JP4328641B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device including a semiconductor element having an imaging function and a package in which the semiconductor element is mounted.

  12 and 13 are a perspective view and a cross-sectional view showing a structure of a semiconductor device 125 in which a semiconductor element 108 having a conventional imaging function is mounted on a package 101. FIG.

  The structure of the conventional semiconductor device 125 includes a rectangular box-shaped package 101 whose upper surface is open, a semiconductor element 108 mounted in the package 101, and a glass plate 118 that closes the upper surface of the package 101. ing.

  The package 101 is formed of a resin in which a main component epoxy resin, a curing agent phenol resin, an amine curing accelerator, a release wax, carbon black, an adhesive, a filler mixed with silica fine particles, and the like are mixed in a predetermined ratio. ing. A metal lead frame made of a copper alloy or nickel alloy is integrally incorporated in the package 101, one end of which is disposed as an inner lead 106 on the bottom surface 105 inside the package 101, and the other end. The outer leads 107 extend outward from the package 101. A semiconductor element 108 is mounted on the bottom surface 105 using a die bonding agent 112.

  On the main surface 109 (surface opposite to the mounting surface fixed by the die bond agent 112) of the semiconductor element 108, a light receiving portion is formed in the central portion, and an electrode terminal 110 is disposed in the peripheral portion. The electrode terminal 110 is connected to the inner lead 106 by a bonding wire such as a gold wire.

  The upper surface opening 102 of the package 101 is closed by a lid 118 made of glass, the lid 118 and the package 101 are joined by a sealing agent 124, and the semiconductor element 108 is hermetically sealed in the package 101. (See Patent Document 1).

The shape of this package is a shape called DIP (Dual In-line Package), which is an external terminal insertion type on a mounting board.
Japanese Patent Laid-Open No. 10-242336 (page 5, FIG. 1)

  In the conventional configuration, the mounting form of the package 101 is a through-hole type large package such as DIP, and a technique suitable for such a large package is disclosed in Patent Document 1. On the other hand, the trend of devices incorporating these packages is certainly toward light, thin and small, and accordingly, components built into the devices are naturally required to be small. However, at present, it is not always possible to reduce the size and thickness of electronic components in line with market demands. On the other hand, the use of an optically flat cover glass (lid 118) is a problem and an obstacle to be improved in terms of characteristics (signal / noise ratio) and cost of the imaging function type semiconductor device 125, and is an imaging function type. This has an important influence on the semiconductor device 125. In the imaging function type semiconductor device 25, miniaturization, ensuring a high signal / noise ratio, and cost reduction are essential conditions for the technology development policy, but the cover glass makes it difficult to satisfy these conditions.

  The present invention has been made in view of this point, and an object of the present invention is to provide a semiconductor device having an imaging function that is small in size and low in cost.

  A first semiconductor device of the present invention is a semiconductor device having a semiconductor element having an imaging function and a package for housing the semiconductor element, and the semiconductor element has a rectangular plate shape and has one surface. A light receiving portion at a central portion of the substrate, and a plurality of electrode terminals arranged in a peripheral portion of the surface. The package includes an envelope having a rectangular frame shape, and a portion of the package is embedded in the envelope. And a plurality of metal leads for electrical connection between the electrode terminal and the outside, and the envelope has a protruding portion in which a part of the surrounding wall surrounding the rectangular opening protrudes into the opening. And the semiconductor element is accommodated in the opening, and one end portion of the plurality of metal leads protrudes from the protruding portion into the opening and is electrically connected to the electrode terminal, The end protrudes from the outer peripheral surface of the envelope. The gap between the semiconductor element and the protruding portion of the surrounding wall is blocked by resin, and the opening of the envelope facing the surface on which the electrode terminal of the semiconductor element is disposed is blocked by a dustproof film. It is peeling off.

  The other ends of the plurality of metal leads are projected substantially perpendicularly from the outer peripheral surface of the envelope, or are projected substantially perpendicularly and are bent at a substantially right angle.

  In a preferred embodiment, the projecting portion into the opening of the surrounding wall includes a first projecting portion and a second projecting portion having a smaller projecting amount than the first projecting portion, and the semiconductor element. A space between the first protruding portion of the surrounding wall is blocked by resin, and a surface of the semiconductor element opposite to the surface on which the electrode terminal is disposed is the second protruding portion. It is supported by a fixed support member.

  The support member is fixed to the surface of the semiconductor element opposite to the surface on which the electrode terminals are disposed with an adhesive.

