JP4364618B2 - Substrate bonding method and bonding apparatus - Google Patents

Description

  The present invention relates to a bonding method and a bonding apparatus in which two substrates are bonded together with a sealant with a fluid interposed between the substrates.

  In the manufacturing process of a flat display panel typified by a liquid crystal display panel, two substrates are opposed to each other at a predetermined interval, and a liquid crystal as a fluid is sealed between the substrates and bonded together with a sealant. Done.

  In the bonding operation, first, the sealing agent is applied to one of the two substrates in a frame shape, and a predetermined amount of the liquid crystal is applied to a portion corresponding to the inside of the sealing agent frame of the substrate or the other substrate. Is supplied dropwise in a plurality of granular forms.

  Next, the two substrates are held on the upper holding table and the lower holding table, and are opposed to each other at a predetermined interval in the vertical direction. In this state, the horizontal directions of these substrates are the X, Y, and θ directions. Next, these substrates are bonded together.

  When the two substrates are aligned in the horizontal direction, the alignment accuracy is required to be as high as μm. Therefore, a high-magnification camera having a relatively shallow depth of focus is used as the alignment camera. .

  When aligning two substrates using a high-magnification camera, if the substrates are aligned with a large distance in the vertical direction, for example, with the two substrates separated by a relatively large distance, Two substrates cannot be positioned at the same time within the depth of focus of the camera with the magnification. Therefore, these substrates cannot be positioned with high accuracy, and the alignment accuracy may be lowered.

  Therefore, when aligning the two substrates, these substrates are brought close to the same distance as the bonded state, and in that state, the two substrates are imaged with a high-magnification camera, and based on the imaging results. One of the substrates is driven in the X, Y and θ directions for alignment. Such a technique is disclosed in Patent Document 1.

JP 2001-51284 A

  However, if the two substrates are brought too close to each other and come into contact with the sealing agent, even if one substrate is moved in the horizontal direction based on the imaging result of the camera, the viscous resistance of the sealing agent causes Since the force required to move the substrate increases, one substrate cannot be moved accurately and smoothly in the horizontal direction against the viscous resistance.

  Furthermore, if the two substrates are brought too close together, not only the two substrates are bonded together by the sealant, but also the liquid crystal dropped in the form of droplets on one substrate is crushed and the two substrates are separated. Therefore, the entire surfaces of the two substrates are in close contact with each other through the liquid crystal. For this reason, the adhesion between the two substrates is increased by the liquid crystal, so that the resistance to move one substrate in the horizontal direction at the time of alignment also increases, thereby also accurately and smoothly aligning the substrates. There are times when you can't.

  According to the present invention, one of the substrates can be moved with a relatively light force to accurately align the two substrates, and the quality of the two bonded substrates can be improved. It is in providing the bonding method and the bonding apparatus.

  In the present invention, a sealant is applied to one of two substrates in a frame shape, and fluid is dropped in a granular form on a portion of the two substrates corresponding to the inside of the sealant frame. In the laminating method in which a predetermined laminating load is applied to the two substrates and the above-mentioned sealing agent is used for laminating, the step of holding one substrate on the lower holding table and the other substrate facing the lower holding table are provided. A step of holding the upper holding table, a step of driving the lower holding table and the upper holding table in a relatively approaching direction, and bringing the two substrates into contact with each other via the fluid. A step of lifting the one substrate from the lower holding table by a force that pulls the two substrates by tension, and a step of bringing the one substrate lifted against the lower holding table. And applying a contact load smaller than the bonding load to the two substrates, and moving the at least one holding table in the horizontal direction with the contact load applied to the two substrates to move the two substrates A method for bonding substrates, comprising: a step of aligning; and a step of applying the bonding load to two aligned substrates and bonding the substrates with the sealant.

