TW201415970A - Auto-focus camera module with flexible printed circuit extension - Google Patents

Abstract

A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

Description

Autofocus camera module with flexible printed circuit extension [Proposition of priority]

The present application claims the priority rights of a group of four patent applications filed concurrently. U.S. Patent Application Serial No. 13/571,395, filed on Aug. 10, 2012, entitled " CAMERA MODULE WITH EMI SHIELD"; U.S. Patent Application Serial No. 13/571,397, filed on Aug. 10, 2012 No. 13/571,405, filed on August 10, 2012, entitled "AUTO-FOCUS CAMERA MODULE WITH FLEXIBLE PRINTED CIRCUIT EXTENSION". Each of the priority applications in these priority applications is hereby incorporated by reference.

The present invention relates to compact camera modules and, in particular, to autofocus and can be included in an efficient, versatile and durable packaging environment. A compact camera module that selects the zoom function.

The camera module can be symbolically or virtually divided into two main components, namely a sensor component and an optical component string component. The resulting electronic camera is referred to as a fixed focus if the position of all of the lenses of the string of optical elements and/or the position of one or more of the constituent lenses is fixed relative to the position of the image sensor. Positioning the optical system rigidly means that an object that is only a certain distance from the camera will focus on the influencing sensor. Fixed-focus cameras have the advantages of small physical size and low cost, but their performance is limited. In particular, the focal length is typically set at 1.2 m so that objects from 60 cm to infinity are imaged with tolerable sharpness. However, the image sharpness is not particularly good, and objects that are less than 60 cm away from the camera will always blur the image. Although the focus can be set at a closer distance to correct this problem, this is at the expense of the sharpness of the distant object.

Therefore, there is a need for a compact camera module that includes autofocus and optional zoom in an efficient, versatile, and durable package environment.

201‧‧‧Image Sensor

202‧‧‧Substrate

203‧‧‧ sleeve

204‧‧‧Thread

205‧‧‧Retainer

206‧‧‧Lens string

207‧‧‧ thread

208‧‧‧ optical axis

601‧‧‧Electromagnetic interference enclosure

602‧‧‧Light leakage baffle

603‧‧‧Lens barrel bracket

604‧‧‧Actuator and lens barrel assembly

605‧‧‧Infrared filter components

606‧‧‧Sensor components

607‧‧‧Bottom sponge

608‧‧‧Focus adjustment aperture

609A‧‧‧conductive trace

609B‧‧‧ conductive traces

701‧‧‧Electromagnetic interference enclosure

702‧‧‧Light leakage baffle

702A‧‧‧Electromagnetic interference characteristics

702B‧‧‧ aperture

702C‧‧‧Outer part

704‧‧‧Microelectromechanical system actuator assembly

708‧‧‧ aperture

802‧‧‧light leakage baffle

901‧‧‧Electromagnetic interference enclosure

902‧‧‧Light leakage baffle

1001‧‧‧Electromagnetic interference enclosure

1002‧‧‧Electromagnetic interference coating

1003‧‧‧conductive traces

1004‧‧‧Frame/bracket/internal structure

1101‧‧‧ bracket

1102‧‧‧ conductive traces

1103‧‧‧Contact point gasket

1104‧‧‧ lens barrel

1105‧‧‧Electronic actuator components

1106‧‧‧Contact point gasket

1107‧‧‧Sensor components

1108‧‧‧Printed circuit

1201‧‧‧Shell

1205‧‧‧Internal module

1210‧‧‧Sponge

1211‧‧‧Bottom sponge

1401‧‧‧Electromagnetic interference enclosure

1402‧‧‧ side sponge

1403‧‧‧Bottom sponge

1404‧‧‧Internal components

1405A‧‧‧Z-direction compression gap

1405B‧‧‧Z-direction compression gap

1406‧‧‧Initial sponge Z-direction length / uncompressed length

1407‧‧‧Compressed sponge Z-direction length/gap

1408‧‧‧ bracket

1409‧‧‧ clip

1410B‧‧‧left side

1410C‧‧‧right

1410D‧‧‧Back

1411‧‧‧ bottom layer

1501‧‧‧ camera module

1502‧‧‧Flexible printed circuit

1502A‧‧‧Sensor connection section

1503‧‧‧Electronic device

1503A‧‧‧ side section

1504‧‧‧Flexible printed circuit extension

1504A‧‧‧conductive side gasket

1505‧‧‧cut part

1601‧‧‧Flexible printed circuit

1602‧‧‧ camera module

1603‧‧‧Accelerator contact points

1604‧‧‧Actuator gasket conductive contact / conductive gasket cut-off

1605‧‧‧Flexible printed circuit segments

1606‧‧‧Aperture

L1‧‧ lens L1

L2‧‧ lens L2

L3‧‧‧Lens L3

L4‧‧ lens L4

L5‧‧ lens L5

1 is a schematic cross-sectional view of an example of an autofocus camera module including a subset of movable lenses and a MEMS actuator, in accordance with some embodiments.

FIG. 2A schematically illustrates another example of an autofocus camera module that includes another subset of one or more movable lenses and a MEMS actuator, in accordance with some embodiments.

FIG. 2B illustrates a camera module including two main sub-elements including a sensor element and an optical element string element, the two The secondary elements can be coupled and decoupled for interchange.

FIG. 3 schematically illustrates another example of an autofocus camera module that includes different subsets of one or more movable lenses and a MEMS actuator, in accordance with some embodiments.

4A schematically illustrates a cross-sectional view of an example of an autofocus camera module including a wire bonded image sensor configuration, in accordance with some embodiments.

4B schematically illustrates a cross-sectional view of an embodiment of an autofocus camera module including a flip chip image sensor configuration in accordance with some embodiments.

Figure 5A schematically illustrates a cross-sectional view of another camera module having copper post interconnections in accordance with some embodiments.

Fig. 5B is a plan view schematically showing the camera module of Fig. 5A.

6A-6C schematically illustrate exploded, top or top views and side views, respectively, of a camera module having certain peripheral and/or internal components, in accordance with certain embodiments.