  A second semiconductor device of the present invention is a semiconductor device having a semiconductor element having an imaging function and a package for housing the semiconductor element, and the semiconductor element has a rectangular plate shape and has one surface. A light receiving portion at a central portion of the substrate, and a plurality of electrode terminals arranged in a peripheral portion of the surface. The package includes an envelope having a rectangular frame shape, and a portion of the package is embedded in the envelope. And a plurality of metal leads for electrical connection between the electrode terminal and the outside, and the envelope has a protruding portion in which a part of the surrounding wall surrounding the rectangular opening protrudes into the opening. And the semiconductor element is accommodated in the opening, and one end of the plurality of metal leads is exposed in the opening at the protruding portion and is electrically connected to the electrode terminal, The other end is exposed on the outer peripheral surface of the envelope. The gap between the semiconductor element and the protruding portion of the surrounding wall is blocked by resin, and the opening of the envelope facing the surface on which the electrode terminal of the semiconductor element is disposed is formed by a dust-proof film. It is blocked.

  The envelope is preferably provided with at least one guide hole for positioning.

  In a preferred embodiment, an optical filter or a lens is provided between the dust-proof film and the semiconductor element.

  Since the package has a rectangular frame shape and the bottom surface is removed, a small and lightweight semiconductor device can be obtained. Since the dust-proof film is provided without using the cover glass, a semiconductor device having excellent optical characteristics can be obtained. Further, the semiconductor device can be manufactured at low cost.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the member which has the substantially same function attaches | subjects and demonstrates the same code | symbol.

(Embodiment 1)
FIG. 1 is a perspective view of a semiconductor device 25 according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. In the description of the present embodiment, the case where the package 1 formed of a thermosetting resin is used will be described as an example. In FIG. 1, the dust-proof film 26 provided on the upper surface of the semiconductor device 25 is omitted for easy explanation.

  The package 1 includes an envelope 19 having a rectangular frame shape and a plurality of metal leads 31. The envelope 19 includes an opening 2 provided through a rectangular interior, and the size of the opening 2 is designed such that the imaging function type semiconductor element 8 can be accommodated and assembled. And the circumference | surroundings of the opening part 2 are enclosed by the envelope 19, and the inner wall of the envelope 19 which surrounds this is an enclosure wall.

  The envelope 19 includes a rectangular frame-shaped envelope upper portion 3 and an envelope lower portion 4, and the envelope upper portion 3 and the envelope lower portion 4 are located outside the outer envelope upper portion 3. The inner wall (enclosure wall) protrudes into the opening from the lower part 4 of the envelope to form a protruding portion 5.

  The metal lead 31 has a longitudinal center portion embedded in the envelope 19, one end protruding into the opening to become the inner lead 6, and the other end of the outer periphery of the envelope 19. The outer lead 7 protrudes outward from the surface 14. The outer lead 7 is attached to and electrically connected to an external substrate. The inner lead 6 protrudes from the protrusion 5 into the opening. In the drawing, the lower surface of the inner lead 6 and the lower surface of the protrusion 5 are substantially flush with each other, and the lower surface of the inner lead 6 is exposed in the opening. Yes. On the other hand, the outer lead 7 protrudes substantially perpendicularly from the outer peripheral surface 14 of the envelope 19 and is bent downward at a right angle. Further, the outer lead 7 is bent at a right angle so as to be away from the envelope 19 near the lower surface of the envelope 19. . Thereby, surface mounting can be performed by soldering directly to the substrate.

  The top surface of the envelope 19 is provided with three positioning guide holes 16 for restricting the positional relationship in order to connect the target module system and the package 1 with high accuracy.

  The semiconductor element 8 having an imaging function has a rectangular thin plate shape, and a light receiving portion is provided at a central portion of one surface (main surface 9). A plurality of electrode terminals 10 are arranged in a row on each side in the peripheral portion of the main surface 9.

  The semiconductor element 8 and the opening of the package 1 are rectangles having substantially the same size, and the semiconductor element 8 is accommodated in the opening of the package 1 so that each electrode terminal 10 and each inner lead 6 are electrically connected. The This connection is performed by flip-chip bonding with the metal protrusion 11 formed on the electrode terminal 10 and the lower surface of the inner lead 6 aligned with high accuracy. The metal protrusion 11 may be formed by plating or printing.

