JP4363194B2 - 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 - Google Patents

蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Download PDF

Info

Publication number
JP4363194B2
JP4363194B2 JP2004009771A JP2004009771A JP4363194B2 JP 4363194 B2 JP4363194 B2 JP 4363194B2 JP 2004009771 A JP2004009771 A JP 2004009771A JP 2004009771 A JP2004009771 A JP 2004009771A JP 4363194 B2 JP4363194 B2 JP 4363194B2
Authority
JP
Japan
Prior art keywords
light
phosphor
emitting
red
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004009771A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005200584A (ja
JP2005200584A5 (enExample
Inventor
孝俊 瀬戸
直人 木島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2004009771A priority Critical patent/JP4363194B2/ja
Publication of JP2005200584A publication Critical patent/JP2005200584A/ja
Publication of JP2005200584A5 publication Critical patent/JP2005200584A5/ja
Application granted granted Critical
Publication of JP4363194B2 publication Critical patent/JP4363194B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Planar Illumination Modules (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004009771A 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Expired - Fee Related JP4363194B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004009771A JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004009771A JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Publications (3)

Publication Number Publication Date
JP2005200584A JP2005200584A (ja) 2005-07-28
JP2005200584A5 JP2005200584A5 (enExample) 2007-03-01
JP4363194B2 true JP4363194B2 (ja) 2009-11-11

Family

ID=34822700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004009771A Expired - Fee Related JP4363194B2 (ja) 2004-01-16 2004-01-16 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Country Status (1)

Country Link
JP (1) JP4363194B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884956B2 (ja) * 2005-12-27 2012-02-29 昭和電工株式会社 導光部材および面光源装置ならびに表示装置
WO2007088966A1 (ja) 2006-02-02 2007-08-09 Mitsubishi Chemical Corporation 複合酸窒化物蛍光体、それを用いた発光装置、画像表示装置、照明装置及び蛍光体含有組成物、並びに、複合酸窒化物
CN101077973B (zh) * 2006-05-26 2010-09-29 大连路明发光科技股份有限公司 硅酸盐荧光材料及其制造方法以及使用其的发光装置
JP4999783B2 (ja) * 2007-07-12 2012-08-15 株式会社小糸製作所 発光装置

Also Published As

Publication number Publication date
JP2005200584A (ja) 2005-07-28

Similar Documents

Publication Publication Date Title
EP1715023B1 (en) Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display
JP4168776B2 (ja) 発光装置及びそれを用いた照明装置
JP4617890B2 (ja) 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
JP4411841B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP4165255B2 (ja) 発光装置及びそれを用いた照明装置
JP2005298805A (ja) 発光装置及び照明装置
JP4389513B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP4363194B2 (ja) 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
JP4561064B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP2004253747A (ja) 発光装置及びそれを用いた照明装置
JP4706358B2 (ja) 青色発光蛍光体およびその製造方法、発光装置、照明装置、ディスプレイ用バックライト並びにディスプレイ
JP2004235546A (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP5326986B2 (ja) 発光装置に用いる蛍光体
JP4972904B2 (ja) 蛍光体、その蛍光体の製造方法、その蛍光体を用いた発光装置、画像表示装置及び照明装置
JP4617889B2 (ja) 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
JP4617888B2 (ja) 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
JP4337468B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP2010059429A (ja) 蛍光体、それを用いた発光装置、画像表示装置及び照明装置
JP2005064189A (ja) 発光装置及び照明装置ならびに画像表示装置
JP4337465B2 (ja) 発光装置及び照明装置ならびに画像表示装置
JP4433847B2 (ja) 蛍光体、それを用いた発光装置、画像表示装置及び照明装置
JP4246502B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP4604516B2 (ja) 発光装置及びそれを用いた照明装置並びにディスプレイ
JP2007009141A (ja) 青色発光蛍光体およびその製造方法、発光装置、照明装置、ディスプレイ用バックライト並びにディスプレイ
JP4380118B2 (ja) 発光装置及びそれを用いた照明装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070112

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070112

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090417

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090624

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20090624

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090728

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090810

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120828

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130828

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees