JP4296134B2 - Camera module and electronic equipment - Google Patents

Description

  The present invention relates to a camera module and an electronic device, and more particularly to a camera module including a shield member for noise reduction and an electronic device including the camera module.

In a conventional general camera module, an optical unit including a lens is disposed on the most object side, and a sector driving device that swings a sector and an imaging unit including an imaging element are disposed behind the optical unit. However, for example, Patent Document 1 proposes a camera module in which a sector driving device is arranged on the subject side of an optical unit. This camera module is advantageous in that it can be easily miniaturized and the lens can be protected because the sector driving device is located closer to the subject than the optical unit.
Japanese Patent Laid-Open No. 2004-15602

  However, in the camera module described in Patent Document 1, electrical noise from an external device (such as an electrical component or an electronic circuit) to the camera module or electrical noise from the camera module to the external device is removed or reduced. The configuration of is not provided. For this reason, the camera module and the external device may malfunction due to the electrical noise. The possibility of such a malfunction becomes particularly noticeable when the camera module is used in an electronic device such as a mobile phone, or when the camera module is used near another electrical device, in order to avoid such malfunction. Technology is required.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a camera module and an electronic device that can reduce electrical noise that causes malfunction of the apparatus. is there.

In order to solve such a problem, the present invention provides a camera module including a shield member, the imaging unit including an imaging device mounted on the substrate and the substrate, and a lens. Including an optical unit, a conductive shield member that covers the imaging unit and the optical unit without being in close contact, a joining unit that fixes the substrate and the shield member, and a ground unit that grounds the shield member. A cutout is formed in the substrate, and a leg portion is provided on the side wall of the shield member so as to protrude from the substrate through the cutout, and the joining means joins the cutout and the leg portion. The grounding means is a grounding pattern provided on the substrate, and the grounding pattern and the joining means are electrically connected .

According to a second aspect of the present invention, in the camera module according to the first aspect, the shield member is made of a metal material, and the joining means is solder.

According to a third aspect of the present invention, in the camera module according to the first or second aspect, the shield member is made of a resin having conductivity, and the joining means is a conductive adhesive.

According to a fourth aspect of the present invention, in the camera module according to the third aspect , the conductive resin is a resin base material with a metal coating on the surface or a resin base material containing a conductive substance. Features.

According to a fifth aspect of the present invention, in the camera module according to the fourth aspect , the conductive material is carbon fiber or carbon black.

According to a sixth aspect of the present invention, in the camera module according to any one of the first to fifth aspects, an opening having a size that does not block an angle of view of the lens of the camera module is provided on the upper surface of the shield member. It is characterized by being.

According to a seventh aspect of the present invention, in the camera module according to the sixth aspect, the inner peripheral surface of the opening has a predetermined inclination angle with respect to the optical axis of the lens, and the inclination angle is the inner periphery The angle is set such that the reflected light from the surface does not enter the light receiving portion of the image sensor.

According to an eighth aspect of the present invention, in the camera module according to the sixth or seventh aspect, the inner peripheral surface of the opening is black.

The invention described in claim 9 is an electronic device, and includes the camera module according to any one of claims 1 to 8 .

  According to the present invention, since the camera module is housed in a shield member formed of a conductive material and the shield member is grounded, electrical noise that causes malfunction of the apparatus can be reduced. It is possible to provide a possible camera module and electronic device.

  Hereinafter, an embodiment according to the present invention will be described with reference to the drawings.

  FIG. 1 is a side view showing the internal configuration of the camera module 1 so that it can be confirmed. The camera module 1 is formed including three main unit portions. That is, the camera module 1 includes an imaging unit 10 including an imaging element, an optical unit 20 including a lens, and a sector driving unit 30 that swings the sector. As shown in FIG. 1, the camera module 1 has a structure in which an optical unit 20 and a sector drive unit 30 are sequentially stacked on an imaging unit 10. Each unit is arranged so that a part thereof overlaps in the upper and lower sides. The imaging unit 10 and the optical unit 20 are collectively referred to as an imaging optical module.