Figure 7 is a schematic illustration of an exploded view of a camera module including: a housing that acts as an electromagnetic interference (EMI) mask or EMI housing and allows for a closed lens barrel Moving through the focus adjustment aperture; and a light leakage baffle that defines the camera aperture, or the baffle limits or surrounds the camera module aperture, or blocks unwanted diffused light from entering or exiting through the first aperture during transmission of the desired exposure Camera module.

Figure 8 illustrates a camera module of Figure 7 with an EMI enclosure (not disassembled) and a light barrier that is spaced apart (for illustration).

FIG. 9 schematically illustrates a camera module having an EMI housing and a light leakage baffle in accordance with some embodiments.

10A and 10B schematically illustrate top and bottom views of an EMI enclosure for an autofocus camera module having an EMI coating on the outer surface and along the edge, in accordance with some embodiments The inner surface has conductive traces for connecting the electronic actuator element to an electronic shim or printed circuit.

11A-11B schematically illustrate perspective and exploded views of an autofocus camera module in accordance with some embodiments, the module including a lens barrel that is at least partially surrounded within the bracket The carrier has conductive traces thereon for connecting the electronic actuator components to an electronic shim or printed circuit.

Figure 12 is a schematic illustration of an exploded view of a camera module having a cushion or absorbent sponge, including the EMI housing and camera module disposed in Figures 6A through 11 in accordance with some embodiments. A plurality of sponges between the autofocus optical elements.

13A through 13B are schematic illustrations, respectively, of an assembled view and a partially exploded view of an x-y-z compression absorbing sponge camera module in accordance with some embodiments.

Figure 14A schematically illustrates a cross-sectional view of an x-y-z compression absorbing sponge camera module in accordance with some embodiments.

Figure 14B schematically illustrates an absorbent sponge camera module in accordance with some embodiments, illustrating a favorable sponge z-direction compression prior to z-direction compression The gap, and the initial sponge z-direction length designed to optimize the protective elasticity in combination with the gaps.

Figure 14C schematically illustrates a camera module of Figure 14B after z-direction compression, illustrating a filled sponge z-direction compression gap, and a camera mode based on advantageous synergy, in accordance with some embodiments. The shortened compression sponge z-direction length of the group architecture.

15A through 15C schematically illustrate camera modules before (FIG. 15A) and after (15C) bending of FPC, in which the camera modules are physically and electronically coupled, in accordance with some embodiments. Connected to a bendable, flexible printed circuit (FPC) at the sensor end; and wherein the FPC includes one or more conductive side pads for electrically contacting the lens barrel of the camera module The actuator spacer at the image end.

16A through 16B schematically illustrate camera modules before and after FPC bending as shown in FIGS. 15A and 15C, respectively, in accordance with some embodiments, wherein the FPC is configured to be electrically connected to The actuator contacts and acts as or is coupled to the light leakage baffle, for example, as an alternative embodiment of the embodiment described with reference to Figures 6A and 7 through 9 .

According to some embodiments, a compact camera module is provided. The module includes: an image sensor configured to be coupled to a flexible printed circuit to activate the camera module and transmit the image sense An image captured at the detector; and an optical element string aligned with the image sensor, the optical element string comprising a plurality of lenses. At least one movable lens is coupled to an actuator (eg, a MEMS actuator) to form an optical system The position of the at least one movable lens along the optical path is automatically adjusted to focus the object disposed within the auto focus range of the camera module onto the image sensor. The compact camera module includes an EMI housing configured to contain an optical component string and a mask camera module component from electromagnetic interference (EMI). The EMI housing has a focus adjustment aperture that has been defined within the housing that is large enough to allow the object end of the optical element string to at least partially protrude through the aperture at one end of the auto focus range. The light leakage baffle has a defined baffle aperture that partially overlaps the focus adjustment aperture along the optical path. The light leakage baffle includes an EMI mask material that partially overlaps the focus adjustment aperture in the optical path direction, but the material is outside the auto focus range along the optical path direction.

One or more lenses of the string of optical elements may be disposed within the lens barrel. The lens barrel can have at least one movable lens. The lens barrel can move with the lens that is fixed within the barrel, and/or one or more lenses can move within the lens barrel.

The EMI enclosure can include an EMI coating. Alternatively, the EMI enclosure may be formed from a conductive material, a semiconductive material, and/or an EMI mask material. The light leakage baffle can also include a conductive material, a semiconductive material, or other EMI mask material that provides an additional EMI mask to the camera module components. The conductive material of the light leakage baffle may include carbon, for example, a carbon feather material. The conductive paste can be used to couple the light leakage barrier to the housing, for example, to the outside of the housing or to the internal recess of the housing.

Another autofocus digital camera module includes a housing, an image sensor in the housing, and an optical component string aligned with the image sensor in the housing. The optical element string defines an optical path and includes a plurality of lenses, the lenses including at least one movable lens coupled to the lens actuator, the actuator configured to move the at least one movable lens along the optical path To focus the object image onto an image sensor placed within the auto focus range of the camera module. The flexible printed circuit (FPC) includes a sensor segment coupled to the image sensor to activate the camera module and transmit the digital image including the image captured by the image sensor Electronic signal. The FPC also includes an extension spaced from the sensor segment, the extension including electrical contact pads configured to be electrically coupled to the lens actuator contact pad for surrounding the camera module at the FPC The lens actuator control signal is transmitted from the sensor end to the object end in the event of folding.

The flexible printed circuit can include an intermediate section between the sensor segment and the extension, the intermediate section enclosing at least one side of the camera module. The extension can be coupled to the object end of the camera module, the extension being opposite the sensor segment coupled to the sensor end of the camera module. The casing may include an electromagnetic interference (EMI) coating on the outer surface.

The casing may have a focus adjustment aperture defined within the casing that is large enough to allow the article end of the string of optical elements to at least partially protrude through the aperture at one end of the autofocus range. The light leakage baffle may overlap the focus adjustment aperture portion outside the auto focus range of the object end of the optical element string. A baffle cavity can be defined in the light leakage baffle that is smaller than the focus adjustment aperture and allows light to enter the camera module to capture an image.

