KR100865720B1 - Apparatus and method for treating substrate - Google Patents

Abstract

The present invention relates to an apparatus and method for processing a substrate. According to an embodiment of the present invention, a plurality of cameras photograph a portion of the edge of the substrate to determine the position of the substrate before bringing the substrate into the process chamber where the process is performed. The deviation is compensated for the path that the robot arm transfers the substrate, so that the robot arm is seated at the predetermined position of the support member in the process chamber. The present invention improves the efficiency of the substrate processing process by allowing the substrate to be seated at a predetermined position of the support member even if the position of the substrate is out of the reference position before the substrate is brought into the process chamber.

Semiconductor, wafer, substrate, alignment, camera, CCD, optics,

Description

Substrate processing apparatus and method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

1 is a view showing the configuration of a substrate processing apparatus according to the present invention.

2 is a perspective view showing a process chamber and a detection member according to the present invention.

3 is a plan view of the detection member illustrated in FIG. 2.

4 is a diagram illustrating a photographing area illustrated in FIG. 2.

5 is a view illustrating a state in which a detection member photographs a substrate located at a photographing position.

FIG. 6 is a diagram illustrating a photographing area of the cameras illustrated in FIG. 5.

7 is a view for explaining a process of the controller to control the substrate movement path of the robot arm.

* Description of symbols on the main parts of the drawings *

1: substrate processing apparatus

10: load port

20: if fem

30: load lock chamber

40: transfer chamber

50: process chamber

110: detection member

114: camera

120: controller

The present invention relates to an apparatus for processing a substrate and a method for processing the substrate.

A general substrate processing apparatus is an apparatus for processing a substrate such as a wafer for manufacturing a semiconductor integrated circuit chip and a glass substrate for manufacturing a flat panel display. Among the substrate processing apparatuses, the multi-chamber wafer processing apparatus includes a plurality of process chambers and a transfer chamber provided between the respective process chambers. Process chambers are arranged along the perimeter of the transfer chamber. The transfer chambers load and unload substrates into and out of each process chamber during processing. A substrate transfer device such as a robot arm is provided inside the transfer chamber. The robot arm provided in the transfer chamber receives the substrate from the load lock chamber during the process and loads the substrate into any one of the process chambers and mounts the substrate on a chuck installed inside the process chamber. When the substrate is seated on the chuck, the process chamber performs a semiconductor manufacturing process on the substrate surface. When the process is complete, the robot arm again removes the substrate from the chuck.

In such a substrate processing apparatus, a process error occurs because the substrate is not seated at a predetermined position of the chuck during the process. For example, when the robot arm is brought into the process chamber and seated on the chuck, if the alignment of the substrate seated on the robot arm is poor or an error occurs in the operation of the robot arm, the substrate is not seated at the preset position of the chuck. can not do it. In order to prevent this phenomenon, a general substrate processing apparatus is provided with various kinds of substrate alignment means for detecting the alignment state of the substrate. The substrate alignment means usually use light-emitting and light-receiving sensors, add a mechanical guide member to the chuck and robot arm, or provide a substrate alignment means, commonly called an aligner, inside the device to detect the alignment of the substrate. do. Usually, the aligner is provided in an equipment front end module (EFEM) or a transfer chamber equipped with the above-described robot arm.

However, these substrate alignment means simply determine whether or not the alignment state of the substrate is poor, so that it is difficult to align the substrate in position by effectively compensating for the value out of alignment. That is, the method of aligning the substrate using the light emitting sensor and the light receiving sensor is merely to determine whether the substrate deviates from the preset position, and the method of aligning the substrate using the mechanical guide member provides precise alignment of the substrate. It was difficult to carry.

In addition, the method having a separate aligner aligns the alignment state of the substrate before the substrate is brought into the process chamber, so that the substrate is out of position in the process of loading the chuck in the process chamber after the substrate is aligned. There is a phenomenon that the substrate is not seated in the predetermined position of the chuck. In addition, since the method of having a separate aligner is to add a separate substrate alignment means inside the apparatus, the manufacturing cost of the apparatus is increased.

