JP4326995B2 - Manufacturing method of electronic component holding plate and mold for manufacturing the same - Google Patents

Description

  The present invention relates to a method of manufacturing a holding plate for an electronic component used when an external electrode is applied to an end portion of an electronic component such as a chip capacitor or a resistor, and a mold structure used for the manufacturing method.

  Patent Document 1 discloses a method using a holding plate in which a large number of elastic holding holes are formed as one of the methods for forming and applying external electrodes to the ends of small electronic components such as chip capacitors and resistors. Yes. The cross-sectional dimension of the holding hole is slightly smaller than the maximum cross-sectional dimension of the small electronic component to be held. The holding hole is expanded to accommodate the electronic component, and the electronic component is elastically held by the elastic force of the holding hole wall surface.

  The holding plate is typically formed of a core plate having rigidity such as metal and a rubber-like elastic body, and a core plate in which a core hole having a diameter slightly larger than the holding hole is provided in advance in the mold. After being accommodated, a fluid rubber-like elastic body, for example, silicone rubber, is injected into the mold, and the core plate and the rubber-like elastic body are integrally formed, and then heat-treated to cure the rubber-like elastic body.

  In order to provide an elastic holding hole in the holding plate, a large number of molding pins corresponding to small electronic components are projected to the cavity side of the mold, and the molding pin is inserted into each of the core material holes of the core material plate. The core material plate is accommodated inside the mold so that the When the rubber-like elastic body is injected into the mold in this state, the rubber-like elastic body is filled in the gap between the molding pin and the core material hole. Thus, when the core plate and the rubber-like elastic body are integrally molded, a hole of the rubber-like elastic body corresponding to the shape of the molding pin is formed inside the core material hole. Holding holes.

  When applying and forming electrodes on small electronic components such as chip capacitors, the holding plates that are stored and transported with the planar portions overlapped are sequentially separated and the small electronic components are inserted into the holding holes of the holding plate. , And fed to the electrode coating line. After the electrodes are applied and formed in units of holding plates, the electronic components are dropped and recovered at once by pushing them out with the same number of holding pins as the holding holes. An electronic component may have electrodes formed on both ends thereof.

  As described above, in the conventional electronic component holding plate, even when an electronic component having a rectangular cross section is held, the holding hole has a circular cross section. And in order to form the cross section of a holding hole circularly, the cross section of the core material hole of a core material plate was made circular, and the cross section of the shaping | molding pin of a metal mold | die has also been made circular. The shape of the holding hole having such a circular cross section is suitable when the direction of holding the electronic component is not a problem, such as when electrodes are applied to the entire end surface of the electronic component. In some cases, electrodes are applied to a streak pattern, and therefore, it is necessary to hold the electronic component correctly in consideration of the orientation.

  To hold an electronic component with a rectangular cross-section correctly in consideration of the orientation, for example, the cross-section of the holding hole is generally similar to the cross-sectional shape of the electronic component and may be a rectangular with a slightly smaller size. The cross section of the core hole is circular as usual, but the cross section of the forming pin may be rectangular.

However, the rubber-like elastic body generally shrinks in the heat treatment step for curing the rubber-like elastic body after the core material plate and the rubber-like elastic body are integrally formed. The inventors have found that the shape of the cross-section of the holding hole changes during this process, and that the degree of change is more severe as the cross-section of the holding hole is smaller. That is, if the core hole is circular and the cross section of the molding pin is rectangular, and the core plate and the rubber elastic body are integrally formed, the cross section of the holding hole is certainly the state before the rubber elastic body is cured. Although it is rectangular, when the holding plate is completed after the rubber-like elastic body is cured, the cross section of the holding hole has been deformed, especially when the size of the holding hole is small, The cross section of the holding hole when completed is no longer a rectangle. For this reason, the problem that many small electronic components which have a rectangular cross section cannot be hold | maintained accurately has arisen.
Japanese Examined Patent Publication No. 62-20585

  The present invention was made in view of the above problems, and when the holding plate is completed, a holding hole is formed in a shape that can hold an electronic component having a rectangular cross section in consideration of its orientation. It is an object of the present invention to provide a method for manufacturing an electronic component holding plate.