Another compact camera module for autofocusing a digital camera is provided herein, the module including a housing configured to contain imaging optics The device and the digital electronic device are used to capture and transmit images, and the cover is configured to shield the electronic components from electromagnetic interference (EMI). The string of optical elements is coupled and aligned with the image sensor, and the string of optical elements is configured to define an optical path to focus the object image onto an image sensor disposed at a focal plane of the string of optical elements. The flexible printed circuit is coupled to the image sensor to transmit an electronic signal including the digital image captured by the image sensor. The light leakage baffle is coupled to the flexible printed circuit and defines a baffle cavity at a predetermined distance from the image sensor to position the light leakage baffle on the image of the optical component string after folding the FPC onto the cover Side and overlap the baffle cavity with the optical path.

The FPC can be configured such that after folding the FPC onto the casing, the one or more electrical contact pads disposed on the object side of the optical element string are electrically coupled to the FPC, thereby causing the lens to The actuator control signal can be transmitted directly from the FPC to the lens actuator. The light leakage baffle can be configured to block some ambient light from entering the camera through the focus adjustment aperture defined in the housing to allow the object end of the optical element string to at least partially protrude through the aperture at one end of the auto focus range. The light leakage baffle can include a conductive or semiconductive material that provides an electromagnetic interference mask, such as carbon. A baffle cavity can be defined in the light leakage baffle that is smaller than the focus adjustment aperture and allows light to enter the camera module to capture an image. The flexible printed circuit can include an intermediate section between the sensor segment and the extension, the intermediate section enclosing at least one side of the camera module.

Also provided is a compact camera module for an autofocus digital camera, the module including a housing configured to include imaging optics and digital electronics for capturing and transmitting images, and Cover It is configured to mask electronic components from electromagnetic interference (EMI). The optical element string is coupled and aligned with an image sensor, the optical element string comprising a plurality of lenses configured to define an optical path within the housing to focus the object image to a focal plane disposed on the string of optical elements On the image sensor. The MEMS actuator is coupled to at least one movable lens of the optical element string that is movable in an auto focus range of the camera module formed by aligning the image sensor element with the compact optical module. The flexible printed circuit is coupled to the image sensor to transmit an electronic signal including the digital image captured by the image sensor. The FPC includes an extension segment configured to cause one or more electrical contact pads disposed on the image side of the optical element string and the FPC extension after folding the FPC onto the housing The contact pad is electrically coupled, whereby the MEMS actuator control signal can be transmitted directly from the FPC to the MEMS lens actuator.

The casing may define a focus adjustment aperture within the housing, the aperture having a predetermined shape configured to allow an object end of the string of optical elements to at least partially protrude through the aperture at one end of the autofocus range; and wherein the FPC The extension includes a light leakage baffle that partially overlaps the focus adjustment aperture to block unwanted light from entering the enclosure, and the baffle is disposed outside of the auto focus range of the object end of the optical element string.

Another autofocus digital camera module is provided herein, the module includes a cover having an image sensor for enclosing the camera module and the outer surface of the inner frame, the inside of the cover, and coupled to the cover A string of optical elements within the inner frame and aligned with the image sensor, the string of optical elements defining an optical path and including a plurality of lenses. For example, a lens actuator of a MEMS actuator is configured to Moving at least one movable lens of the optical element string along the optical path to focus an image of the object image disposed within the auto focus range of the camera module onto an active plane of the image sensor. For example, a flexible, rigid or rigid flex circuit or a printed circuit board printed circuit is coupled to the image sensor to activate the camera module and to transmit an electronic signal comprising the digital image captured by the image sensor. The printed circuit is also electrically coupled to the lens actuator to transfer the lens actuator control signal. An electromagnetic interference (EMI) mask is provided to the outer surface of the casing. Conductive traces are provided to one or more surfaces of the inner frame of the casing that allow lens actuator control signals to be transmitted from the electrical contact pads on the printed circuit to the lens actuator contact pads.

Another autofocus digital camera module is provided herein that includes an EMI shroud housing that includes a bracket that forms an inner frame on the inside of the shroud. An optical element string comprising a plurality of lenses is coupled and aligned with an image sensor within the housing to define an optical path. At least one movable lens coupled to a lens actuator, such as a MEMS actuator, configured to move at least one movable lens along an optical path to focus on an object disposed within an autofocus range of the camera module Like the image. The printed circuit is coupled to the image sensor to activate the camera module and transmit an electronic signal including the digital image captured by the image sensor. One or two conductive traces are formed along one or more surfaces of the carrier to electrically connect one or more (eg, a pair) of electrical contact pads on the printed circuit to the lens actuator The contact pad is adapted to allow the lens actuator control signal to pass between the electrical contact pad on the printed circuit and the contact pad on the lens actuator.

The EMI mask can include electromagnetic interference on at least one surface The (electromagnetic interference; EMI) coating and/or EMI mask cover may include an electromagnetic interference (EMI) mask substrate material.

The light leakage baffle may have a baffle aperture defined within the baffle that overlaps the focus adjustment aperture defined by the object image end of the autofocus digital camera module to allow at least one movable lens to be optically The path at least partially protrudes through the aperture at one end of the autofocus range. The light leakage baffle may include an EMI mask material that partially overlaps the focus adjustment aperture and is just outside the object image end of the auto focus range of the digital camera module.

The light leakage baffle may comprise a conductive or semiconductive material such as carbon or carbon plume that provides an EMI mask to the optical module component. The conductive paste can couple the light leakage barrier to the EMI housing. The light leakage baffle can be placed on the outside of the casing.