It is an object of the present invention to provide a substrate processing apparatus and method for improving the efficiency of a substrate processing process by allowing the substrate to be efficiently positioned at a predetermined position for performing the process.

The substrate processing apparatus according to the present invention for achieving the above object is

According to an embodiment of the invention,

The substrate processing method according to the present invention for achieving the above object is

According to an embodiment of the invention,

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, one embodiment introduced herein is provided so that the disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. In the present embodiment, the apparatus for processing a wafer for manufacturing a semiconductor integrated circuit chip has been described as an example, but the present invention can be applied to any apparatus for processing a substrate.

(Example)

1 is a view showing the configuration of a substrate processing apparatus according to the present invention, Figure 2 is a perspective view showing a process chamber and a detection member according to the present invention. 3 is a plan view of the detection member shown in FIG. 2, and FIG. 4 is a view showing the photographing area shown in FIG. 2.

1 and 2, the substrate processing apparatus 1 according to the present invention may include a load port 10, an equipment front end module (EFEM), and the like. ), A load-rock chamber 30, a transfer chamber 40, a process chamber 50, and a substrate control member.

The load port 10 is disposed in front of the EMP20. The load port 10 has a plurality of supports 12. Each support 12 is arranged in a line, and supports the receiving member (C) by seating during the process. The accommodation member C is a container that accommodates the plurality of substrates W. As shown in FIG. As the housing member C, a cassette may be used.

If EMP 20 transfers the substrate (W) between the accommodating member (C) and the load lock chamber (30). If the FM 20 is disposed adjacent to the load port 10. The EMP 20 transfers the substrate W between the accommodating member C seated in the load port 10 and the load lock chamber 30. At least one substrate transfer device 22 is provided in the EPDM 20. A robot arm may be used as the substrate transfer device 22.

The load lock chamber 30 is disposed between the EPM 20 and the transfer chamber 40. The load lock chamber 30 includes a first chamber 32 and a second chamber 34. The first chamber 32 is a chamber for moving the substrate W from the EMP 20 to the transfer chamber 40, and the second chamber 34 is a substrate from the EEP 20 to the transfer chamber 40. (W) is a chamber for moving.

The transfer chamber 40 transfers the substrate W between the load lock chamber 30 and the process chambers 50. The transfer chamber 40 has a substrate transfer device. Various kinds of robot arms are used as the substrate transfer device. In one embodiment, the substrate transfer apparatus has a robot arm 42 capable of simultaneously processing two substrates W. As shown in FIG. The robot arm 42 has two arms 42a. The arm 42a is stretched and contracted in directions opposite to each other during the process to transfer the substrate W. FIG. The robot arm 42 is provided with means for preventing the substrate W seated on the arm 42a from being separated from the arm 42a during the process. For example, when the substrate W is seated on the arm 42a, the robot arm 42 may fix the substrate W by suctioning the bottom surface of the substrate W to the arm 42a by vacuum.

The process chamber 50 performs a substrate treatment process. Process chamber 50 is provided with a plurality, each of the process chambers 50 is disposed around the transfer chamber (40). The process chamber 50 includes a housing 52 and a support member 56. The housing 52 provides a space for performing a process of processing the substrate W therein. One side of the housing 52 is provided with a substrate entrance 54. The substrate entrance 54 is a passage through which the substrate W enters and exits the housing 52 during the process. The support member 56 supports the substrate W in the housing 52 during the process. At least one support member 56 is provided. An electrostatic chuck may be used as the support material 56. The process chambers 50 described above perform the same substrate treatment process. Alternatively, the process chambers 50 may optionally be provided to perform one or more different processes.

The substrate controller includes a detecting member 110 and a controller 120. The detection member 110 is installed in front of the substrate entrance 54 of each process chamber 52, and the controller 120 receives image data from each detection member 110. The detection members 110 installed corresponding to each of the process chambers 52 have the same configuration and structure. Therefore, in this embodiment, only the configuration and structure of one detection member 110 will be described, and the description of the other detection member 110 will be omitted.