  It is another object of the present invention to provide a mold used for manufacturing an electronic component holding plate.

  It is another object of the present invention to provide a mold used for manufacturing a holding plate capable of holding a small electronic component with high accuracy.

  In the first aspect of the present invention, a rigid core material plate having a plurality of core material holes penetrating in the thickness direction and a rubber-like elastic body covering the outer surface of the core material plate are integrally formed. Thus, a holding hole made of the rubber-like elastic body is formed inside the core material hole, and in the method of manufacturing an electronic component holding plate for holding the electronic component in the holding hole, the core material plate and the The cross-sectional shape of the holding hole after the integral molding with the rubber-like elastic body and before the rubber-like elastic body is cured is an arc in which at least a pair of opposed long sides curve convexly toward the center of the holding hole. After that, the cross-sectional shape of the holding hole after the rubber-like elastic body is cured is such that an arc that is convexly curved toward the center of the holding hole is formed in a straight line. It is said.

  The invention described in claim 2 is a mold used in the method for manufacturing a holding plate for electronic components according to claim 1, wherein the mold is mounted when the core plate is installed in the mold. A plurality of molding pins that can penetrate each of the core material holes are disposed, the cross-section of the molding pins is smaller than the cross-section of the core material holes, and the cross-sectional shape of the molding pins is at least opposed to each other. The pair of long sides form an arc that curves convexly toward the center of the cross section of the forming pin.

  The invention according to claim 3 includes a pair of long sides facing each other and a pair of facing short sides arranged at a position orthogonal to the long side when the holding plate is completed. The long side length (L) is 0.5 mm or more and 4.0 mm or less, and the ratio (L / T) of the long side length to the short side length (T) is 1.2 or more and 5. When it is set to 0 or less, the maximum difference dimension (L1) between the pair of long sides of the cross section of the forming pin is 95. 5 with respect to the long side length (L) of the holding hole cross section at the time of completion. The minimum difference dimension (L2) between the pair of long sides is 93.0% or more with respect to the long side length (L) of the holding hole cross section at the time of completion. 98.0% or less, and the pair of short sides of the cross section of the molding pin is directed toward the center of the cross section of the molding pin. It is convexly curved, and the maximum difference dimension (T1) between the pair of short sides is 80.0% or more and 97.0% with respect to the short side length (T) of the holding hole cross section at the time of completion. The minimum difference dimension (T2) between the pair of short sides is 60.0% or more and 95.0% or less of the short side length (T) of the holding hole cross section at the time of completion. It is characterized by that.

  According to the first aspect of the present invention, the cross-sectional shape of the holding hole after the integral molding of the core material plate and the rubber-like elastic body and before the rubber-like elastic body is cured has at least a pair of long sides facing each other. The cross-sectional shape of the holding hole after the rubber-like elastic body is cured is linear with the arc curved convexly toward the central part of the holding hole. Since it is formed, it is possible to provide a method for manufacturing a holding plate in which a direction is given to the holding hole by providing a pair of linear long sides facing the cross-sectional shape of the holding hole.

  According to the second aspect of the present invention, when the core plate is set in the mold, a plurality of molding pins that can penetrate each of the core material holes are arranged, and the cross section of the molding pin is the core material hole. A pair of long sides that are smaller than the cross section of the first and second surfaces and at least face each other form an arc that curves convexly toward the center of the cross section. By providing this, it is possible to provide a mold for manufacturing a holding plate in which the holding hole is oriented.

  According to the invention described in claim 3, in addition to the effect described in claim 2, since the shape of the forming pin is formed in consideration of the forming shrinkage rate of the rubber-like elastic body, the completed holding plate Since the cross-sectional shape of the holding hole can be formed into a shape suitable for holding a small electronic component, a mold for manufacturing a holding plate capable of holding the small electronic component with high accuracy can be provided.