Another compact optical module is provided herein that is configured for coupling to an image sensor component of an autofocus digital camera module. The optical element string of the compact optical module includes a plurality of lenses including at least one movable lens; and a lens actuator configured to move at least one movable lens along the optical path to The image sensor is disposed on a focal plane of the string of optical elements and coupled to the printed circuit to transmit an electronic signal comprising the digital image captured by the image sensor. The inner casing is configured as a frame to include the optical element string and the image sensor and align the two, while the outer casing includes an inner casing and an optical element string and is configured to cover the optical element string and image sense The detector is protected from electromagnetic interference (EMI) and external physical vibration. One or more shock absorbing sponges are disposed between the outer casing and the inner casing, the sponges Configured to compress to absorb external physical shocks in three spatial dimensions. One or more volume sponge compression gaps are defined between the outer casing and the inner casing to permit relative movement in the direction of the outer casing to the optical path of the inner casing without contact.

The lens actuator can include a pair of lens actuator control pads for receiving lens actuator control signals from the printed circuit along a pair of conductive traces that electrically connect the printed circuit to the pair The lens actuator engages the shim. The outer casing can be integral with the inner frame and the conductive traces can be formed along the inner frame. The molded carrier can be disposed within the outer casing as an inner frame, and the conductive traces can be formed on or along one or more surfaces of the bracket.

One or more of the plurality of lenses may be included in the lens barrel, the lenses including at least one movable lens. The EMI outer casing may include an EMI coating that provides an EMI mask to the optical module components. The EMI outer casing may include a conductive or semiconductive material that provides an EMI mask to the optical module components.

One or more shock absorbing sponges may be disposed between the outer casing and the inner casing in such a manner that the sponges do not overlap the optical element strings in the optical path direction, and thus the sponges are compressed to absorb Z The vibration is applied without increasing the Z-direction height of the string of optical elements.

One or more shock absorbing sponges may also be positioned such that the sponges do not overlap the inner casing in the direction of the optical path. Thus, one or more sponges can also be compressed to absorb the Z-direction shock without increasing the Z-direction height of the inner casing.

One or more volume sponge compression gaps can be configured to not be optical The path direction overlaps the inner casing, thereby not increasing the Z-direction height of the string of optical elements.

One or more volume sponge compression gaps may be defined to at least reach a predicted sponge compression depth and may be defined between one or more region portions of the inner casing and the outer casing, the regions being in the optical path Overlapping in the direction. One or more overlapping portion portions may be defined by an outer contour that is within a range between an approximate outermost radius of the overlap region of the inner casing and an inner wall of the radially adjacent shock absorbing sponge; One or more overlapping region portions may also be defined by an inner contour having an inner diameter defining an outer casing ring of the focus adjustment aperture, the inner contour being defined in the casing to allow optical components The string extends through the EMI housing to achieve an outer boundary of the autofocus range of the compact camera module, the outer boundary being formed by coupling and aligning the image sensor module with the compact optical module.

The second volume of sponge compression gap can be defined to at least achieve a predicted depth of sponge compression and can be defined to include an area between at least an inner surface contour and an outer surface contour of the EMI shell sidewall along one or more sections To allow independent movement of the side walls of the outer casing in the direction of the optical path without contact. The second volume sponge compression gap can include at least one sidewall portion of the outer casing that is configured to overlap with a flexible printed circuit (FPC), including a compact camera module of the compact optical module Configure to couple to the FPC. The second volume of sponge compression gap may also include one or more other sidewall portions of the outer casing that are determined to interfere with one or more other obstacles that interfere with the independent movement of the outer casing in the direction of the optical path. Object overlap, and / or second volume sponge compression gap can be external One or more of the inner and outer surfaces of the side walls of the casing overlap completely.

The compact camera module can include a fixed lens that is coupled along the optical path just prior to the image sensor, for example, the lens can be combined with electronic zoom image processing.

Another compact camera module is provided herein that includes a compact optical module coupled to the sensor module, and includes the compact optical module, compact camera module, and/or sense described herein. Any of the sensor module features. Further embodiments include combinations of the features described herein.

Auto focus camera module

A camera module in accordance with embodiments described herein includes an image sensor that converts images in the optical domain to an electronic format, and an optical component string that focuses the scene of interest to the image On the sensor. Embodiments include cameras that are configured to have the ability to accurately capture the details of the scene. The quality of the string of optical components and/or the resolution of the image sensor can be selected based on the ability to accurately capture such detail. The image sensor may contain millions of primitives (image elements), and the optical element string of the autofocus camera module according to some embodiments may include two, three, four, five or more lens.

The position of the at least one movable lens of the string of optical elements is not fixed relative to the position of the image sensor, and thus, the autofocus camera module according to embodiments described herein can modify the object on the image sensor The distance between the focus and the electronic camera. According to an embodiment, the system can be used to determine one or more distances between one or more primary objects and a camera in a scene. The at least one movable lens can be moved according to the determined distance and/or can be moved until one or more of the main objects are focused on the image sensor. The distance between the objects and the camera can range from very close (10 cm or more) to extremely far (unlimited).

Embodiments of the camera are provided herein that provide image quality superior to conventional autofocus and fixed focus cameras. The camera module in accordance with certain embodiments also exhibits a compact size and advantageous power efficiency, as well as an efficient and durable packaging environment that prevents physical shock and electromagnetic interference that are not desired by us.

An electronic camera in accordance with certain embodiments exhibits the advantageous ability to significantly change the field of view. For example, when using a conventional camera, a family photo taken in front of a house may improperly include a trash can at the edge of the scene. The camera according to some embodiments may be adjusted to limit the field of view of the camera to remove the artifact from the captured image. In contrast, a family photo taken on top of a mountain can be improved using a camera in accordance with certain embodiments by adjusting to a wider field of view that captures more of the panorama.

A camera in accordance with certain embodiments exhibits a clear improvement in overall performance by incorporating dynamic field of view features with an autofocus mechanism. In some embodiments, the design of the optical element string of the camera includes a fixed portion and a portion that is movable along the optical axis of the camera by an actuator. In some embodiments, some image processing may be provided by a code embedded in a fixed storage device or a removable storage device on the camera, and/or by using a remote processor, for example, to remove image distortion.

Provided herein are advantageous cameras in accordance with certain embodiments, such photographs The machine integrates all of the above three features into a compact camera module. Such camera modules may be stand-alone camera products, or may be included in fixed electronic products or portable electronic products, and/or in various other environments such as automobiles.

