JP4335512B2 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP4335512B2
JP4335512B2 JP2002290620A JP2002290620A JP4335512B2 JP 4335512 B2 JP4335512 B2 JP 4335512B2 JP 2002290620 A JP2002290620 A JP 2002290620A JP 2002290620 A JP2002290620 A JP 2002290620A JP 4335512 B2 JP4335512 B2 JP 4335512B2
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Japan
Prior art keywords
printed circuit
circuit board
light emitter
notch
heat radiating
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JP2002290620A
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Japanese (ja)
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JP2003303511A (en
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賢治 米田
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CCS Inc
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CCS Inc
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【0001】
【発明の属する技術分野】
本発明は、反射照明によって製品検査をする場合に好適に使用される製品検査用照明装置に関するものである。
【0002】
【従来の技術】
この種の製品検査用照明装置において、LED等の発光体を複数配置し、被検査体に対して周囲方向から覆うように照明してその検査面の光度をムラなく一定に保つようにしたものが開発されている。そして、被検査体を周囲方向から覆うためには、円筒内面や円錐凹面等のような湾曲凹面状をなす発光体装着面を形成し、その発光体装着面に複数のLEDをくまなく装着することが望ましい。
【0003】
そのために従来、保持枠そのものを円筒内面や円錐凹面形状に加工して穿孔し、発光体をその孔に各々直接埋設したうえで手配線を施すという複雑な工程を経てかかる製品検査用照明装置を製造していたところ、その手間やコストを大幅削減すべく本願発明者は、湾曲可能なプリント基板を平面状に保った状態でLEDを装着し、そのプリント基板を湾曲させてこの種の照明装置を製造する方法を発明し、特許を取得している(例えば、特許文献1参照)。
【0004】
【特許文献1】
特開平10−21729号公報
【0005】
【発明が解決しようとする課題】
しかしながら、この種の照明装置において、湾曲する発光体装着面の裏面に放熱構造を設けることは極めて難しいと考えられていたため、放熱を積極的に行うような工夫はほとんどなされていないのが実状である。具体的には、図に示すように、LED100の裏側には何ら放熱部材は設けられておらず、空気層ASが介在していた。そしてその結果、LEDの温度を積極的に下げることができないことから大きな照明光度を得にくく、またその寿命を延ばしにくいという点に改善の余地が残されていた。
【0006】
本発明は、このような実情に鑑みてなされたものであって、複数の発光体を湾曲凹面に配置した製品検査用の照明装置において、製造容易性を担保しつつ、大きな照明光度及び長寿命を得ることを主たる目的としたものである。
【0007】
【課題を解決するための手段】
すなわち、本発明は、複数の発光体を湾曲凹面に配置し、被検査体に対して周囲方向から覆うように照明してその反射照明によって製品検査をする場合に使用される製品検査用照明装置であって、複数の発光体と、厚み方向に湾曲可能であって一部に切り欠きを有し且つ前記複数の発光体を装着する面の裏面に抵抗が配設された円環状のプリント基板と、前記プリント基板と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材と、プリント基板を保持する保持枠とを備えたものであって、前記プリント基板を平面状態又は略平面状態に保持し、その一方の面に設定した発光体装着面に複数の発光体を装着した後、前記発光体を装着したプリント基板の一方の切り欠き辺と他方の切り欠き辺とを、前記発光体装着面が凹面側に位置するように接合または近接保持して該プリント基板を切頭円錐形状にし、又は前記プリント基板の一方の切り欠き辺と他方の切り欠き辺とを、前記発光体装着面が凹面側に位置するように接合または近接保持して該プリント基板を切頭円錐形状にした後、その発光体装着面に発光体を装着する一方、前記放熱部材の一方の切り欠き辺と他方の切り欠き辺とを接合または近接保持して切頭円錐形状にし、その凹面側に設定した密着面を、切頭円錐形状にした前記プリント基板における発光体装着面の裏面に密着させてなり、前記放熱部材における前記発光体装着面の裏面に密着する面が柔軟性を有し且つ前記抵抗を包み込むように凹み変形するものであり、前記保持枠に設けた保持溝に放熱部材及び発光体を装着したプリント基板を保持させ、この保持状態において、放熱部材が、保持溝内に略隙間無くはまり込み、プリント基板の裏面及び保持溝の底面双方に密着又は略密着することを特徴とする製品検査用照明装置に係るものである。
【0008】
このようなものであれば、放熱部材をその切り欠き辺同士を接合または近接させるだけで、反発光体装着面に密着し得るような切頭円錐凹面を形成できるので、極めて簡単にかつ無理なくこの種の湾曲凹面に配置するような発光体の放熱を図ることができる。そしてその結果、無理なく発光体の放熱を行ってその温度を積極的に下げることができるので、高い照明光度を得られ、製品の長寿命化も促進することができる。
【0009】
また、保持枠には、プリント基板及び放熱部材を保持するための円錐凹面状等の加工を施すのみで、発光体埋設保持用の孔等を穿設する必要がなく、発光体を容易に切頭円錐凹面に配置し、しかも配線することができるので、製造方法が複雑になることもない。さらに、放熱部材やプリント基板の切り欠きの大きさや径寸法を適宣変更することにより、種々の接頭円錐凹面を形成することも容易に行える。
【0010】
一方、前記同様の作用効果を奏し得る他の態様としては、複数の発光体と、厚み方向に湾曲可能であって一部に切り欠きを有し且つ前記複数の発光体を装着する面の裏面に抵抗が配設された円環状のプリント基板と、前記プリント基板と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材と、前記プリント基板を保持する保持枠とを備え、基板と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材を前記プリント基板における発光体装着面の裏面に密着又は略密着させ、前記発光体及び放熱部材を装着したプリント基板の一方の切り欠き辺と他方の切り欠き辺とを、前記発光体装着面が凹面側に位置するように接合または近接保持して切頭円錐形状にして形成し、前記放熱部材における前記発光体装着面の裏面に密着する面が柔軟性を有し且つ前記抵抗を包み込むように凹み変形するものであり、保持枠に設けた保持溝に放熱部材及び発光体を装着したプリント基板を保持させ、この保持状態において、放熱部材が、保持溝内に略隙間無くはまり込み、プリント基板の裏面及び保持溝の底面双方に密着又は略密着することを特徴とする製品検査用照明装置を挙げることができる。
