JP4363194B2 - 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 - Google Patents
蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Download PDFInfo
- Publication number
- JP4363194B2 JP4363194B2 JP2004009771A JP2004009771A JP4363194B2 JP 4363194 B2 JP4363194 B2 JP 4363194B2 JP 2004009771 A JP2004009771 A JP 2004009771A JP 2004009771 A JP2004009771 A JP 2004009771A JP 4363194 B2 JP4363194 B2 JP 4363194B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- phosphor
- emitting
- red
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Devices (AREA)
- Planar Illumination Modules (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004009771A JP4363194B2 (ja) | 2004-01-16 | 2004-01-16 | 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004009771A JP4363194B2 (ja) | 2004-01-16 | 2004-01-16 | 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005200584A JP2005200584A (ja) | 2005-07-28 |
| JP2005200584A5 JP2005200584A5 (https=) | 2007-03-01 |
| JP4363194B2 true JP4363194B2 (ja) | 2009-11-11 |
Family
ID=34822700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004009771A Expired - Fee Related JP4363194B2 (ja) | 2004-01-16 | 2004-01-16 | 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4363194B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4884956B2 (ja) * | 2005-12-27 | 2012-02-29 | 昭和電工株式会社 | 導光部材および面光源装置ならびに表示装置 |
| CN101379163B (zh) | 2006-02-02 | 2013-01-02 | 三菱化学株式会社 | 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物 |
| CN101077973B (zh) * | 2006-05-26 | 2010-09-29 | 大连路明发光科技股份有限公司 | 硅酸盐荧光材料及其制造方法以及使用其的发光装置 |
| JP4999783B2 (ja) * | 2007-07-12 | 2012-08-15 | 株式会社小糸製作所 | 発光装置 |
-
2004
- 2004-01-16 JP JP2004009771A patent/JP4363194B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005200584A (ja) | 2005-07-28 |
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