JP4357619B2 - Multi-chamber system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present inventionMulti-chamber system having substrate positioning device and arm position monitoring device for transfer mechanismAbout.
[0002]
[Prior art]
For example, a semiconductor device such as an LSI is manufactured through many surface treatments on a substrate. An apparatus for performing surface treatment on a substrate is generally referred to as a semiconductor manufacturing apparatus. In this apparatus, an apparatus for forming a thin film such as sputtering or chemical vapor deposition (CVD) or a surface processing such as etching or impurity implantation is performed. Device included.
[0003]
In the semiconductor manufacturing apparatus described above, it is necessary to carry an unprocessed substrate into the process chamber and unload the processed substrate from the process chamber. For this reason, many semiconductor manufacturing apparatuses are provided with a substrate transfer mechanism (transfer robot). An example of a conventional substrate transport mechanism is disclosed in Japanese Patent Application No. 6-224284. The substrate transport mechanism disclosed in this document shows an example applied to a multi-chamber type sputtering apparatus.
[0004]
The substrate transport mechanism described in the above document is applied to handling by a robot, has a position control mechanism, and is a mechanism for transporting and arranging a substrate at a predetermined position in a process chamber. In this apparatus, a transfer chamber having a transfer robot is provided in the center, and a plurality of process chambers are provided around the transfer chamber. When the substrate is transferred to each process chamber by the transfer robot in the transfer chamber, the movement state of the substrate itself is monitored, the obtained monitoring data is used to determine the center point of the substrate, and the support blade for supporting the substrate is transferred. Calibrate the operating state of The means for monitoring the moving state of the substrate is a sensor array provided in the transfer chamber. More specifically, in the substrate transport mechanism according to the above document, when the substrate is transferred to each of the plurality of process chambers, the substrate and the support blade are used to accurately position the substrate with respect to a predetermined target position for each process chamber. A sensor array arranged in a direction substantially transverse to the circular arc trajectory caused by the movement of the substrate is provided in the transfer chamber, and the movement state of the substrate is monitored by this sensor array, and the relative position of the substrate and the support blade to the target position is detected. It is configured as follows.
[0005]
[Problems to be solved by the invention]
When transporting a substrate in a vacuum, the substrate transport mechanism performs not only rotation and vertical movement, but also expansion and contraction, so that the stopping accuracy particularly when the arm is extended becomes a problem. Also, the stopping accuracy of the substrate transfer mechanism in vacuum causes a decrease in product yield such as substrate breakage or particle generation. Furthermore, the stop accuracy of the substrate transport mechanism is required to be improved in three dimensions, and in particular, if the two-dimensional accuracy is poor, the yield of the substrate may be damaged or particles may be reduced.
[0006]
Furthermore, in semiconductor manufacturing using a substrate transport mechanism for each process chamber in a multi-chamber type semiconductor manufacturing apparatus, the stop accuracy of the substrate transport apparatus has been improved in recent years as the design room becomes smaller. is needed.
[0007]
According to the above-described conventional substrate transport mechanism, a sensor array of units including at least three pairs of light emitters and light receivers is used as the detection means. For example, a CCD camera is used as the detection means in this substrate transport mechanism. In this case, since at least three CCD cameras are required as a sensor array for determining the center position of the substrate and a plurality of CCD cameras must be used, the overall apparatus configuration becomes complicated. Moreover, in practice, it is very difficult to perform data processing to accurately obtain the center position of the substrate using three CCD cameras. Furthermore, since the above three CCD cameras are arranged at positions outside the transfer chamber, there is a problem that the absolute positions of the CCD camera arrangement positions tend to shift when the vacuum processing apparatus is assembled.
[0008]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and in the process chamber, the substrate positioning in the process chamber is easily and accurately performed when the substrate is transferred into the process chamber by the substrate transfer mechanism provided in the transfer chamber. An object of the present invention is to provide a multi-chamber system including an apparatus for positioning a substrate and a monitoring device for an arm position of a transfer mechanism optimum for the substrate positioning apparatus.
[0009]
[Means and Actions for Solving the Problems]
  According to the present inventionMulti-chamber systemIn order to achieve the above object, is configured as follows.
[0010]
  According to the inventionMulti-chamber systemIs
  A transfer chamber provided with a substrate transfer mechanism;
  A plurality of process chambers for performing substrate processing on a substrate that is provided around the transfer chamber and is transferred to and disposed at a predetermined position by a substrate transfer mechanism;
  At least two of the plurality of process chambers are different from each other in distance from a transfer chamber at a predetermined position for placing a substrate,
  The substrate transfer mechanism is provided with an arm that can freely rotate to change the direction toward each process chamber provided in the periphery, and an expansion / contraction operation from the transfer chamber to the process chamber. A support member that extends in the extending and contracting direction of the arm and moves along the extending direction by the expanding and contracting operation of the arm,
  The support member includes a substrate support unit that supports the substrate, and an arm that extends behind the substrate support unit in the direction in which the arm extends, and the substrate support unit is in a position where the substrate is placed at a predetermined position of each process chamber. And a rear portion located at
  At least two rear portions are provided along the extending direction corresponding to the respective process chambers having different distances, and a target portion is provided in the transfer chamber when the substrate is placed at a predetermined position of the corresponding process chamber. ,
  Furthermore, each of the plurality of process chambers is provided on the upper side of the process chamber, and is disposed at a position where the corresponding target portion can be imaged when the substrate is placed at a predetermined position of the corresponding process chamber. A plurality of imaging devices for measuring the position of
  The position data of the target part obtained by the measurement of the imaging device is compared with the reference position data taught in advance. If the difference between the position data and the reference position data is within the correctable range, the difference becomes 0. Processing control means for correcting the operation of the substrate transport mechanism,
  It is characterized by that.
As a configuration different from the above-described invention of the present application, for example, there is one target part, and each camera is arranged at a position where the target part can be detected corresponding to the arrangement position of the substrate of the process chamber, or within the imaging range of the camera. It is also conceivable to perform image processing on target portions that appear at different positions.
  However, when the (θ, r) -based substrate transport mechanism is used as in the present invention, the amount of the circumferential shift amount relative to the rotation angle shift amount depends on the radial distance from the rotation center where the target portion is provided. Come different. For example, when only one target part is provided, the target part is provided in accordance with the process chamber in which the position of the substrate is farthest from the center of rotation. In this case, the target part is not provided in other process chambers having a short arm extension / contraction distance. The distance in the radial direction is reduced, and therefore the amount of deviation in the circumferential direction is also small, the amount of deviation of the imaging data with respect to the reference position data is small, and the position deviation cannot be detected with high accuracy.
