JP4363194B2 - 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 - Google Patents

蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Download PDF

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Publication number
JP4363194B2
JP4363194B2 JP2004009771A JP2004009771A JP4363194B2 JP 4363194 B2 JP4363194 B2 JP 4363194B2 JP 2004009771 A JP2004009771 A JP 2004009771A JP 2004009771 A JP2004009771 A JP 2004009771A JP 4363194 B2 JP4363194 B2 JP 4363194B2
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JP
Japan
Prior art keywords
light
phosphor
emitting
red
emitting device
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Expired - Fee Related
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JP2004009771A
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English (en)
Japanese (ja)
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JP2005200584A5 (https=
JP2005200584A (ja
Inventor
孝俊 瀬戸
直人 木島
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Priority to JP2004009771A priority Critical patent/JP4363194B2/ja
Publication of JP2005200584A publication Critical patent/JP2005200584A/ja
Publication of JP2005200584A5 publication Critical patent/JP2005200584A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2004009771A 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Expired - Fee Related JP4363194B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004009771A JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004009771A JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Publications (3)

Publication Number Publication Date
JP2005200584A JP2005200584A (ja) 2005-07-28
JP2005200584A5 JP2005200584A5 (https=) 2007-03-01
JP4363194B2 true JP4363194B2 (ja) 2009-11-11

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Application Number Title Priority Date Filing Date
JP2004009771A Expired - Fee Related JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

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JP (1) JP4363194B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884956B2 (ja) * 2005-12-27 2012-02-29 昭和電工株式会社 導光部材および面光源装置ならびに表示装置
CN101379163B (zh) 2006-02-02 2013-01-02 三菱化学株式会社 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物
CN101077973B (zh) * 2006-05-26 2010-09-29 大连路明发光科技股份有限公司 硅酸盐荧光材料及其制造方法以及使用其的发光装置
JP4999783B2 (ja) * 2007-07-12 2012-08-15 株式会社小糸製作所 発光装置

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JP2005200584A (ja) 2005-07-28

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