Various embodiments will now be described herein with reference to the drawings. Provided herein are electronic cameras that advantageously utilize an integrated auto focus and optional zoom function. In some embodiments, the auto focus function and the zoom function utilize a combination of advantageous optical element strings and processor-based image processing, and in some embodiments, the auto focus function and the zoom function are included in both cases. The same or similar components.

An alternative method for adding auto focus may involve the step of moving one or more other lenses in the string of optical elements in groups. An autofocus zoom camera based on this principle of operation is described in U.S. Patent Application Serial No. 61/609,293, the disclosure of which is incorporated herein by reference. The movable lens group can include more than one movable lens, and can include four lenses as described in the '293 application, and various numbers of stops and apertures, which are based on forming a movable lens group. Depending on the particular number and geometry of one or more lenses.

The optical element string according to some embodiments includes auto focus and, as the case may be, a zoom function, the optical element string comprising two general elements, namely a movable lens group and a fixed lens group. 1 illustrates an autofocus zoom camera module including: a first movable lens group (eg, L1 to L4) including one or more movable movable along an optical axis of the camera a lens; and a fixed lens group (eg, L5) including at least one lens that has been fixed in place. One or more moving lenses include the example in Figure 1 The four lenses L1 to L4 are closest to the scene, and the fixed lens L5 is closest to the image sensor.

In general, the moving lens group performs the function of changing the focal length of the camera, and in embodiments that also include a zoom camera module, at least one of the fixed lenses is configured to perform an optional electronic zoom function, the function being an optical device The PSF function matches the imager and compensates for field curvature induced by the moving lens group. The fixed lens that performs this function in the particular embodiment described in the '293 application is the lens closest to the image sensor. At least one moving lens is positioned at an appropriate distance along the optical axis to achieve a desired focal length, while at least one of the fixed lenses is positioned such that the focal length of the lens matches the distance between the lens and the imager.

The processor programmed by the embedded code can collect information from the elements in the image sensor and change the associated electronic file (in some cases automatically, and in other cases based on the user's input) Zooming and as many other image processing enhancements as possible are provided, as described in the patents and the patent applications of the present application. For example, the degree of zoom can be adjusted. The processor can also be programmed to attempt to correct for distortion and other artifacts produced by the optical component string in a predictable manner. Image processing features can be implemented in hardware or software. In some embodiments, the features are placed earlier in the image processing pipeline, such as RTL (resistive transistor logic) codes embedded in the image sensor, while in other embodiments, the features are It is placed on an external DSP (digital signal processor) or fully embedded in the software of the processor, such as a baseband chip in a mobile phone.

According to the example illustrated in Figure 1, the autofocus zoom camera is Examples may have a focal length in the range of 10 cm to 9 m in some embodiments, the focal length is typically 15 cm to 5 m, and preferably 20 cm to 3 m (excluding hyperfocal length), and the zoom function may range from 0.5 times to Between 5 times, typically 1 to 4 times, and in some embodiments more specifically between 1 and 3 times. According to some embodiments, the notable feature of the final electronic file generated by the advantageous camera module is the file size and the effective resolution of the image contained in the file, in some embodiments, regardless of the focal length and zoom settings. It can be almost constant.

A variable optical camera according to some embodiments includes a camera, wherein the optical element strings are divided into groups, the functions and positions of some of the groups are fixed, and the functions and positions of other groups in the groups are variable . In this way, more advanced control of the string of optical components can be accomplished. For example, the field of view of the camera can be changed by moving two specific lens groups along the optical axis. Since the resolution of the camera can be substantially fixed by other parameters in some embodiments, limiting the field of view allows for efficient magnification of the objects in the scene. Therefore, such a camera is referred to as a zoom camera or an auto focus zoom camera.

Auto focus zoom camera module

A number of different embodiments include an advantageous autofocus zoom camera, and/or an autofocus zoom camera component or subset of features. In one embodiment, the auto focus and zoom functions are accomplished by a combination of: (i) a lens configured to incorporate a zoom algorithm to provide electronic zoom, and the lens is fixed in position relative to the image sensor (ii) a single lens that is movable along the optical axis of the camera, or alternatively two or more moving lenses, or a combination of a moving lens and two or more fixed lenses; (iii) The zoom algorithm can program the image processing component, which changes the electronic form of the image. In an alternative embodiment, the movable lens element is provided with a zoom. In other embodiments, an autofocus camera module that does not include a zoom element is provided, wherein an exemplary lens string for an auto focus zoom camera module described herein can be used in an auto focus camera module (ie, without zooming) In, or the lens string can be simplified, especially for lens L5. Related embodiments and alternative features that are particularly relevant to the zoom feature of this embodiment are available in U.S. Patent No. RE42,898 and U.S. Published Patent Application No. US2009/0115885 and No. US2009/0225171. The description is incorporated herein by reference. In another embodiment, the zoom function is provided by one or more moving lenses. A single lens that can be moved in an electronic zoom embodiment can be a lens that is located in the middle of the string of optical elements and that is movable to provide an autofocus function. In other embodiments, more than one single lens is movable, and in other embodiments includes more than one fixed lens.

In various embodiments, certain other optical elements are included in various combinations, such as one or more of the stops, apertures, and/or infrared filters that are not specifically mentioned in each embodiment. The infrared filter can be included between the image sensor and the last lens of the string of optical elements, or elsewhere along the optical path. One or more apertures may be secured to the lens surface or separately to the camera module housing or to a lens barrel housing or other securing element of the camera module or camera device. One or more apertures, such as a movable aperture, can be moved over the movable lens or moved with the movable lens. In some embodiments, the aperture for the movable lens moves when positioned on or near the surface of the movable lens, or the aperture can be fixed relative to the movable lens, So that the aperture and the movable lens can be moved together by using an actuator. In other embodiments, the aperture for the movable lens can be fixed relative to the image sensor.