【0011】
実施の上で放熱性を向上させる極めて好ましい態様としては、複数の発光体を、保持枠に設けた湾曲面状をなす発光体装着面上に配置してなるものであって、前記発光体装着面の裏面及び前記保持枠に、厚み方向に湾曲可能な放熱部材を密着させ、当該放熱部材における前記発光体装着面の裏面に密着する面が柔軟性を有しているものを挙げることができる。このようなものであれば、発光体の熱が放熱部材を介して保持枠に効率よく速やかに伝達され、保持枠全体で放熱させることが可能になるからである。ちなみに空気の熱伝導率は0.02 kcal/mh℃であり、放熱部材にシリコ−ン、フロロシリコ−ン、SEP等を主体材料とする部材を用いた場合にはその熱伝導率が0.8kcal/mh℃程度又はそれ以上となることから、放熱部材を用いずに空気層が介在した場合と、放熱部材を用いた場合とでは、その放熱性に極めて顕著な差が生じることがわかる。さらに、放熱部材を介在させることで、プリント基板のがたや変形等を抑止することができるという効果をも得ることができる。
【0012】
また、密着度を向上させ放熱性の向上に寄与させるとともに、組立の容易性等にも寄与させるには、放熱部材における少なくとも前記発光体装着面の裏面に密着する側の面を柔軟性を有したものにしておくことが好ましい。ここで「柔軟性」とは、放熱部材を取り付けた際に、発光体装着面の裏面から突出する発光体のリード線や抵抗等の部品を包み込むように凹んで前記発光体装着面の裏面に密着する程度の柔らかさを有するということである。
【0013】
【発明の実施の形態】
以下、本発明の第1実施形態を、図面を参照して説明する。
【0014】
本実施形態に係る照明装置4は、図1〜図3に示すように、複数の発光体たるLED1と、一部に切り欠きを有した円環状をなし厚み方向に湾曲可能なプリント基板2と、前記プリント基板2と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材たる放熱板6と、目視あるいは撮影等のための中心孔32を有し前記プリント基板2を保持する保持枠たる照明ケース3とを備えたものである。なお、照明ケース3に穿設されためねじ31は、照明装置4を取着するためのものである。
【0015】
このような構成において、本実施形態による照明装置の製造方法について説明する。まず前記プリント配線基板2を平面状態に保持した上で、該基板2の一方の面に設定した発光体装着面2cに複数のLED1をはんだ付け等の方法でくまなく植設する。しかる後に、該基板2の一方の切り欠き辺2aと他方の切り欠き辺2bとを前記発光体装着面2cが凹面側に位置するように接合または近接させて湾曲させる。このことにより、該プリント基板2は必然的に切頭円錐型となり、前記発光体装着面2cが切頭円錐凹面となって、そこにLED1が配置されることとなる。このとき、電源ケーブル5も該基板2にはんだ付け等によって配線する。
【0016】
その一方で、前記放熱板6の一方の切り欠き辺6aと他方の切り欠き辺6bとを接合または近接させ切頭円錐形状にする。そして、前記発光体装着面2cの湾曲する裏面2dに該放熱板6の凹面側に設定した密着面6cを密着させる。ここで「密着」とは、裏面2dの一部又は全部と、密着面6cの一部又は全部とが密着することも含む。
【0017】
しかしてこの放熱板6は、例えばシリコ−ン、フロロシリコ−ン、SEP等を主体材料として形成してなる電気的に絶縁性を持った熱伝導性及び柔軟性に富むものである。そして、プリント基板2の裏面2dに密着させた状態では、その密着面6cが、前記裏面2dに配設されている抵抗等の各部品や突出するLED1の足等を包み込むように凹み変形する。なお、プリント基板2への密着面6cに感圧接着剤又は粘着剤を添着し、密着面6cが裏面2dに粘着するようにしてもよい。
【0018】
その後、放熱板6及びLED1を装着したプリント基板2を、前記照明ケースに設けた対応する径を有する保持溝33に保持させる。本実施形態において保持溝33は、ちょうどプリント基板2及び放熱板6を容れ得る大きさになっており、放熱板6は、保持溝33内に略隙間無くはまり込んで、プリント基板2の裏面2d及び保持溝33の底面双方に密着又は略密着する。
【0019】
したがってこのようなものであれば、LED1の熱が放熱板6を介して保持枠3に効率よく速やかに伝達され、保持枠3全体で放熱させることが可能になるため、無理なくLED1の放熱を行ってその温度を積極的に下げることができる。LED1の温度上昇を抑止することが可能になる。そしてその結果、高い照明光度を得られ、製品の長寿命化も促進することができる。
【0020】
さらに、放熱板6を介在させることで、プリント基板2のがたや変形等を抑止することができるという効果をも得ることができる。
【0021】
加えて放熱板6の切り欠き辺6a、6b同士を接合または近接させるだけで、プリント基板2の反発光体装着面2dに密着し得るような切頭円錐凹面を形成できるので、組立が簡単であり、製造工程を複雑化することもない。
【0022】
具体的な効果を図7、図8に示す。図7は赤色LEDに対し、放熱板6がある場合とない場合とを比較実験した結果である。同図に示すように、放熱板6がある場合とない場合とでは、実験開始から20分後におけるLED1の半田部分温度が25℃度程度相違し、光量においては、放熱板6がある場合には、初期光量に比して略10%程度しか落ち込まないのに対し、放熱板6がない場合には、初期光量に比して略25%も落ち込むという顕著な相違が生じる。
【0023】
図8は白色LEDに対する比較実験の結果である。この実験において放熱板6がないものは、温度がLEDの動作保証温度である100℃にまで上昇している。これは、白色LEDや青色LEDあるいは緑色LEDの順方向電圧(VFmax)が3.5Vと高く、発熱量が大きくなる傾向があることに起因するものであるが、このように放熱板6がないと、使用条件によっては高温化を招いて劣化を惹起し、寿命や光度に極めて大きな影響を及ぼすと考えられる。これに比して放熱板6がないものは温度が45℃前後に保たれ、温度差が実に55℃も生じていることがわかる。
【0024】
もちろん、その他に、照明ケース3側にLED埋設保持用の孔を穿設するといった必要がなく、LED1を容易に切頭円錐凹面2cに配置し、しかも配線することが可能となるといった製造容易化という効果をも奏し得る。
【0025】
さらに、図4〜図6に示すように、放熱板6やプリント基板2の切り欠きの大きさや径寸法を適宣変更することにより、種々の接頭円錐凹面を形成することも容易に行える。
【0026】
なお、放熱板1を、LED6をくまなく植設したプリント基板2を湾曲させる前の例えば平面状態にて予め該プリント基板2に貼り付けておき、その後、該基板2の一方の切り欠き辺2aと他方の切り欠き辺2bとを前記発光体装着面2cが凹面側に位置するように接合または近接させ、前記照明ケース4に設けた対応する径を有する保持溝33に保持させるようにしても構わない。