  Therefore, as in the present application, by providing the target portion according to the difference in the arrangement position of the substrate (extension distance of the arm) in each process chamber, the rotation center of the substrate transfer mechanism to the substrate arrangement regardless of the difference in the arrangement position of the substrate Sometimes, the radial distance between the target parts located in the transfer chamber (and the installation position of the camera that images the target part) can be set within an appropriate range, and highly accurate displacement detection can be performed.
  In addition, the above-described configuration does not require the camera position to be changed even in the case of addition or change of a process chamber, and only the addition or change of the target portion is sufficient, and a highly scalable multi-chamber system can be provided. There is also an effect. In addition, accurate measurement can be performed within an imaging range where optimal measurement can be performed, and a camera can be provided at low cost.
  In the above-described configuration, more preferably, the support member is attached to the arm at the center in the extending direction. According to this configuration, it is possible to maintain a balance, prevent a shift in the height direction of the substrate, and the like, and secure a positional accuracy that is important for positioning.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
[0027]
The overall configuration will be described with reference to FIG. The configuration shown in FIG. 1 is a representative example, and the present invention is not limited to this. Reference numeral 11 denotes a multi-chamber system to which the substrate positioning device in the process chamber and the arm position monitoring device of the substrate transfer mechanism according to the present invention are applied. The multi-chamber system 11 includes a separation chamber 12 provided in the center, and a plurality of process chambers (central chambers) 13 a to 13 e and a load lock chamber 14 provided around the separation chamber 12. The separation chamber 12 is a transfer chamber, and incorporates therein a substrate transfer mechanism (not shown in FIG. 1) for carrying substrates into and out of the process chambers. In each of the process chambers 13a to 13e, each process such as film formation and etching is performed on a substrate disposed at a predetermined position. The installation positions of the process chambers 13a to 13e are different from, for example, the center position serving as the reference position of the separation chamber 12.
[0028]
The substrate positioning device in the process chamber according to the present invention and the arm position monitoring device of the transfer mechanism that is the basis thereof are attached to the separation chamber 12 of the multi-chamber system 11. This substrate positioning device accurately arranges a substrate at a predetermined position in each process chamber when the substrate is transferred from the separation chamber 12 to each of the process chambers 13a to 13e by the substrate transfer mechanism. In this case, since the substrate installation position is different for each process chamber, according to the substrate positioning device provided in the separation chamber 12, the position of the substrate is monitored by the monitoring device for each process chamber in the separation chamber 12. Place the substrate in the correct position in the process chamber. Therefore, the substrate positioning device is provided with CCD cameras 15 a to 15 e corresponding to the process chambers 13 a to 13 e on the outside of the ceiling wall of the separation chamber 12. The position of the substrate in the separation chamber 12 is monitored by monitoring a substrate transport mechanism that transports the substrate with a corresponding one CCD camera and determining whether the operation is appropriate. More specifically, preferably, a mark (monitoring target portion) provided on a support member (hereinafter referred to as “fork”) for supporting a substrate in a substrate transport mechanism is provided for each process chamber by a single CCD camera as described later. This is done by monitoring. Therefore, position monitoring with respect to the substrate means fork position monitoring.
[0029]
The multi-chamber system 11 is provided with at least two types of controllers (sequence control units) 16 and 17 and a fork position monitoring computer 18 as a control system. The controller 16 is a control unit that controls the overall operation of the multi-chamber system 11, and the controller 17 is a control unit that controls the operation of the CCD cameras 15a to 15e included in the substrate positioning apparatus. Each of the controllers 16 and 17 is provided with a program for executing a predetermined operation. The fork position monitoring computer 18 is a control means used for monitoring the position of the fork provided on the arm 22 when the substrate is transported by the arm 22 of the substrate transport mechanism 21, and setting necessary conditions and inputting information. -It is a means for presenting.
[0030]
FIG. 2 shows the internal and external structures of the separation chamber 12 and one process chamber 13a, and the apparatus configuration and control system for monitoring the fork position. FIGS. 3 and 4 stop the extension of the arm 22 of the substrate transfer mechanism 21 described above. And the state of shrinkage stop is shown.
[0031]
The substrate transfer mechanism 21 provided inside the separation chamber 12 includes an arm 22 and a fork 23. The arm 22 is configured such that four relatively long pieces 22a are coupled by a rotatable coupling portion to form a substantially parallelogram whose shape is deformed. A base end 22 b of the arm 22 is coupled to a rotating shaft 24 a of a motor 24 provided substantially below the center portion of the lower wall 12 a of the separation chamber 12. The arm 22 is configured to freely rotate about a base end 22b by a motor 24. The arm 22 is configured as a mechanism that expands and contracts in the radial direction 25 of the separation chamber 12. FIG. 3 shows a state where the arm 22 is at the extension stop position, and FIG. 4 shows a state where the arm 22 is contracted and at the stop position. The rotation of the arm 22 is performed when the arm 22 is contracted and stopped as shown in FIG. A fork 23 is fixed to the tip 22 c of the arm 22. The fork 23 has a long shape, and is attached to the tip 22c of the arm 22 at the center. The fork 23 is held so that its longitudinal direction always faces the radial direction of the separation chamber 12. The fork 23 is composed of a first fork 23a on the right side and a second fork 23b on the left side which are preferably in a line-symmetrical positional relationship in FIG. 3 or FIG. The first fork 23a functions as a portion for mounting and supporting at least one substrate in a substantially horizontal state. Substrates are carried into the process chambers one by one by the first fork 23a. Furthermore, a plurality of positions (A, B, C) are provided on the upper surface of the second fork 23b as target portions for monitoring the position of the arm 22 of the substrate transport mechanism 21. In this example, three marks 26 are shown on the upper surface of the second fork 23b. On the other hand, marks 27 are shown at two positions (D, E) on the upper surface of the first fork 23a. These marks are used for positioning the substrate in each of the process chambers 13a to 13e or the load lock chamber 14.
[0032]
In the fork 23, the second fork 23b can be recognized as, for example, a mark display member extending rearward from the rear end of the first fork 23a with respect to the first fork 23a for supporting the substrate. It is. This mark display member is recognized as an extended portion having a fixed positional relationship with the first fork 23a. In such a viewpoint, the first fork and the second fork are not necessarily provided symmetrically. Further, when the first fork and the second fork are symmetrical, the first fork and the second fork can be equally provided with the same functions of supporting the substrate and displaying the mark.
[0033]
In FIG. 3, the substrate transport mechanism 21 is viewed from the direction of the arrow 28 as shown in FIG. The pair of arm pieces on the proximal end side and the pair of arm pieces on the distal end side are connected with different height positions, thereby enabling the above-described expansion and contraction operation. The substrate transport mechanism 21 can move the entire position in the height direction.
