KR100401068B1 - Manufacturing method for carrier plate - Google Patents

Abstract

The present invention relates to a method for manufacturing a carrier plate, specifically about 7000 holes formed in the carrier plate used for coating the ends of the terminal electrode of the Miniature Electronic Component such as chip capacitor, resistor, MLCC, etc. Simultaneously process using a multi-axis drill and distribute the silicon to be uniformly distributed in the hole by using atmospheric pressure and vacuum pressure or vacuum pressure of injection device and auxiliary device for smooth transfer and confinement of the device inside the machined hole. To improve the productivity of the carrier plate and to produce a permanent high quality product.

According to the present invention, in a machining process requiring a large number of small holes, such as a carrier plate, there is an effect of improving approximately 30 to 250 times the productivity of the conventional machining process, and producing a permanent high quality carrier plate It is possible, and can be applied to the hole size of the carrier plate in a variety of different ways, and as the bubbles generated in the silicon molding process is significantly reduced, there is an effect of improving the roughness of the hole as well as durability.

Description

Manufacturing method of carrier plate {MANUFACTURING METHOD FOR CARRIER PLATE}

The present invention relates to a method for manufacturing a carrier plate, specifically about 7000 holes formed in the carrier plate used for coating the both ends of the terminal electrode of the Miniature Electronic Component such as chip capacitor, resistor, MLCC, etc. Simultaneously process using a multi-axis drill and distribute the silicon to be uniformly distributed in the hole by using atmospheric pressure and vacuum pressure or vacuum pressure of injection device and auxiliary device for smooth transfer and confinement of the device inside the machined hole. To improve the productivity of the carrier plate and to produce a permanent high quality product.

In general, the carrier plate is a jig used to apply an electrode coating on both ends of the device at the same time by using a vacuum pressure or a vibrator so that each device is positioned as a small hole in the carrier plate. The conventional MLCC carrier plate 100 shown in FIG. 1 has a hole 12 arranged in a plurality of rows and columns on the carrier plate body 11, and the inside of the hole 12 for smooth transfer and restraint of the device. Is made of silicon, and the general carrier plate is 279.0 mm (L) x 177.0 mm (W) x 7.0 mm (T), and the pitch between holes is 2.286 mm. Depending on the size of the variety of 0.2mm, 0.3mm, 0.5mm, 0.8mm.

The general manufacturing method of such a carrier plate is formed by first processing a shape of an aluminum plate, then processing about 7000 holes, and finally forming silicon in the processed holes.

In particular, the conventional method for drilling holes is to use a high-speed machine to process one or a few dozen spindles, depending on the degree of the machine tool and the degree of the tool guide bush. Machining more than 7000 holes on a sheet had many problems in terms of quality assurance and productivity.

In addition, as a method of forming a silicone rubber in the hole of the carrier plate, the first intermediate cured silicone rubber was formed by applying heat and pressure. It can be said that it is divided into injection molding and extrusion molding.

The hot press method is a method that focuses on heat rather than pressure, and the injection molding is a method that focuses more on pressure, and the extrusion method has both advantages of hot press and injection molding, but it is limited in the shape of the molding. In general, if the shape of the product can be satisfied with the extrusion shape, the extrusion molding method is the first priority, but deformation due to heat and pressure is a significant problem in the manufacturing process, and bubbles generated during the molding process will not only have internal roughness in the future. It also affects durability.

In addition, since the positional tolerance and the precision of the hole after the silicone rubber is formed play an important role in the function of the product, the quality of the carrier plate depends on the pin conditions at the time of molding and the device of the tool.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a manufacturing method for manufacturing a carrier plate having many holes of about 7000 in a fast and sophisticated process to improve productivity and quality. It is in Sikkim.

Another object of the present invention is to provide a molding technique in which the position diagram of the silicon rubber formed in the holes in the carrier plate obtained through the rapid manufacturing method as described above, and the inner diameter dimension and roughness of each hole conform to the basically required quality. have.

Other objects of the present invention will be described in more detail in the configurations and operations described below.

1 is a perspective view showing a conventional carrier plate.

2 is a partially enlarged view of a multi-axis drill for performing a multi-axis machining process in accordance with the present invention.

3 is a plan view of one embodiment of a carrier plate according to the invention.

4 is a cross-sectional view illustrating one embodiment of a multi-axis drill arrangement in the embodiment of FIG. 3.

5 is a plan view for showing another embodiment of a carrier plate according to the present invention.

Fig. 6 is a perspective view for explaining a step of forming silicon in a hole in a carrier plate according to the present invention.

FIG. 7 is a cross-sectional view illustrating a cross section of FIG. 6. FIG.

8 is a perspective view for showing another embodiment according to the present invention.