  The imaging unit 10 includes an imaging substrate 11, an imaging element 12, a lens barrel 13, and an optical filter 14. The image pickup device 12 is an image sensor such as a CCD or CMOS, and is fixed at a predetermined position on the image pickup substrate 11. The lens barrel 13 is generally cylindrical in shape, and is fixed on the imaging substrate 11 so as to surround the outer periphery of the imaging element 12. An optical filter 14 such as an IR cut filter is disposed in the lower portion 13L of the lens barrel 13. The upper portion 13U of the lens barrel 13 is engaged with a part on the optical unit 20 and sector drive unit 30 side as will be described later. Further, an FPC (Flexible Printed Circuit) 17 for connecting the camera module 1 to an electronic device such as a camera or a mobile phone is connected to a wiring pattern (not shown) formed on the imaging substrate 11. The FPC 17 is provided with a connector 18 for connecting to a main circuit board (motherboard) on the electronic device side. For connecting the imaging board 11 and an external circuit, a connector may be directly provided on, for example, the back side of the imaging board 11 without using the FPC. In this case, when an electronic component such as the image sensor 12 is mounted on the image pickup substrate 11, a connector is also mounted at the same time.

  A lens holder 21 forming a part of the optical unit 20 is fitted inside the upper portion 13U of the lens barrel 13. Three lenses 22, 23 and 24 are held in the lens holder 21. Screws that are screwed to each other are formed on the outer peripheral surface of the lens holder 21 and the inner peripheral surface of the upper portion 13 </ b> U of the lens barrel 13. Therefore, by rotating the lens holder 21 with respect to the lens barrel 13, the position in the optical axis direction LA is changed, so that light incident through the lenses 22, 23, and 24 is imaged on the image sensor 12. You can adjust the focus. After the focus adjustment is completed, the lens holder 21 is fixed in the lens barrel 13 using, for example, an adhesive.

  Further, a notch 25 having a stepped outer periphery is formed at the upper end of the lens holder 21 (end on the subject side). The notch 25 has an annular surface 25F perpendicular to the optical axis direction LA. As will be described later, the sector substrate 31 of the sector drive unit 30 contacts the annular surface 25F.

  A sector drive unit 30 is disposed above the optical unit 20. The sector drive unit 30 includes a configuration generally referred to as a sector drive device or a shutter device. In the camera module 1, the sector drive unit 30 is disposed on the subject side with respect to the optical unit 20. More specifically, a part of the sector substrate 31 included in the sector drive unit 30 is fixed on the lens holder 21 of the optical unit 20. A sector pressing plate 32 is disposed so as to face the sector substrate 31. Three sectors 33, 34, and 35 are arranged in a space SP between the sector substrate 31 and the sector presser plate 32.

  The sector substrate 31 includes a cylindrical portion 37 that is in contact with the lens holder 21 and covers the upper portion 13U of the lens barrel 13, and a motor storage portion 39 in which a step motor 36 as an actuator is installed. Contains. A shutter opening 38 is formed in the upper part of the cylindrical portion 37. The shutter opening 38 is formed so as to be fitted into the notch 25 described above formed in the upper portion of the lens holder 21. That is, the peripheral portion 38 </ b> C of the shutter opening 38 is fixed in a state of being in contact with the annular surface 25 </ b> F of the notch portion 25. The portion of the sector substrate 31 where the shutter opening 38 is formed has a flat plate shape perpendicular to the optical axis direction LA. Therefore, the sector substrate 31 is fixed perpendicularly to the optical axis direction LA when the annular surface 25F of the notch 25 and the peripheral portion 38C of the shutter opening 38 come into contact with each other.

  If the cutout portion 25 on the lens holder 21 side is formed in a step portion having a right-angled cross section, and the shutter opening 38 is formed so as to be just fitted into the cutout portion 25, the sector substrate with respect to the lens holder 21 is formed. 31 can be fitted with higher positional accuracy.

  The lens holder 21 is fixed in the lens barrel 13 as described above. The lens holder 21 is fitted with a shutter opening 38 of the sector substrate 31. Therefore, in the camera module 1, the relative position between the lens in the optical unit 20 and the sector drive unit 30 does not change. In the camera module 1, since the shutter opening 38 of the sector substrate 31 is fitted to the lens holder 21, the camera module 1 does not substantially function as a photographing opening. In the camera module 1, the opening 32HL formed in the sector presser plate 32 is an opening for photographing.