An electronic camera incorporating a fixed lens of the type described can provide dynamic changes to the field of view, in other words, zoom, by imaging trimming. Although trimming typically reduces image quality due to scene information being discarded, in some embodiments the fidelity of the cropped image is preserved because the image center has been magnified by this fixed lens. This fixed lens is used in some embodiments to produce a dynamic field of view camera that will produce image distortion similar to barrel distortion unless the camera is calibrated. The degree of distortion is fixed and controlled by the lens design. This feature makes it relatively efficient to correct and remove distortion and other predictable artifacts by configuring image data in image processing operations, which are performed by the onboard processor, which is located in the camera module itself. In or outside the camera module but within the device (such as a camera phone, or a portable camera, or a tablet, or a laptop, or other device including the camera module as a device component), or coupled by an entity It is either electrically coupled or coupled by a wireless signal to other processors of the device, and the processor is programmed with an algorithm designed for a particular use. A plurality of embodiments of a camera having a zoom based on the principle of operation are disclosed in U.S. Patent No. RE42,898, issued U.S. Patent Application Serial Nos. Nos. Nos. Nos. Nos. Nos. Nos. Nos. 2011. It is described in U.S. Patent Application Serial No. 61/609,293, the disclosure of which is incorporated herein by reference. The algorithm can be stored on the camera module or stored in the camera module Externally but within the electronic device with the camera module as an internal component, or stored in the cloud, or otherwise stored in a manner accessible by a processor utilized by the camera module, the processor configured to algorithmize Applied to image data, for example, raw data from an image sensor or image data before processing, which is not stored, transmitted or displayed as permanent image data until the processor applies an algorithm to the data to cause the image It can be displayed by zooming in on the appearance.

For physical reasons, the fixed lens involved in producing a zoom in conjunction with the algorithm is advantageously placed in some embodiments as the lens closest to the image sensor. An alternative method for increasing autofocus may involve the step of moving one or more other lenses in the string of optical elements in groups. An autofocus zoom camera based on this principle of operation is described in U.S. Patent Application Serial No. 61/609,293, the disclosure of which is incorporated herein by reference. The movable lens group can include more than one movable lens, and can include four lenses as described in the '293 application, and various numbers of stops and apertures, which are based on forming a movable lens group. Depending on the particular number and geometry of one or more lenses. In an embodiment in which only a single lens is included in the movable lens group, such as the intermediate lens L3, it is movable relative to the two pairs of fixed lenses L1 to L2 and L4 to L5 on the respective sides of L3, as shown in FIGS. 2A to 2B. Illustrated in the illustrations, the embodiments have the advantage of being of lower mass and therefore the relatively low force involved in moving the lens, and even have the surprising further advantage that actuators with a smaller range of displacement can be used .

Another feature of the autofocus zoom camera module in accordance with some embodiments relates to a fixed focus lens of the type described above by moving the optics of certain embodiments Autofocusing in combination with zooming is achieved by an intermediate lens in the component string, such as L3 in an optical component string of five lenses, or L4 in an optical component string having seven lenses, or three lenses L2 in the string of optical components. In other embodiments, the movable lens is offset somewhere between the at least one fixed lens and the remaining lenses of the string of optical elements, for example, L2 or L4 in the embodiment of the five lenses, or in seven lenses In the examples, L2, L3, L5 or L6. Other embodiments still involve a movable lens at one or both ends of the string of optical elements.

Referring now to FIGS. 2A-2B, another example of an autofocus camera module is schematically illustrated in which the intermediate lens L3 is movable between two pairs of fixed lenses L1 to L2 and L4 to L5. This embodiment is described in U.S. Patent Application Serial No. 61/643,331, the disclosure of which is incorporated herein by reference. In an embodiment in which only a single lens is included in the movable lens group, such as the intermediate lens L3, it is movable with respect to two pairs of fixed lenses L1 to L2 and L4 to L5 respectively located on respective sides of the intermediate lens L3, the embodiments having mass The advantage of being relatively small and therefore the force involved in moving the lens is relatively low. The movable single lens embodiment also has the surprising further advantage that an actuator with a smaller range of displacement can be used. By moving the intermediate lens in the string of optical elements in some embodiments, for example, L3 in a string of optical elements comprising five lenses, or L4 in a string of optical elements having seven lenses, or having three lenses L2 in the string of optical components. In other embodiments, the movable lens is offset somewhere between the at least one fixed lens and the remaining lenses of the string of optical elements, for example, L2 or L4 in the embodiment of the five lenses, or in the implementation of seven lenses In the example, L2, L3, L5 or L6. Other embodiments still involve one or both of the strings of optical components The movable lens at the end.

Contrary to known expectations, it has been found that the intermediate lens in the example of Figure 2A moves relatively short distances, typically about 100 [mu]m, to achieve a similar focus range for conventional autofocus cameras. This makes it possible to use novel type actuators such as MEMS actuators to move the lens and to obtain a number of resulting benefits resulting from the inherent characteristics of the devices. Among the many benefits of this design are small size, low power consumption, low noise, high speed and high motion accuracy and other improvements.

2B also schematically illustrates a cross-section through an autofocus zoom camera in accordance with some embodiments, the camera utilizing an assembly having a lens train that is fabricated as a pre-aligned integral component. The image sensor 201 is on the substrate 202, and the sleeve 203 is attached to the substrate 202. In the example shown in Figure 2B, the sleeve has threads 204. The holder 205 containing the lens string 206 has a mating thread 207. The integral lens train is moved relative to the sleeve rotation holder, in this exemplary embodiment, to move the integral lens string along the camera optical axis 208, thereby allowing the focal length to be set. Alternatives to mating threads 204 and mating threads 207 include mating grooves and grooves having various patterns to allow for continuous or intermittent set of focal lengths, such as using a series of notches, spring-elastic drive pins or levers, or plastic material or The focal length is used to couple the lens string holder 205 to the sleeve 204, which allows the distance between the image sensor 201 and one or more fixed lenses of the lens train 206 to be set.