【0032】
なお、本発明は前記各実施形態に限られず、種々の変形が可能である。
【0033】
例えば、発光体装着面は、切頭円錐凹面に限られず、円筒内面でもよいしその他それに類する湾曲凹面であっても構わない。そしてその場合、放熱板やプリント基板の平板状にしたときの形状を帯状にするなど、対応したものにしなければならないのはもちろんである。
【0034】
また、プリント基板を先に湾曲させて切頭円錐形状とし、その凹面にLEDを装着してもよい。
【0035】
さらに、プリント基板の外周から半径方向に内側に延びるスリットを複数間欠的に設けておいても構わない。このようなものであれば、プリント基板をより簡単に湾曲させることができるようになる。
【0036】
さらに、プリント基板の配線を、電流量に応じて通常必要とされる太さよりも太いものとし、この配線そのものに放熱機能を有させるものとしてもよい。このようにすれば、放熱効果をさらに高めることができる。具体的には、LEDの発光素子(ベアチップ)を保持する保持体から延伸するリード線に接続する配線幅を大きくすることが、放熱を効率的に行う上で好ましい。
【0037】
また、従来のように保持枠そのものを加工して発光体装着面を形成し、その発光体装着面にLEDを配置したものに、前記実施形態のような放熱板や放熱部材を設けるようにしても構わない。
【0038】
その他、各部の構成は図示例に限定されるものではなく、本発明の趣旨を逸脱しない範囲で種々変形が可能である。
【0039】
【発明の効果】
以上に詳述したように、本発明によれば、放熱板をその切り欠き辺同士を接合または近接させるだけで、反発光体装着面に密着し得るような切頭円錐凹面を形成できるので、極めて容易にこの種の湾曲凹面に配置するような発光体の放熱を図ることができる。そしてその結果、無理なく発光体の放熱を行ってその温度を積極的に下げることができるので、高い照明光度を得られ、製品の長寿命化も促進することができる。
【0040】
もちろん、保持枠側に円錐凹面状の加工や、発光体埋設保持用の孔等を穿設する必要がなく、発光体を容易に切頭円錐凹面に配置し、しかも配線することができるので、製造方法が複雑になることもない。
【0041】
さらに、放熱板やプリント基板の切り欠きの大きさや径寸法を適宣変更することにより、種々の接頭円錐凹面を形成することも容易に行える。
【図面の簡単な説明】
【図1】本発明の一実施形態におけるLEDを装着したプリント基板の平板状態を示す平面図。
【図2】同実施形態における放熱板の平板状態を示す平面図。
【図3】同実施形態における照明装置の中央縦断面図。
【図4】同実施形態の変形例におけるLEDを装着したプリント基板の平板状態を示す平面図。
【図5】同変形例における放熱板の平板状態を示す平面図。
【図6】同変形例における照明装置の中央縦断面図。
【図7】本発明の効果を示す実験データ(赤色LED)。
【図8】本発明の効果を示す実験データ(白色LED)。
【図9】従来における照明装置の中央縦断面図。
【符号の説明】
1・・・発光体(LED)
2・・・プリント基板
2a・・・基板の一方の切り欠き辺
2b・・・基板の他方の切り欠き辺
2c・・・発光体装着面
2d・・・裏面
6・・・放熱部材(放熱板)
6a・・・放熱板の一方の切り欠き辺
6b・・・放熱板の他方の切り欠き辺
6c・・・密着面
7・・・放熱部材
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an illumination device for product inspection that is suitably used when product inspection is performed using reflected illumination.
[0002]
[Prior art]
In this type of product inspection illumination device, a plurality of light emitters such as LEDs are arranged and illuminated so as to cover the object to be inspected from the peripheral direction so that the intensity of the inspection surface is kept uniform. Has been developed. And in order to cover a to-be-inspected object from the circumference direction, the light-emitting body mounting surface which makes | forms a curved concave surface shape, such as a cylindrical inner surface and a conical concave surface, is formed, and several LED is mounted on the light-emitting body mounting surface. It is desirable.
[0003]
For this purpose, a product inspection lighting device is conventionally subjected to a complicated process in which the holding frame itself is machined into a cylindrical inner surface or conical concave shape and perforated, and a light emitter is directly embedded in each hole and then manual wiring is performed. In order to greatly reduce the labor and cost, the inventor of the present application mounted the LED in a state where the bendable printed circuit board is kept flat, and curved the printed circuit board to make this kind of lighting device. Has been invented and patented (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-21729
[Problems to be solved by the invention]
