WO2008136503A1 - Processing device, processing method, method of recognizing processing target body, and storage medium - Google Patents

Processing device, processing method, method of recognizing processing target body, and storage medium Download PDF

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Publication number
WO2008136503A1
WO2008136503A1 PCT/JP2008/058371 JP2008058371W WO2008136503A1 WO 2008136503 A1 WO2008136503 A1 WO 2008136503A1 JP 2008058371 W JP2008058371 W JP 2008058371W WO 2008136503 A1 WO2008136503 A1 WO 2008136503A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
semiconductor wafer
storage medium
recognizing
target body
Prior art date
Application number
PCT/JP2008/058371
Other languages
French (fr)
Japanese (ja)
Inventor
Hirofumi Yamaguchi
Katsuhito Hirose
Gaku Ikeda
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008013900A external-priority patent/JP5058836B2/en
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to CN2008800150143A priority Critical patent/CN101675511B/en
Publication of WO2008136503A1 publication Critical patent/WO2008136503A1/en
Priority to US12/614,065 priority patent/US20100080444A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Abstract

A CCD detector (30) captures an image of the circular arc shape of the outer periphery of a semiconductor wafer (W) that is on standby at a standby position (W1) near the inlet of a processing unit (1). A calculation section (40) detects, from the captured image of the circular arc shape, positional data on multiple positions of the shape, obtains an imaginary circle of the semiconductor wafer (W), calculates the center coordinates of the imaginary circle, and calculates “information on positional displacement' of the semiconductor wafer (W) at the standby position (W1). A controller (50) controls a conveyance device (12) based on the 'information on displacement' to correct the position of the semiconductor wafer (W) on the processing unit (1).
PCT/JP2008/058371 2007-05-08 2008-05-01 Processing device, processing method, method of recognizing processing target body, and storage medium WO2008136503A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800150143A CN101675511B (en) 2007-05-08 2008-05-01 Processing device and method of recognizing processing target body
US12/614,065 US20100080444A1 (en) 2007-05-08 2009-11-06 Processing apparatus, processing method, method of recognizing target object and storage medium

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007123265 2007-05-08
JP2007-123265 2007-05-08
JP2008013900A JP5058836B2 (en) 2007-05-08 2008-01-24 PROCESSING DEVICE, PROCESSING METHOD, OBJECT RECOGNITION METHOD, AND STORAGE MEDIUM
JP2008-013900 2008-01-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/614,065 Continuation US20100080444A1 (en) 2007-05-08 2009-11-06 Processing apparatus, processing method, method of recognizing target object and storage medium

Publications (1)

Publication Number Publication Date
WO2008136503A1 true WO2008136503A1 (en) 2008-11-13

Family

ID=39943608

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058371 WO2008136503A1 (en) 2007-05-08 2008-05-01 Processing device, processing method, method of recognizing processing target body, and storage medium

Country Status (1)

Country Link
WO (1) WO2008136503A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752219A (en) * 2008-12-11 2010-06-23 日东电工株式会社 Method and apparatus for separating protective tape from semiconductor wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223732A (en) * 1996-12-02 1998-08-21 Toyota Autom Loom Works Ltd Positional deviation detecting device and method
JP2000232147A (en) * 1999-02-09 2000-08-22 Anelva Corp Substrate positioning device for inside process chamber and device for monitoring arm position of transporting mechanism
JP2001110873A (en) * 1999-10-06 2001-04-20 Tokyo Electron Ltd Treatment device
WO2002023623A1 (en) * 2000-09-14 2002-03-21 Olympus Optical Co., Ltd. Alignment apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223732A (en) * 1996-12-02 1998-08-21 Toyota Autom Loom Works Ltd Positional deviation detecting device and method
JP2000232147A (en) * 1999-02-09 2000-08-22 Anelva Corp Substrate positioning device for inside process chamber and device for monitoring arm position of transporting mechanism
JP2001110873A (en) * 1999-10-06 2001-04-20 Tokyo Electron Ltd Treatment device
WO2002023623A1 (en) * 2000-09-14 2002-03-21 Olympus Optical Co., Ltd. Alignment apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752219A (en) * 2008-12-11 2010-06-23 日东电工株式会社 Method and apparatus for separating protective tape from semiconductor wafer
CN101752219B (en) * 2008-12-11 2013-10-30 日东电工株式会社 Method and apparatus for separating protective tape from semiconductor wafer and protective tape separation method

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