Embodiments of the present invention will be described below.
[Embodiment 1 of the Invention]

  Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 6 and FIG.

  In the first embodiment of the present invention, when the holding plate 10 is completed, the method of manufacturing the holding plate 10 for an electronic component in which the holding hole 15 formed by the rubber-like elastic body 14 is considered to have a rectangular cross section and This is related to the mold 11 for that purpose.

  FIG. 1 is a perspective view of a mold according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of the core material plate according to Embodiment 1 of the present invention. FIG. 3 is a cross-sectional view showing a situation when the core material plate is installed in the mold according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view of main parts when FIG. 3 is viewed from above.

  FIG. 9 is a perspective view in which a part of the holding plate for an electronic component according to Embodiment 1 of the present invention is cut out.

  The holding plate 10 includes a core material plate 12 provided with a large number of core material holes 13 and a rubber-like elastic body 14 formed integrally with the core material plate 12. Since the core material plate 12 and the rubber-like elastic body 14 are integrally formed, a holding hole 15 made of the rubber-like elastic body 14 is formed inside each core material hole 13. The electronic component can be held inside each holding hole 15 by the elastic force of the rubber-like elastic body 14.

  In the state before the rubber-like elastic body 14 is cured after the core material plate 12 and the rubber-like elastic body 14 are integrally molded, the cross section of the holding hole 15 is surrounded by four sides. Of the sides, at least a pair of opposing long sides is formed to form an arc that curves convexly toward the center of the cross section. Thereby, when the holding plate 10 is completed after the rubber-like elastic body 14 is cured, the cross-sectional shape of the holding hole 15 is formed such that a pair of opposing long sides is linear.

  In Embodiment 1 of the present invention, when the holding plate 10 is completed, the purpose is to form a cross section of the holding hole 15 in a rectangular shape. Therefore, before the rubber-like elastic body 14 is cured, the cross section of the holding hole 15 is It is surrounded by four sides, and these four sides are formed so as to form an arc that curves convexly toward the center of the cross section.

In the mold 11, a plurality of molding pins 11 a are arranged so as to penetrate each of the core material holes 13 when the core material plate 12 is set in the mold 11. In FIG. 4, the cross section of the core material hole 13 is circular. Moreover, although the cross section of the forming pin 11a is surrounded by four sides, these four sides form an arc that curves convexly toward the center of the cross section.
Hereinafter, the manufacturing method of the holding plate 10 will be described in detail.

  As shown in FIG. 2, the core material plate 12 has a plurality of core material holes 13 having a circular cross section. The forming method of the core material plate 12 is not different from that according to the prior art, and is formed by grinding a plate made of a material having rigidity such as metal until it has a predetermined shape as shown in FIG. The material having rigidity is not particularly limited, but carbon steel, aluminum alloy, magnesium alloy, nickel alloy are preferable, and aluminum alloy is particularly preferable in terms of workability and operability. Is done.

  The core material plate 12 is stored in the mold 11 in a state as shown in FIG. 3, that is, in a state where each of the core material holes 13 of the core material plate 12 penetrates the molding pin 11a. And the rubber-like elastic body 14 which has fluidity | liquidity is inject | poured into the metal mold | die 11, and the core material plate 12 and the rubber-like elastic body 14 are integrally molded. At this time, since there is a gap between the core material hole 13 and the molding pin 11a as shown in FIG. 4, the rubber-like elastic body 14 fills this gap. Thus, a holding hole 15 made of a rubber-like elastic body 14 corresponding to the shape of the molding pin 11a is formed inside each core hole 13.