  Then, a liquid resin 15 as a thermosetting underfill is filled in a minute gap formed between the inner wall (enclosure wall) of the envelope 19 and the side surface of the semiconductor element 8 and between the protrusion 5 and the main surface 9 of the semiconductor element 8. Then, the heat curing is performed to strengthen the mechanical connection strength between the inner lead 6 and the semiconductor element 8, and the dust that enters from the lower surface opening of the package 1 by closing the gap between the semiconductor element 8 and the protruding portion 5. Reaching the main surface 9 side of the semiconductor element 8 is prevented.

  Finally, after inspection of the dimensions required for the imaging function type semiconductor element 8 and removal of dust on and around the semiconductor element 8, the lower surface is weakly adhesive so as to cover the opening 2 of the upper surface 17 of the envelope 19. The semiconductor device of this embodiment is completed by attaching the dust-proof film 26 provided with glue. This semiconductor device is used by peeling off the dust-proof film 26 immediately before being incorporated into a substrate or the like.

  With the above configuration and method, a small-sized semiconductor device having high performance and an inexpensive imaging function can be realized. Realization of glassless size, thickness reduction, prevention of incident light absorption by glass, flare prevention by reflected light on glass front and back, reduction of component material cost, easy removal of dust on semiconductor element surface, etc. it can. Further, by forming the guide hole 16, the assembly accuracy with the set can be improved. Note that at least one guide hole 16 is sufficient.

  In addition, the miniaturization and thinning of these components also provide the effect that the set to be attached can be miniaturized. Although the thermosetting resin has been described as the material of the package 1, the present invention is not limited to this.

  Although the quad type is used for the outer shape of the package 1 as the present embodiment, a dual inline type or a non-lead type may be used. Further, although the liquid resin is used as the underfill material, a semi-cured sheet-like resin may be used.

(Embodiment 2)
3 is a perspective view of the semiconductor device 25 according to the second embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along the line BB ′ of FIG. In the description of the present embodiment, the case where the package 1 formed of a thermosetting resin is used will be described as an example. Since the present embodiment is different from the first embodiment in that the guide member is not formed and the support member 13 is attached, the difference will be described. In FIG. 3, the dust-proof film 26 provided on the upper surface of the semiconductor device 25 is omitted for easy explanation.

  In the present embodiment, the first protrusion 35 is formed on the envelope upper portion 3, and the second protrusion is also less in the envelope lower portion 4 than the first protrusion 35. 45 is formed. Further, unlike the first embodiment, no guide hole is provided on the upper surface of the envelope 19.

  Then, a liquid resin as a thermosetting underfill is formed in the minute gap formed between the inner wall (enclosure wall) of the envelope 19 and the side surface of the semiconductor element 8 and between the first protrusion 35 and the periphery of the main surface 9 of the semiconductor element 8. 15 is filled and heat-cured to strengthen the mechanical connection strength between the inner lead 6 and the semiconductor element 8.

  Further, the end of the sheet-like support member 13 is fixed to the second protrusion 45. The support member 13 supports the lower surface of the semiconductor element 8. An adhesive 12 is applied to the lower surface of the semiconductor element 8, and the semiconductor element 8 and the support member 13 are fixed. For the support member 13, an inorganic material such as metal or glass, a resin molded product, a glass epoxy substrate, a flexible sheet including a metal film, or the like can be used.

  The fixing between the lower surface of the semiconductor element 8 and the upper surface of the support member 13 and the fixing of the second projecting portion 45 and the support member 13 may be performed either in the former or in the both. Absent.

  With the above configuration and method, the semiconductor device 25 having a small, high-performance, and inexpensive imaging function can be realized. Realization of glassless size, thickness reduction, prevention of incident light absorption by glass, flare prevention by reflected light on glass front and back, reduction of component material cost, easy removal of dust on semiconductor element surface, etc. it can. Further, by providing the support base 13 having a metal film or the like on the lower side of the semiconductor element 8, it is possible to prevent moisture entering from the lower surface side of the semiconductor element 8 and to reduce the thermal resistance of the package 1, thereby reducing the high-power semiconductor element. Can be installed.

  In the first and second embodiments, the outer lead 7 of the package 1 is described as being bent downward along the side surface of the lower part 4 of the envelope, and the vicinity of the tip is formed into a shape that enables board mounting. As described in FIGS. 7 (a), 7 (b) and 7 (c), it is bent downward along the side surface of the lower part 4 of the envelope according to the mounting form, and the vicinity of the tip is a substrate. Finishing molded into a shape that enables mounting, bending upward along the side of the upper 3 upper part of the envelope, and finishing near the tip so that it can be mounted on the board, and side of the envelope 19 It may be a finish that extends as it is without being bent, and is cut at a predetermined length.

