JP4318667B2 - ガス・フラッシング・デバイスを有するリソグラフィ装置 - Google Patents
ガス・フラッシング・デバイスを有するリソグラフィ装置 Download PDFInfo
- Publication number
- JP4318667B2 JP4318667B2 JP2005150621A JP2005150621A JP4318667B2 JP 4318667 B2 JP4318667 B2 JP 4318667B2 JP 2005150621 A JP2005150621 A JP 2005150621A JP 2005150621 A JP2005150621 A JP 2005150621A JP 4318667 B2 JP4318667 B2 JP 4318667B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- gas outlet
- laminator
- flushing device
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000011010 flushing procedure Methods 0.000 title claims description 126
- 239000000758 substrate Substances 0.000 claims description 88
- 230000005855 radiation Effects 0.000 claims description 49
- 230000003287 optical effect Effects 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 20
- 238000000059 patterning Methods 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000013459 approach Methods 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 2
- 241000080590 Niso Species 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 10
- 239000000356 contaminant Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 230000003993 interaction Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/852,686 US7136142B2 (en) | 2004-05-25 | 2004-05-25 | Lithographic apparatus having a gas flushing device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008265455A Division JP4637223B2 (ja) | 2004-05-25 | 2008-10-14 | ガス・フラッシング・デバイスを有するリソグラフィ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005340825A JP2005340825A (ja) | 2005-12-08 |
| JP2005340825A5 JP2005340825A5 (enExample) | 2007-06-28 |
| JP4318667B2 true JP4318667B2 (ja) | 2009-08-26 |
Family
ID=34938293
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005150621A Expired - Fee Related JP4318667B2 (ja) | 2004-05-25 | 2005-05-24 | ガス・フラッシング・デバイスを有するリソグラフィ装置 |
| JP2008265455A Expired - Lifetime JP4637223B2 (ja) | 2004-05-25 | 2008-10-14 | ガス・フラッシング・デバイスを有するリソグラフィ装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008265455A Expired - Lifetime JP4637223B2 (ja) | 2004-05-25 | 2008-10-14 | ガス・フラッシング・デバイスを有するリソグラフィ装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7136142B2 (enExample) |
| EP (1) | EP1600819B1 (enExample) |
| JP (2) | JP4318667B2 (enExample) |
| KR (1) | KR100768946B1 (enExample) |
| CN (1) | CN100541334C (enExample) |
| DE (1) | DE602005013145D1 (enExample) |
| SG (1) | SG117593A1 (enExample) |
| TW (1) | TWI266965B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060119811A1 (en) * | 2004-12-07 | 2006-06-08 | Asml Netherlands B.V. | Radiation exposure apparatus comprising a gas flushing system |
| JP5022912B2 (ja) * | 2004-12-23 | 2012-09-12 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 少なくとも1つの交換可能な光学素子を備えるレンズモジュール |
| NL1036181A1 (nl) * | 2007-11-30 | 2009-06-04 | Asml Netherlands Bv | A lithographic apparatus, a projection system and a device manufacturing method. |
| KR101399303B1 (ko) * | 2008-12-05 | 2014-05-26 | 엘지디스플레이 주식회사 | 평판표시장치용 노광장비 |
| NL2008184A (en) | 2011-02-28 | 2012-08-29 | Asml Netherlands Bv | Gas manifold, module for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| US9453801B2 (en) | 2012-05-25 | 2016-09-27 | Kla-Tencor Corporation | Photoemission monitoring of EUV mirror and mask surface contamination in actinic EUV systems |
| US9662688B2 (en) | 2012-07-09 | 2017-05-30 | Kla-Tencor Corporation | Apparatus and method for cross-flow purge for optical components in a chamber |
| NL2012291A (en) * | 2013-02-20 | 2014-08-21 | Asml Netherlands Bv | Gas flow optimization in reticle stage environment. |
| CN109283797B (zh) * | 2017-07-21 | 2021-04-30 | 上海微电子装备(集团)股份有限公司 | 物镜保护装置、物镜系统以及光刻设备 |
| CN108398858B (zh) * | 2018-03-20 | 2019-05-10 | 李笛 | 一种气体隔离装置及隔离方法 |
| WO2020182540A1 (en) | 2019-03-14 | 2020-09-17 | Asml Netherlands B.V. | Providing substantially laminar fluid flow in a lithographic apparatus |
| JP7427461B2 (ja) * | 2020-02-06 | 2024-02-05 | キヤノン株式会社 | 露光装置、及び物品の製造方法 |
| DE102022128598A1 (de) * | 2022-10-28 | 2024-05-08 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zur Inertisierung einer Prozesskammer für die additive Fertigung eines Werkstücks |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4692934A (en) | 1984-11-08 | 1987-09-08 | Hampshire Instruments | X-ray lithography system |
| JPH03252507A (ja) | 1990-03-02 | 1991-11-11 | Hitachi Ltd | レーザ干渉測長装置およびそれを用いた位置決め方法 |
| JP3448670B2 (ja) | 1993-09-02 | 2003-09-22 | 株式会社ニコン | 露光装置及び素子製造方法 |
| JP3637639B2 (ja) | 1995-07-10 | 2005-04-13 | 株式会社ニコン | 露光装置 |
| JP2828090B2 (ja) * | 1997-03-24 | 1998-11-25 | 株式会社ニコン | 露光装置 |
| DE19830438A1 (de) | 1998-07-08 | 2000-01-13 | Zeiss Carl Fa | Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen |
| TW480372B (en) | 1999-11-05 | 2002-03-21 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the apparatus, and device manufactured according to the method |
| TW563002B (en) * | 1999-11-05 | 2003-11-21 | Asml Netherlands Bv | Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method |
| JP2002373852A (ja) * | 2001-06-15 | 2002-12-26 | Canon Inc | 露光装置 |
-
2004
- 2004-05-25 US US10/852,686 patent/US7136142B2/en not_active Expired - Lifetime
-
2005
- 2005-05-23 DE DE602005013145T patent/DE602005013145D1/de not_active Expired - Lifetime
- 2005-05-23 EP EP05076194A patent/EP1600819B1/en not_active Expired - Lifetime
- 2005-05-24 SG SG200503180A patent/SG117593A1/en unknown
- 2005-05-24 TW TW094116915A patent/TWI266965B/zh not_active IP Right Cessation
- 2005-05-24 CN CNB2005100817530A patent/CN100541334C/zh not_active Expired - Lifetime
- 2005-05-24 JP JP2005150621A patent/JP4318667B2/ja not_active Expired - Fee Related
- 2005-05-25 KR KR1020050044143A patent/KR100768946B1/ko not_active Expired - Fee Related
-
2008
- 2008-10-14 JP JP2008265455A patent/JP4637223B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050264773A1 (en) | 2005-12-01 |
| TWI266965B (en) | 2006-11-21 |
| CN1725110A (zh) | 2006-01-25 |
| SG117593A1 (en) | 2005-12-29 |
| EP1600819A1 (en) | 2005-11-30 |
| TW200609687A (en) | 2006-03-16 |
| JP2005340825A (ja) | 2005-12-08 |
| KR20060048091A (ko) | 2006-05-18 |
| EP1600819B1 (en) | 2009-03-11 |
| CN100541334C (zh) | 2009-09-16 |
| KR100768946B1 (ko) | 2007-10-19 |
| DE602005013145D1 (de) | 2009-04-23 |
| US7136142B2 (en) | 2006-11-14 |
| JP4637223B2 (ja) | 2011-02-23 |
| JP2009021636A (ja) | 2009-01-29 |
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