However, in this type of lighting device, it was thought that it was extremely difficult to provide a heat dissipation structure on the back surface of the curved light emitter mounting surface. is there. Specifically, as shown in FIG. 9 , no heat radiating member is provided on the back side of the LED 100, and the air layer AS is interposed. As a result, there is still room for improvement in that it is difficult to obtain a large illumination intensity because the temperature of the LED cannot be actively lowered, and it is difficult to extend its life.
[0006]
The present invention has been made in view of such circumstances, and in a lighting device for product inspection in which a plurality of light emitters are arranged on a curved concave surface, a large illumination luminous intensity and a long lifetime are ensured while ensuring manufacturability. The main purpose is to obtain
[0007]
[Means for Solving the Problems]
That is, the present invention provides a product inspection illumination device used when a plurality of light emitters are arranged on a curved concave surface, illuminate the subject to be inspected from the surrounding direction, and use the reflected illumination to inspect the product. a is a plurality of the light emitters, chromatic and and said plurality of annular back surface resistance of the surface to be mounted is disposed a light emitter of the printed circuit board a notch in a portion a bendable in the thickness direction And a heat dissipating member that has substantially the same shape as that of the printed board in plan view and can be bent in the thickness direction, and a holding frame that holds the printed board, and the printed board is in a planar state or a substantially planar state. After holding a plurality of light emitters on the light emitter mounting surface set on one surface thereof, one notch side and the other notch side of the printed circuit board on which the light emitter is mounted are connected to the light emitter. The mounting surface is located on the concave side Bonding or holding close to each other to form the printed circuit board in a truncated conical shape, or bonding one notch side and the other notch side of the printed circuit board so that the light emitter mounting surface is located on the concave side The printed circuit board is held close to a truncated cone shape, and the light emitting body is mounted on the light emitting body mounting surface, while one cut-out side and the other cut-out side of the heat radiating member are joined or held in close proximity. The contact surface set on the concave side of the truncated cone shape is in close contact with the back surface of the light emitter mounting surface of the printed circuit board having the truncated cone shape, and the light emitting member mounting surface of the heat dissipation member Monodea the surface in close contact with the back surface is recessed so as to wrap the and the resistor has a flexible deformation is, to hold a printed circuit board equipped with the heat radiating member and the light emitters in the holding groove provided in the holding frame, the Retention In state, the heat radiating member is held groove in fits without substantially gap, which relates to a product inspection lighting apparatus characterized that you contact or substantially close contact with the bottom surface both of the back surface and holding groove of the printed circuit board.
