JP4371719B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP4371719B2
JP4371719B2 JP2003178223A JP2003178223A JP4371719B2 JP 4371719 B2 JP4371719 B2 JP 4371719B2 JP 2003178223 A JP2003178223 A JP 2003178223A JP 2003178223 A JP2003178223 A JP 2003178223A JP 4371719 B2 JP4371719 B2 JP 4371719B2
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JP
Japan
Prior art keywords
wiring
semiconductor device
semiconductor
manufacturing
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2003178223A
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English (en)
Japanese (ja)
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JP2004088085A (ja
JP2004088085A5 (enExample
Inventor
崇 野間
裕之 篠木
信行 高井
勝彦 北川
利洋智 徳重
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Priority to JP2003178223A priority Critical patent/JP4371719B2/ja
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Publication of JP2004088085A5 publication Critical patent/JP2004088085A5/ja
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Publication of JP4371719B2 publication Critical patent/JP4371719B2/ja
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JP2003178223A 2002-06-26 2003-06-23 半導体装置及びその製造方法 Expired - Fee Related JP4371719B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003178223A JP4371719B2 (ja) 2002-06-26 2003-06-23 半導体装置及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002185749 2002-06-26
JP2003178223A JP4371719B2 (ja) 2002-06-26 2003-06-23 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2004088085A JP2004088085A (ja) 2004-03-18
JP2004088085A5 JP2004088085A5 (enExample) 2006-08-10
JP4371719B2 true JP4371719B2 (ja) 2009-11-25

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Family Applications (1)

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JP2003178223A Expired - Fee Related JP4371719B2 (ja) 2002-06-26 2003-06-23 半導体装置及びその製造方法

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JP (1) JP4371719B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4522213B2 (ja) * 2004-09-29 2010-08-11 三洋電機株式会社 半導体装置の製造方法
JP2006179709A (ja) * 2004-12-22 2006-07-06 Sanyo Electric Co Ltd 半導体装置の製造方法
JP4828261B2 (ja) * 2006-03-07 2011-11-30 オンセミコンダクター・トレーディング・リミテッド 半導体装置及びその製造方法
JP2009099838A (ja) * 2007-10-18 2009-05-07 Nec Electronics Corp 半導体装置およびその製造方法

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Publication number Publication date
JP2004088085A (ja) 2004-03-18

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