  In the present invention, a sealing agent is applied in a frame shape to one of the two substrates, and a fluid is dropped on a portion corresponding to the inside of the sealing agent frame of either of the two substrates. In a laminating apparatus that applies a predetermined laminating load to the substrate and bonds with the sealing agent, a lower holding table that holds one substrate and an upper portion that is provided to face the lower holding table and holds the other substrate A holding table, a driving means for driving the upper holding table in a direction to contact and separate from the lower holding table, and driving the driving means, the two substrates are smaller than the bonding load through the fluid. Positioning means for aligning the two substrates in the horizontal direction in contact with the contact load, and the driving means when the two substrates contact with the contact load. And a control means for controlling the driving means to apply the bonding load to the substrate when the two substrates are aligned by the alignment means. The lower holding table floats the one substrate generated from the lower holding table by a force that draws the two substrates by the surface tension of the fluid when the two substrates come into contact with each other through the fluid. The substrate bonding apparatus is characterized in that the one substrate is held with a force weaker than a force to be applied.

  According to the present invention, one of the substrates can be moved with a relatively light force to accurately align the two substrates, and the quality of the two bonded substrates can be improved.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic view showing a liquid crystal display panel assembling apparatus 1 according to an embodiment of the present invention. The assembling apparatus 1 includes a sealing agent application apparatus 2. The coating device 2 is supplied with a first substrate 3 that is one of first and second substrates 3 and 4 constituting a liquid crystal display panel.

  The coating apparatus 2 includes a table on which the first substrate 3 is supplied and placed, and a coating nozzle (both not shown) arranged above the table, and the coating nozzle is attached to the first substrate 3. The sealant 5 (shown in FIG. 3) made of a viscoelastic material is applied to the inner surface (surface to be bonded) of the first substrate 3 by being driven in the X, Y, and Z directions relatively. Is applied in a rectangular frame shape.

  The first substrate 3 coated with the sealing agent 5 is supplied to the dropping device 7. The dropping device 7 has a table on which the first substrate 3 is placed and a dropping nozzle (both not shown) disposed above the table, and the dropping nozzle is disposed on the first substrate 3. Driven relatively in X, Y and Z directions. As a result, a plurality of liquid crystals 6 in the form of fluid are dropped and supplied in a predetermined arrangement pattern, for example, in a matrix, in the region surrounded by the sealant 5 on the inner surface of the first substrate 3.

  Here, the height h of the droplets of the liquid crystal 6 supplied to the first substrate 3 is set to be higher than the height H of the sealant 5 as shown in FIG. . That is, if the total amount of the liquid crystal 6 supplied to the first substrate 3 is determined, the amount of the liquid crystal 6 per droplet is determined by the number of droplets, and thus the height h per droplet of the liquid crystal 6 is also determined by the amount. The Therefore, by adjusting the number of droplets according to the total supply amount of the liquid crystal 6 supplied to the first substrate 3, it is possible to set so that h> H.

  The first substrate 3 onto which the liquid crystal 6 has been dropped is supplied to the bonding apparatus 11. The bonding apparatus 11 is supplied with the second substrate 4 together with the first substrate 3. Then, the first substrate 3 and the second substrate 4 are positioned and bonded as will be described later. As a result, the pair of substrates 3 and 4 are bonded together by the sealing agent 5, and the liquid crystal 6 is sealed between the substrates 3 and 4.

  The bonding apparatus 11 has a chamber 12 as shown in FIG. The inside of the chamber 12 is depressurized by a decompression pump 10 to a predetermined pressure, for example, about 1 Pa. A loading / unloading port 14 opened and closed by a shutter 13 is formed on one side of the chamber 12, and the first substrate 3 and the second substrate 4 are loaded / unloaded from the loading / unloading port 14.

  A lower holding table 15 is provided in the chamber 12. The lower holding table 15 is driven in the X, Y, and θ directions by an XYθ driving source 16. On the holding surface 15a (upper surface) of the lower holding table 15, the first substrate 3 to which the sealant 5 is applied and the liquid crystal 6 is dropped is supplied with the inner surface on which the liquid crystal 6 is dropped facing upward. Is done. The outer surface (lower surface) of the substrate 3 supplied to the holding surface 15a is held on the holding surface 15a with a predetermined holding force by, for example, electrostatic force.

  Above the lower holding table 15, an upper holding table 18 driven in the Z direction that is in contact with and away from the lower holding table 15 by the driving means 17 is disposed. On the holding surface 18a on the lower surface of the upper holding table 18, the second substrate 4 holds the outer surface by electrostatic force.