[0008]
If this is the case, it is possible to form a truncated conical concave surface that can be brought into close contact with the anti-illuminant mounting surface simply by joining or bringing the cut-out sides of the heat radiating member together, so that it is extremely easy and reasonable. It is possible to dissipate heat from the light emitter that is disposed on this kind of curved concave surface. As a result, it is possible to dissipate the luminous body without difficulty and actively lower the temperature, so that a high illumination intensity can be obtained and the product life can be increased.
[0009]
In addition, the holding frame is simply processed into a conical concave shape for holding the printed circuit board and the heat radiating member, and there is no need to make holes for holding the light emitter embedded, so that the light emitter can be easily cut. Since it can be arranged on the concave surface of the head cone and can be wired, the manufacturing method is not complicated. Furthermore, various prefix conical concave surfaces can be easily formed by appropriately changing the size and diameter of the notches of the heat radiating member and the printed circuit board.
[0010]
On the other hand, as another embodiment that can achieve the same effect as described above, a plurality of light emitters, and a back surface of a surface that can be bent in the thickness direction and has a notch in a part thereof and on which the plurality of light emitters are mounted. An annular printed circuit board in which a resistor is disposed, a heat radiation member that has substantially the same shape as the printed circuit board in a plan view and can be bent in a thickness direction, and a holding frame that holds the printed circuit board. A heat dissipating member that has substantially the same shape as viewed and can be bent in the thickness direction is in close contact with or substantially in close contact with the back surface of the light emitting body mounting surface of the printed circuit board, The other notch side is formed in a truncated conical shape by being joined or held in close proximity so that the light emitter mounting surface is located on the concave side, and is in close contact with the back surface of the light emitter mounting surface of the heat radiating member. Flexible surface A and are those depressions to deform so as to wrap the resistor, to hold a printed circuit board equipped with the heat radiating member and the light emitters in the holding groove provided in the holding frame, in the holding state, the heat radiating member is retained in the groove And an illumination device for product inspection, characterized in that it fits in substantially without any gap and is in close contact with or substantially in close contact with both the back surface of the printed circuit board and the bottom surface of the holding groove .
[0011]
As a highly preferable mode for improving heat dissipation in implementation, a plurality of light emitters are arranged on a light emitter mounting surface having a curved surface provided in a holding frame, and the light emitter mounting A heat radiating member that can be bent in the thickness direction is brought into close contact with the back surface of the surface and the holding frame, and the surface that is in close contact with the back surface of the light emitting body mounting surface of the heat radiating member has flexibility. . This is because the heat of the luminous body can be efficiently and promptly transmitted to the holding frame via the heat radiating member so that the entire holding frame can dissipate heat. By the way, the thermal conductivity of air is 0.02 kcal / mh ° C. When a member made mainly of silicon, fluorosilicone, SEP, etc. is used as the heat radiating member, the thermal conductivity is 0.8 kcal / mh ° C. Since it becomes a grade or more, it turns out that the remarkable remarkable difference arises in the case where an air layer intervenes without using a heat radiating member, and the case where a heat radiating member is used. Furthermore, by interposing a heat radiating member, it is possible to obtain an effect that it is possible to suppress rattling and deformation of the printed circuit board.
[0012]
In addition, in order to improve the degree of adhesion and contribute to the improvement of heat dissipation, and also contribute to the ease of assembly, etc., at least the surface of the heat radiating member that is in close contact with the rear surface of the light emitter mounting surface has flexibility. It is preferable to keep it. Here, “flexibility” means that when a heat radiating member is attached, it is recessed on the back surface of the light emitter mounting surface so as to enclose parts such as lead wires and resistors protruding from the back surface of the light emitter mounting surface. That is, it is soft enough to adhere.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
[0014]
As shown in FIGS. 1 to 3, the illuminating device 4 according to the present embodiment includes a plurality of LEDs 1 that are light emitters, and a printed circuit board 2 that has an annular shape with a part of the cutout and can be bent in the thickness direction. The heat sink 6 is a heat dissipating member that has substantially the same shape as the printed circuit board 2 in plan view and can be bent in the thickness direction, and a holding frame that holds the printed circuit board 2 and has a center hole 32 for visual observation or photographing. An illumination case 3 is provided. Note that the screw 31 is provided for attaching the lighting device 4 because it is drilled in the lighting case 3.
