JP2001205557A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001205557A5 JP2001205557A5 JP2000017309A JP2000017309A JP2001205557A5 JP 2001205557 A5 JP2001205557 A5 JP 2001205557A5 JP 2000017309 A JP2000017309 A JP 2000017309A JP 2000017309 A JP2000017309 A JP 2000017309A JP 2001205557 A5 JP2001205557 A5 JP 2001205557A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000017309A JP4307674B2 (ja) | 2000-01-26 | 2000-01-26 | ウェーハの研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000017309A JP4307674B2 (ja) | 2000-01-26 | 2000-01-26 | ウェーハの研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001205557A JP2001205557A (ja) | 2001-07-31 |
| JP2001205557A5 true JP2001205557A5 (enExample) | 2007-03-15 |
| JP4307674B2 JP4307674B2 (ja) | 2009-08-05 |
Family
ID=18544320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000017309A Expired - Fee Related JP4307674B2 (ja) | 2000-01-26 | 2000-01-26 | ウェーハの研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4307674B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8192248B2 (en) * | 2008-05-30 | 2012-06-05 | Memc Electronic Materials, Inc. | Semiconductor wafer polishing apparatus and method of polishing |
| JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| JP2013173226A (ja) * | 2013-04-25 | 2013-09-05 | Nikon Corp | 研磨装置 |
| CN110605629B (zh) * | 2019-09-19 | 2022-11-18 | 西安奕斯伟材料科技有限公司 | 一种研磨装置 |
| CN114871932A (zh) * | 2022-06-13 | 2022-08-09 | 江苏科沛达半导体科技有限公司 | 一种半导体材料用环保型生产设备及其使用方法 |
-
2000
- 2000-01-26 JP JP2000017309A patent/JP4307674B2/ja not_active Expired - Fee Related