  Further, a positioning structure is formed between the cylindrical portion 37 of the sector substrate 31 and the upper portion 13U of the lens barrel 13. This will be described with reference to FIG. FIG. 2 is a view shown for explaining the engagement relationship between the cylindrical portion 37 of the sector substrate 31 and the upper portion 13U of the lens barrel 13. As shown in FIG. In this drawing, the relationship between the inner surface of the cylindrical portion 37 and the convex portion 13Ua formed on the upper portion 13U of the lens barrel 13 is particularly illustrated. A convex portion 13Ua is formed on the outer peripheral surface of the upper portion 13U of the lens barrel 13 so as to project in the radial direction. The convex portion 13Ua extends with a predetermined length in the optical axis direction LA. Although one piece is shown in FIG. 2, the upper portion 13U of the lens barrel 13 is tubular, and a plurality of pieces may be arranged on the outer peripheral surface. Correspondingly, a concave portion 37 a that engages with the convex portion 13 Ua is formed in the cylindrical portion 37 of the sector substrate 31. Therefore, the sector substrate 31 of the sector drive unit 30 can be positioned so as not to rotate around the optical axis with respect to the lens barrel 13 fixed to the imaging substrate 11.

  FIG. 2 shows an example in which a convex portion is formed in the upper portion 13U of the lens barrel 13 and a concave portion is formed in the cylindrical portion 37 of the sector substrate 31, but the arrangement of the convex portion and the concave portion may be reversed. Good. In short, an engaging portion that engages with each other is formed on the lens barrel 13 side and the cylindrical portion 37 side of the sector substrate 31, and it is only necessary that the position of the cylindrical portion 37 around the optical axis can be regulated by this engaging portion. The cylindrical portion 37 is formed with an inner surface so as to be just fitted into the upper portion 13U of the lens barrel 13.

  After positioning the concave portion 37a of the cylindrical portion 37 on the sector substrate 31 side with respect to the convex portion 13Ua on the side of the lens barrel 13 as described above, an adhesive is applied to the engaging portion to thereby apply the sector substrate to the lens barrel 13. 31 can be fixed with high positional accuracy. Further, such a structure can be confirmed with reference to FIG. 1, and the upper portion 13 </ b> U of the lens barrel 13 is covered with the cylindrical portion 37 of the sector substrate 31. Therefore, the camera module 1 has a structure capable of preventing unnecessary light from entering the lens barrel 13 from the side.

  Further, a printed circuit board 40 for connecting the electrode of the step motor 36 to the imaging substrate 11 is joined to the side portion of the sector substrate 31. This printed board is a hard printed board formed of a base material such as polyimide resin, epoxy resin, or glass epoxy resin. The printed circuit board 40 is electrically connected to the imaging board 11 by solder 41 and is fixed at a substantially right angle to the imaging board 11. Therefore, the sector drive unit 30 is electrically connected to the imaging board 11 and is reliably supported by the imaging board 11 via the hard printed board 40. Further, as described above, the sector drive unit 30 is fixed to the imaging substrate 11 on the cylindrical portion 37 side via the lens barrel 13. Thus, since the sector drive unit 30 is stably supported by the imaging substrate 11, the camera module 1 has a structure that is excellent in impact resistance and can reduce the occurrence of internal load. Therefore, this camera module 1 does not cause a problem that the sector of the sector drive unit 30 collides with the peripheral portion and is damaged.

  Moreover, since the printed circuit board 40 is connected to the imaging board 11 as described above, the camera module 1 can control the step motor 36 from the imaging board 11 side. By adopting such a structure, it is possible to arrange electronic components for a motor, which should originally be arranged on the sector drive unit 30 side, on the imaging substrate 11 side. As described above, when the camera module 1 has a space on the side of the image pickup substrate 11, the size of the entire apparatus is reduced by utilizing the space. Such a device for miniaturization is not limited to the camera module 1. For example, a sector drive IC (control circuit element) for driving and controlling a sector has a relatively large external shape, and therefore, when mounted on the motherboard side of the electronic device, the size increases. In the camera module 1, the sector driving IC 15 is arranged on the image pickup substrate 11 by utilizing space. Therefore, it is possible to reduce the size of the electronic device that employs the camera module 1.