Precision alignment of the string of optical elements in accordance with certain embodiments allows images to be transmitted with high fidelity. Some embodiments relate to the tilting, centering, and relative orientation of various components of the string of optical elements (primarily lenses) to a certain degree of accuracy Rotate. Although in some embodiments active alignment techniques may be used to achieve extremely precise alignment of the lenses with each other, in some embodiments passive methods are used and, where possible, passive methods are used, as this method The assembly speed is high and the cost is low. In some embodiments of the autofocus zoom module, all but one of the lens string junctions accommodates a suitable passive alignment tolerance.

In another embodiment, the autofocus camera can have an entire string of optical elements that move during autofocus. Moreover, an advantageous camera including an optical element string having both a movable element and a fixed element according to embodiments described herein may be subjected to numerous other examples in addition to the examples shown in FIGS. 1 and 2A through 2B. Configuration. For example, an example of an autofocus camera module schematically illustrated in FIG. 3 includes a MEMS actuator coupled to a lens L1 that is furthest from the image sensor or coupled to an optical component string. Image side. Including L1 to L4, L1 to L3, L1 to L2 or even only one lens L1 (or L3 as shown in Figures 2A to 2B, or in some embodiments, or only three in the optical element string) In other embodiments of four or four lenses, or in other embodiments including six or seven lenses, L2, or L4, or even L5) lens barrels can be positioned under this MEMS actuator It can be moved by using different camera module embodiments with different lens numbers and/or different lens configurations. The MEMS actuator can be electrically coupled to the lens barrel lens L1 closest to the image by two methods: using one or more conductive traces in the camera module holder and the lens The outer side of the lens barrel continues to the flexible printed circuit, the flexible printed circuit is coupled to the sensor end of the camera module; or extends using a flexible printed circuit that is electrically coupled to the image end of the camera module Actuator contact point pad At the same time, the sensor end is still connected to the FPC in the second position. The string of optical elements in the advantageous autofocus zoom cameras has one or more fixed parts and one or more moving parts. In some embodiments, the camera exhibits a centered and tilted alignment of the moving lens and the fixed lens with a different accuracy than conventional fixed focus or autofocus cameras.

Camera modules in accordance with various embodiments are schematically illustrated herein by way of example physical, electronic, and optical architecture, and in other patent applications of the same assignee, or in other patents. For example, other camera module embodiments and camera module features and components that may be included in alternative embodiments are described in the following patents and patent applications: U.S. Patent Nos. 7,224,056, 7,683,468, 7,936,062 No. 7,935,568, 7,927,070, 7,858,445, 7,807,508, 7,569,424, 7,449,779, 7,443,597, 7,768,574, 7,593,636, 7,566,853, 8,005,268, 8,014,662, Nos. 8,090,252, 8,004,780, 8,119,516, 7,920,163, 7,747,155, 7,368,695, 7,095,054, 6,888,168, 6,583,444 and 5,882,221, and US Published Patent Application No. 2012/ 0063761, 2011/0317013, 2011/0255182, 2011/0274423, 2010/0053407, 2009/0212381, 2009/0023249, 2008/0296, 717, 2008/ 0099907, 2008/0099900, 2008/0029879, 2007/0190747, 2007/0190691 No. 2007/0145564, 2007/0138644, 2007/0096312, 2007/0096311, 2007/0096295, 2005/0095835, 2005/0087861, 2005/0085016, No. 2005/0082654, No. 2005/0082653, No. 2005/0067688, and U.S. Patent Application Serial No. 61/609,293, and PCT Application Nos. PCT/US12/24018 and PCT/US12/25758, The patents and patent applications are hereby incorporated by reference in their entirety.

MEMS actuator

The MEMS actuator is coupled to L3 in the examples of FIGS. 2A-2B (and to the movable lens groups L1 to L4 in the example of FIG. 1) to provide autofocus capability in some embodiments. . In other embodiments, a voice coil motor (VCM) or piezoelectric actuator can be used to provide mobility.

Suitable MEMS actuators are described in the U.S. Patent Application Serial No. 61/622,480, the disclosure of which is incorporated herein by reference. Another MEMS actuator having a slightly different design is described in U.S. PCT Application No. PCT/US12/24018. Both of these U.S. patent applications are hereby incorporated by reference herein in their entirety in their entireties in the the the the the the the the the the The actuators may be made of tantalum or substantially of polymeric material and have a stroke of about 100 μm. The actuators also exhibit a number of other beneficial properties that are imparted by the autofocus zoom camera module of the type described herein. These features include: very low power consumption, fast and accurate actuation, low noise, negligible particulate contamination Dyeing and low cost.

A MEMS actuator in accordance with certain embodiments may generally be considered a unidirectional device, without any consideration of any centering or tilt alignment movement attributable to the actuator element, even though MEMS according to certain embodiments The actuator provides a favorable alignment in three dimensions. In other words, a MEMS actuator in accordance with certain embodiments has a rest position, and the actuator can be driven in one dimension from the rest position, ie, when used to perform auto focus features. This has the benefit of assembly of the autofocus camera module as this allows the entire lens string or a large portion of the lens string to be assembled as a pre-aligned integral component. Then, in the subsequent assembly and calibration steps, the lens string can be processed in a similar or identical manner to the lens string of the fixed focus camera, that is, by inserting the holder and fixing the lens string to the image. Set the focal length in the sleeve on the sensor. In some embodiments, the holder and the sleeve are coupled by threads.

Camera module with protective cover

In some embodiments, an optical surface can be added to the image sensor as a single component. This optical surface can act as a cover made of clear glass or polymer to prevent dust or other contaminants from reaching the active surface of the sensor while allowing visible light to pass through and reach the sensor. The optical surface can also act as an infrared (IR) filter, especially for helium sensors. The IR absorbing material can be used for the cover or the IR coating can be applied to a glass or polymer or other optional transparent protective cover. The optical surface may also be formed to provide optical power, such as the shape of the replica lens L1, as shown in the examples of FIGS. 4A-4B, in which case the IR filter may also be disposed in the sensor and lens L1. Between (not shown, but please refer to US Patent Application Serial No. 13/445,857). The process of forming the splitting elements on the wafer stage prior to cutting is described briefly below, and is described in detail in the '857 application.