[0034]
An example of the fork 23 will be further described in detail with reference to FIG. FIG. 6 shows that the position of the mark 26 on the second fork 23b is three, for example, A, B, and C, and the position of the substrate holding center portion on the first fork 23a is D (matches the electrode center portion of the process chamber). ) And E (in the case of the central portion of the load lock chamber), for example, two cases are shown. As described above, by preparing the marks 26 at a plurality of positions, the positions from the central portion of the separation chamber 12 to the process chambers 13a to 13e are not constant and correspond to different configurations for each process chamber. When the arm 22 of the substrate transport mechanism 21 rotates, the circumferential direction depends on the position of the mark 26 used by the second fork 23b and the position of the substrate holding center used by the first fork 23a. The length of movement (the length of the arc) is different. Therefore, the center of the separation chamber 12 is converted by converting the length of the arc when the arm 22 is rotated into the number of pulses according to the position of the mark 26 of the second fork 23b and the position of the substrate holding center of the first fork 23a. Teaching (teaching) with respect to the arrangement position of each substrate 29 is possible even when the position from the section to each of the process chambers 13a to 13e is not constant.
[0035]
Next, with reference to FIG. 2, the operation of carrying a substrate (not shown in FIG. 2) into the process chamber 13a will be described. In FIG. 2, in the separation chamber 12 and the process chamber 13a, the substrate transport mechanism 21 is in the stretch stop state shown in FIG. 3, and the substrate is carried into the process chamber 13a. At this time, whether or not the set position of the substrate in the process chamber 13a is at a predetermined correct position is monitored by the aforementioned monitoring device attached to the separation chamber 12. The monitoring apparatus includes a CCD camera 15a corresponding to the process chamber 13a. The CCD camera 15a is fixedly provided outside the ceiling wall 12b of the separation chamber 12, and photographs the inside of the separation chamber 12 from above through a viewing port 31 provided on the ceiling wall 12b.
[0036]
The position monitoring CCD camera is provided corresponding to each of the process chambers 13a to 13e. This is because the arrangement position for each process chamber is different and the set position of the substrate is different for each process chamber.
[0037]
The CCD camera 15 a is connected to a CCD camera controller 17, and the CCD camera controller 17 is connected to a fork position monitoring personal computer 18. The CCD camera controller 17 controls the imaging of the CCD camera 15 a and sends the processed imaging data to the monitoring personal computer 18. The CCD camera controller 17 and the monitoring personal computer 18 are connected to a controller 16 for the apparatus main body. The controller 16 is further connected to a drive controller 32 that controls the drive of the substrate transport mechanism 21. The controller 32 controls the operation of the motor 24 that drives the substrate transport mechanism 21.
[0038]
For example, a plurality of illuminators 33 are disposed outside the viewing port 31 and around the CCD camera 15a. For example, a lamp is used as the illuminator 33. These illuminators 33 are connected to the light source unit 34. The illuminator 33 brightens the inside of the separation chamber 12 through the viewing port 31 to facilitate imaging and observation by the CCD camera 15a. In the state shown in FIG. 2, the substrate (not shown) is held on the first fork 23a, the arm 23 extends, and the substrate is set at a predetermined position in the process chamber 13a at the extended stop position. At this time, the upper CCD camera 15 a monitors the position of the mark 26 on the second fork 23 b of the arm 22 of the substrate transport mechanism 21 through the viewing port 31 and images it. The mark 26 to be monitored is a mark related to the process chamber 13a among the three marks (A to C) described above. Here, it is assumed that the mark is the mark 26. The CCD camera 15a monitors the position of the mark 26 on the second fork 23b from above at a fixed position, picks up an image, and measures the position. In the substrate positioning apparatus according to the present embodiment, the position of the mark 26 is detected at the extension stop position of the arm 22 for carrying the substrate into the process chamber 13a in the substrate transfer mechanism 21, and the position is predetermined by teaching. By comparing with the position, it is determined whether or not the substrate is correctly placed at the determined position in the process chamber 13a. When the arrangement of the substrates deviates from the determined position within an allowable range, correction is automatically performed under a predetermined condition described later, and positioning is performed at the correct position.
[0039]
In addition, on the inner surface of the lower wall 12a of the separation chamber 12, a mark 35 for detecting the displacement of the CCD camera 15a itself is provided corresponding to the fixed position of the CCD camera 15a that is fixedly arranged outside the separation chamber 12a. Yes. The CCD camera 15a is attached so that the mark 35 can always be imaged. The mark 35 is a mark formed on the lower wall 12a, for example, and its position is unchanged. Therefore, the change of the image of the mark 35 picked up by the CCD camera 15a from a predetermined position means that the mounting position of the CCD camera 15a itself is shifted and changed. By using the mark 35, it is possible to detect the positional deviation of the CCD camera 15a itself. The configuration of the CCD camera 15a, the mark 35, and the like related to the process chamber 12 in the separation chamber 12 is the same for the other process chambers. Accordingly, a viewing port is provided corresponding to the CCD camera of each process chamber, and a mark is formed at a corresponding position on the inner surface of the lower wall of each chamber.
[0040]
In FIG. 1, five CCD cameras 15 a to 15 e are provided outside the ceiling wall 12 a of the separation chamber 12 corresponding to each of the process chambers 13 a to 13 e.
[0041]
Next, referring to FIG. 1 to FIG. 6 as hardware, and further to FIG. 7 to FIG. 16, the arm operation of the substrate transport mechanism 21 for loading and unloading the substrate in each process chamber and the like, the CCD camera 15a Operations such as measurement / monitoring and automatic correction related to the substrate position by .about.15e and detection of deviation of the CCD camera itself will be described. The substrate transport mechanism 21 in the separation chamber 12 loads and unloads substrates in each of the process chambers 13 a to 13 e around the separation chamber 12. Here, the conveyance of the substrate in the process chamber 13a will be described as an example.
[0042]
In the substrate transport mechanism 21, the arm 22 is rotatable about its base end 22 b (located at the central portion of the separation chamber 12) and is extendable in the radial direction 25 of the separation chamber 12. In the expansion / contraction operation of the arm 22, there are two stop states, an extension stop position (state shown in FIG. 3) and a contraction stop position (state shown in FIG. 4). A process chamber for carrying in / out the substrate is selected at a stop position in the rotation operation of the arm 22. The position where the substrate 29 supported by the first fork 23a is arranged in the process chamber is determined at the extension stop position in the extension operation of the arm 22. Further, the vertical movement of the arm 22 in the substrate transport mechanism 21 is used when adjusting the height of the stop position with respect to each process chamber. Each stop position of the arm 22 of the substrate transport mechanism 21 is given to the entire operation controller 16 that realizes the main part of the positioning device by teaching in advance.