  Each holding table 15 and 18 is provided with a plurality of electrodes 15c and 18c. When power is supplied to the electrodes 15c and 18c by a power source (not shown), an electrostatic force for holding the substrates 3 and 4 can be generated on the holding tables 15 and 18, respectively.

  The drive means 17 has a Z drive motor 19. The Z drive motor 19 is fixed to a fixed portion 21 via a bracket 20, and a screw shaft 23 is connected to the rotating shaft 22. The screw shaft 23 is screwed into the upper side 24a of the movable body 24 having a U-shape. The tip of the upper side 24a is slidably engaged with a linear guide 25 provided on the bracket 20 along the vertical direction. Accordingly, when the screw shaft 23 is rotationally driven by the rotary shaft 22 of the Z drive motor 19, the movable body 24 is driven up and down along the linear guide 25.

  The movable body 24 is inserted into the chamber 12 in an airtight and vertically movable state by a seal mechanism 26 provided on the upper wall of the chamber 12. An L-shaped locking body 31 provided on the upper surface of the upper holding table 18 is engaged with one side of the U-shaped lower side 24 b of the movable body 24. Between the engagement surfaces of the movable body 24 and the locking body 31, a load cell 32 is provided as a load detection means for detecting a load applied to the movable body 24 of the driving means 17.

  The XYθ drive source 16 and the Z drive motor 19 are driven by a drive signal from the control device 34. The load applied to the movable body 24 detected by the load cell 32 is input to the control device 34.

  An optically transparent window 35 is formed on the bottom wall of the chamber 12. A high-magnification imaging camera 36 is disposed opposite to the window 35. The imaging camera 36 was held on the table 15 through the through-hole portion 37 formed in the lower holding table 15 when the first substrate 3 and the second substrate 4 were brought close to each other as described later. An alignment mark (not shown) formed at each of the four corners of the first substrate 3 and the second substrate 4 held on the upper holding table 18 is imaged.

  Although not shown, a coarse alignment camera with a low magnification is arranged in the vicinity of the high-magnification imaging camera 36, and the first and second substrates 3 and 4 separated by using the coarse alignment camera are arranged in a coarse position. Can be combined.

  The imaging signal of the imaging camera 36 is processed into a digital signal by the image processing unit 38 and then input to the control device 34. In the control device 34, based on the signal from the image processing unit 38, the relative shift amount of the alignment mark between the first substrate 3 and the second substrate 4, that is, the first substrate 3 and the second substrate 4. The amount of deviation in the horizontal direction is calculated.

  Then, when the control device 34 calculates the shift amount of the pair of substrates 3 and 4, the lower holding table 15 is driven by the XYθ drive source 16 according to the shift amount, and the first substrate 3 becomes the second substrate 4. Are aligned with each other.

  Next, a procedure for bonding the first substrate 3 and the second substrate 4 by the bonding apparatus 11 having the above-described configuration will be described with reference to FIGS. 3 (a) to 3 (e).

  As shown in FIG. 3A, the first substrate 3 is held on the lower holding table 15 and the second substrate 4 is held on the upper holding table 18 so that the substrates 3 and 4 are moved up and down at predetermined intervals. In the direction away from each other. In this state, the four corners of the first substrate 3 and the second substrate 4 are imaged by a coarse alignment camera (not shown), and the substrates 3, 4 are coarsely aligned in the X, Y, and θ directions.

  Next, the driving means 17 is operated to drive the upper holding table 18 downward in the Z direction at a moderate speed. As shown in FIG. 3B, when the second substrate 4 approaches the first substrate 3, the lower surface of the second substrate 4 is the sealing agent 5 and the liquid crystal 6 provided on the upper surface of the first substrate 3. Among them, the liquid crystal 6 is in contact with a number of liquid drops 6 dropped at a height h higher than the height H of the sealant 5. Each liquid crystal 6 in the form of droplets is deformed from the hemispherical state shown in FIG. 3A to the drum shape shown in FIG. 3B by capillary action.

