JP4361310B2 - プリント回路基板用の巻き付け冷却機構 - Google Patents

プリント回路基板用の巻き付け冷却機構 Download PDF

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Publication number
JP4361310B2
JP4361310B2 JP2003112891A JP2003112891A JP4361310B2 JP 4361310 B2 JP4361310 B2 JP 4361310B2 JP 2003112891 A JP2003112891 A JP 2003112891A JP 2003112891 A JP2003112891 A JP 2003112891A JP 4361310 B2 JP4361310 B2 JP 4361310B2
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JP
Japan
Prior art keywords
thermal
pcb
heat sink
jumpers
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003112891A
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English (en)
Japanese (ja)
Other versions
JP2003318581A (ja
JP2003318581A5 (enExample
Inventor
エル デーニイ ジェフリー
ディー ダットサン ジョセフ
シー サイモン グレン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2003318581A publication Critical patent/JP2003318581A/ja
Publication of JP2003318581A5 publication Critical patent/JP2003318581A5/ja
Application granted granted Critical
Publication of JP4361310B2 publication Critical patent/JP4361310B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003112891A 2002-04-25 2003-04-17 プリント回路基板用の巻き付け冷却機構 Expired - Fee Related JP4361310B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/131476 2002-04-25
US10/131,476 US6882536B2 (en) 2002-04-25 2002-04-25 Wrap-around cooling arrangement for printed circuit board

Publications (3)

Publication Number Publication Date
JP2003318581A JP2003318581A (ja) 2003-11-07
JP2003318581A5 JP2003318581A5 (enExample) 2006-06-01
JP4361310B2 true JP4361310B2 (ja) 2009-11-11

Family

ID=22449632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003112891A Expired - Fee Related JP4361310B2 (ja) 2002-04-25 2003-04-17 プリント回路基板用の巻き付け冷却機構

Country Status (3)

Country Link
US (1) US6882536B2 (enExample)
JP (1) JP4361310B2 (enExample)
GB (1) GB2387974B (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798661B1 (en) * 2003-05-08 2004-09-28 Hewlett-Packard Development Company, L.P. Chassis conducted cooling thermal dissipation apparatus for servers
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
TWM246694U (en) * 2003-11-11 2004-10-11 Hon Hai Prec Ind Co Ltd Heat dissipation device
JP2005316861A (ja) 2004-04-30 2005-11-10 Hitachi Ltd ディスクアレイ装置
CN1988785A (zh) * 2005-12-23 2007-06-27 鸿富锦精密工业（深圳）有限公司 散热装置
JP4719079B2 (ja) * 2006-05-19 2011-07-06 株式会社東芝 電子機器
TWM304705U (en) * 2006-07-04 2007-01-11 Cooler Master Co Ltd Display card heat sink
CN101102655A (zh) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 散热装置
CN101118458A (zh) * 2006-07-31 2008-02-06 华硕电脑股份有限公司 配置均温板的电子装置
JP4921096B2 (ja) * 2006-09-28 2012-04-18 富士通株式会社 電子機器および冷却部品
US7447033B2 (en) * 2006-11-01 2008-11-04 Apple Inc. Embedded thermal-electric cooling modules for surface spreading of heat
CN101193534A (zh) * 2006-11-29 2008-06-04 富准精密工业(深圳)有限公司 散热装置
JP2008203376A (ja) * 2007-02-19 2008-09-04 Matsushita Electric Ind Co Ltd 半導体装置、並びに表示装置
JP4842346B2 (ja) * 2009-04-21 2011-12-21 シャープ株式会社 電子部品モジュールおよびその製造方法
US8547699B1 (en) 2010-11-09 2013-10-01 Adtran, Inc. Enclosure for outside plant equipment with interconnect for mating printed circuit boards, printed circuit board device and method of repairing outside plant equipment
US9089076B2 (en) 2012-07-06 2015-07-21 International Business Machines Corporation Cooling system for electronics
US9261924B2 (en) * 2013-09-05 2016-02-16 Dell Inc. Heat pipe assemblies
US9111915B1 (en) 2014-02-24 2015-08-18 Honeywell International Inc. Thermal conduction cooling
JP6161816B2 (ja) 2014-06-27 2017-07-12 三菱電機株式会社 一体型電動パワーステアリング装置、及びその製造方法
US9605821B2 (en) * 2014-11-19 2017-03-28 GE Lighting Solutions, LLC Outdoor LED luminaire with plastic housing
US10136557B2 (en) * 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
DE102016115665B3 (de) * 2016-08-24 2018-01-18 Harting Electric Gmbh & Co. Kg Steckverbinder
US10199904B2 (en) 2017-02-23 2019-02-05 Schaft Inc. Cooling a heat-generating electronic device
CN107703700A (zh) * 2017-09-13 2018-02-16 广东欧珀移动通信有限公司 终端设备、电路板组件、闪光灯组件及其制造方法
US20190301809A1 (en) * 2018-04-03 2019-10-03 Aavid Thermalloy, Llc Wrap around heat exchanger
FR3080501B1 (fr) * 2018-04-23 2021-10-08 Valeo Systemes Thermiques Groupe moto-ventilateur pour vehicule automobile comprenant une carte electronique de commande d’un moteur electrique
US11277545B2 (en) 2020-02-27 2022-03-15 Gopro, Inc. Heatsink of an image capture device
US11146711B1 (en) 2020-04-10 2021-10-12 Gopro, Inc. Heatsinks for an image capture device
US11665856B2 (en) * 2021-10-26 2023-05-30 Eagle Technology, Llc Electronic device having flexible, heat conductive layer and associated methods
US12081848B2 (en) 2022-08-23 2024-09-03 Gopro, Inc. Multifunctional heatsink
US12075141B2 (en) 2022-08-23 2024-08-27 Gopro, Inc. Heatsinks and thermal architecture of an image capture device
US12389102B2 (en) 2022-08-23 2025-08-12 Gopro, Inc. Bucket architecture for an image capture device including a reconfigurable PCB module
US12316932B2 (en) 2023-08-11 2025-05-27 Gopro, Inc. Adjustable thermal solution
US20250107045A1 (en) * 2023-09-21 2025-03-27 Advanced Micro Devices, Inc. Systems and methods for cooling accelerators having back side power delivery components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492535A (en) 1968-01-08 1970-01-27 Ncr Co Ceramic circuit card
US5237485A (en) * 1985-04-26 1993-08-17 Sgs Microelettronica S.P.A. Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board
US5184283A (en) 1991-12-23 1993-02-02 Ford Motor Company Power device assembly and method
DE69227522T2 (de) * 1992-05-20 1999-05-06 Seiko Epson Corp., Tokio/Tokyo Kassette für eine elektronische vorrichtung
US5272599A (en) 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
US5513073A (en) * 1994-04-18 1996-04-30 International Business Machines Corporation Optical device heat spreader and thermal isolation apparatus
SE9600649L (sv) * 1996-02-21 1997-07-07 Ericsson Telefon Ab L M Värmeledande anordning
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6349035B1 (en) * 2000-09-29 2002-02-19 Compaq Information Technologies Group, L.P. Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink

Also Published As

Publication number Publication date
GB2387974A (en) 2003-10-29
US6882536B2 (en) 2005-04-19
JP2003318581A (ja) 2003-11-07
GB0309114D0 (en) 2003-05-28
GB2387974B (en) 2006-01-04
US20030202328A1 (en) 2003-10-30

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