[0043]
Next, the operation of the substrate positioning device will be described in detail. First, the operation on the fork position monitoring personal computer 18 side will be described. The flowchart of FIG. 7 shows the display content (operation menu) on the screen of the display device 18a of the monitoring personal computer 18 and the processing flow of operations for the display content. At the initial stage of the operation menu that is the display content, an initial menu screen is displayed (step S101).
[0044]
An example of the initial menu screen 41 is shown in FIG. The initial menu screen 41 includes an operation button 42 for “CCD camera position monitoring and automatic correction”, an operation button 43 for “CCD camera position monitoring”, and operation buttons 44 and 45 for other functions as operation menus. Is provided. When the “CCD camera position monitoring and automatic correction” operation button 42 is pressed, the entire system of the substrate positioning apparatus is set to the “correction mode”. Here, the “correction mode” is a position obtained by monitoring and imaging the extension stop position of the arm 22 with the CCD camera 15a when the substrate is transferred to the process chamber 13a by the arm 22 of the substrate transport mechanism 21, for example. The data is compared with the teaching reference position, and based on the difference between them, the necessity / unnecessity of position correction is determined. If necessary, the correction is automatically performed, and the arm 22 is positioned at the original correct extension stop position. Thus, it means an operation state in which control is performed to set the substrate at a correct position in the process chamber 15a. A similar operation in the correction mode is also performed when a substrate is received from the process chamber 15a by the arm 22 of the substrate transport mechanism 21. When the “CCD camera position monitoring” operation button 43 is pressed, the entire system of the substrate positioning apparatus is set to the “monitoring mode”. Here, the “monitoring mode” simply refers to an operation state in which the stop position of the arm 22 of the substrate transport mechanism 21 is monitored. In the following, when the correction mode or the monitoring mode is set, “correction / monitoring mode” is described. In the above initial menu screen 41, the operation buttons 42 and 43 can be used to select whether or not to select each of the correction mode and the monitoring mode.
[0045]
Returning again to the flowchart of FIG. In the next determination step S102, it is determined whether or not the “correction mode” has been selected. When the correction mode is selected, for example, the process waits until the substrate 29 is loaded into the process chamber 15a (the same applies to other process chambers), and when the operation of loading the substrate 29 into the process chamber 15a is started ( Step S103) and correction mode processing (Step S104) are executed. Step S <b> 103 for determining whether or not standby is in progress is determined based on the operating state of the substrate transport mechanism 21. In step S104 of the correction mode process, position monitoring and automatic correction are performed by the CCD camera 15a. If the correction mode is not selected, the process proceeds to determination step S105 regarding the selection of the “monitoring mode”. If the monitoring mode is selected, the monitoring mode process is executed in step S106. In step S106 of the monitoring mode process, position monitoring by the CCD camera 15a is performed. When the monitoring mode is not selected, the process proceeds to determination step S107 regarding selection of other functions. If another function is selected, the process for the function is executed (step S108). If NO is determined in the determination step S107, it is determined whether or not to exit the initial menu screen 41 (EXIT) (step S109). If YES in determination step S109, the process proceeds to another menu screen. If NO, the process proceeds to step S101. When each of the above-described steps S103, S104, S106, S108, and S109 is completed, the process proceeds to step S101 again.
[0046]
FIG. 9 schematically shows the entire substrate positioning operation in the process chamber. The substrate positioning operation includes an extension operation of the arm 22 of the substrate transport mechanism 21, a measurement operation related to the substrate placement position when the substrate is carried into the process chamber, and a position monitoring and automatic correction operation related to the substrate placement position. Become. The measurement operation, the position monitoring, and the automatic correction operation relating to the arrangement position of the substrate are performed by measuring the position of the arm 22 of the substrate transfer mechanism 21, the position monitoring, and the automatic correction. That is, the measurement of the arrangement position of the substrate, the position monitoring, and the automatic correction are performed by using the mark 26 attached to the second fork 23 b provided at the tip of the arm 22. In this operation, the operation button 42 on the initial menu screen 41 is pressed and the correction mode is set so that step S115 described later can be executed.
[0047]
In step S111, based on the control by the controller 16, the transfer of the substrate 29 is started by the start of the extending operation of the arm 22 of the substrate transfer mechanism 21, and the loading of the substrate 29 is completed by the end of the extending operation of the arm 22. The substrate 29 is supported by the first fork 23 a at the tip of the arm 22. Since the substrate is carried into the process chamber 13a, the substrate is attached with reference to the mark 26 at a predetermined position. The arm 22 of the substrate transport mechanism 21 is positioned in the direction toward the process chamber 13a by the rotational operation. Thereafter, the arm 22 performs an extending operation, and moves toward the extension stop position in order to insert the substrate 29 into the process chamber 13a (step S111). At this time, as shown in FIG. 2, the gate valve provided between the separation chamber 11 and the process chamber 13a is opened so that the first fork 23a and the substrate can enter the process chamber 13a. The arrangement position of the substrate in the process chamber 13 a is taught in advance as an extension stop position of the arm 22. Accordingly, if the stop position of the arm 22 is the correct extension stop position, the substrate is placed at the correct position in the process chamber 13a.
[0048]
In step S112, when the arm 22 stops at the extension stop position, the arm stop position is set to the viewing port 31 based on the CCD camera controller 17 in order to determine whether or not the stop position matches the taught position. Through the CCD camera 15a, and the arm position is measured. The position data of the mark 26 obtained by imaging by the CCD camera 15 a is given to the monitoring personal computer 18 via the CCD camera controller 17. The personal computer 18 determines whether or not the extension stop position of the arm 22 is appropriate (step S113). If the extension stop position of the arm 22 is appropriate, the substrate transfer operation by the substrate transfer mechanism 21 is continued (step S114). If the extension stop position of the arm 22 is not appropriate, the position monitoring and automatic correction of the arm 22 are performed in step S115. As described above, the system is set to the correction mode so that the position of the arm 22 and automatic correction can be performed in step S115. Step S115 corresponds to the correction mode process of step S104 shown in FIG.
[0049]
In the case where the automatic correction process is performed in step S115, it is determined whether or not correction relating to the extension stop position of the arm 22 is possible. The correction regarding the extension stop position of the arm 22 substantially means correcting the arrangement position of the substrate in the process chamber 15a. For the correction related to the extension stop position of the arm 22, the X-axis position, the Y-axis position, and the like are sequentially determined independently. In the correction relating to the extension stop position of the arm 22, the amount of deviation between the detected actual extension stop position of the arm 22 and the extension stop position of the taught arm 22 is within an allowable range set in advance by the personal computer 18. When it is within the correctable range, it is determined that correction can be performed, and correction is performed. When the amount of deviation exceeds the allowable range or exceeds the correctable range, the stop process is performed without performing correction. The above points will be described in detail later.