  As the rubber-like elastic body 14, generally used silicone materials such as millable silicone rubber and addition-type liquid silicone rubber can be used. Further, as the thermosetting elastic body, EPDM (ethylene propylene diene terpolymer), butadiene rubber, or fluorine rubber may be used. In order to improve the adhesiveness of the rubber-like elastic body 14 to the core material plate 12, it is desirable that the surface of the core material plate 12 be subjected to primer treatment before being housed in the mold 11.

  FIG. 5A is a cross-sectional view of a main part of the holding plate according to Embodiment 1 of the present invention after the core material plate and the rubber elastic body are integrally formed and before the rubber elastic body is cured. is there. FIG.5 (b) is principal part sectional drawing at the time of completion of a holding plate after hardening a rubber-like elastic body in the holding plate which concerns on Embodiment 1 of this invention.

  Corresponding to the cross-sectional shape of the molding pin 11a, in FIG. 5A, the cross section of the rubber-like elastic body 14 is surrounded by four sides, but these four sides are convex toward the center of the cross section. A curved arc is formed. On the other hand, when the holding plate is completed, each of the four sides surrounding the cross section of the holding hole 15 is linear as shown in FIG. That is, after the rubber-like elastic body 14 is cured, the holding hole 15 has a rectangular cross section.

  The reason why the cross-sectional shape of the holding hole 15 at the time of completion is formed as shown in FIG. 5B is generally understood as follows. That is, the rubber-like elastic body 14 shrinks when cured, but since the rubber-like elastic body 14 is in close contact with the wall surface of the core material hole 13, each side surrounding the cross section of the holding hole 15 is formed in the core material hole 13. It deforms so that it sticks toward the wall surface. The degree of deformation differs for each side portion. That is, if the volume shrinkage of the rubber-like elastic body 14 at the time of curing is the same in the entire region of the rubber-like elastic body 14, in general, the portion where the rubber-like elastic body 14 is thick. The amount of deformation increases. That is, when the side A is illustrated as an example in FIG. 5A, the rubber-like elastic body 14 is thicker at the center of the side A than at the end of the side A, so that the rubber-like elastic body 14 is cured. Sometimes, the deformation amount at which the central portion of the side A moves toward the wall surface of the core hole 13 is larger than the deformation amount at the end portion of the side A. Since the same action also occurs on the other sides B, C, and D, the cross-sectional shape of the holding hole 15 becomes a linear shape as shown in FIG. 5B after the rubber-like elastic body 14 is cured.

  As described above, in the process of curing the rubber-like elastic body 14, each side surrounding the cross section of the holding hole 15 is deformed so as to stick to the wall surface of the core material hole 13, and the amount of deformation is changed for each side part. In view of the above, in the state before the rubber-like elastic body 14 is cured, the shape is as shown in FIG. 5 (a), and for that purpose, it has a cross-sectional shape as shown in FIG. A mold 11 provided with a forming pin 11a is used.

  On the other hand, when the cross section of the molding pin 11a of the mold 11 is rectangular, as shown in FIG. 6 (a), the rubber shape after the core plate 12 and the rubber-like elastic body 14 are integrally molded. In a state before the elastic body 14 is cured, the holding hole 15 has a rectangular cross section. When the holding plate 10 is completed after the rubber-like elastic body 14 is cured, as shown in FIG. 6B, each of the four sides surrounding the cross section of the holding hole 15 is outside the cross section. Curved convex toward If the degree of curvature is excessive, the cross section of the holding hole 15 becomes elliptical, and the completed holding plate 10 accurately holds the electronic component having a rectangular cross section in consideration of its orientation. Can not do it.

  As described above, when the electronic component holding plate 10 is manufactured using the mold 11 according to the first embodiment of the present invention, the rubber plate is formed by the rubber-like elastic body 14 when the holding plate 10 is completed. The holding hole 15 has a rectangular cross section. As a result, as shown in FIG. 9, it is possible to manufacture the holding plate 10 in which the holding accuracy of the rectangular electronic component is improved.