  As a result, the drum-shaped liquid crystal 6 tries to return to the spherical shape due to the surface tension, so that the first substrate 3 is attracted to the second substrate 4 by the surface tension. At this time, if the value obtained by adding the holding force of the first substrate 3 by the lower holding table 15 and the weight of the substrate 3 is weaker than the surface tension of the liquid crystal 6, as shown in FIG. The substrate 3 is temporarily lifted from the lower holding table 15.

  When the second substrate 4 is gradually lowered from the state in which the lower surface thereof is in contact with the liquid crystal 6, the first substrate 3 comes into contact with the upper surface of the lower holding table 15 as shown in FIG. The liquid crystal 6 in the form of droplets receives the weight of the upper holding table 18 holding the second substrate 4. Thereby, the weight of the upper holding table 18 applied to the movable body 24 via the locking body 31 is reduced.

  When the weight applied to the movable body 24 is reduced, the load detected by the load cell 32 provided between the engagement surfaces of the movable body 24 and the locking body 31 is also reduced. Therefore, the change in the detection signal from the load cell 32 at that time is reduced. Thus, the control device 34 stops the driving of the upper holding table 18 in the descending direction by the Z drive motor 19.

  When the lowering of the upper holding table 18 is stopped when the load detected by the load cell 32 is changed, the second substrate 4 is in contact with the liquid crystal 6 in a state of being slightly crushed. 3 (d), the liquid crystal 6 is not filled between the first and second substrates 3 and 4, and the second substrate 4 is applied to the first substrate 3 The spacing is such that no contact is made with the agent 5, that is, a contact load is applied to the two substrates 3 and 4.

  That is, by stopping the driving means 17 depending on the load change detected by the load cell 32, the first and second substrates 3 and 4 have a load smaller than the bonding load for bonding the substrates 3 and 4 together. That is, a contact load is applied. This contact load is set to 40 to 50% of the bonding load. For example, if the bonding load is 200 kg, the contact load is set to 80 to 100 kg.

  Accordingly, as described above, the distance between the first and second substrates 3 and 4 is such that the liquid crystal 6 is not filled between the substrates 3 and 4, and the second substrate 4 is in contact with the sealant 5. Not maintained at intervals. That is, each droplet-like liquid crystal 6 is deformed from the hemispherical state shown in FIG. 3A to the drum shape shown in FIG. 3D, but the adjacent droplet-like liquid crystals 6 are not integrated. That is, the liquid crystal 6 is not fully filled between the pair of substrates 3 and 4.

  In such a state, the adhesion force by the liquid crystal 6 does not occur over the entire opposing surface of the first substrate 3 and the second substrate 4, and the second substrate 4 contacts the sealing agent 5. Therefore, when the first substrate 3 is aligned with the second substrate 4, the first substrate 3 can be moved precisely and smoothly.

  Further, as shown in FIG. 3C, considering the case where the second substrate 4 comes into contact with the liquid crystal 6 and the first substrate 3 is lifted from the lower holding table 15, the following advantages are also obtained. That is, the first substrate 3 is lifted up to a position where the force pulling the first substrate 3 due to the surface tension of the liquid crystal 6 and the weight of the first substrate 3 are balanced. Then, the upper holding table 18 is further lowered while maintaining the distance between the first substrate 3 and the second substrate 4 formed at this time. When the first substrate 3 comes into contact with the lower holding table 15 and a contact load is applied, the lowering operation of the upper holding table 18 is stopped.

  At that time, the distance between the first substrate 3 and the second substrate 4 is already in accordance with the surface tension of the liquid crystal 6 as described above. Therefore, when the first substrate 3 is in contact with the lower holding table 15 and a contact load is applied, the distance between the two substrates 3 and 4 is prevented from being further narrowed by the surface tension of the liquid crystal 6. . Accordingly, since the contact load is reduced and the first substrate 3 is prevented from being lifted by the decrease in the distance between the two substrates 3 and 4, the contact load is surely applied to the two substrates 3 and 4. Can do.