[0050]
Next, the contents of step S104, that is, step S115 (correction mode processing) will be described in more detail with reference to the flowcharts of FIGS.
[0051]
10 and 11 show the main flow of the correction mode processing. The flowcharts of FIGS. 10 and 11 divide a series of processing flows. In FIG. 10, in the first determination step S201, it is determined whether or not another operation button has been pressed on the initial menu screen 41 shown in FIG. When the operation button is pressed, the process leaves the correction mode process flow and returns to the original state (step S202). If the operation button is not pressed, the process proceeds to step S203, where CCD camera processing is executed. This CCD camera processing is executed by the CCD camera controller 17 (camera side program). At this time, the monitoring personal computer 18 waits for a signal from the controller 17. The contents of the CCD camera processing are shown in FIG.
[0052]
The CCD camera processing in the “correction mode” will be described with reference to the flowchart of FIG. First, measurement timing data (output I / O) given from the overall operation controller 16 to the controller 17 via the cable 51 (shown in FIG. 1) is read (step S301). According to the read measurement timing data, the CCD camera of which process chamber among the process chambers 13a to 13e measures the arm 22 (the mark 26 on the second fork 23a) of the substrate transport mechanism 21 or the CCD camera itself. Decide whether to detect misalignment. In this case, the CCD camera 15a is targeted based on the measurement timing data. CCD camera processing is performed on the CCD camera 15a. After receiving the measurement timing data, the CCD camera 15a of the process chamber 13a determines whether the measurement trigger is on or off (step S302). If the measurement trigger is off, the process proceeds to EXIT, and the monitoring process by the CCD camera 15a ends and exits from this processing route. When the measurement trigger is on, the contents of the measurement timing data (output I / O) sent from the controller 16 are identified to perform the correction / monitoring mode process for measuring the arm 22 by the CCD camera 15a. Or a process for detecting the displacement of the CCD camera 15a itself (step S303). When the correction / monitoring mode process is performed, the process proceeds to a process step S304 on the CCD measurement arm side, and when the shift detection process is performed, the process proceeds to a process step S305 on the CCD measurement lower wall side.
[0053]
In the present invention, as described above, displacement detection relating to the position of the CCD camera 15a itself is performed using the mark 35 on the lower wall 12a of the separation chamber 12. Here, “deviation detection” refers to a process of determining whether the position of the CCD camera itself is deviated from the correct position where it should be installed. This deviation detection is also performed only during the “correction mode process”. Therefore, in the processing of the CCD camera, the CCD camera 15a is set to monitor and image the mark 26 on the second fork 23b on the arm 22 side in the correction / monitoring mode, and acquires the measurement data of the mark 26 ( In step S304), in the case of displacement detection, the process is configured to set the monitoring / imaging of the mark 35 on the lower wall 12a and acquire the measurement data of the mark 35 (step S305).
[0054]
The deviation detection of the CCD camera 15a itself is normally performed for each cassette only when the first cassette recipe of the lot (determining what kind of vacuum processing is performed in the process chamber 13a) is changed. The deviation detection is executed in step S209 described later on the flowchart. The execution timing of the deviation detection process will be specifically described. The operation of the multi-chamber system is started, and the substrate is loaded into the load lock chamber 14 (for example, when a substrate can hold 25 substrates, the processing time is about 8 minutes). To evacuate (treatment time about 4 minutes). After the load lock chamber 14 is evacuated, before the predetermined processing is performed in each of the process chambers 13a to 13e, the displacement detection of each of the CCD cameras 15a to 15e corresponding to each process chamber is performed. Since the processing time for detecting the deviation of the CCD camera is about 1 second in one process chamber, it takes about 5 seconds (1 second × 1 time) even if all the deviation detection of the CCD cameras installed in all the process chambers 13a to 13e is performed. 5 channels) and does not affect the throughput.
[0055]
When the cassette recipe is not changed, the original correction / monitoring mode processing is performed in principle.
[0056]
In the flowchart of FIG. 12, in step S306, the measurement data obtained in step S304 or the measurement data obtained in step S305 are respectively connected from the controller 17 to the monitoring personal computer 18 with a cable 52 (shown in FIG. 1). In order to transmit via, it processes into data suitable for a transmission format (RS-232C). According to the measurement data obtained by the processing in step S306, it is possible to identify whether the measurement data is on the arm 22 side or the measurement data on the lower wall 12a side. In the next step S307, the processed measurement data is transmitted as a measurement result to the personal computer 18 side. As described above, the CCD camera processing is completed, and then the process returns to the original main flow shown in FIG.
[0057]
In FIG. 10, in a determination step S204, it is determined whether or not a measurement result is sent from the controller 17 on the CCD camera side. When the measurement result has not been sent (NO), the process returns to step S201. When the measurement result is sent (YES), the process proceeds to step S205. In step S205, it is confirmed whether or not the illuminator 33 that illuminates the CCD camera 15a is turned off. If the illuminator 33 is burned out, abort (stop processing) is performed, and “CCD camera lamp burnout abnormality” is displayed on the display device 18a (step S206). In this case, when the “OK” button is pressed on the initial menu screen, the process proceeds to the monitoring process (step S207), and the monitoring process is executed. The monitoring process will be described later with reference to FIG. If the illuminator 33 is not burned out, the process proceeds to the next determination step S208, where it is determined whether or not to detect the deviation of the CCD camera 15a. In the determination in the determination step S208, when the data transmitted from the CCD camera controller 17 side in the CCD camera process (step S203) is measurement data related to the imaging of the mark 35 on the lower wall 12a of the separation chamber 12. Therefore, it is determined that the displacement of the CCD camera is detected. If YES in determination step S208, step S209 for detecting camera misalignment is executed. When the data transmitted from the CCD camera controller 17 side in the CCD camera process (step S203) is measurement data obtained by imaging the mark 26 on the arm 22 side of the substrate transport mechanism 21, the correction mode is set. It is determined NO in determination step S208. If NO in determination step S208, it is determined that the correction mode is set, and the flow proceeds to step S210.
[0058]
The camera shift detection process performed in step S209 will be described in detail with reference to FIG. The camera deviation detection is performed when it is determined in step S208 that the CCD camera 15a itself has been detected based on the measurement data sent from the controller 17 side.
