JP4361542B2 - Dicing sheet affixing method - Google Patents

Description

  The present invention relates to a dicing sheet attaching method for attaching a dicing sheet to a laminate in which a plurality of ceramic green sheets are laminated.

For example, in a process of manufacturing a multilayer electronic component such as a ceramic capacitor, a multilayer body in which a plurality of ceramic green sheets having a conductive pattern is stacked is manufactured, and the multilayer body is formed into chips with a predetermined shape and size by dicing. A process is included. When dicing is performed, a dicing sheet having surface adhesiveness is attached to the laminate as an underlay in order to prevent scattering of the laminated laminate in chips (see, for example, Patent Document 1).
JP-A-8-236388

  By the way, when a dicing sheet is affixed to a laminated body, a space | gap may arise between a laminated body and a dicing sheet. If dicing is performed in a state where such voids are generated, chipping and cracks are likely to occur in the laminate, which may reduce the yield of the product.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for attaching a dicing sheet that can suppress the generation of voids between the dicing sheet and the laminate.

  In order to solve the above-mentioned problems, a dicing sheet sticking method according to the present invention is a sticking of a dicing sheet in which a dicing sheet is attached to a laminate in which a plurality of ceramic green sheets are laminated, and the laminate is diced through the dicing sheet. A method of preparing an adsorption plate having an adsorption surface capable of adsorbing a dicing sheet, adsorbing the dicing sheet to the adsorption surface so that one end of the dicing sheet protrudes from the adsorption surface, and a dicing sheet in a laminate A step of pressing one end of the dicing sheet against the planned pasting surface with a pressing roller while the suction surface is inclined with respect to the planned pasting surface so that the one end of the dicing sheet is close to the planned pasting surface The dicing sheet is released from the suction surface after the suction of the dicing sheet on the surface is released. A step of moving at least one of the suction plate and the laminated body in the in-plane direction of the pasting surface and transporting the dicing sheet from the suction surface side to the pasting surface side while pressing with a pressing roller. It is characterized by.

  In this dicing sheet sticking method, the dicing sheet is fixed to the suction plate so that one end portion of the dicing sheet protrudes from the suction surface, and this one end portion is pressed against the planned sticking surface of the laminate by a pressing roller. Then, the entire dicing sheet is transported to the side to be pasted in a flattened state by the suction force slightly remaining on the suction surface after releasing the suction and the pressing force by the pressing roller. By such a method, generation | occurrence | production of the space | gap between the bonded dicing sheet and a laminated body is suppressed, and it becomes possible to suppress generation | occurrence | production of the chipping and crack of a laminated body at the time of dicing.

  Moreover, it is preferable that the open angle which an adsorption | suction surface and a sticking scheduled surface comprise is in the range of 2 degrees-6 degrees. When the open angle is less than the lower limit, a portion other than one end of the dicing sheet may come into contact with the surface to be pasted, and a gap is likely to be generated between the dicing sheet and the laminate. In addition, when the open angle exceeds the upper limit, the dicing sheet may be creased when pressing one end of the dicing sheet against the surface to be pasted with the pressing roller. It becomes easy to produce a space | gap. Therefore, by setting the open angle within the above range, it is possible to more reliably suppress the generation of voids between the dicing sheet and the laminate.

  Moreover, it is preferable that the pressing force applied to the one end part of a dicing sheet with a press roller is the range of 0.2 MPa-0.8 MPa. If the pressing force is less than the lower limit, the adhesiveness between the dicing sheet and the laminate is insufficient, and the original function of the dicing sheet that prevents scattering of the laminate formed into chips during dicing may not be sufficiently exhibited. Moreover, when a pressing force exceeds an upper limit, a laminated body may deform | transform with an excessive load. Therefore, a dicing sheet can be suitably affixed to a laminated body by setting pressing force in the said range.

  According to the dicing sheet sticking method of the present invention, it is possible to suppress the generation of voids between the dicing sheet and the laminate. Thereby, generation | occurrence | production of the chipping and crack of a laminated body at the time of dicing can be suppressed.

