JP4299303B2 - 熱検出構造の製作 - Google Patents
熱検出構造の製作 Download PDFInfo
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- JP4299303B2 JP4299303B2 JP2005510189A JP2005510189A JP4299303B2 JP 4299303 B2 JP4299303 B2 JP 4299303B2 JP 2005510189 A JP2005510189 A JP 2005510189A JP 2005510189 A JP2005510189 A JP 2005510189A JP 4299303 B2 JP4299303 B2 JP 4299303B2
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- heat
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- 238000001514 detection method Methods 0.000 title claims description 84
- 238000004519 manufacturing process Methods 0.000 title description 24
- 239000000463 material Substances 0.000 claims description 118
- 239000010410 layer Substances 0.000 claims description 100
- 238000000034 method Methods 0.000 claims description 72
- 229910001935 vanadium oxide Inorganic materials 0.000 claims description 62
- 239000004020 conductor Substances 0.000 claims description 56
- 239000011540 sensing material Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 52
- 150000002500 ions Chemical class 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 10
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 description 35
- 238000012545 processing Methods 0.000 description 16
- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 238000000059 patterning Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910018487 Ni—Cr Inorganic materials 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001659 ion-beam spectroscopy Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Radiation Pyrometers (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
Claims (4)
- 熱検出構造(100)の製作に使用するための方法において、
複数の導電接点(118、120、318,320)を備えている基板アッセンブリ(116、316)を提供する段階と、
前記基板アッセンブリ(116)の少なくとも一部に熱検出材料(104、304)を形成する段階と、前記熱検出材料が検出領域(106,306)を備え、
前記熱検出材料(104、304)の前記検出領域と、前記複数の接点の少なくとも1つとの間に脚構造体(372、374)を形成する段階と、
前記熱検出材料と、複数の導電接点(118、120、318,320)の少なくとも1つとの間に電気的接続部(311、313)を形成する段階と、
前記基板アッセンブリと熱検出材料の少なくとも一部の上に絶縁層(334,336)を形成する段階と、を有し、
前記熱検出材料と、複数の導電接点の少なくとも1つとの間に電気的接続部(311、313)を形成する段階が、
前記基板アッセンブリと熱検出材料の少なくとも一部の上に形成された前記絶縁層(334,336)の一部を除去し、前記検出領域(306)と前記脚構造体(372)との間に熱検出材料の露出面を備えた接触領域(308,310)を画定することと、
前記熱検出材料(104)の接触領域の露出面を、不活性ガスイオンに曝して前記露出面を改質することと、
前記複数の導電接点(118、120、318,320)の少なくとも1つに前記接触領域(308,310)の前記熱検出材料の改質された露出面を接続する導体材料(112、114、312,314)の単一の層を形成することと、を含み、
前記脚構造体(372、374)が、前記導体材料の単一層から形成された導電脚(322,324)および前記絶縁層(334,336)を含む、
ことを特徴とする方法。 - 前記接触領域(108、110、308,310)の前記熱検出材料(104、304)の少なくとも露出面を不活性ガスイオンに曝して、前記露出面を改質することが、前記熱検出材料(104)の少なくとも露出面をバックスパッタリングする段階を含んでいる、請求項1に記載の方法。
- 前記熱検出材料(104)は酸化バナジウム(VOx)を含んでおり、前記xは約1.0から約2.5の範囲内にある、請求項1に記載の方法。
- 前記熱検出構造(100)は、前記基板アッセンブリ(116)の部分から或る隙間を空けて配置された検出器アッセンブリ(102)を備えている、請求項1に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2003/031337 WO2005043624A1 (en) | 2003-10-02 | 2003-10-02 | Fabrication of thermal detecting structures |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007521637A JP2007521637A (ja) | 2007-08-02 |
JP4299303B2 true JP4299303B2 (ja) | 2009-07-22 |
Family
ID=34548797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005510189A Expired - Fee Related JP4299303B2 (ja) | 2003-10-02 | 2003-10-02 | 熱検出構造の製作 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1668700B1 (ja) |
JP (1) | JP4299303B2 (ja) |
AU (1) | AU2003279119A1 (ja) |
CA (1) | CA2540941C (ja) |
DE (1) | DE60331692D1 (ja) |
WO (1) | WO2005043624A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2910125B1 (fr) * | 2006-12-14 | 2013-07-05 | Commissariat Energie Atomique | Utilisation d'association de monoxyde de fer et d'oxydes spinelles comme materiau sensible destine a la detection de rayonnements infrarouges |
JP6669957B2 (ja) | 2015-09-30 | 2020-03-18 | ミツミ電機株式会社 | 流量センサ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5962909A (en) * | 1996-09-12 | 1999-10-05 | Institut National D'optique | Microstructure suspended by a microsupport |
US6323486B1 (en) * | 1998-07-31 | 2001-11-27 | The United States Of America As Represented By The Secretary Of Commerce | Method and apparatus for bias and readout of bolometers operated on a hysteretic metal-insulator transition |
US6144285A (en) * | 1999-09-13 | 2000-11-07 | Honeywell International Inc. | Thermal sensor and method of making same |
-
2003
- 2003-10-02 AU AU2003279119A patent/AU2003279119A1/en not_active Abandoned
- 2003-10-02 DE DE60331692T patent/DE60331692D1/de not_active Expired - Lifetime
- 2003-10-02 CA CA2540941A patent/CA2540941C/en not_active Expired - Fee Related
- 2003-10-02 EP EP03770627A patent/EP1668700B1/en not_active Expired - Fee Related
- 2003-10-02 WO PCT/US2003/031337 patent/WO2005043624A1/en active Application Filing
- 2003-10-02 JP JP2005510189A patent/JP4299303B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2005043624A1 (en) | 2005-05-12 |
AU2003279119A1 (en) | 2005-05-19 |
CA2540941A1 (en) | 2005-05-12 |
CA2540941C (en) | 2013-08-27 |
EP1668700A1 (en) | 2006-06-14 |
JP2007521637A (ja) | 2007-08-02 |
EP1668700B1 (en) | 2010-03-10 |
DE60331692D1 (de) | 2010-04-22 |
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