[0059]
First, the significance of performing camera deviation detection processing will be described. “When the CCD camera itself is displaced” means that the CCD camera 15a is displaced from the correct position where it should be originally installed. The CCD camera 15a itself is displaced mainly for the following reason. The CCD camera 15a is provided outside the separation chamber 12, that is, above the viewing port 31 of the upper lid (the ceiling portion 12b) of the separation chamber 12. However, vibration or the like occurs in this place when the upper lid of the separation chamber 12 is opened or maintenance is performed. It is considered that the CCD camera 15a itself is easily displaced due to this vibration or the like. When a deviation occurs with respect to the mounting position of the CCD camera 15a, the extension stop position of the arm 22 cannot be accurately monitored even if the position of the mark 26 of the second fork 23b of the arm 22 of the CCD camera 15a is imaged. Therefore, accurate correction control cannot be performed. That is, when the CCD camera 15a itself is displaced, it may be determined that the arm 22 of the substrate transport mechanism 21 is not at the original stop position even when the arm 22 is at the original extension stop position. Therefore, it is necessary to detect the deviation of the CCD camera 15a itself. Therefore, in the present embodiment, in step S209, it is determined whether or not the CCD camera itself is displaced.
[0060]
Further, in the present embodiment, the “detection of displacement of the CCD camera itself” is performed in a vacuum for the following reason. When the interior of the separation chamber 12 is in a vacuum, the upper lid of the separation chamber 12 (the portion of the ceiling portion 12b where the viewing port 31 is installed) is distorted inward. Therefore, even if the displacement of the CCD camera 15a itself is measured when the inside of the separation chamber 12 is in the atmosphere, the upper lid is distorted inward when the inside of the separation chamber 12 is in a vacuum. The significance of detecting the displacement disappears. Therefore, camera displacement detection is performed when the inside of the separation chamber 12 is vacuum.
[0061]
As described above, the displacement detection of the CCD camera 15a itself is performed by imaging the position of the mark 35 on the lower wall 12a of the separation chamber 12 with the CCD camera 15a (step S305) and teaching the measurement data obtained by this imaging to the set value. It is done by comparing with. Details of the displacement detection of the CCD camera 15a are shown in FIG. Steps S401 to S404 show a process flow for detecting the displacement of the CCD camera. In the process of detecting the deviation of the CCD camera itself, it is first determined whether or not the deviation amount (CCD deviation amount) of the CCD camera 15a measured in step S305 is included in the deviation detection allowable range (step S401). ). When the amount of deviation of the CCD camera 15a is outside the allowable deviation detection range (NO), an abort (stop processing) is performed, and a process of displaying “CCD camera deviation detection abnormality” (CRT display) on the display device 18a. Is performed (step S402). As a result, the contents of the abort are confirmed. Thereafter, the process proceeds to a monitoring process (step S403). Here, the “shift detection allowable range” refers to a range in which the shift amount of the CCD camera itself does not hinder the detection of the extension stop position of the arm 22 of the substrate transport mechanism 21. On the other hand, when the amount of deviation of the CCD camera 15a is within the deviation detection allowable range (YES), the process proceeds to step S404, and further proceeds to step S210.
[0062]
Next, step S210 is executed. The processing after step S210 is processing in the correction mode, that is, processing relating to the contents of steps S113 and S115 shown in FIG. In summary, the amount of deviation of the position data of the mark 26 on the second fork 23b measured by the imaging of the CCD camera 15a at the extension stop position of the arm 22 of the substrate transport mechanism 21 with respect to the teaching reference point position is within an allowable range. This is a process of determining whether or not it is included, and further determining whether or not it is included in the correctable range and performing correction automatically when correction is necessary. Here, the “allowable range regarding the arm extension stop position” means that the extension stop position of the arm 22 of the substrate transport mechanism 21 is deviated from the position of the teaching reference point, but the deviation needs to be corrected. This is a range that does not cause any problems. Therefore, the correction process is not performed when the deviation amount relating to the position data of the mark 26 is included in the allowable range, and when it is not included in the allowable range, it is determined whether it is included in the correctable range. The allowable range can be arbitrarily changed according to the characteristics of the apparatus.
[0063]
The execution of step S210 is subject to the correction mode. In this step, the deviation amount relating to the position data of the mark 26 on the second fork 23b measured by the imaging of the CCD camera 15a in step S304 is within an allowable range. It is determined whether it is included. The amount of deviation of the mark 26 is obtained as a difference between the position data of the mark 26 obtained by imaging with the CCD camera 15a and the position data of the reference point for the extension stop position of the arm 22. When the deviation amount of the mark 26 is included within the allowable range (NO), the measurement result regarding the deviation amount of the mark 26 is written in the file on the assumption that no correction is performed (step S211). After step S211, the process returns to the first step S201 to perform the CCD camera process (step S203). Further, when the deviation amount of the mark 26 on the arm 22 side is not included in the allowable range (in the case of YES), it proceeds to the next step S212, assuming that correction is performed.
[0064]
In step S212, the amount of deviation of the mark 26 is compared with the correctable range set on the initial menu screen 41 shown in FIG. 8, and whether or not the amount of deviation of the mark 26 is included in the correctable range. Is determined. When it is not included in the correctable range (NO), an abort process is performed, and a display (CRT display) that “arm automatic correction is impossible” is performed on the display device 18a (step S213). In this case, when the “OK” button is pressed on the initial menu screen, the process proceeds to monitoring processing (step S214). If it is determined in step S212 that it is included in the correction range (YES), the process proceeds to conversion processing step S215.
[0065]
In the above description, the “correctable range” refers to a range in which the displacement amount of the mark 26 (position displacement amount related to the extension stop position of the arm 22) obtained by imaging with the CCD camera 15a can be corrected by teaching. The correctable range can be arbitrarily set on the initial menu screen 41 according to the situation.
[0066]
The amount of deviation regarding the position of the mark 26 detected based on the imaging of the CCD camera 15a is originally given by length data (expressed in units of millimeters (mm)). The number of pulses corresponding to the length is converted (step S215). The reason why the amount of deviation of the mark 26 is converted from millimeters to pulses in step S215 is that the drive unit 24 of the arm 22 is constituted by a pulse motor. Thereafter, it is determined again whether or not correction is possible in determination step S216.
[0067]
The determination in step S216 is a mechanical configuration in correcting the extension stop position of the arm 22 detected as the amount of deviation of the mark 216 so that the arm 22 is operated to be the original correct extension stop position. This is for determining whether or not it is possible.
[0068]
A method of determining whether correction is possible in step S216 will be described. The determination as to whether correction is possible is determined by the following four factors X, Y, H, and W.