  Therefore, the contact load ensures that the liquid crystal 6 does not fill the entire area between the substrates 3 and 4, and that the adhesion force due to the liquid crystal 6 does not occur over the entire opposing surfaces of the two substrates 3 and 4. The first substrate 3 can be moved more precisely and smoothly by the lower holding table 15.

  With a contact load applied to the first and second substrates 3 and 4, the imaging camera 36 images the alignment marks (not shown) provided at the four corners of the first substrate 3 and the second substrate 4. . The imaging signal of the imaging camera 36 is processed into a digital signal by the image processing unit 38 and input to the control device 34. As a result, the control device 34 operates the XYθ drive source 16 to drive the lower holding table 15 and aligns the first substrate 3 with the second substrate 4 with high accuracy.

  During the alignment, the load applied to the first and second substrates 3 and 4 is maintained at the contact load by the detection signal of the load cell 32 as described above. As a result, the second substrate 4 is not in contact with the sealant 5 applied to the first substrate 3, and the liquid crystal 6 is not fully filled between the opposing surfaces of the second substrate 4 and the first substrate 3. The

  Therefore, in order to image the pair of substrates 3 and 4 with the imaging camera 36 and align them with high precision, the substrates 3 and 4 are sufficiently brought close to each other by the contact load so as to be positioned within the depth of focus of the imaging camera 36. Even so, the adhesive force of the sealant 5 acts on the second substrate 4, or the adhesion force of the liquid crystal 6 is generated over the entire opposing surface of the first substrate 3 and the second substrate 4. There is no. As a result, the first substrate 3 can be smoothly moved in the X, Y, and θ directions with a relatively light force with respect to the second substrate 4, and the alignment of these substrates can be performed with high accuracy.

  That is, when the adjacent liquid crystals 6 in the form of droplets are integrated and filled between the pair of substrates 3 and 4, the adhesion force of the liquid crystal 6 acts on the entire opposing surfaces of the substrates 3 and 4, and thus the adhesion force is large. Thus, the first substrate 3 cannot be accurately moved in the horizontal direction with respect to the second substrate 4.

  However, if the load applied to the substrates 3 and 4 at the time of alignment is a contact load, the adjacent liquid crystals 6 in the form of droplets are not integrated and filled between the substrates 3 and 4, and the second substrate 4 is not filled. Does not come into contact with the sealant 5. Therefore, the first substrate 3 can be smoothly moved with a relatively small resistance, and the alignment accuracy of the substrates 3 and 4 can be improved.

  In this way, when the alignment between the first substrate 3 and the second substrate 4 is completed, the Z drive motor 19 is operated to further lower the upper holding table 18, and the first and second substrates are moved downward. A bonding load for bonding these substrates 3 and 4 to 3 and 4 is applied. Thereby, as shown in FIG. 3 (e), the distance between the pair of substrates 3 and 4 is further narrower than that at the time of alignment, and the pair of substrates 3 and 4 are bonded together by the sealant 5, The liquid crystal 6 is filled between the four.

  When the bonding of the substrates 3 and 4 in the chamber 12 is completed, the upper holding table 18 is lifted after removing the electrostatic force of the upper holding table 18, and then gas is introduced into the chamber 12. The pair of substrates 3 and 4 are pressurized by the difference between the pressure in the chamber 12 after introducing the gas and the pressure in the space between the substrates 3 and 4. As a result, the pair of substrates 3 and 4 are securely bonded together by the sealant 5.

  According to the bonding apparatus of the above embodiment, as described above with reference to FIGS. 3 (c) and 3 (d), the first substrate 3 is highly accurate with respect to the second substrate 4. Can be aligned. Therefore, the first and second substrates 3 and 4 can be bonded together with high positional accuracy, and the display quality of the liquid crystal display panel manufactured by bonding the two substrates 3 and 4 can be improved.

  In addition, since the contact load can be reliably applied to the two substrates 3 and 4, the feedback control of the contact load during the positioning operation of the first and second substrates 3 and 4 by the lower holding table 15 is omitted. Therefore, it is possible to simplify the control of the driving unit 17.