  Hereinafter, preferred embodiments of a dicing sheet attaching method according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view of a ceramic capacitor shown as an example of a ceramic electronic component manufactured by using a dicing sheet attaching method according to an embodiment of the present invention. As shown in FIGS. 1 and 2, the ceramic capacitor 1 includes an element portion 2 having a substantially rectangular parallelepiped shape, and a pair of terminal electrodes 3 and 3 formed at both ends in the longitudinal direction of the element portion 2. Yes.

  As shown in FIG. 2, the element portion 2 is configured by alternately laminating dielectric layers 4 and internal electrode layers 5. As shown in FIG. 3, such an element portion 2 is formed by sequentially laminating dielectric layers 4 on which rectangular internal electrode layers 5 are formed. Further, dielectric layers 6 in which the internal electrode layer 5 is not formed are laminated as protective layers at both ends of the element unit 2 in the lamination direction. Although simplified in FIG. 2, the dielectric layer 4 is actually laminated by about 300 layers.

  The internal electrode layers 5 and 5 adjacent to each other in the upper and lower sides face each other with a certain area and are electrically insulated from each other by the dielectric layer 4. The internal electrode layers 5 and 5 extend to the end of the dielectric layer 4 and are electrically connected to one terminal electrodes 3 and 3 different from each other. Therefore, when a predetermined voltage is applied to the terminal electrodes 3, 3, charges proportional to the facing area are stored between the internal electrode layers 5, 5 facing vertically.

  Next, a method for manufacturing the ceramic capacitor 1 having the above-described configuration will be described.

When manufacturing the ceramic capacitor 1, first, for example, a slurry obtained by adding a resin binder and a predetermined solvent to a dielectric powder mainly composed of BaTiO ₃ is applied on a base film (not shown) with a predetermined thickness, and then the ceramic capacitor 1 is manufactured. A green sheet 7 is produced. Next, a rectangular conductor pattern 6 is formed in a matrix on the ceramic green sheet 7 by screen printing a conductor paste mainly composed of Ni or Ag, for example. After performing predetermined drying, the ceramic green sheets 7 on which the conductor patterns 6 are formed are stacked in a predetermined order, and further, the ceramic green sheets 8 on which the conductor patterns 6 are not formed are stacked on both ends in the stacking direction. As shown to (a) and (b), the laminated body 9 of the ceramic green sheets 7 and 8 is formed. After the laminated body 9 is formed, the laminated body 9 is pressed in the laminating direction using a predetermined pressing device (not shown), and the ceramic green sheets 7 and 8 are pressure-bonded to each other.

  After the laminated body 9 is formed, a step of dicing the laminated body 9 into chips is performed. FIG. 5 is a side view showing a device configuration of a dicing sheet sticking device used in this dicing step. FIG. 6 is a plan view of FIG. As shown in FIGS. 5 and 6, the dicing sheet sticking apparatus 10 includes a sheet transport mechanism 11, a transport stage 12, a forward suction plate 13, a vacuum suction plate 14, a sticking stage 15, and a laminate transport. The apparatus is provided with a mechanism 16 and is configured as an apparatus for affixing the dicing sheet 40 to the affixing planned surface 9a (see FIG. 7) of the laminate 9 in which a plurality of ceramic green sheets are laminated.

  The sheet transport mechanism 11 includes a feeding roller 21, a take-up roller 22, and auxiliary rollers 23 and 24 for tension adjustment. From the feeding roller 21, a long base film 50 made of, for example, PET (polyethylene terephthalate) is fed out. On one surface side of the base film 50, for example, a dicing sheet 40 made of a thermally foamable resin containing polystyrene is formed. The dicing sheet 40 has a substantially square shape with a side of 160 mm, for example, and is formed at predetermined intervals along the longitudinal direction of the base film 50.