In relation to Embodiment 1 of the present invention, the inventors of the present invention made various types of molds 11 and compared them for the purpose of specifying the desired dimensions of the cross section of the molding pin 11a. As a result, the cross-sectional shape of the holding hole 15 at the time of completion of the holding plate 10 is rectangular, the length (L) of the long side A and the long side B is 0.5 mm to 4.0 mm, and the short side When the ratio (L / T) of the length of the long side A and the long side B to the length (T) of C and the short side D is 1.2 or more and 5.0 or less, the cross section of the forming pin 11a is The pair of long sides A and long sides B are surrounded by a pair of short sides C and short sides D opposed to each other, and the pair of long sides A and long sides B in the cross section of the forming pin 11a are formed respectively. The pin 11a is convexly curved toward the center of the cross section of the pin 11a, and the maximum difference dimension (L1) between the pair of long sides A and long sides B is the long side A and the long side of the cross section of the holding hole 15 at the time of completion. 95.0% or more and 99.0% or less with respect to the length (L) of the side B, and the minimum difference between the pair of the long side A and the long side B The dimension (L2) is 93.0% or more and 98.0% or less with respect to the length (L) of the long side A and the long side B of the cross section of the holding hole 15 at the completion, and the dimension of the forming pin 11a. The pair of short sides C and short sides D of the cross section are each convexly curved toward the center of the cross section of the forming pin 11a, and the maximum difference dimension (T1) between the pair of short sides C and short sides D Is 80.0% or more and 97.0% or less with respect to the length (T) of the short side C and the short side D of the cross section of the holding hole 15 when completed, and between the pair of short sides C and short sides D The forming pin 11a is set so that the minimum difference dimension (T2) is 60.0% or more and 95.0% or less of the length (T) of the short side C and the short side D of the cross section of the holding hole 15 at the time of completion. As a result, the rubber-like elastic body 14 is in close contact with the wall surface of the core hole 13 with a substantially uniform thickness in the state after curing. Out was. In this way, an electrode coating holding plate 10 for an electronic component having a rectangular holding hole 15 as shown in FIG. 9 was obtained.
[Embodiment 2 of the Invention]

  The second embodiment of the present invention will be described below with reference to FIGS.

  In the second embodiment of the present invention, in the completed state of the holding plate 10, the pair of opposing sides of the cross section of the holding hole 15 formed by the rubber-like elastic body 14 is considered to be formed linearly. The present invention relates to a method for manufacturing a component holding plate 10 and a mold 11 therefor.

  FIG. 7 is a cross-sectional view of a main part for explaining the cross-sectional shape of the forming pin in the mold according to Embodiment 2 of the present invention. FIG. 8A is a cross-sectional view of a main part in a state before the rubber-like elastic body is cured after integrally forming the core material plate and the rubber-like elastic body in the holding plate according to the second embodiment. is there. FIG.8 (b) is principal part sectional drawing after hardening a rubber-like elastic body in the holding plate which concerns on the same Embodiment 2. FIG.

  In FIG. 7, in a state where the core plate 12 is accommodated in the mold 11 so that the molding pin 11a passes through each of the core hole 13, the main part is enlarged in the same state as shown in FIG. It is sectional drawing shown.

  As shown in FIG. 7, a large number of forming pins 11 a are formed in the mold 11 at positions corresponding to the core material holes 13 of the core material plate 12. The cross section of the forming pin 11a is surrounded by four long sides A, long sides B, short sides C, and short sides D. Of these four sides, a pair of opposed long sides A and long sides B are the center of the cross section. It forms so that the arc which curves convexly toward the part may be comprised.

  The difference from the first embodiment of the present invention is that all sides surrounding the cross section of the forming pin 11a need not be arcuate. Therefore, for example, in FIG. 7, the long side A and the long side B form an arc shape that curves convexly toward the center of the cross section of the forming pin 11a, but the short side C and the short side D are straight lines. .