[0015]
With such a configuration, the manufacturing method of the lighting apparatus according to the present embodiment will be described. First, after holding the printed wiring board 2 in a flat state, a plurality of LEDs 1 are implanted all over the light-emitting body mounting surface 2c set on one surface of the board 2 by a method such as soldering. Thereafter, one notch side 2a and the other notch side 2b of the substrate 2 are curved by joining or approaching so that the light emitter mounting surface 2c is located on the concave side. As a result, the printed circuit board 2 inevitably has a frustoconical shape, and the light emitter mounting surface 2c becomes a frustoconical concave surface, and the LED 1 is disposed there. At this time, the power cable 5 is also wired to the substrate 2 by soldering or the like.
[0016]
On the other hand, one notch side 6a and the other notch side 6b of the heat radiating plate 6 are joined or brought close to each other to form a truncated cone shape. Then, the close contact surface 6c set on the concave surface side of the heat radiating plate 6 is brought into close contact with the curved back surface 2d of the light emitter mounting surface 2c. Here, “contact” includes that part or all of the back surface 2d and part or all of the contact surface 6c are in close contact.
[0017]
The heat radiating plate 6 is made of, for example, silicon, fluorosilicone, SEP or the like as a main material, and has high heat conductivity and flexibility with electrical insulation. When the printed circuit board 2 is in close contact with the back surface 2d, the contact surface 6c is deformed so as to wrap around each component such as a resistor, the protruding LED 1 leg, and the like disposed on the back surface 2d. Note that a pressure-sensitive adhesive or a pressure-sensitive adhesive may be attached to the contact surface 6c to the printed circuit board 2 so that the contact surface 6c adheres to the back surface 2d.
[0018]
Thereafter, the printed board 2 on which the heat sink 6 and the LED 1 are mounted is held in a holding groove 33 having a corresponding diameter provided in the lighting case. In the present embodiment, the holding groove 33 is just large enough to accommodate the printed circuit board 2 and the heat radiating plate 6, and the heat radiating plate 6 fits in the holding groove 33 with almost no gap, and the back surface 2 d of the printed circuit board 2. In addition, it is in close contact with or substantially in close contact with both bottom surfaces of the holding grooves 33.
[0019]
Therefore, in such a case, the heat of the LED 1 can be efficiently and promptly transmitted to the holding frame 3 via the heat radiating plate 6 and can be radiated by the entire holding frame 3, so that the heat dissipation of the LED 1 can be performed without difficulty. You can go and lower the temperature positively. It becomes possible to suppress the temperature rise of LED1. As a result, high illumination intensity can be obtained, and the product life can be increased.
[0020]
Furthermore, by interposing the heat sink 6, it is possible to obtain an effect that it is possible to suppress rattling and deformation of the printed circuit board 2.
[0021]
In addition, it is possible to form a truncated conical concave surface that can be brought into close contact with the anti-light emitting body mounting surface 2d of the printed circuit board 2 simply by joining or bringing the cut-out sides 6a and 6b of the heat sink 6 together. In addition, the manufacturing process is not complicated.
[0022]
Specific effects are shown in FIGS. FIG. 7 shows the result of a comparative experiment for the red LED with and without the heat sink 6. As shown in the figure, the case where the heat sink 6 is present and the case where the heat sink 6 is not present are different from each other by about 25 ° C. in the solder portion temperature of the LED 1 20 minutes after the start of the experiment. Is approximately 10% lower than the initial light amount, whereas when there is no heat radiating plate 6, there is a significant difference of approximately 25% lower than the initial light amount.
[0023]
FIG. 8 shows the result of a comparative experiment for a white LED. In this experiment, the temperature without the heat radiating plate 6 rises to 100 ° C., which is the operation guarantee temperature of the LED. This is due to the fact that the forward voltage (VFmax) of white LED, blue LED or green LED is as high as 3.5 V and the amount of heat generation tends to increase, but there is no heat sink 6 in this way. Depending on the use conditions, it is considered that the temperature rises and causes deterioration, which has a great influence on the lifetime and the luminous intensity. Compared to this, it is understood that the temperature without the heat radiating plate 6 is kept around 45 ° C., and the temperature difference is actually 55 ° C.
[0024]
Of course, there is no need to make a hole for embedding and holding the LED on the illumination case 3 side, and the LED 1 can be easily arranged on the truncated conical concave surface 2c and can be wired easily. It can also have the effect.
[0025]
Furthermore, as shown in FIGS. 4 to 6, various prefix conical concave surfaces can be easily formed by appropriately changing the size and diameter of the notches of the heat sink 6 and the printed board 2.
[0026]
The heat sink 1 is attached to the printed circuit board 2 in advance, for example, in a flat state before the printed circuit board 2 in which the LEDs 6 are all planted is bent, and then one notch side 2a of the substrate 2 is formed. And the other cut-out side 2b are joined or brought close to each other so that the light emitter mounting surface 2c is located on the concave side, and held in a holding groove 33 having a corresponding diameter provided in the lighting case 4. I do not care.
[0032]
The present invention is not limited to the above-described embodiments, and various modifications can be made.
[0033]
For example, the light-emitting body mounting surface is not limited to a truncated conical concave surface, and may be a cylindrical inner surface or a curved concave surface similar thereto. And in that case, of course, it is necessary to make it the corresponding thing, such as making the shape at the time of making it flat form of a heat sink or a printed circuit board.