  After the base film 50 is fed from the feed roller 21, it is guided to the transport stage 12 while being subjected to tension adjustment by the auxiliary roller 23. After the base film 50 travels on the upper surface side of the transport stage 12, the base film 50 is folded downward at an acute angle along the edge portion 12 a provided at the tip of the transport stage 12, whereby the base film 50 is turned into the dicing sheet 40. Is peeled off. Thereafter, the base film 50 is wound around the winding roller 22 while being subjected to tension adjustment by the auxiliary roller 24.

  The forward suction plate 13 is a rectangular suction plate that assists in transporting the dicing sheet 40 on the transport stage 12. The forward suction plate 13 is disposed, for example, above the upstream side of the transport stage 12, and is moved to the transport stage 12 in synchronization with the dicing sheet 40 being guided onto the transport stage 12 by the sheet transport mechanism 11. Go down. The forward suction plate 13 travels a predetermined distance downstream on the transport stage 12 together with the base film 50 while pressing the dicing sheet 40 toward the transport stage 12, and then above the transport stage 12. evacuate.

  The vacuum suction plate 14 is a rectangular suction plate used for attaching the dicing sheet 40 to the laminate 9. The bottom surface of the vacuum suction plate 14 is a suction surface 14a in which many air holes (not shown) are arranged. The adsorption surface 14a can detachably adsorb the dicing sheet 40 by switching on / off of intake air by a pump (not shown) through an air hole. A pressing roller 17 wider than the dicing sheet 40 is provided in front of the vacuum suction plate 14. The pressing roller 17 is connected to the front end portion of the vacuum suction plate 14 via a support plate 18 protruding forward from the side surface of the vacuum suction plate 14, and is supported substantially parallel to the front end side of the suction surface 14a.

  The vacuum suction plate 14 is disposed above the forward suction plate 13 on the downstream side of the transport stage 12 and descends toward the transport stage 12 after the forward suction plate 13 is retracted from the transport stage 12. After the dicing sheet 40 is adsorbed to the adsorbing surface 14a, the vacuum adsorbing plate 14 travels on the conveying stage 12 together with the base film 50 until it passes through the edge portion 12a. Then, after the base film 50 is peeled from the dicing sheet 40, the vacuum suction plate 14 conveys the dicing sheet 40 toward the sticking stage 15.

  As shown in FIG. 6, the stacked body transport mechanism 16 includes a supply stocker 25, a storage stocker 26, and a transport arm (not shown). 4 is accommodated in the supply stocker 25, and the transport arm is synchronized with the dicing sheet 40 being transported onto the pasting stage 15 by the vacuum suction plate 14. 9 is placed on the stage 15 for sticking. After the pasting of the dicing sheet 40 is completed, the transport arm transports the stacked body 9 to the storage stocker 26.

  When the dicing sheet 40 is stuck to the laminate 9 using such a dicing sheet sticking apparatus 10, first, the base film 50 on which the dicing sheet 40 is formed is transported to the transport stage 12 by the sheet transport mechanism 11. Then, the dicing sheet 40 is conveyed to the downstream side of the conveying stage 12 while being pressed by the forward suction plate 13. After the conveyance, the forward suction plate 13 is retracted.

  Next, the degree of vacuum on the suction surface 14a of the vacuum suction plate 14 is reduced to about -60 kPa, and the front end (one end) 40a of the dicing sheet 40 protrudes about 30 mm from the suction surface 14a. Is adsorbed on the adsorption surface 14a. In this state, the vacuum suction plate 14 is caused to run along with the base film 50 until it passes through the edge portion 12a of the transfer stage 12, and the base film 50 is peeled from the dicing sheet 40. After the base film 50 is peeled off, the vacuum suction plate 14 is moved onto the sticking stage 15. Further, the laminate transport mechanism 16 transports the laminate 9 to the inside of the positioning frames 27 and 27 on the sticking stage 15 by the transport arm. Thereby, the laminated body 9 is arrange | positioned in the approximate center of the sticking stage 15 in the state which faced the sticking plan surface 9a of the dicing sheet 40 to the upper surface side.