  The present invention is not limited to the above-described embodiment. For example, the present invention can be applied even when the pair of substrates 3 and 4 are bonded in the atmosphere. In addition, the sealant 5 is applied to the first substrate 3 and the liquid crystal 6 is supplied dropwise, but the sealant may be applied to one substrate and the liquid crystal may be supplied to the other substrate.

  Further, when aligning the pair of substrates 3 and 4, the second substrate 4 is in contact with the liquid crystal 6 but not in contact with the sealant 5. However, if the viscosity of the sealant 5 is small, Since the viscous resistance is small, even when the second substrate 4 is in contact with the sealing agent 5, the substrates 3 and 4 can be aligned.

  In addition, the first substrate 3 is held on the lower holding table 15 by electrostatic force. However, an elastic sheet such as rubber is attached to the upper surface of the lower holding table 15, and the first substrate 3 is caused by the frictional force of the elastic sheet. The substrate 3 may be held immovably on the lower holding table 15 in the direction along the holding surface 15a. This elastic sheet may be approximately the same size as the lower holding table 15, or may be divided into a plurality of blocks.

  When an elastic sheet is provided on the upper surface of the lower holding table 15 and the first substrate 3 is held without using electrostatic chucking, vacuum chucking, or mechanical chucking means, the second substrate is lowered by the lowering of the upper holding table 18. When 4 comes into contact with the liquid crystal 6 and a pulling force due to the surface tension of the liquid crystal 6 is applied, the first substrate 3 is easily lifted from the lower holding table 15.

  Therefore, as compared with the case where the first substrate 3 is attracted to the lower holding table 15 by electrostatic force, the force for narrowing the distance between the two substrates 3 and 4 due to the surface tension of the liquid crystal 6 can be surely weakened. . Therefore, even if a contact load is applied and the lowering of the upper holding table 18 is stopped, it is possible to prevent the distance between the two substrates 3 and 4 from being narrowed by the surface tension of the liquid crystal 6 thereafter. It is possible to prevent a decrease in contact load caused by a decrease in the interval between 3 and 4 and a lifting of the first substrate 3.

  Therefore, a contact load can be more reliably applied to the two substrates 3 and 4. As a result, the distance between the two substrates 3 and 4 is such that the liquid crystal 6 is not filled between the substrates 3 and 4 due to the contact load, and the adhesion between the two substrates 3 and 4 faces each other. It is reliably maintained in a state that does not occur over the entire surface.

  Therefore, when an elastic sheet is attached to the lower holding table 15, the two substrates 3 and 4 are brought closer to each other as compared with the above embodiment in which the first substrate 3 is attracted to the lower holding table 15 by electrostatic force. Thus, the lower holding table 15 can be moved more precisely and smoothly when positioning.

  Further, when aligning the two substrates 3 and 4, due to the frictional force between the first substrate 3 and the elastic sheet and the force (contact load) that presses the first substrate 3 against the elastic sheet, The holding force of the first substrate 3 with respect to the moving direction of the lower holding table 15 is obtained. Therefore, alignment can be performed without providing a holding mechanism or a mechanical holding mechanism by electrostatic chucking or vacuum chucking. As a result, the apparatus configuration can be simplified, operability can be improved, and maintenance management can be facilitated.

  At this time, the elastic sheet needs to be a member that can obtain a frictional force larger than the resistance acting between the substrates 3 and 4 during alignment between the substrate 3 and the elastic sheet.

  In the above description, the elastic sheet is made of a non-adhesive material or reduces the adhesive force on the surface so that the first substrate 3 and the elastic sheet can be easily separated from each other on the surface (holding surface) of the elastic sheet. It is preferable to use a material that has been processed.

  Even when an elastic sheet and a holding mechanism using electrostatic suction or vacuum suction are used in combination, a member having a lower suction force than a holding mechanism such as an electrostatic chuck provided on the upper holding table 18 is used, or at least the upper holding The same effect as described above can be obtained if the holding mechanism is not operated from when the table 18 starts to descend until the contact load is applied and the upper holding table 18 stops descending.

  In the present invention, the sealing agent may be applied to the second substrate 4 or both the substrates 3 and 4, and the liquid crystal 6 is also dropped onto the second substrate 4 or both the substrates 3 and 4. Also good.

