspection areas are displayed in order. In addition, a name is given so that each inspection area can be identified. The operator selects an operation button and performs an operation. Similarly, on the display screen of the display 8, operation buttons necessary for the operator to operate and input from time to time are displayed.

In a partially enlarged display step 213, the designated inspection area portion is enlarged and displayed. Further, when thinning is necessary, pixel thinning is performed in order to create an image for display so that the entire area can be displayed. In the pixel thinning, for example, a display image is created by excluding pixels in the horizontal direction and the height direction every predetermined number.
Next, in the image parameter setting / changing step 214, detection items, image processing parameters, and determination parameters set for each examination area are edited. At this time, since the image generated in the image generation processing step 209 is picked up at the enlargement ratio at the time of executing the inspection, the image processing at the resolution (resolution) by the enlargement ratio can be executed.

Next, in an image re-acquisition determination step 215, it is determined again whether or not an image of the imaging field including the examination area is captured. That is, when the operator sees the image magnified and displayed in the partially magnified display step 213, the operator determines again whether to capture the image of the imaging field of view including the examination area, and presses the corresponding button on the display screen. Push. The control PC 7 recognizes whether any of these buttons has been pressed, thereby selecting whether or not to re-capture the image.
If it is determined that the image is to be retaken, the process proceeds to step 216 for re-reading the sample data. This image re-acquisition is performed for reproducibility confirmation in an image processing trial.

In the sample data re-reading step 216, re-acquisition is performed. That is, data such as the stage coordinates of the imaging field of view (inspection capture field of view (inspection area), imaging position coordinates, etc.) is acquired again, and the process proceeds to the imaging position movement / image recapture step 217.
In the imaging position movement / image re-acquisition step 217, the sample stage is moved to the corresponding stage coordinates of each imaging visual field to capture the image, and the process proceeds to the full-field re-imaging determination step 218.
In the full-field reimaging determination step 218, it is determined whether the target image has been captured. If not completed, the imaging position shift / image recapture step 217 is repeated. If completed, the process proceeds to an image regeneration process step 209.
In the image regeneration processing step 209, processing is performed for connecting the captured adjacent images to generate an image in the inspection area as one image combining the entire sample 5, and the process proceeds to a partially enlarged display step 213.
In the partially enlarged display step 213, the designated inspection area portion is enlarged and displayed again by the already designated detection item, image processing parameter, and determination parameter. The following processing is the same as that already described.
In the setting end step 220, it is selected whether or not all the settings are completed. If the process is repeated, the process returns to the inspection area setting step 211. If the process is ended, the process ends. Whether the process ends or not depends on a selection instruction from the operator.

When the inspection is executed, based on the above inspection data, an image of only the imaging field of view in which the inspection area is set is captured, and defect detection and determination are performed as an inspection target. An example of the inspection will be described with reference to FIGS.
FIG. 7 is a diagram illustrating a timing example of sample stage movement, image capture, and image processing. The locations (1) to (7) attached to each imaging field shown in FIG. 6 are image capture locations, that is, inspection areas. FIG. 7A shows the time during which the sample stage is moving. FIG. 7B shows the time during which an image is captured. FIG. 7C shows the time during image processing.
First, the sample stage moves to the stage coordinates of the first visual field image (1) in FIG. After the movement is completed, the image is captured. When the image capture is completed, the stage coordinate of the next visual field image (2) is moved and image processing of the captured visual field image (1) is performed.
After moving to the stage coordinates of the next visual field image (2), the image of the visual field image (2) is captured. When the image capture is completed, the stage coordinate of the next visual field image (3) is moved and image processing of the captured visual field image (2) is performed.
Similarly, as set in the inspection data, the image processing is performed while acquiring the all the visual field images set as all the inspection data while moving the sample stage, acquiring the visual field images, and performing image processing. Perform an inspection. The timing is adjusted so that the capture of the next visual field image is completed after the image processing of the previous visual field image is completed.

In addition, display of captured images and display of processing results on the display for display 8 are performed as necessary. Therefore, it may be displayed after the image processing is completed for all inspection areas of one sample, or gradually displayed in the order in which the results are obtained or some defect or measurement data is obtained in the inspection. Also good.
FIG. 8 is a diagram showing an example of display of inspection results according to the present invention. On the display 8 for display, for example, only the inspection area part of FIG. 8 may be displayed, or the imaging visual field (3), the imaging visual field (4), the imaging visual field (5), and the imaging visual field (6) are sequentially or They may be displayed side by side. Further, it may be displayed side by side simultaneously with other inspection areas.

