JP4347734B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4347734B2 JP4347734B2 JP2004090080A JP2004090080A JP4347734B2 JP 4347734 B2 JP4347734 B2 JP 4347734B2 JP 2004090080 A JP2004090080 A JP 2004090080A JP 2004090080 A JP2004090080 A JP 2004090080A JP 4347734 B2 JP4347734 B2 JP 4347734B2
- Authority
- JP
- Japan
- Prior art keywords
- processing liquid
- flow path
- substrate
- processing
- down flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 263
- 239000000758 substrate Substances 0.000 title claims description 103
- 239000007788 liquid Substances 0.000 claims description 274
- 238000000034 method Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000003466 anti-cipated effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004090080A JP4347734B2 (ja) | 2004-03-25 | 2004-03-25 | 基板処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004090080A JP4347734B2 (ja) | 2004-03-25 | 2004-03-25 | 基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005277211A JP2005277211A (ja) | 2005-10-06 |
| JP2005277211A5 JP2005277211A5 (enExample) | 2007-05-17 |
| JP4347734B2 true JP4347734B2 (ja) | 2009-10-21 |
Family
ID=35176516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004090080A Expired - Fee Related JP4347734B2 (ja) | 2004-03-25 | 2004-03-25 | 基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4347734B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4731377B2 (ja) * | 2006-03-30 | 2011-07-20 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP5317505B2 (ja) * | 2008-03-24 | 2013-10-16 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5410040B2 (ja) * | 2008-06-26 | 2014-02-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4982453B2 (ja) * | 2008-09-03 | 2012-07-25 | 東京エレクトロン株式会社 | 処理液供給機構および液処理装置ならびに処理液供給方法 |
| JP6385864B2 (ja) * | 2015-03-18 | 2018-09-05 | 株式会社東芝 | ノズルおよび液体供給装置 |
| JP6337854B2 (ja) * | 2015-08-19 | 2018-06-06 | 東芝三菱電機産業システム株式会社 | 二流体噴霧装置及びその制御方法 |
| JP6148363B2 (ja) * | 2016-02-22 | 2017-06-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理液供給方法 |
-
2004
- 2004-03-25 JP JP2004090080A patent/JP4347734B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005277211A (ja) | 2005-10-06 |
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