  A series of steps of injecting the rubber-like elastic body 14 into the mold 11, bringing the rubber-like elastic body 14 into close contact with the inner wall surface of the core hole 13, and then curing the rubber-like elastic body 14 is performed according to the present invention. Since it is the same as that of Embodiment 1, the description is abbreviate | omitted.

  Since the molding pin 11a is formed as described above, in the state before the rubber-like elastic body 14 is cured, the side surrounding the cross section of the holding hole 15 is a long side as shown in FIG. A and the long side B are convexly curved toward the center of the cross section, but the short side C and the short side D are linear. And after hardening the rubber-like elastic body 14, as shown in FIG.8 (b), as for the side surrounding the cross section of the holding hole 15, the long side A and the long side B are linear, but a short side C and the short side D curve slightly convex toward the outside of the cross section. The reason why the shape of the holding hole 15 changes in this way before and after the curing process of the rubber-like elastic body 14 has already been described in relation to the first embodiment of the present invention, and will be omitted here.

  When an electronic component having a rectangular cross section is inserted and held in the holding hole 15 having a cross sectional shape as shown in FIG. 8B, the two long sides in the cross section of the electronic component are The elastic force generated by being sandwiched between the two long sides A and B in the cross section becomes a main force for holding the electronic component in the holding hole 15, and therefore, the two short sides C in the cross section of the holding hole 15. Even if the short side D is not necessarily formed in a straight line, it does not matter so much in holding the electronic component.

  As described above, the mold 11 according to Embodiment 2 of the present invention has a configuration in which a pair of opposing sides are convexly curved toward the center of the cross section in the cross section of the molding pin 11a. The shape of the molding pin 11a is simplified as compared with the mold 11 according to the first embodiment of the present invention, and the mold 11 is not impaired without impairing the function of accurately holding the electronic component in consideration of its orientation. Can be made easier.

  Hereinafter, Embodiment 1 of the present invention will be described in more detail with reference to Examples, but the present invention is not limited to this.

  As the core material plate 12, an aluminum alloy is cut into a length of 180 mm, a width of 280 mm, and a thickness of 10 mm, and the outer periphery of 10 mm is left and ground 2 mm from both sides in the thickness direction. A core plate 12 having a total of 1500 material holes 13 in 30 rows and 50 rows was prepared.

  The same number of molding pins 11a are also provided in the mold 11 that accommodates them. The cross section of the forming pin 11a is generally rectangular, the short side length is 0.7 mm, and the long side length is 1.2 mm. However, the short side and the long side are convex toward the center of the cross section of the forming pin 11a. The height of the curved arc was 0.02 mm and 0.035 mm on the short side and the long side, respectively.

  The core material plate 12 is inserted into the mold 11 so that the molding pin 11 a is accommodated inside each of the core material holes 13 of the core material plate 12. Liquid silicone rubber KE-1950-50A / B (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) is injected by an injection molding machine, and the gap between the core material hole 13 and the molding pin 11a and the core material plate 12 The upper and lower surfaces were coated with silicone rubber and cured. As a result, the core material plate 12 integrally formed with the rubber-like elastic body 14 was formed.

  After the curing treatment, the surface of the silicone rubber was ground with a surface grinder in order to remove irregularities on the surface of the silicone rubber on both surfaces of the core material plate 12 and burrs on the edge of the core material hole 13.

  When the inside of the core material hole 13 was observed, the silicone rubber was in close contact with the inside of the core material hole 13 with a substantially uniform thickness. Actually, when the small electronic component was held on the manufactured holding plate 10 and the electrode was applied, it was found that no defective product was generated and the holding accuracy of the small electronic component was good.

  In this way, an electrode coating holding plate 10 for an electronic component having a rectangular holding hole 15 as shown in FIG. 9 was obtained.