The detection member 110 measures a portion of the edge of the substrate W before the substrate W is carried into the process chamber 52. The detection member 110 includes a supporter 112 and an imaging member. The support 112 is fixed to the upper portion of the movement path of the substrate (W). The imaging member includes a plurality of cameras 114. As the camera 114, a charge-coupled device (CCD) camera may be used. The cameras 114 are disposed below the support 112. Each of the cameras 114 photographs a portion of the front edge region of the substrate W which is transferred to the process chamber 50 during the process. As an example, as shown in FIG. 3, the cameras 114 are arranged at equal intervals along a line L1 corresponding to the edge line of the substrate W. As shown in FIG. Therefore, the cameras 114 photograph a portion of the edge region of the substrate W at a position opposite to the edge region of the substrate W. FIG. The support 112 is preferably provided with illumination (not shown) for effective imaging of the cameras 114. The illumination irradiates light to the photographing area of each of the cameras 114.

A coordinate system 114b and a reference position 114c are set in the photographing area 114a where the cameras 114 photograph the substrate W, as shown in FIG. 4. The coordinate system 114b is provided for calculating a value for determining the position of the substrate W. The coordinate system 114b is composed of a plurality of X and Y axes arranged in parallel at equal intervals. The reference position 114c is a coordinate system 114b when the substrate W is normally positioned at a position of the substrate W for photographing the substrate W (hereinafter, referred to as a 'shooting position'). Is the position of the substrate W positioned on the substrate. Here, the photographing position is the substrate W when waiting in front of the substrate entrance 54 of the process chamber 52 just before the substrate W is brought into the process chamber 52 by the robot arm 42 during the process. It is preferable that it is the position of.

Each of the cameras 114 is arranged to photograph a portion of the front edge region of the substrate W. That is, the photographing area 114a photographed by each of the cameras 114 during the process allows the front edge of the substrate W to be positioned over the photographing area 114a when the substrate W is located at the photographing position. . Therefore, when the substrate W is normally positioned at the reference position 114c, only a part of the edge region of the substrate W is photographed in the photographing area 114a. This is to determine how much the coordinate value of the substrate W deviates from the preset reference position 114c based on the edge line of the substrate W. If the entire processing surface of the substrate W is photographed in the photographing area 114a of the cameras 114 but not only a part of the edge of the substrate W, or the processing surface of the substrate W is not photographed at all, the substrate W The controller 110 recognizes that the alignment state of the robot arm is out of the degree to which the correction can be performed, and the controller 110 stops the transfer of the substrate W of the robot arm 42 and displays it so that an operator can recognize it.

In addition, the photographing of the substrate W of the cameras 114 is preferably performed in a state in which the substrate W is temporarily supported by the robot arm 42 in front of the substrate entrance 54 of the process chamber 52. Do. This is because the imaging of the cameras 110 may be inaccurate in the situation where the substrate W is transferred. However, the substrate W may be selectively photographed in the process of moving the substrate W at a constant speed toward the substrate entrance 54 of the process chamber 52 by the robot arm 42. In this case, a moving speed of the substrate W and a photographing time point of the cameras 114 are preset, and a portion of the edge area of the substrate W, which is moved at a constant speed, is set as a reference to the photographing area 114c. Photographing is done when positioned at position 114b.

The controller 120 receives image data photographed by each of the cameras 114 and calculates a coordinate value at which the substrate W deviates from the reference position 114c. In addition, the controller 120 controls the robot arm 42 to change the movement path of the robot arm 42 according to the calculated coordinate value. A process of calculating the coordinate value of the controller 120 and controlling the robot arm 42 according to the calculated coordinate value will be described later.

In the present exemplary embodiment, the cameras 114 of the detecting member 110 take the front edge regions of the substrate W as an example, but the cameras and the area of the substrate W that the cameras 114 capture are described. The arrangement of the 114 may be variously changed. For example, the cameras 114 may be disposed in an annular shape so as to photograph all edges of the substrate W, not just the front end portion of the substrate W. Accordingly, by photographing all the edge regions of the substrate W, the alignment state of the substrate W can be accurately determined. In this case, however, the number of cameras 114 increases, which increases the manufacturing cost.