[0069]
X: Position data of point as teaching origin
(Acquired through the maintenance program)
Y: Maximum deviation (expressed by the number of pulses. Acquired by the maintenance program)
H: Current teaching point position data
W: Deviation amount of the mark 26 obtained by imaging with the CCD camera 15a
(Value converted to the number of pulses)
[0070]
An example of the positional relationship between the above four factors X, Y, H, and W is shown by the relationship with the substrate 29 that is the position correction target in the coordinate system composed of the X axis and the Y axis, as shown in FIG. Become. As shown in FIG. 16, a point X that is the teaching origin is determined by the maintenance program, and the amount of deviation of the substrate from the origin point X to the maximum is determined as the maximum deviation amount Y. Then, whether correction is possible or not is determined based on the magnitude relationship of the amount of H + W with respect to the amount of X + Y. That is, when X + Y> H + W, it is determined that correction can be performed, and when X + Y ≦ H + W, it is determined that correction cannot be performed. As described above, when the position of the substrate 29 is corrected, it is determined whether the position of the substrate is within the correctable range or outside the correctable range.
[0071]
If X + Y ≦ H + W, the abort process is performed because the correction is impossible, and the CRT display is performed (step S217). In this case, when the “OK” button is pressed on the initial menu screen 41, the process proceeds to the monitoring process (step S218). If it is determined in step S216 that correction is possible, the process proceeds to step S219.
[0072]
In step S219, the correction pulses (hereinafter referred to as “correction pulses”) are integrated. The reason for accumulating the number of correction pulses is to make data indicating which process chamber has a large positional deviation when a substrate is loaded into each of the process chambers 13a to 13e. Thereafter, the process proceeds to determination step S220.
[0073]
In determination step S220, it is determined whether or not the integrated value of the correction pulse is larger than the accumulated value. The accumulated value is set to 250 pulses, for example. For example, when the correction process of the process chamber 13a is performed, 200 pulses are required for the first correction process of the extension stop position of the arm 22, and 100 pulses are required when the second correction process is performed. The integrated value of the correction pulse is 300 pulses. In this case, the integrated value of the correction pulse becomes larger than the accumulated value.
[0074]
If the integrated value of the correction pulse is larger than the accumulated value in the determination step S220 (YES), an abort process is performed and a CRT display of “Arm automatic corrected accumulated value excess abnormality” is performed (step S221). In this case, when the “OK” button is pressed on the initial menu screen, the process proceeds to monitoring processing (step S222).
[0075]
When the integrated value of the correction pulse is equal to or less than the cumulative value (when NO) in determination step S220, the process proceeds to step S223. In step S223, the number of correction processes performed in the same process chamber (13a to 13e) is counted. In this example, 1 is counted when a correction process is required for the extension stop position of the arm 22 in the process chamber 13a, and 0 is counted when a correction process is unnecessary. Thereafter, the process proceeds to determination step S224.
[0076]
As a whole process flow, when the correction process for each of the process chambers 13a to 13e is completed, the process returns to the first process chamber, and it is determined whether the correction process regarding the extension stop position of the arm 22 of the substrate transfer mechanism 21 is necessary. The For example, when the correction process regarding the extension stop position of the arm 22 of the process chamber 13a is necessary again, it is counted as the second correction process of the process chamber 13a. In this way, the process chambers 13a to 13e sequentially count whether or not the correction processing of the extension stop position of the arm 22 is necessary (step S223), and in step S224, the correction processing of a specific process chamber (for example, the process chamber 13a) is performed. When the number of times reaches three (when YES), abort processing is performed as three-time correction of the arm 22 related to the same process chamber 13a, and a CRT display of “arm automatic correction same arm three consecutive occurrence abnormality” is performed ( Step S225). In this case, when the “OK” button is pressed on the initial menu screen 41, the process proceeds to the monitoring process (step S226). In step S224, when the correction process for a specific process chamber (for example, process chamber 15a) is performed twice or less (NO), the process proceeds to step S227.
[0077]
As described above, in this embodiment, it is possible to determine whether the correction process is abnormal in step S220 depending on whether the integrated value of the correction pulse is larger or smaller than the accumulated value, regardless of the number of corrections in the same process chamber. Furthermore, when the number of corrections for the same process chamber reaches three in step S224, it can be determined that the correction process is abnormal.
[0078]
In step S227, the correction process is executed. The detailed contents of the correction process are shown in FIG. In FIG. 14, in the first step S501, information (arm position, code, number of correction pulses) on the position of the arm 22 is sent from the personal computer 18 to the controller 16 via the cable 53 (shown in FIG. 1). Write to. Next, the controller 16 starts correction processing for the extension stop position of the arm 22 using the position information (step S502). On the system side that monitors the position of the arm 22 of the substrate transport mechanism 21, correction processing is separately performed for θ, the X axis, and the Y axis. After the correction process is completed, the measurement of the position of the arm 22 is started again with the CCD camera 15a (step S503). If the re-measurement data of the CCD camera 15a is not received (YES) in the next determination step S504, an abort process is performed and a CRT display “CCD re-measurement data reception error” is displayed (step S505). Thereafter, the process proceeds to the monitoring process mode (step S506).
[0079]
If the CCD remeasurement data is not received in the determination step S504 (NO), the position of the arm 22 of the substrate transport mechanism 21 for which the correction processing in the process chamber 13a has been completed and the received CCD camera remeasurement data are included. It is determined whether or not the position of the base arm 22 is coincident (step S507). If it is determined in step S507 that they do not match, an abort process is performed, and a CRT display of “arm automatic correction collation abnormality” is performed (step S508). Thereafter, the mode shifts to the monitoring mode (step S509). On the other hand, when it is determined in step S507 that they match, the correction process is terminated, and the process returns to step S228 shown in FIG. 11 (step S510).
[0080]
In step S228, it is determined whether the result of the CCD remeasurement is normal or abnormal. If the result of the CCD remeasurement is abnormal (NO), an abort process is performed, and a CRT display of “CCD remeasurement data allowable range excess abnormality” is performed (step S229). Thereafter, the process proceeds to a monitoring process (step S230). When the result of CCD remeasurement is normal (YES), the process proceeds to step S231. In step S231, the teaching data is written to a file on the CCD management personal computer 18 that manages the teaching data. In the next step S232, the measurement result (measurement value data) by CCD remeasurement is further written in the log file. Thereafter, the apparatus is restarted (step S233), and the first step S201 is executed.
[0081]
Next, the monitoring process shown in FIG. 15 will be described. The monitoring process (step S106 shown in FIG. 7) is performed when the correction mode is not pressed (NO in step S102) and the monitoring mode is pressed (YES in step S105) when the initial menu screen 41 is displayed. Done.
[0082]
In FIG. 15, it is determined in the first step S601 whether or not the menu key on the initial menu screen 41 has been pressed. When it is pressed (YES), the process proceeds to the first step S101 shown in FIG. If NO in step S101, CCD camera measurement is started (step S602). The CCD camera measurement is performed by the controller 17. This CCD camera measurement is substantially the same as the content of step S203 in the correction mode process. However, in this case, the position is imaged by using the mark 26 on the second fork 23b of the arm 22 of the substrate transport mechanism 21 by the CCD camera 15a. The position of the mark 26 of the second fork 23b of the arm 22 measured by the CCD camera 15a is received as a measurement result (step S603). The measurement result is transmitted to the CCD management personal computer 18 via the cable 52 (RS232C), and is written in the CCD management personal computer 18 as a measurement file (step S604). Thus, the monitoring process ends.