[0034]
Alternatively, the printed circuit board may be first bent into a truncated cone shape, and the LED may be mounted on the concave surface.
[0035]
Furthermore, a plurality of slits extending radially inward from the outer periphery of the printed board may be provided intermittently. With such a configuration, the printed circuit board can be bent more easily.
[0036]
Furthermore, the wiring of the printed board may be thicker than the thickness normally required according to the amount of current, and the wiring itself may have a heat dissipation function. In this way, the heat dissipation effect can be further enhanced. Specifically, it is preferable to increase the width of the wiring connected to the lead wire extending from the holding body that holds the light emitting element (bare chip) of the LED in order to efficiently dissipate heat.
[0037]
In addition, the holding frame itself is processed to form a light emitter mounting surface as in the prior art, and the heat sink and the heat dissipation member as in the above embodiment are provided on the LED mounting surface. It doesn't matter.
[0038]
In addition, the structure of each part is not limited to the illustrated example, and various modifications can be made without departing from the spirit of the present invention.
[0039]
【The invention's effect】
As described in detail above, according to the present invention, it is possible to form a truncated conical concave surface that can be in close contact with the anti-illuminant mounting surface by simply joining or bringing the cutout sides of the heat sink together. It is very easy to dissipate heat from the light-emitting body that is disposed on this curved concave surface. As a result, it is possible to dissipate the luminous body without difficulty and actively lower the temperature, so that a high illumination intensity can be obtained and the product life can be increased.
[0040]
Of course, there is no need to drill a conical concave surface on the holding frame side, a hole for holding the light emitter embedded, etc., and the light emitter can be easily placed on the truncated conical concave surface and wired. The manufacturing method is not complicated.
[0041]
Furthermore, various prefix conical concave surfaces can be easily formed by appropriately changing the size and diameter of the notches of the heat sink and the printed circuit board.
[Brief description of the drawings]
FIG. 1 is a plan view showing a flat state of a printed circuit board on which an LED is mounted according to an embodiment of the present invention.
FIG. 2 is a plan view showing a flat plate state of the heat sink in the embodiment.
FIG. 3 is a central vertical cross-sectional view of the illumination device in the embodiment.
FIG. 4 is a plan view showing a flat state of a printed board on which an LED is mounted according to a modification of the embodiment.
FIG. 5 is a plan view showing a flat plate state of a heat sink in the modification.
FIG. 6 is a central longitudinal sectional view of a lighting device according to the modification.
FIG. 7 is experimental data (red LED) showing the effect of the present invention.
FIG. 8 is experimental data (white LED) showing the effect of the present invention.
FIG. 9 is a central longitudinal sectional view of a conventional lighting device.
[Explanation of symbols]
1. Light emitter (LED)
2 ... Printed circuit board 2a ... One notch side 2b of the board ... The other notch side 2c of the board ... Light emitter mounting surface 2d ... Back surface 6 ... Heat dissipation member (heat dissipation plate) )
6a: one notch side 6b of the heat sink ... the other notch side 6c of the heat sink ... contact surface 7 ... heat dissipation member

Claims (2)

複数の発光体を湾曲凹面に配置し、被検査体に対して周囲方向から覆うように照明してその反射照明によって製品検査をする場合に使用される製品検査用照明装置であって、
複数の発光体と、厚み方向に湾曲可能であって一部に切り欠きを有し且つ前記複数の発光体を装着する面の裏面に抵抗が配設された円環状のプリント基板と、前記プリント基板と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材と、前記プリント基板を保持する保持枠とを備え、前記プリント基板を平面状態又は略平面状態に保持し、その一方の面に設定した発光体装着面に複数の発光体を装着した後、前記発光体を装着したプリント基板の一方の切り欠き辺と他方の切り欠き辺とを、前記発光体装着面が凹面側に位置するように接合または近接保持して該プリント基板を切頭円錐形状にし、又は前記プリント基板の一方の切り欠き辺と他方の切り欠き辺とを、前記発光体装着面が凹面側に位置するように接合または近接保持して該プリント基板を切頭円錐形状にした後、その発光体装着面に発光体を装着する一方、前記放熱部材の一方の切り欠き辺と他方の切り欠き辺とを接合または近接保持して切頭円錐形状にし、その凹面側に設定した密着面を、切頭円錐形状にした前記プリント基板における発光体装着面の裏面に密着させてなり、前記放熱部材における前記発光体装着面の裏面に密着する面が柔軟性を有し且つ前記抵抗を包み込むように凹み変形するものであり、
前記保持枠に、プリント基板及び放熱部材を容れ得る大きさに設定した保持溝を設け、この保持溝に放熱部材及び発光体を装着したプリント基板を保持させた状態において、放熱部材が、保持溝内に略隙間無くはまり込み、プリント基板の裏面及び保持溝の底面双方に密着又は略密着し、且つ前記発光体が前記保持溝外に位置付けられることを特徴とする製品検査用照明装置。
A lighting device for product inspection used when placing a plurality of light emitters on a curved concave surface, illuminating the object to be inspected from the surrounding direction, and inspecting the product by its reflected illumination,