  After moving the vacuum suction plate 14 onto the pasting stage 15, as shown in FIG. 7A, the height of the rear end side of the vacuum suction plate 14 is made relatively higher than the front end side. The suction surface 14a is inclined with respect to the planned application surface 9a so that the front end portion 40a of the dicing sheet 40 protruding from the adsorption surface 14a is close to the planned application surface 9a of the laminate 9. Then, in this state, the vacuum suction plate 14 is lowered toward the pasting stage 15, and the front end portion 40a of the dicing sheet 40 is pressed against the planned pasting surface 9a by the pressing roller 17, as shown in FIG.

  At this time, the opening angle θ formed by the suction surface 14a and the pasting planned surface 9a is in a range of about 2 ° to about 6 ° in order to prevent contact between the rear end portion 40b of the dicing sheet 40 and the pasting planned surface 9a. The angle is preferably about 3.6 °. Further, the pressing force applied to the front end portion 40a of the dicing sheet 40 by the pressing roller 17 is in the range of about 0.2 MPa to about 0.8 MPa, preferably about 0.55 MPa so that an excessive load is not applied to the laminate 9. To the extent.

  After pressing the front end portion 40a of the dicing sheet 40, suction by a pump (not shown) is stopped, and suction of the dicing sheet 40 on the suction surface 14a is released. When the suction is released, the degree of vacuum on the suction surface 14a becomes approximately 0 MPa in about 0.5 seconds, and the dicing sheet 40 is detached from the suction surface 14a. Therefore, as shown in FIG. 8A, after the suction is released until the dicing sheet 40 is detached from the suction surface 14a, that is, while the vacuum residual pressure due to intake air remains on the suction surface 14a. The vacuum suction plate 14 is moved in parallel to the rear end portion 40b side of the dicing sheet 40.

  Thereby, the dicing sheet 40 is conveyed from the suction surface 14a side to the pasting planned surface 9a side in a state where the dicing sheet 40 as a whole is flattened by the suction force slightly remaining on the suction surface 14a and the pressing force by the pressing roller 17. As shown in FIG. 8 (b), the attachment of the dicing sheet 40 to the planned attachment surface 9a of the laminate 9 is completed. After the pasting is completed, the stacked body transport mechanism 16 transports the stacked body 9 to the storage stocker 26 (see FIG. 6). After the dicing sheet 40 is pasted, the laminate 9 is diced using the dicing sheet 40 as an underlay to form chips into a predetermined shape and size. Thereafter, a firing process for firing the laminate 9, an electrode formation process for forming the terminal electrodes 3 and 3 at both ends of the laminate 9, and a plating process for plating the surfaces of the terminal electrodes 3 and 3, 1 to 3 complete the ceramic capacitor 1.

  As described above, in this dicing sheet attaching method, the dicing sheet 40 is adsorbed to the adsorbing surface 14a so that the front end portion 40a of the dicing sheet 40 protrudes from the adsorbing surface 14a, and the front end portion 40a is absorbed by the pressing roller 17. The laminate 9 is pressed against the planned pasting surface 9a. Then, the entire dicing sheet 40 is conveyed to the side to be pasted surface 9a in a state where the entire dicing sheet 40 is flattened by the suction force slightly remaining on the suction surface 14a after releasing the suction and the pressing force by the pressing roller 17. By such a method, generation | occurrence | production of the space | gap between the bonded dicing sheet 40 and the laminated body 9 is suppressed, and it becomes possible to suppress the generation | occurrence | production of the chipping and the crack of the laminated body 9 at the time of dicing.