  Although the driving means 17 is provided on the upper holding table 18, it may be provided on the lower holding table 15, or may be provided on both holding tables.

  Although the load cell 32 as the load detecting means is provided in the driving means 17, the present invention is not limited to this. For example, the load cell 32 may be provided between the lower holding table 15 and the XYθ driving source 16. What is necessary is just to be provided in the state which can detect the load added to the board | substrates 3 and 4. FIG.

  As described above, according to the present invention, when two substrates are brought close to each other and aligned, the resistance of the liquid crystal generated between the substrates can be reduced, so that the alignment can be performed smoothly and precisely. Thus, the quality of the two bonded substrates can be improved.

FIG. 1 is a schematic view of an apparatus for assembling a liquid crystal display panel according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a schematic configuration of a bonding apparatus for bonding a pair of substrates. FIGS. 3A to 3E are explanatory views showing a procedure for bonding a pair of substrates together.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Assembling apparatus 2 Coating apparatus 3 1st board | substrate 4 2nd board | substrate 5 Sealant 6 Liquid crystal 7 Dropping apparatus 11 Bonding apparatus 15 Lower holding table 15a Holding surface 16 XY (theta) drive source 17 Driving means 18 Upper holding table 18a Holding surface 19 Z drive motor 31 Locking body 32 Load cell (load detection means)
34 Control Device 36 Imaging Camera 38 Image Processing Unit

Claims (5)

A sealant is applied to one of the two substrates in a frame shape, and a fluid is dropped in a portion corresponding to the inside of the frame of either of the two substrates, and the two substrates In a laminating method in which a predetermined laminating load is applied and laminating with the sealing agent,
Holding one substrate on the lower holding table;
Holding the other substrate on an upper holding table provided opposite to the lower holding table;
Driving the lower holding table and the upper holding table in a relatively approaching direction;
Bringing two substrates into contact with each other through the fluid, and lifting the one substrate from the lower holding table by a force that draws the two substrates by surface tension of the fluid; and
A step of bringing one of the floating substrates into contact with the lower holding table and applying a contact load smaller than the bonding load to the two substrates;
A step of aligning the two substrates by moving at least one of the holding tables in a horizontal direction with a contact load applied to the two substrates;
Applying the bonding load to the two aligned substrates and bonding the substrates with the sealant;
A method for bonding substrates, comprising:   The substrate bonding method according to claim 1, wherein a height of the fluid dropped onto the substrate is higher than a height of the sealant.   The contact load is such that the granular fluid is crushed between two approaching substrates and does not fill, and the two substrates are not bonded together by the sealing agent. 2. The method for bonding substrates according to claim 1, wherein the load is maintained. A sealant is applied to one of the two substrates in a frame shape, and a fluid is dropped on the corresponding part of the sealant frame on either of the two substrates. In the laminating apparatus for laminating with the sealing agent by applying a laminating load of
A lower holding table for holding one substrate;
An upper holding table provided opposite to the lower holding table and holding the other substrate;
Drive means for driving the upper holding table in a direction to be in contact with and away from the lower holding table;
Alignment means for aligning the two substrates in the horizontal direction in a state where the two substrates are brought into contact with each other with a contact load smaller than the bonding load through the fluid by driving the driving means;
When the two substrates come into contact with each other with the contact load, the driving unit is controlled to stop the lowering of the upper holding table. If the two substrates are aligned by the positioning unit, the driving unit is And a control means for controlling and applying the bonding load to the substrate,
The lower holding table is a force that lifts the one substrate from the lower holding table that is generated by a force that draws the two substrates due to the surface tension of the fluid when the two substrates come into contact with each other through the fluid. A substrate bonding apparatus characterized in that the one substrate is held with a weaker force. The drive means includes a movable body that is driven up and down by a drive motor, a locking body that is provided on an upper surface of the upper holding table and that is engaged with the movable body, and a gap between the movable body and the locking body. Provided with a load detecting means for detecting a load applied to the movable body,
5. The substrate bonding apparatus according to claim 4, wherein the control means stops the lowering of the upper holding table by the driving means based on a reduction in the load detected by the load detecting means.

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