It is a perspective view of the metal mold | die which concerns on Embodiment 1 of this invention. It is a perspective view of the core material plate which is a material of the holding plate of the electronic component which concerns on the same Embodiment 1. FIG. It is a cross-sectional view for demonstrating the condition when the core material plate which concerns on the same Embodiment 1 is installed in the metal mold | die. It is principal part sectional drawing for demonstrating the cross-sectional shape of a shaping | molding pin in the metal mold | die concerning the Embodiment 1. FIG. It is principal part sectional drawing before inject | pouring a rubber-like elastic body into the core material plate which concerns on the same Embodiment 1, but before hardening. It is principal part sectional drawing after hardening a rubber-like elastic body to the core material plate which concerns on the same Embodiment 1. FIG. It is principal part sectional drawing before hardening after inject | pouring a rubber-like elastic body into the conventional core material plate. It is principal part sectional drawing after hardening a rubber-like elastic body to the conventional core material plate. In the metal mold | die which concerns on Embodiment 2 of this invention, it is principal part sectional drawing for demonstrating the cross-sectional shape of a forming pin. It is principal part sectional drawing before inject | pouring a rubber-like elastic body into the core material plate which concerns on the same Embodiment 2, and before hardening. It is principal part sectional drawing after hardening a rubber-like elastic body to the core material plate which concerns on the same Embodiment 2. FIG. It is the perspective view which cut off a part in the completion state of the holding plate of the electronic component which concerns on the same Embodiment 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Holding plate 11 Mold 11a Molding pin 12 Core material plate 13 Core material hole 14 Rubber-like elastic body 15 Holding hole

Claims (3)

The core material hole is formed by integrally molding a rigid core material plate provided with a plurality of core material holes penetrating in the thickness direction and a rubber-like elastic body covering the outer surface of the core material plate. In the method of manufacturing an electronic component holding plate in which a holding hole made of the rubber-like elastic body is formed inside, and the electronic component is held in the holding hole.
The cross-sectional shape of the holding hole after the integral molding of the core plate and the rubber-like elastic body and before the rubber-like elastic body is cured is such that at least a pair of opposing long sides are directed toward the center of the holding hole. A convexly curved arc is formed, and thereafter, the cross-sectional shape of the holding hole after the rubber-like elastic body is cured is formed in a straight line with a convexly curved arc toward the center of the holding hole. A method of manufacturing a holding plate for an electronic component, characterized in that it is configured as described above. A mold for use in the method of manufacturing an electronic component holding plate according to claim 1,
The mold is provided with a plurality of molding pins that can penetrate each of the core material holes when the core material plate is installed in the mold.
The cross-section of the forming pin is smaller than the cross-section of the core hole, and the cross-sectional shape of the forming pin is an arc in which at least a pair of opposed long sides curves convexly toward the cross-sectional center of the forming pin. A mold for manufacturing a holding plate for an electronic component, characterized by comprising: When the holding plate is completed, the holding hole has a cross-sectional shape composed of a pair of long sides facing each other and a pair of opposing short sides arranged at positions orthogonal to the long sides, and the long side length (L ) Is 0.5 mm to 4.0 mm, and the ratio of the long side length to the short side length (T) (L / T) is 1.2 to 5.0,
The maximum difference dimension (L1) between the pair of long sides of the cross section of the forming pin is 95.0% or more and 99.0% or less with respect to the long side length (L) of the holding hole cross section at the time of completion. And the minimum difference dimension (L2) between the pair of long sides is 93.0% or more and 98.0% or less with respect to the long side length (L) of the holding hole cross section at the time of completion,
Further, the pair of short sides of the cross section of the forming pin are convexly curved toward the center of the cross section of the forming pin, and the maximum difference dimension (T1) between the pair of short sides is 80.0% or more and 97.0% or less with respect to the short side length (T) of the cross section of the holding hole in the above, and the minimum difference dimension (T2) between the pair of short sides is the holding at the time of completion. The mold for manufacturing a holding plate for an electronic component according to claim 2, wherein the short side length (T) of the hole cross section is 60.0% or more and 95.0% or less.

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