A plurality of light emitters, and the printed circuit board of the annular rear surface resistance is disposed in a plane and have a notch in a portion a bendable in the thickness direction is mounted a plurality of light emitters, the printed A heat dissipating member that has substantially the same shape as the substrate in plan view and can be bent in the thickness direction, and a holding frame that holds the printed circuit board, and holds the printed circuit board in a planar state or a substantially planar state, on one surface thereof After mounting the plurality of light emitters on the set light emitter mounting surface, the light emitter mounting surface is positioned on the concave side of one notch side and the other notch side of the printed circuit board on which the light emitter is mounted. In this way, the printed circuit board is formed in a truncated conical shape by being joined or held in close proximity, or one notch side and the other notch side of the printed circuit board are positioned on the concave surface side. Join or keep close After making the truncated substrate into a truncated cone shape, the luminous body is mounted on the luminous body mounting surface, while one notch side and the other notched side of the heat radiating member are joined or held in close proximity to each other. The contact surface set in the shape and on the concave surface side is closely contacted with the back surface of the light emitter mounting surface of the printed circuit board having a truncated conical shape, and the surface closely contacting the back surface of the light emitter mounting surface of the heat dissipation member There Ri Monodea deforming recess so as to wrap the and the resistor has flexibility,
The holding frame is provided with a holding groove set to a size that can accommodate the printed circuit board and the heat radiating member, and in the state where the printed circuit board with the heat radiating member and the light emitter mounted thereon is held in the holding groove, the heat radiating member is the holding groove. substantially clearance fits without close contact or substantially in close contact with the bottom surface both of the back surface and holding groove of the printed circuit board, and the light emitters illumination device for device testing, wherein Rukoto positioned outside the holding groove within.
複数の発光体を湾曲凹面に配置し、被検査体に対して周囲方向から覆うように照明してその反射照明によって製品検査をする場合に使用される製品検査用照明装置であって、
複数の発光体と、厚み方向に湾曲可能であって一部に切り欠きを有し且つ前記複数の発光体を装着する面の裏面に抵抗が配設された円環状のプリント基板と、前記プリント基板と平面視略同一形状をなし厚み方向に湾曲可能な放熱部材と、前記プリント基板を保持する保持枠とを備え、前記プリント基板を平面状態又は略平面状態に保持したうえで、その一方の面に設定した発光体装着面に複数の発光体を装着し、前記放熱部材の一方の面に設けた密着面を前記発光体装着面の裏面に密着させた後、前記プリント基板の一方の切り欠き辺と他方の切り欠き辺とを前記発光体装着面が凹面側に位置するように接合または近接保持して切頭円錐形状にしてなり、前記放熱部材における前記発光体装着面の裏面に密着する面が柔軟性を有し且つ前記抵抗を包み込むように凹み変形するものであり、
前記保持枠に、プリント基板及び放熱部材を容れ得る大きさに設定した保持溝を設け、この保持溝に放熱部材及び発光体を装着したプリント基板を保持させた状態において、放熱部材が、保持溝内に略隙間無くはまり込み、プリント基板の裏面及び保持溝の底面双方に密着又は略密着し、且つ前記発光体が前記保持溝外に位置付けられることを特徴とする製品検査用照明装置。
A lighting device for product inspection used when placing a plurality of light emitters on a curved concave surface, illuminating the object to be inspected from the surrounding direction, and inspecting the product by its reflected illumination,
A plurality of light emitters, and the printed circuit board of the annular rear surface resistance is disposed in a plane and have a notch in a portion a bendable in the thickness direction is mounted a plurality of light emitters, the printed A heat dissipating member that has substantially the same shape as the substrate in plan view and can be bent in the thickness direction, and a holding frame that holds the printed circuit board, and holds the printed circuit board in a planar state or a substantially planar state, A plurality of light emitters are mounted on the light emitter mounting surface set on the surface, and a close contact surface provided on one surface of the heat radiating member is in close contact with the back surface of the light emitter mounting surface, and then one of the printed circuit boards is cut. The notch side and the other notch side are joined or held close together so that the light emitter mounting surface is located on the concave side to form a frustoconical shape, and are in close contact with the back surface of the light emitter mounting surface of the heat radiating member and said surfaces has a flexible Ri deformed Monodea recess so as to enclose the anti,
The holding frame is provided with a holding groove set to a size that can accommodate the printed circuit board and the heat radiating member, and in the state where the printed circuit board with the heat radiating member and the light emitter mounted thereon is held in the holding groove, the heat radiating member is the holding groove. substantially clearance fits without close contact or substantially in close contact with the bottom surface both of the back surface and holding groove of the printed circuit board, and the light emitters illumination device for device testing, wherein Rukoto positioned outside the holding groove within.
JP2002290620A 2002-10-03 2002-10-03 Lighting device Expired - Lifetime JP4335512B2 (en)

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