JP4307674B2 - ウェーハの研磨装置 - Google Patents

ウェーハの研磨装置 Download PDF

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Publication number
JP4307674B2
JP4307674B2 JP2000017309A JP2000017309A JP4307674B2 JP 4307674 B2 JP4307674 B2 JP 4307674B2 JP 2000017309 A JP2000017309 A JP 2000017309A JP 2000017309 A JP2000017309 A JP 2000017309A JP 4307674 B2 JP4307674 B2 JP 4307674B2
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Japan
Prior art keywords
wafer
elastic suspension
holding
suspension member
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000017309A
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English (en)
Japanese (ja)
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JP2001205557A (ja
JP2001205557A5 (enExample
Inventor
由夫 中村
康秀 傳田
大西　　進
健二 橋詰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
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Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Priority to JP2000017309A priority Critical patent/JP4307674B2/ja
Publication of JP2001205557A publication Critical patent/JP2001205557A/ja
Publication of JP2001205557A5 publication Critical patent/JP2001205557A5/ja
Application granted granted Critical
Publication of JP4307674B2 publication Critical patent/JP4307674B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000017309A 2000-01-26 2000-01-26 ウェーハの研磨装置 Expired - Fee Related JP4307674B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000017309A JP4307674B2 (ja) 2000-01-26 2000-01-26 ウェーハの研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000017309A JP4307674B2 (ja) 2000-01-26 2000-01-26 ウェーハの研磨装置

Publications (3)

Publication Number Publication Date
JP2001205557A JP2001205557A (ja) 2001-07-31
JP2001205557A5 JP2001205557A5 (enExample) 2007-03-15
JP4307674B2 true JP4307674B2 (ja) 2009-08-05

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ID=18544320

Family Applications (1)

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JP2000017309A Expired - Fee Related JP4307674B2 (ja) 2000-01-26 2000-01-26 ウェーハの研磨装置

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JP (1) JP4307674B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110605629A (zh) * 2019-09-19 2019-12-24 西安奕斯伟硅片技术有限公司 一种研磨装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8192248B2 (en) * 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP2013173226A (ja) * 2013-04-25 2013-09-05 Nikon Corp 研磨装置
CN114871932A (zh) * 2022-06-13 2022-08-09 江苏科沛达半导体科技有限公司 一种半导体材料用环保型生产设备及其使用方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110605629A (zh) * 2019-09-19 2019-12-24 西安奕斯伟硅片技术有限公司 一种研磨装置
US12138743B2 (en) 2019-09-19 2024-11-12 Xi'an ESWIN Material Technology Co., Ltd. Polishing device

Also Published As

Publication number Publication date
JP2001205557A (ja) 2001-07-31

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