In addition, the detection member 110 may detect an alignment state of the substrate W by photographing the entire processing surface of the substrate W by using a single camera. In this case, when the substrate W is positioned at the photographing position, the entire processing surface of the substrate W is positioned in the photographing region of the camera to determine the degree to which the substrate W deviates from the reference position. However, in the case of using one camera, since the photographing area of the camera is wider and the width of the scales of the coordinate system is larger than the method of accurately photographing only a part of the edge of the substrate, the accuracy of determining the position of the substrate W is inferior. Therefore, it is preferable that the detecting member accurately photographs only a part of the edge region of the substrate W using the plurality of cameras 114 to increase the accuracy of the position determination of the substrate W. FIG.

Hereinafter, the process of the substrate processing apparatus 1 having the above-described configuration will be described in detail. Here, the same reference numerals for the same components as the above-described components are the same, and detailed description of the components is omitted.

5 to 7 are views for explaining a process of adjusting the movement path of the substrate by the detection member according to the present invention. In more detail, FIG. 5 is a diagram illustrating a state in which a detection member photographs a substrate positioned at a photographing position, and FIG. 6 is a diagram illustrating a photographing area of the cameras illustrated in FIG. 5. And, Figure 7 is a view for explaining the process of the controller to control the substrate movement path of the robot arm.

When the process is started, the housing member C is seated on the support part 12 of the load port 10, and the substrate transfer device 22 of the RFF 20 is the housing member C seated on the support part 12. The substrates W are sequentially transferred from the load lock chamber 30 to the first chamber 32. The robot arm 42 of the transfer chamber 40 carries the substrates W transferred to the first chamber 32 into each process chamber 50. The process chamber 50 performs a predetermined semiconductor manufacturing process on the loaded substrate (W). The substrate W on which the process is completed is carried out from the process chamber 50 by the robot arm 42 and transferred to the second chamber 34 of the load lock chamber 30. The substrates W transferred to the second chamber 34 are transferred back to the housing member C by the substrate transfer device 22. When all of the substrates W completed with the process are accommodated in the accommodating member C, the accommodating member C is conveyed to a facility where the subsequent process is performed.

In the process of performing the above-described process, the detection member 110 determines the position of the substrate W before being carried into the process chamber 50, and the controller 120 changes the movement path of the robot arm 42 accordingly. Let's do it. That is, referring to FIG. 5, the robot arm 42 temporarily stops the substrate W at the photographing position in front of the substrate entrance 54 of the process chamber 52. When the substrate W is positioned at the photographing position, each of the cameras 114 of the detecting member 110 photographs an edge region of the substrate W. The captured image data is transmitted to the controller 120. The controller 120 determines the transferred image data to calculate how far the substrate W deviates from the reference position 114c set in the photographing area 114c.

The process of the controller 120 calculating how far the substrate W is from the reference position 114c is as follows. Here, in the present embodiment, only the photographing area 114c photographed by one camera 114 will be described. However, the determination of whether the substrate W deviates from the reference position 114c is made by comprehensively determining the image data photographed by all the cameras 114. In addition, the present embodiment will be described by taking an example that the controller 120 adjusts the movement path of the substrate W when the substrate W is mounted on the robot arm 42 outside the fixed position, the robot arm 42 ) Is out of position.

 When the edge region of the substrate W photographed by one of the cameras 114 is photographed as shown in FIG. 6, the controller 120 determines that the substrate W is in the X-axis first direction (the X axis of the coordinate system 114b). X1) is out of the two divisions, and it is determined that it is out of the two divisions in the first direction Y2 of the Y axis. Here, the X-axis first direction X1 is a right direction in a direction perpendicular to the moving direction of the substrate W moved to the process chamber 52, and the Y-axis first direction Y1 is a direction of the substrate W. The direction opposite to the movement direction. If the scale of the coordinate system 114b is set in units of 1 mm, the controller 120 causes the substrate W to deviate 2 mm from the reference position 114c in the X-axis first direction X1 and to the Y-axis first direction Y1. ) Is 2mm off. The controller 120 determines that the substrate W is 2 mm outward from the reference position 114c. Therefore, the controller 120 changes the movement path of the robot arm 42 so as to compensate by the coordinate value deviated to the right. That is, the controller 120 changes the normal movement path a1 of the robot arm 42 so that the center of the substrate W and the center of the supporting member 56 coincide with each other, as shown in FIG. 7. The robot arm 42 is controlled so that 42 is moved along the changed movement path a2. Therefore, the robot arm 42 normally seats the substrate W at the predetermined position 56a of the support member 56.