  Examples 1 to 3 described above have described the X-ray inspection apparatus. However, in all inspection devices such as defect inspection devices, appearance inspection devices, dimension inspection devices, line width measurement devices, and image quality inspection devices, an enlarged image is acquired and image processing is performed or the displayed image is inspected or measured visually. It is clear that the present invention can be applied to an inspection apparatus. At this time, as shown in page 2 and FIG. 5 of Patent Document 1, a reflected light from the object to be inspected is magnified and imaged by using a drop-type microscope (an epi-illumination microscope) as an enlarging means. It is obvious that the inspection apparatus may be obtained by the apparatus.

  In the first to third embodiments, the inspection apparatus has been described in which an enlarged image is acquired and image processing is performed or the displayed image is inspected or measured in the inspection apparatus. However, in all inspection apparatuses such as a defect inspection apparatus, appearance inspection apparatus, dimension inspection apparatus, line width measurement apparatus, and image quality inspection apparatus, it is not necessary that the magnification corresponding to the resolution of the acquired image is enlarged. Even in the case of an image or a reduced image, when an image to be acquired at a time is small compared to an object to be inspected and it is necessary to acquire a plurality of images, the inspection data setting method of the present invention, an inspection method using the same, and Obviously, it can be applied to the device.

According to the above-described embodiment, it is possible to connect the individually captured images to generate a single image, and to perform settings necessary for the inspection with respect to the single image.
Thereby, when setting the inspection area, the inspection area may straddle the imaging field of view, and the operator can perform the setting without being aware of the imaging field of view and the stage coordinates.
In addition, since there is no need to be aware of the imaging field of view, it is possible to collectively set inspection data that has been set for each field of view.
Furthermore, since the generated single image is imaged at an enlargement rate at the time of executing the inspection (ie, enlargement, equal magnification, or reduction rate corresponding to the resolution), the image processing can be executed as it is. . For example, when the entire sample is imaged by changing the magnification rate, the resolution (resolution) is different from that at the time of the inspection, and the inspection cannot be executed. However, according to the present embodiment, it can be executed as it is.
Furthermore, it is possible to cope with a case where the entire sample cannot be imaged with a large sample and an enlargement, equal magnification, or reduction ratio corresponding to the resolution.

The block diagram which shows the structure of one Example of the test | inspection apparatus of this invention. The flowchart which shows the process operation example of one Example of the test | inspection data setting method of this invention. FIG. 2 is an enlarged view of the X-ray II tube portion 2-1 and the sample 5 in FIG. 1 and the tip portion 11 of the X-ray generator 1; The figure for demonstrating an example of a sample. The figure for demonstrating the minimum detected defect size and image size. The figure for demonstrating dividing | segmenting the whole sample into a some imaging visual field with the sample of FIG. The figure which shows the example of a timing of sample stage movement, image taking, and image processing. The figure which shows one Example of the display of the test result of this invention.

Explanation of symbols

1: X-ray tube, 2: X-ray camera, 2-1: X-ray II tube, 2-2: CCD camera, 3: Sample table, 3-1: X-axis sample stage, 3-2: Y-axis sample Stage, 4: Z-axis movement mechanism, 5: Sample, 6: X-ray protective cabin, 7: Control PC, 8: Display for display, 9: Stage controller, 10: X-ray controller, 11: Tip, 12: Input phosphor screen, 51: Power amplifier, 52: Metal heat sink, 53: Wiring board, 50-1, 50-2, 50-3: Semiconductor chip, 54: Solder.

Claims (4)

In an imaging unit that images a part of a sample, and an inspection apparatus that performs image processing of the captured image of the sample and inspects the sample, in an inspection apparatus that performs inspection based on preset inspection data,
Capture the above sample with an image divided for each field of view,
Connect the divided images to generate one image,
Display the generated single image,
An inspection data setting method, wherein at least one of the inspection data is set based on the displayed image. A part of the sample is imaged, the captured image of the sample is image-processed, and at least one of the image-processed data or the captured image of the sample is displayed, and the inspection data set in advance is displayed. In the inspection method for performing the inspection based on
An inspection method comprising operating the inspection apparatus based on an image displayed on the display unit, and creating or changing the inspection data in accordance with an instruction from an operator. An image capturing unit that captures at least a part of the sample, an image processing unit that performs image processing on the captured image of the sample, and uses the result as data, data output from the image processing unit, or the image captured In an inspection apparatus that includes at least a display unit that displays at least one of the images of the sample, and inspects based on preset inspection data,
Having an operation means for operating the inspection apparatus based on the image displayed on the display unit;
The operation device creates or changes the inspection data in accordance with an instruction from an operator. The inspection apparatus according to claim 3, wherein
The operation means captures the sample as an image divided for each imaging field of view, connects the divided images to generate one image, displays the generated one image, and displays the displayed image. An inspection apparatus, wherein at least one of the inspection data is set based on an image.

Images