  Further, when the dicing sheet 40 is pasted, the opening angle θ formed by the suction surface 14a and the planned pasting surface 9a is in the range of 2 ° to 6 °. When the opening angle θ is less than the lower limit, a portion other than the front end portion 40a of the dicing sheet 40 may come into contact with the pasted surface 9a, and a gap is likely to be generated between the dicing sheet 40 and the laminate 9. When the opening angle θ exceeds the upper limit, the dicing sheet 40 may be folded when the front end portion 40a of the dicing sheet 40 is pressed against the planned pasting surface 9a by the pressing roller 17, and in this case as well, the dicing sheet 40 is creased. And a gap between the laminated body 9 are easily generated. Therefore, by setting the opening angle θ within the above range, the generation of a gap between the dicing sheet 40 and the laminate 9 can be more reliably suppressed.

  The pressing force applied to the front end portion 40a of the dicing sheet 40 by the pressing roller 17 is preferably in the range of 0.2 MPa to 0.8 MPa. When the pressing force is less than the lower limit, the adhesiveness between the dicing sheet 40 and the laminate 9 is insufficient, and the original function of the dicing sheet 40 that prevents scattering of the laminate 9 formed into chips at the time of dicing is not sufficiently exhibited. There is. Moreover, when the pressing force exceeds the upper limit, the laminate 9 may be deformed by an excessive load. Therefore, the dicing sheet 40 can be suitably attached to the laminate 9 by setting the pressing force within the above range.

  Then, the experiment conducted in order to verify the space | gap suppression effect between a dicing sheet and a laminated body at the time of using the sticking method of the dicing sheet mentioned above is demonstrated.

  In this experiment, when the front end portion 40a of the dicing sheet 40 adsorbed on the suction surface 14a of the vacuum suction plate 14 is brought into contact with the planned attachment surface 9a of the laminate 9, the suction surface 14a and the planned attachment surface 9a are opened. The sticking state between the dicing sheet 40 and the laminate 9 under each condition is observed by changing the angle θ and the pressing force by the pressing roller 17. In this experiment, the dicing sheet 40 is sucked to the suction surface 14a so that the front end portion 40a of the dicing sheet 40 protrudes from the suction surface 14a by about 30 mm, and the opening angle θ is changed in the range of 1 ° to 15 °. The pressing force was changed in the range of 0.1 MPa to 1.5 MPa. Under each condition, 100 samples of the laminate 9 were prepared, and after dicing was released, the dicing sheet 40 was attached to the laminate 9 using the adsorption force slightly remaining on the adsorption surface 14a, and then diced lamination The number of chipping cracks in the body 9 was also examined.

  FIG. 9 is a diagram illustrating the observation result of the pasting state with respect to the change in the opening angle θ. As shown in the figure, when the open angle θ was in the range of 3 ° to 5 °, no gap was generated between the dicing sheet 40 and the laminated body 9, and the film was in a good pasting state. In this case, the number of chipping cracks in the diced laminate 9 was 0/100. On the other hand, when the opening angle θ was 1 °, the rear end portion 40b of the dicing sheet 40 was in contact with the planned pasting surface 9a, and a gap was generated between the dicing sheet 40 and the laminate 9. In this case, chipping cracks occurred in all the diced laminates 9. Further, when the opening angle θ was 7 ° or more, the dicing sheet 40 was bent when the pressing roller 17 pressed the front end portion 40a of the dicing sheet 40 against the planned application surface 9a. In these cases, the number of chipping cracks in the diced laminate 9 is 10/100 when the opening angle θ is 7 °, 12/100 when the opening angle θ is 10 °, and the opening angle. When θ was 15 °, the number was 16/100.

  Moreover, FIG. 10 is a figure which shows the observation result of the sticking state with respect to the change of pressing force. As shown in the figure, when the pressing force was in the range of 0.3 MPa to 0.7 MPa, no gap was generated between the dicing sheet 40 and the laminate 9, and a good pasting condition was obtained. In this case, the number of chipping cracks in the diced laminate 9 was 0/100. On the other hand, when the pressing force was 0.1 MPa, sufficient adhesion between the dicing sheet 40 and the laminate 9 could not be obtained, resulting in poor sticking. In this case, chipping cracks occurred in all the diced laminates 9. Further, when the pressing force was 1.0 MPa or more, an excessive load was applied to the laminate 9 and the laminate 9 was deformed. In these cases, the number of chipping cracks in the diced laminate 9 was 7/100 when the pressing force was 1.0 MPa, and 11/100 when the pressing force was 1.5 MPa. .

