JP4297659B2 - 静電チャックの性能を特徴付ける方法 - Google Patents

静電チャックの性能を特徴付ける方法 Download PDF

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Publication number
JP4297659B2
JP4297659B2 JP2002228459A JP2002228459A JP4297659B2 JP 4297659 B2 JP4297659 B2 JP 4297659B2 JP 2002228459 A JP2002228459 A JP 2002228459A JP 2002228459 A JP2002228459 A JP 2002228459A JP 4297659 B2 JP4297659 B2 JP 4297659B2
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electrostatic chuck
performance
vacuum chamber
processing system
voltage
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Expired - Fee Related
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Japanese (ja)
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JP2003133404A5 (enExample
JP2003133404A (ja
Inventor
ブルッカ ジョーゼフ
ジョーンズ ビル
リューシンク ヘリット
ジェイ ロング ジェフリー
オリヴァー ビル
トウィード チャールズ
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2002228459A 2001-08-07 2002-08-06 静電チャックの性能を特徴付ける方法 Expired - Fee Related JP4297659B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US924038 2001-08-07
US09/924,038 US6853953B2 (en) 2001-08-07 2001-08-07 Method for characterizing the performance of an electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2003133404A JP2003133404A (ja) 2003-05-09
JP2003133404A5 JP2003133404A5 (enExample) 2005-10-27
JP4297659B2 true JP4297659B2 (ja) 2009-07-15

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JP2002228459A Expired - Fee Related JP4297659B2 (ja) 2001-08-07 2002-08-06 静電チャックの性能を特徴付ける方法

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US (1) US6853953B2 (enExample)
JP (1) JP4297659B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140069198A (ko) * 2011-09-30 2014-06-09 어플라이드 머티어리얼스, 인코포레이티드 정전 척
US9870900B2 (en) 2014-07-30 2018-01-16 Samsung Electronics Co., Ltd. Methods and systems for managing semiconductor manufacturing equipment

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US6853953B2 (en) 2005-02-08
JP2003133404A (ja) 2003-05-09
US20030033116A1 (en) 2003-02-13

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