  The camera module 1 is devised so as not to increase the size even if the sector driving IC 15 is disposed on the imaging substrate 11 side. This point will be described. As shown in FIG. 1, the right side portion where the lens barrel 13 and the lens holder 21 are stacked is relatively high. On the other hand, there is a space on the imaging substrate 11 facing the motor storage unit 39. A sector driving IC 15 is arranged in this space. Therefore, the camera module 1 is not increased in size by moving the components used for the sector drive unit 30 to the imaging substrate 11 side, and can be reduced in size as a whole device by effectively utilizing the space.

  Further, as described above, the FPC 17 is connected to the imaging board 11 for connection to an electronic device, and the FPC 17 is provided with a connector 18 for connecting to a circuit board (motherboard or the like) on the electronic device side. Yes. Therefore, the imaging unit 10 and the sector drive unit 30 can be controlled simply by connecting the connector 18 to a motherboard or the like of the electronic device. Therefore, compared with the case where the sector drive unit 30 and the camera module are individually controlled, the camera module 1 can simplify the electrical configuration.

  FIG. 3 is a view showing a modification in the case where the printed circuit board 40 for the step motor is fixed to the imaging board 11. In the camera module 1 shown in FIG. 3, the printed circuit board 40 that is electrically connected to the electrodes of the step motor 36 is connected to the terminal pins 45. The terminal pin 45 is inserted into a contact hole 11HL provided in the image pickup substrate 11 and is fixed to the image pickup substrate 11 with solder 41. In the case of this modified structure, since the terminal pin 45 is inserted into the imaging substrate 11, the sector drive unit 30 can be held more firmly. Therefore, the camera module 1 is a device that can further improve the impact resistance.

  Below, with reference to FIG.4, FIG.5 and FIG.6, the shielding member (cover member) which covers said imaging unit 10, the optical unit 20, and the sector drive unit 30 is demonstrated. The shield member 50 is a cover for enhancing the impact resistance of the camera module 1 and a shield for reducing electrical noise of the camera module 1. The camera module 1 and the shield member that houses the camera module 1 are collectively referred to as a “camera module having a shield member”.

  4, 5, and 6 are a top view, a side view, and a back view of a camera module provided with the shield member of the present invention, respectively, in which the shield member 50 is indicated by a solid line, The camera module 1 housed in is shown by a broken line. In the following description, the camera module 1 housed in the shield member 50 is described as having the sector drive device as described above, but may be a camera module not having the sector drive device.

  The shield member 50 has a rectangular parallelepiped shape whose cross section is a “U” shape, and includes one upper plate and four side walls. The shield member 50 is made of, for example, a metal such as SUS (stainless steel), and the upper plate thereof has the same size as the imaging substrate 11. Inside the shield member 50, the camera module 1 including the imaging unit 10, the optical unit 20, and the sector drive unit 30 is housed. Here, the shield member 50 is not limited to SUS, and may be a metal other than SUS. Alternatively, the shield member 50 may be formed of a resin base material with a metal film coated on the surface by plating or vapor deposition, or a resin base material mixed with a conductive material such as carbon fiber or carbon black. In addition, since the metal is stronger than the resin and the manufacturing process is not complicated, it is preferable to mold the shield member 50 with a metal.

  The reason why the shield member 50 is formed of such a conductive material is to secure grounding in order to reduce electrical noise. Such a ground is ensured by solder provided at the joint between the shield member 50 and the imaging substrate 11. As described above, when the shield member 50 is formed of a conductive resin, a conductive adhesive may be used instead of the solder.

  Three leg portions 50 a, 50 b, and 50 c that are longer than the plate thickness of the imaging substrate 11 are provided on three different side walls of the shield member 50 on the end surface that is in contact with the imaging substrate 11. Further, on the outer peripheral portion of the imaging substrate 11, notches 11a, 11b, and 11c that are fitted to these leg portions are formed at positions corresponding to the leg portions 50a, 50b, and 50c of the shield member 50, When the end surface of the shield member 50 comes into contact with the imaging substrate 11, each leg portion protrudes from the imaging substrate 11 through a corresponding notch. Thus, by providing a notch in the imaging substrate 11, it is possible to avoid the enlargement of the imaging substrate 11 and to reduce the size of the camera module. In addition to the three legs, two corners located diagonally among the corners formed between two adjacent side walls are formed with notches 50d and 50e throughout. Yes. These three legs 50a, 50b, and 50c and the back surface of the imaging board 11 (in this example, the surface on which the camera module is not mounted), the two notches 50d and 50e, and the surface of the imaging board 11 (this example) Then, the surface on which the camera module is mounted is soldered, and the shield member 50 and the imaging substrate 11 are joined. Thus, since the leg parts 50a-50c and the back surface of the imaging board 11 are soldered, it can prevent more reliably that the shield member 50 peels from the imaging board 11. FIG.