  As described above, when the dicing sheet pasting method according to the present invention is used, the generation of a gap between the dicing sheet 40 and the laminate 9 is effectively suppressed. This is because the dicing sheet 40 can be pasted on the planned pasting surface 9a in a state in which the entire dicing sheet 40 is flattened by the slight suction force remaining on the suction surface 14a and the pressing force by the pressing roller 17. The effectiveness of the present invention was confirmed. Further, the opening angle θ formed between the suction surface 14a and the pasting surface 9a when the dicing sheet 40 is pasted, and the pressing force applied to the front end portion 40a of the dicing sheet 40 by the pressing roller 17 are within the above range. It was confirmed that the dicing sheet 40 can be satisfactorily adhered to the laminate 9, and the occurrence of chipping and cracks in the laminate 9 during dicing can be effectively suppressed.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, a ceramic capacitor is illustrated as an example of a ceramic electronic component. However, the dicing sheet attaching method can be applied to the manufacture of other ceramic electronic components such as a chip varistor, a chip inductor, and a chip bead. .

It is a perspective view of the ceramic capacitor shown as an example of the ceramic electronic component manufactured using the sticking method of the dicing sheet concerning one embodiment of the present invention. It is the II-II sectional view taken on the line in FIG. It is a figure which shows the structure of the internal electrode layer formed in each dielectric material layer. It is an exploded perspective view of a layered product, and a perspective view which cuts and shows a part of this layered product. It is a figure which shows the structure of a dicing sheet sticking apparatus. It is a top view of the dicing sheet sticking apparatus shown in FIG. It is a figure which shows the process of affixing a dicing sheet on a laminated body by the dicing sheet sticking apparatus shown in FIG.5 and FIG.6. FIG. 8 is a diagram showing a step subsequent to FIG. 7. It is an observation result of the sticking state of a dicing sheet and a laminated body at the time of changing the open angle which an adsorption surface and a sticking plan side make. It is an observation result of the sticking state of a dicing sheet and a laminated body at the time of changing the pressing force to the front end part of a dicing sheet by a pressing roller.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Ceramic capacitor, 7, 8 ... Ceramic green sheet, 9 ... Laminated body, 9a ... Planned sticking surface, 14 ... Vacuum suction plate (suction plate), 14a ... Suction surface, 17 ... Pressure roller, 40 ... Dicing sheet, 40a ... front end (one end), θ ... open angle.

Claims (3)

A dicing sheet attaching method for attaching a dicing sheet to a laminate in which a plurality of ceramic green sheets are laminated,
Preparing an adsorption plate having an adsorption surface capable of adsorbing the dicing sheet, and adsorbing the dicing sheet to the adsorption surface such that one end of the dicing sheet protrudes from the adsorption surface;
One end portion of the dicing sheet is pressed by the pressing roller in a state where the suction surface is inclined with respect to the pasting surface so that the one end portion of the dicing sheet is close to the pasting surface of the dicing sheet in the laminate. A step of pressing the planned pasting surface by:
The at least one of the suction plate and the laminated body is moved in the in-plane direction of the pasting surface after the suction of the dicing sheet on the suction surface until the dicing sheet is detached from the suction surface. And a step of conveying the dicing sheet from the suction surface side to the pasting surface side while being pressed by the pressing roller.   The dicing sheet sticking method according to claim 1, wherein an opening angle formed by the suction surface and the sticking scheduled surface is in a range of 2 ° to 6 °. 3. The dicing sheet sticking method according to claim 1, wherein a pressing force applied to the one end portion of the dicing sheet by the pressing roller is in a range of 0.2 MPa to 0.8 MPa.

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