[0083]
In the above description, the substrate positioning operation using the CCD camera 15a with respect to the arrangement position of the substrate in the process chamber 13a has been described. However, the monitoring and imaging operations of the CCD cameras 15b to 15e also with respect to the other process chambers 13b to 13e. Is done in the same way. The control operation in this case is performed by a combination of the control operations of the controllers 16 and 17 and the monitoring computer 18 described above. In the above-described embodiment, the example of the multi-chamber system in which the plurality of process chambers 13a to 13e are provided around the separation chamber 12 has been described. However, the apparatus to which the substrate positioning apparatus according to the present invention is applied is multi It is not limited to a chamber system. Further, the use of the monitoring device for the arm position of the transfer mechanism is not limited to the substrate transfer mechanism, and the monitoring device can be applied to the monitoring of the arm position of various transfer mechanisms.
[0084]
【The invention's effect】
As is apparent from the above description, the present invention has the following effects.
[0085]
  According to the present invention, by providing the target portion in accordance with the difference in the arrangement position of the substrate (extension distance of the arm) in each process chamber, the rotation center of the substrate transport mechanism to the substrate arrangement regardless of the difference in the arrangement position of the substrate Sometimes, the radial distance between the target parts located in the transfer chamber (and the installation position of the camera that images the target part) can be set within an appropriate range, and highly accurate displacement detection can be performed.
  Furthermore, it is not necessary to change the position of the camera when adding or changing a process chamber, and it is only necessary to add or change the target part, and there is an effect that it is possible to provide a highly scalable multi-chamber system. In addition, accurate measurement can be performed within an imaging range where optimal measurement can be performed, and a camera can be provided at low cost.
[0086]
As a device part related to the substrate positioning control in the process chamber, a part related to the arm of the substrate transport mechanism other than the substrate (a mark on the second fork) is used, and it is a relatively clean environment other than the process chamber. Since a CCD camera is provided outside the transfer chamber so that the space in the transfer chamber can be used and monitoring and imaging are performed using the viewing port, only one CCD camera is required for each process chamber. Easy configuration, easy monitoring and imaging, easy data processing of measurement data, easy automatic correction processing, less contamination of viewing port, easy maintenance management There is also an effect that it can be performed.
[0087]
When the substrate positioning apparatus according to the present invention is applied to a multi-chamber system including a plurality of process chambers, the configuration is simplified because only one CCD camera is provided for each process chamber.
[0088]
Furthermore, a mark is provided at a monitorable position in the transfer chamber corresponding to the arrangement position of the CCD camera, and the occurrence of deviation of the CCD camera itself can be determined using this mark. It can always be kept high and work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view schematically showing a multi-chamber type substrate processing apparatus to which substrate positioning according to the present invention is applied and a control system attached thereto.
FIG. 2 is a diagram showing a configuration of a main part of a substrate positioning device, showing a separation chamber and an internal structure of one process chamber, and a control system including a monitoring device and a processing device attached to the chamber; .
FIG. 3 is a plan view showing a state in which an arm of a substrate transport mechanism provided in the separation chamber is at an extension stop position.
FIG. 4 is a plan view showing a state in which an arm of a substrate transport mechanism provided in a separation chamber is in a contraction stop position and rotates.
5 is a side view of the arm as viewed from the direction of the arrow (28) in FIG. 3. FIG.
FIG. 6 is a plan view showing an example of only a substrate support portion.
FIG. 7 is a flowchart showing the overall processing flow of the substrate positioning operation.
FIG. 8 is a diagram showing an example of an initial menu screen.
FIG. 9 is a flowchart showing a process of monitoring / imaging and automatic correction by the substrate positioning apparatus according to the present invention.
FIG. 10 is a flowchart showing the first half of the flow of correction mode processing in the substrate positioning process;
FIG. 11 is a flowchart showing the latter half of the flow of correction mode processing in the substrate positioning process;
FIG. 12 is a flowchart showing a flow of CCD camera processing.
FIG. 13 is a flowchart showing a flow of camera deviation detection.
FIG. 14 is a flowchart showing a flow of correction processing.
FIG. 15 is a flowchart showing a monitoring process flow;
FIG. 16 is a diagram illustrating the positional relationship between X, Y, H, and W that determines whether automatic correction is possible or not.
[Explanation of symbols]
11 Multi-chamber system
12 Separation chamber
13a-13e process chamber
14 Load lock chamber
15a-15e CCD camera
16 Controller for overall operation
17 CCD camera controller
18 Computer for fork position monitoring
21 Substrate transport mechanism
22 Arm
23 Fork
26 and 27 marks
31 viewing port

Claims (2)

A transfer chamber which board conveying mechanism is provided,
A plurality of process chambers for performing substrate processing on a substrate that is provided around the transfer chamber and is transferred to and arranged at a predetermined position by the substrate transfer mechanism;
At least two of the plurality of process chambers are different from each other in distance from the transfer chamber at the predetermined position for placing the substrate,
The substrate transfer mechanism includes a movable arm stretching operation is directed from the rotating operation and the transporting chamber to the process chamber for diverting towards the respective process chambers provided in the periphery, it is provided on the tip portion of the arm And a support member that extends in the extending and contracting direction of the arm and moves along the extending direction by the extending and contracting operation of the arm, and
The support member is a substrate support portion that supports a substrate, and is located behind the substrate support portion in the extending direction of the arm, and the substrate support portion is located at a position where the substrate is disposed at a predetermined position of each process chamber. A rear portion located in the transfer chamber sometimes,
At least two rear portions are provided along the extending direction corresponding to the process chambers having different distances, and the rear portions are positioned in the transfer chamber when the substrate is disposed at the predetermined position of the corresponding process chamber. With a target part
Furthermore, it is provided on the upper side of the process chamber corresponding to each of the plurality of process chambers, and is disposed at a position where the corresponding target portion can be imaged when the substrate is disposed at the predetermined position of the corresponding process chamber. A plurality of imaging devices for measuring the position of the target portion;
The position data of the target portion obtained by the measurement of the imaging device is compared with reference position data taught in advance, and if the difference between the position data and the reference position data is within a correctable range, the difference is 0. Processing control means for correcting the operation of the substrate transport mechanism so as to become,
A multi-chamber system . The multi-chamber system according to claim 1, wherein the support member is attached to the arm at a center in the extending direction.

Images