  In the first and second embodiments, the semiconductor device 25 has a larger outer dimension of the package upper part 3 than that of the lower package part 4, but FIG. 8 (a) to FIG. 8 (c). As shown, the outer dimension of the envelope upper part 3 of the package 1 may be smaller than or the same as the outer dimension of the envelope lower part 4.

  Further, as shown in FIG. 9 in the first and second embodiments, the entire thickness can be reduced by mounting the optical filter 18 in the opening 2 above the stepped portion 5, and the small and high-density semiconductor device 25. Can be realized. The same can be said even if an optical component such as a lens is attached instead of the optical filter 18. Further, by performing optical adjustment when the semiconductor device 25 is formed, it is possible to reduce the number of steps for assembling the set incorporating the semiconductor device 25.

(Embodiment 3)
FIG. 5A is a perspective view seen from the upper surface side of the semiconductor device 25 according to the third embodiment of the present invention, FIG. 5B is a perspective view seen from the lower surface side, and FIG. It is CC 'sectional view taken on the line of a). In the description of the present embodiment, the case where the package 1 formed of a thermosetting resin is used will be described as an example.

  The package 1 includes a resin envelope 19 and a plurality of metal leads 31 partially embedded in the envelope 19.

  The plurality of metal leads 31 of this embodiment are obtained by punching and extruding a metal plate made of an alloy material having copper, nickel, and iron as a base material. Each metal lead 31 has an inner lead 6 and an outer lead 7, and the tip of each inner lead 6 is aligned with the peripheral portion so as to be positioned at the outline of the rectangular opening 2 provided in the package 1 of the present invention. Arranged and arranged.

  The package 1 having the metal lead 31 includes the opening 2 inside the envelope 19, and the size of the opening 2 is designed to accommodate the semiconductor element 8 having an imaging function and the assembling work. The periphery of the part 2 has a structure surrounded by an envelope 19.

  The envelope 19 includes a rectangular frame-shaped envelope upper portion 3 and an envelope lower portion 4, and the envelope upper portion 3 and the envelope lower portion 4 are located outside the outer envelope upper portion 3. The inner wall (enclosure wall) protrudes into the opening from the lower part 4 of the envelope to form a protruding portion 5.

  The metal lead 31 has a central portion in the longitudinal direction embedded in the envelope 19, and one end portion of the metal lead 31 is substantially flush with the lower surface portion of the protruding portion 5 and is exposed in the opening. The other end is the outer lead 7 exposed to be substantially flush with the outer peripheral surface of the envelope 19. The outer lead 7 is attached to and electrically connected to an external substrate. Thereby, surface mounting can be performed on the substrate. The exposed surfaces of the inner lead 6 and the outer lead 7 are plated with gold or palladium.

  The upper surface of the envelope 19 is provided with three guide holes 16 for regulating the positional relationship in order to connect the target module system and the package 1 with high accuracy.

  The semiconductor element 8 having an imaging function has a rectangular thin plate shape, and a light receiving portion is provided at a central portion of one surface (main surface 9). A plurality of electrode terminals 10 are arranged in a row on each side in the peripheral portion of the main surface 9.

  The semiconductor element 8 and the opening of the package 1 are rectangles having substantially the same size, and the semiconductor element 8 is accommodated in the opening of the package 1 so that each electrode terminal 10 and each inner lead 6 are electrically connected. The This connection is performed by flip-chip bonding with the metal protrusion 11 formed on the electrode terminal 10 and the lower surface of the inner lead 6 aligned with high accuracy. The metal protrusion 11 may be formed by plating or printing.

  Then, a liquid resin 15 as a thermosetting underfill is filled in the minute gap formed between the inner wall (enclosure wall) of the envelope 19 and the side surface of the semiconductor element 8 and between the protrusion 5 and the main surface 9 of the semiconductor element 8. Then, the heat curing is performed to strengthen the mechanical connection strength between the inner lead 6 and the semiconductor element 8, and the dust that enters from the lower surface opening of the package 1 by closing the gap between the semiconductor element 8 and the protruding portion 5. Reaching the main surface 9 side of the semiconductor element 8 is prevented.