9 is a cross-sectional view for illustrating a cross section of FIG. 8.

The manufacturing method according to the present invention for achieving the object as described above, the step of performing a milling process using a general purpose and NC machining equipment by cutting the material substrate to a predetermined size; A multi-axis machining step of processing a plurality of holes in the substrate at one time or several times using a multi-axis drill having a spindle arranged in a plurality of rows and columns; And a silicon molding step of molding silicon in the plurality of holes formed in the multi-axis processing step.

Preferably, the silicone molding step may include a molding method using a difference between atmospheric pressure and vacuum pressure, by first pouring a predetermined amount of silicon rubber on the molding jig at atmospheric pressure; Vacuuming around the molding jig to discharge bubbles inside the uncured silicon; And curing the air for a predetermined time in a place such as an oven after waiting for a predetermined time so that the bubbles are completely defoamed.

And, as another embodiment of the silicon forming step, pouring a silicon rubber in a predetermined amount on the front of the carrier plate in a vacuum pressure state; Forming a mold around the molding jig by pressing the pores inside the uncured silicon to atmospheric pressure; And it may be made of a step such as curing in a certain time put in an oven.

In addition, as another embodiment of the silicon molding step as a method using a main injection device for injecting silicon rubber, and an auxiliary injection device for injecting silicon rubber in a separate position from the main injection device, first using a defoaming device Completely removing the bubbles inside the silicon; Applying a high vacuum to the auxiliary injection device such that the silicon in the main injection device is transferred to the carrier plate; Relieving the vacuum of the auxiliary injection device slightly so that the silicon injected into the carrier plate is evenly distributed; And putting in a place such as an oven to cure for a predetermined time, and the method is repeated by at least several times until the silicon level between the main injection device and the auxiliary injection device is stabilized before the curing step. It is possible to achieve a good quality silicone molding aimed at.

In this silicone molding step, all surfaces between the molding jig and the carrier plate must be thoroughly sealed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to FIG. 2, an enlarged multi-axis drill 200 for performing a multi-axis machining process according to the present invention is shown, and the carrier plate 100 faces the spindles 24 arranged in a plurality of rows and columns in the multi-axis drill 200. Is disposed under the multi-axis drill to perform a multi-axis machining process.

The multi-axis drill 200 is a method of transmitting the power transmitted from the main shaft to the movable spindle by connecting the eccentric crank shaft and the camshaft drive spindle connected to the general purpose and NC machining equipment, according to the multi-axis mechanism According to the spindle and the cutter, the bushing plate is installed and the guide rod and the tie rod are interlocked to secure the precision of machining. Since the configuration is not very different, detailed descriptions will be omitted.

3 is a plan view of the carrier plate 100 fabricated according to the present invention from the top, by applying a wedge lock type drill having the multi-axis drill 200 having a spindle diameter of .156 ", horizontal and The drill array is 55 rows x 34 rows with 2 columns spaced, and 1,870 holes can be processed at the same time. Through this, 7,370 holes can be machined in 2 minutes in 4 times, so that many holes can be processed at a faster time.

Since the holes of the carrier plate 100 are even in the column direction, the holes are not even or overlapped depending on the arrangement of the spindle 24. However, the holes in the carrier plate 100 are odd in the row direction. As described above, the height of the multi-axis drill 200 is arranged differently so that the upper and lower directions in the z-axis direction are controlled by the NC so that there is no overlapping or missing hole.

In addition, in the manufacture of the carrier plate 100 according to the present invention, the minimum spacing between the holes may be set to .250 inch (6.35 mm) .156 inch (3.9624 mm) or the like depending on the situation, which is one optional embodiment. It should not be a limitation to the present invention.

Fig. 5 is different from the embodiment of Fig. 3 by applying a plane collect type with a spindle diameter of .250 ". The drill arrangement is divided into 5 columns and 3 columns. With 23 rows, 506 holes can be machined at the same time, and 7,370 holes can be machined in 15 times and 5 minutes.

This embodiment is easier to maintain and maintain a multi-axis drill than in the embodiment of Figure 3, so less power is required in consideration of the amount of production can be selected.

As a result, as mentioned in the embodiments of FIGS. 3 and 5, the machining process of the carrier plate 100 requiring a large number of holes having a small diameter may be improved by at least 30 to 250 times compared to the conventional machining method. Will be.

FIG. 6 is a perspective view illustrating a process of molding silicon in a hole in a carrier plate 100 according to the present invention. The needle plate jig 300 is disposed below the needle plate jig 300, and the needle plate jig 300 is illustrated in FIG. 3 or FIG. The carrier plate 100 processed by the embodiment of 4 is disposed to face, and the silicon rubber 400 is poured on the upper portion of the carrier plate 100 by a predetermined amount.