  When the cutout portion is provided in the shield member 50 as described above, it can be soldered to the outer periphery of the cutout portion, and can be easily soldered even after the end surface of the shield member 50 is in contact with the imaging substrate 11. Further, soldering is facilitated without making the size of the imaging substrate 11 larger than that of the shield member 50. Further, since the contact area between the shield member 50 and the solder can be widened, sufficient bonding strength can be ensured. Note that it is not always necessary that all of these five joints serve as the ground, and it is sufficient that the ground is secured at least at one joint.

  On the upper plate of the shield member 50, an opening 51 having a size that does not block the angle of view (imaging range) of the lens of the camera module is formed at a position facing the shutter opening of the blade pressing plate. Here, the shape and color of the opening 51 of the shield member 50 are such that the reflected light on the inner peripheral surface thereof is not incident on the light receiving portion of the image sensor 12 in order to prevent the image from being blurred. It is preferable to do. As an example of such a shape, for example, there is a shape whose inner peripheral surface has a predetermined inclination angle with respect to the optical axis of the lens. Further, if the inner peripheral surface is black at least as the color of the opening 51, the above effect can be obtained.

  As shown in these drawings, the entire camera module 1 is covered with a shield member 50 to protect the inside when there is an impact. For example, when the camera module 1 is incorporated in an electronic device or the like, Provided is a camera module that can prevent the unit from being damaged due to contact with each other, can reduce the electrical noise of the camera module 1, and can reduce the electrical noise that causes malfunction of the apparatus. be able to.

  FIG. 7 is a flowchart for explaining a manufacturing process of the camera module 1 provided with the shield member 50 of the present invention. First, electronic components such as the image sensor 12 are mounted on the imaging substrate 11 (step S110), and a holder to which an optical filter is bonded is bonded to the imaging substrate 11 (step S120). Next, the lens holder 21 to which the lens is bonded is screwed into the holder, focus adjustment is performed, and an adhesive is applied to the screwed portion to fix the holder and the lens holder (step S130). Further, the FPC 17 is connected to the imaging substrate 11 to complete the camera module 1 (step S140).

  Subsequently, the sector drive device assembled in advance is attached to the camera module 1 (step S150). This process will be described in detail. The concave portion of the sector substrate 31 and the projection of the holder are fitted, and the contact portion of the sector substrate 31 and the flat surface of the cutout portion 25 of the lens holder 21 are brought into contact. Then, an adhesive is applied and fixed to the fitting portion between the concave portion 37a of the sector substrate 31 and the protruding portion 13Ua of the lens barrel 13, and finally, the pattern of the printed circuit board 40 and the pattern of the imaging substrate 11 are soldered. The sector driving device grips each sector with the sector substrate 31 and the blade pressing plate 32, fixes the sector substrate 31 and the blade pressing plate 32, and stores the actuator 36 in the storage portion 39. It is assembled by joining the printed circuit board 40 to one end.

  Finally, the end face of the shield member 50 is brought into contact with the imaging substrate 11 so that the camera module 1 and the sector drive unit 30 are accommodated in the shield member 50, and the leg portions 50a, 50b, 50c of the shield member 50 are The periphery and the outer periphery of the notches 50d and 50e of the shield member 50 and the imaging substrate 11 are soldered (step S160). At this time, it solders to the grounding pattern provided in at least one place of the imaging substrate 11. Thus, the camera module provided with the shield member of the present invention is completed.

  In the camera module provided with such a shield member, noise from outside and outside noise can be reduced by the shield member 50 covering the camera module 1 and the sector drive unit 30, and the camera module 1, sector drive unit 30 and It is possible to prevent malfunction caused by noise of the external device. Further, since the shield member 50 and the grounding pattern of the imaging substrate 11 are soldered, the fixing of both and the grounding of the shield member 50 can be performed by one member and one manufacturing process.