In this embodiment, a case in which the movement path of the robot arm 42 is changed when the substrate W deviates to the right (first direction X1) has been described as an example. Even when both the left and right alignments are disturbed, the controller 120 may change the movement path of the robot arm 42 to seat the substrate W at the predetermined position 56a of the support member 56.

In addition, in the present embodiment, only the case where the robot arm 42 is normally positioned and the substrate W is not seated at the correct position of the robot arm 42 has been described as an example. However, the substrate control unit of the present invention can be applied even when the substrate W is normally positioned on the robot arm 42 but the robot arm 42 is abnormally positioned. For example, as another embodiment of the present invention, the detection member 110 is a separate sensor (not shown) for detecting whether the robot arm 42 is positioned in place when photographing the substrate (W) of the cameras 114 ) Is further provided. Accordingly, if the robot arm 42 is out of position when the substrate W of the cameras 114 is photographed, the controller 120 may not be properly seated on the robot arm 42. Recognize that 42) is abnormally located. In addition, the controller 120 determines the degree of the substrate W taken by the cameras 114 from the reference position 114c, and then the substrate W placed on the robot arm 42 is placed on the support member 56. The movement path of the robot arm 42 is adjusted to be at the preset position 56a.

As described above, the substrate processing apparatus and method according to the present invention determine the alignment state of the substrate W into which the detection member 100 is carried into the process chamber 50 during the process, so that the position of the substrate W is referred to. If it is out of the position 114c, the controller 120 changes the substrate movement path of the robot arm 42 so that the substrate W is seated at the predetermined position 56a of the support member. Therefore, the present invention allows the substrate W to be accurately seated at the predetermined position 56a of the support member 56 even when an error occurs in the alignment state of the substrate W outside the process chamber 52. Improve the efficiency of the treatment process.

In addition, the present invention adjusts the movement path of the substrate (W) seated on the support member 56 of the process chamber 52 to seat the substrate (W), a separate aligner and the like in the conventional EMP 20, etc. It may not be provided with the same substrate control means can reduce the manufacturing cost of the device.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments illustrate the best state for implementing the technical idea of the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the invention. Various changes required are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the substrate processing apparatus and method according to the present invention can be effectively positioned at a predetermined position of the support member for supporting the substrate to improve the efficiency of the substrate processing process.

Claims (11)

delete delete delete delete In the apparatus for processing a substrate, A load port on which an accommodating member accommodating a plurality of substrates is mounted; An IFM disposed at one side of the load port to transfer the substrate in the accommodation member; A load lock chamber disposed at one side of the EFM; A transfer chamber disposed adjacent to the load lock chamber and having a robot arm installed therein; A plurality of process chambers disposed along a circumference of the transfer chamber; A detection member for detecting a position of the substrate supported by the robot arm, and And a controller for controlling the robot arm to adjust the movement path of the substrate according to the position of the substrate detected by the detection member. The method of claim 5, wherein The detection member, And a substrate fixed to the front of the substrate entrance provided in the process chamber. The method according to claim 5 or 6, The detection member, A substrate processing apparatus comprising a plurality of cameras. Using a robot arm, the substrate is brought into a process chamber having a supporting member for supporting the substrate during the process, and the substrate is seated at a predetermined position of the supporting member, wherein the substrate supported by the robot arm is at a predetermined reference position. Detecting the deviation and adjusting the movement path of the robot arm to compensate for the deviation from the reference position. The method of claim 8, The detection is, And a part of the edge of the substrate moved to the process chamber by photographing the camera. The method according to claim 8 or 9, The detection is, And a substrate processing method in front of the substrate entrance and exit of the process chamber. The method of claim 10, The robot arm is, Pauses in front of the substrate entrance and exit prior to bringing the substrate into the process chamber, The detection is, And the robot arm is stationary in front of the substrate entrance and exit.

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