  Finally, after inspection of the dimensions required for the imaging function type semiconductor element 8 and removal of dust on and around the semiconductor element 8, the lower surface is weakly adhesive so as to cover the opening 2 of the upper surface 17 of the envelope 19. The semiconductor device of this embodiment is completed by attaching the dust-proof film 26 provided with glue. This semiconductor device is used by peeling off the dust-proof film 26 immediately before being incorporated into a substrate or the like.

  With the above configuration and method, the semiconductor device 25 having an imaging function with a thinner structure can be realized. Realization of glassless size, thickness reduction, prevention of incident light absorption by glass, flare prevention by reflected light on glass front and back, reduction of component material cost, easy removal of dust on semiconductor element surface, etc. it can.

  Although the thermosetting resin was used for the material of the package 1, the present invention is not limited to this.

  Although the LGA type is used for the outer shape of the package 1 as the present embodiment, a SON type or a BGA type may be used. Further, the liquid resin is used as the underfill material, but a semi-cured sheet resin may be used.

  Furthermore, as shown in FIG. 10, if the outer leads 7 exposed on the lower surface of the envelope 19 in the package 1 do not reach the outermost periphery of the lower surface of the envelope 19, the finish when the package 1 is separated into pieces is obtained. Since quality improves, it is preferable.

  When the package 1 is assembled in the system, it is preferable that a step 55 having a predetermined size shown in FIG.

  As described above, the semiconductor device according to the present invention can be manufactured at a low cost and in a small size, and is useful as a semiconductor device on which a semiconductor element having an imaging function is mounted.

1 is a perspective view of a semiconductor device according to a first embodiment of the present invention. It is sectional drawing of the semiconductor device which concerns on Embodiment 1 of this invention. It is a perspective view of the semiconductor device which concerns on Embodiment 2 of this invention. It is sectional drawing of the semiconductor device which concerns on Embodiment 2 of this invention. It is a perspective view of the semiconductor device which concerns on Embodiment 3 of this invention. It is sectional drawing of the semiconductor device which concerns on Embodiment 3 of this invention. It is sectional drawing of the semiconductor device which concerns on another embodiment. It is sectional drawing of the semiconductor device which concerns on other embodiment. It is sectional drawing of the semiconductor device which concerns on another embodiment. FIG. 10 is a perspective view of a semiconductor device according to a modification of the third embodiment. FIG. 10 is a perspective view of a semiconductor device according to a modification of the third embodiment. It is a perspective view of the conventional semiconductor device. It is sectional drawing of the conventional semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package 2 Opening part 5 Protrusion part 6 Inner lead 7 Outer lead 8 Semiconductor element 9 Main surface 10 Electrode terminal 12 Adhesive 13 Support member 14 Outer wall 15 Resin 16 Guide hole 18 Optical filter 19 Enclosure 25 Semiconductor device 26 Dust-proof film 35 First protrusion 45 Second protrusion

Claims (3)

A semiconductor element having an imaging function;
A package containing the semiconductor element;
A semiconductor device comprising:
The semiconductor element has a rectangular plate shape, and includes a light receiving portion in a central portion of one surface and a plurality of electrode terminals arranged in a peripheral portion of the surface,
The package includes an envelope having a rectangular frame shape, and a plurality of metal leads that are partly embedded in the envelope and electrically connect the electrode terminal and the outside.
The envelope has a protruding portion in which a part of the surrounding wall surrounding the rectangular opening protrudes into the opening, and the semiconductor element is accommodated in the opening,
One end of the plurality of metal leads protrudes from the protrusion into the opening and is electrically connected to the electrode terminal, and the other end protrudes from the outer peripheral surface of the envelope,
Between the semiconductor element and the protruding portion of the surrounding wall is blocked by resin,
The opening of the envelope facing the surface on which the electrode terminal of the semiconductor element is disposed is closed by a dust-proof film,
The projecting portion into the opening of the surrounding wall is composed of a first projecting portion and a second projecting portion having a smaller projecting amount than the first projecting portion,
Between the semiconductor element and the first projecting portion of the surrounding wall is blocked by resin,
Wherein the surface opposite to the electrode terminals disposed to face the semiconductor element is supported by a supporting member fixed to the second protrusion, the semi-conductor device.   The other end of each of the plurality of metal leads protrudes substantially vertically from the outer peripheral surface of the envelope, or protrudes substantially vertically and is bent at a substantially right angle. Semiconductor device. The support member, wherein the electrode terminals of the semiconductor element and disposed to face is fixed by an adhesive and the opposite surface, the semiconductor device according to claim 1 or 2.

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