That is, the embodiment of Figure 6 is a molding method using the difference between the atmospheric pressure and the vacuum pressure, by pouring a certain amount of silicon rubber 400 on the molding jig at atmospheric pressure, and then by making a vacuum around the molding jig The bubbles inside the uncured silicone are completely discharged to the outside, and after being allowed to stand for a certain period of time, the bubbles are placed in an oven and cured at a predetermined temperature for a predetermined time.

This may be more easily understood by referring to the cross-sectional view of FIG. 7.

FIG. 8 is a view illustrating another method of forming a silicon according to the present invention, and is an embodiment showing a forming method by a vacuum pressure difference between the main injection device 600 and the auxiliary injection device 700.

Once the bubble inside the silicon is completely removed using a defoaming device, high vacuum is applied to the auxiliary injection device 700 so that the silicon of the main injection device 600 is transferred to the carrier plate 100 side, and then the auxiliary injection device 700 To loosen the vacuum slightly to induce an even distribution inside the carrier plate 100.

By repeating this method several times, when the silicon level between the main injection device 600 and the auxiliary injection device 700 is stabilized, it is cured for a predetermined time under a prescribed temperature such as an oven.

This may be more easily understood by referring to the cross-sectional view of FIG. 9.

6 and 8 described above, all surfaces between the needle plate jig 300 and the carrier plate 100 must be thoroughly sealed, and 7,370 pins mounted on the top plate of the needle plate jig 300 are It is manufactured in two stages for easy fixing and exchange of jig, and the surface is chrome-plated to facilitate the detachment of silicon with molding.

Unlike the conventional needle plate jig, the pin diameter of the molding site is reduced to 88-95% compared to the length of one side of both end faces of the device to maximize the function as the carrier plate jig.

As a result, as described above, many holes on the carrier plate are formed by using a multi-axis drill, and the silicon molding in the holes is molded to be evenly distributed by using a method based on a difference between atmospheric pressure and vacuum pressure, thereby improving productivity. A method of silicone molding of a carrier plate which has been greatly improved and which has not been easy to develop by a complex element is proposed.

Although the preferred embodiment of the present invention has been described in detail as described above, those skilled in the art will be able to modify or change the present invention as many as possible without departing from the spirit and scope of the present invention. It will be appreciated that it can be done.

Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

According to the present invention, in a machining process requiring a large number of small holes, such as a carrier plate, there is an effect of improving approximately 30 to 250 times the productivity of the conventional machining process, and producing a permanent high quality carrier plate It becomes possible.

In addition, the hole size of the carrier plate can be applied in various ways, unlike the prior art, and as the bubbles generated during the silicon molding process are greatly reduced, the roughness and durability of the inside of the hole are also improved.

Claims (6)

In the manufacturing method of a carrier plate, Performing a milling process by cutting the material substrate into a predetermined size; A multi-axis machining step of processing a plurality of holes in the substrate at one time or several times using a multi-axis drill having a spindle arranged in a plurality of rows and columns; And a silicon molding step of molding silicon into a plurality of holes formed in the multi-axis processing step. The method of claim 1, The silicon molding step Pouring a predetermined amount of silicone rubber onto the molding jig at atmospheric pressure; Vacuuming around the molding jig to discharge bubbles inside the uncured silicon; And Method for producing a carrier plate comprising the step of curing for a certain time after waiting a certain time so that the bubble is completely defoamed. The method of claim 1, The silicon molding step Pouring a silicon rubber by a predetermined amount on the front of the carrier plate under vacuum pressure; Forming a mold around the molding jig by pressing the pores inside the uncured silicon to atmospheric pressure; And Method for producing a carrier plate comprising the step of curing for a period of time. The method of claim 1, The silicon molding step The main injection device for injecting silicon rubber, and the auxiliary injection device for injecting silicon rubber in a separate position from the main injection device, Firstly removing bubbles in the silicon completely using a defoaming device; Applying a high vacuum to the auxiliary injection device such that the silicon in the main injection device is transferred to the carrier plate; Relieving the vacuum of the auxiliary injection device slightly so that the silicon injected into the carrier plate is evenly distributed; And Method for producing a carrier plate comprising the step of curing for a period of time. The method of claim 4, wherein The process of producing a carrier plate, characterized in that the process is repeated several times or more before the curing step until at least the silicon level between the main injection device and the auxiliary injection device is stabilized. The method of claim 1, The needle plate jig used for forming the silicon rubber hole in the silicon forming step is made in two stages to facilitate fixing and exchange, and the surface is plated with chromium to facilitate the detachment of silicon with the molding. A method of manufacturing a carrier plate, characterized in that it is carried out by using a pin diameter of the molding portion in the range of 88% to 95% of the length of one side of both end faces of the device.