  The preferred embodiment of the present invention has been described in detail above, but the present invention is not limited to the specific embodiment, and various modifications can be made within the scope of the gist of the present invention described in the claims.・ Change is possible.

  For example, the number and length of the leg portions 50a to 50c can be appropriately changed, and instead of providing the leg portion on the shield member 50, a claw portion is provided so as to be locked to the imaging substrate 11. Good. Similarly, the shapes of the cutout portions 11a to 11c can be appropriately changed. When the imaging substrate 11 is locked by the claw portion, the imaging substrate 11 and the shield member 50 are not provided with a cutout portion. Also good.

  In the above embodiment, the grounding pattern is provided on the imaging substrate. However, for example, the grounding pattern is provided on the inner peripheral surface of the notches 11a to 11c of the imaging substrate 11 to form the leg portions 50a to 50c of the shield member 50. For example, a grounding pattern may be provided on the inner periphery of an outer case of an electronic device, another circuit board, or the like so as to directly or indirectly contact the shield member.

  Furthermore, the end face of the shield member 50 may be brought into contact with another member (another circuit board or the like). In this way, there is an advantage that the load (load) applied to the imaging substrate 11 can be reduced.

  The present invention provides a camera module capable of reducing electrical noise that causes device malfunction.

It is the side view shown so that the internal structure of the camera module which concerns on embodiment could be confirmed. It is the figure shown in order to demonstrate the engagement relation of the cylindrical part of a sector board | substrate, and the upper part of a lens-barrel. It is the figure which showed the modification in the case of fixing the printed circuit board for step motors to an imaging board. It is a top view of the camera module provided with the shield member of the present invention. It is a side view of the camera module provided with the shield member of the present invention. It is a reverse view of the camera module provided with the shield member of the present invention. It is a flowchart for demonstrating the manufacturing process of the camera module provided with the shield member of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Camera module 10 Imaging unit 11 Imaging board 12 Imaging element 13 Lens tube 13Ua Protrusion part 17 FPC
18 Connector 20 Optical Unit 21 Lens Holder 25 Notch 30 Sector Drive Unit 31 Sector Substrate 31U Head 31L Leg 31PR Contact 32 Sector Presser Plate 33, 34, 35 Sector 36 Step Motor 37 Cylindrical Part 37a Concave 38 Shutter Opening 39 Motor housing part 36MP Actuation pin 40 Printed circuit board 41 Solder 45 Terminal pin 50 Shield member LA Optical axis direction

Claims (9)

An image pickup unit including an image pickup element mounted on a substrate, an image pickup device mounted on the substrate, an optical unit including a lens, a conductive shield member that covers the image pickup unit and the optical unit without being in close contact, and the substrate and the shield member. A joining means for fixing and a grounding means for grounding the shield member are provided , a notch is formed in the substrate, and the side wall of the shield member is fitted so as to protrude from the substrate through the notch. Legs are provided, the joining means joins the notches and the legs, and the grounding means is a grounding pattern provided on the substrate, and the grounding pattern and the joining means are electrically connected. The camera module characterized by being made . The camera module according to claim 1, wherein the shield member is made of a metal material, and the joining means is solder. The camera module according to claim 1, wherein the shield member is made of a resin having conductivity, and the joining unit is a conductive adhesive. The camera module according to claim 3 , wherein the resin having conductivity is a resin base material with a metal coating on a surface or a resin base material containing a conductive substance. The camera module according to claim 4 , wherein the conductive material is carbon fiber or carbon black. Wherein the top surface of the shield member, a camera module according to any one of claims 1 to 5, characterized in that the openings of a size that does not block the field angle of the lens of the camera module is provided. The inner peripheral surface of the opening has a predetermined tilt angle with respect to the optical axis of the lens, and the tilt angle is set to an angle at which the reflected light from the inner peripheral surface does not enter the light receiving portion of the image sensor. The camera module according to claim 6 . The camera module according to claim 6 or 7, wherein the inner peripheral surface of the opening portion is black. An electronic apparatus characterized in that it comprises a camera module according to any one of claims 1 to 8.

Images