The splitting element is illustrated in Figures 4A-4B, which includes an active image sensor that is protected from contamination by, for example, using wafer level hybrid optics. This method has the additional advantage of the Z-total physical height of the camera module, that is, the total Z-to-body height along the optical path perpendicular to the sensor plane can be combined with the camera module components by the hybrid optical device And it can be reduced.

The active image area on the image sensor is protected on the crystal stage prior to cutting or splitting the image sensor wafer to discrete grains according to certain embodiments. This protection of the active image area is achieved in some embodiments by attaching a glass wafer such as a blue glass or IR coated glass or other material such as a polymer or to visible light absorption and absorption or Other materials that block IR light. Further improved functionality of this glass protection can be achieved by the addition of wafer level optics components, as shown in the examples of Figures 4A-4B.

FIG. 4A schematically illustrates an exemplary camera module including wire bonds coupled to camera module components. FIG. 4B schematically illustrates an exemplary camera module that includes flip chip. The exemplary camera module schematically illustrated in FIG. 4B may use a thermal compression or thermal ultrasonic process. Such processes are described in more detail in the exemplary embodiments of U.S. Patent Application Serial No. 13/445,857, the disclosure of which is incorporated herein by reference.

Autofocus and optional zoom camera mode in accordance with various embodiments In the group, processor-based components such as distortion correction components, chromatic aberration correction components, brightness enhancement components, color enhancement components and/or luminance or color contrast enhancement components, blur correction components, and/or extended depth of field; EDOF) components and/or extended dynamic range (EDR) components or high dynamic range (HDR) components.

Another example is schematically illustrated in Figures 5A and 5B, and is also detailed in U.S. Patent Application Serial No. 13/445,857, the disclosure of which is incorporated herein by reference.

5A-5B include examples of structural elements of a camera module in accordance with certain embodiments, which are illustrated in cross-sectional and plan views, respectively. The flat substrate forms the base of the camera module of FIGS. 5A to 5B. The purpose of this substrate is to provide structural support, and thus, suitable materials include metals (e.g., titanium), ceramics (e.g., alumina), and rigid polymers similar to phenolic resins. The substrate material can be molded, or one or more other methods can be used to fabricate the array of vias in the substrate material. In some embodiments, the vias will eventually be completely or partially filled with a conductive material as part of the structure that provides the interface to the camera module. Since the substrate contributes to the full height of the camera module, the substrate is extremely thin, but the rigidity is sufficient. The mechanical properties of the substrate material are carefully selected in certain embodiments, including the modulus and fracture toughness of the substrate material. The thickness of the substrate can be about 200 microns, and the substrate can have a thickness ranging between about 50 microns and 400 microns.

In the exemplary embodiment illustrated in FIGS. 5A-5B, the image sensor and the cover glass are roughly coupled on a central portion of the substrate. The image sensor can be attached to the substrate by the following method: bonding with an adhesive or magnetic attachment Alternatively, or using one or more clips or complementary sliding or twisting fastening elements, or using a mating bond using electrostatic or thermal/compression shrinkage or expansion fit, or using other means. In this example, the flexible circuit is attached to a substantial portion of the remainder of the substrate. The attachment method can be adhesive bonding or one of the above methods or other methods. The flexible circuit may, in certain embodiments, include a thin conductive trace from copper or other metal or conductive polymerization on the surface of a soft polymeric material such as polyimide and/or embedded in the soft polymeric material. Made of objects. Apertures or other features can be used to provide access to the copper traces for electrical connection.

As illustrated by the examples in Figures 5A-5B, the flexible circuit has an aperture that is smaller than the planar area of the image sensor. This allows the flexible circuit to be placed over the image sensor such that the bond pads on the image sensor are covered by the flexible circuit. In this manner, electrical coupling can be made between the bond pads on the image sensor and the appropriate land on the flexible circuit. A variety of alternative methods and materials are used to achieve such coupling in accordance with various embodiments, examples of which include conductive adhesives, thermocompression bonding, welded joints, and ultrasonic welding.

The image sensor is electrically connected or electrically connectable to the flexible circuit such that tracking on the flexible circuit in accordance with certain embodiments can be used to route the electrical connection to other locations, which can include active Components and / or passive components. Active and/or passive components can be attached to and interconnected to flexible circuits in various embodiments using established methods and techniques. In Figures 5A through 5B, the camera module includes three (3) passive components, including ten (10) bond pads and eight (8) through-hole solder interconnects, but the number and The position and shape and dimensions are provided by way of illustration and there may be numerous variations.

External electrical connections to the camera module, in some embodiments, involve electrical connections to the appropriate land on the flexible circuit. By design, the land is advantageously positioned on the through holes in the substrate. Although FIGS. 5A-5B illustrate copper posts for the electrical interconnects, the electrical interconnects can be fabricated from a variety of materials and structures including solder posts, stacked bolt bumps. , conductive adhesive and / or deep hole wire bonding. Other embodiments include mechanical structures such as spring elements and pogo pins. When a solder column is used and the solder is reflowed, the peripheral shape will become hemispherical such that the external interface of the camera module is similar to a semiconductor package interconnect similar to a ball grid array. The exemplary structure illustrated in Figures 5A-5B includes a planar flexible printed circuit, although in other embodiments, the flexible printed circuit has one or more slight bends, and in other embodiments, The FPC is bent into a U shape.

5A-5B schematically illustrate an image sensor disposed in a recess in the substrate such that the image sensor bond pad is at the same level as the bottom surface of the flexible circuit While in other embodiments, the bond pads can be biased. Some detail adjustments to this alignment may account for the thickness of the bonding medium used to attach and attach the flexible circuit to the bond pads.

Camera module overview example

6A-6C illustrate examples of camera modules in an exploded view, a top view, and a side view, respectively, including a module that may be included with an image sensor and an optical component string component in an illustrative overview example. Some components. Other embodiments illustrated in FIG. 6A include an EMI mask or EMI enclosure 601, Light leakage baffle 602, lens barrel carrier 603, actuator and lens barrel assembly 604, blue glass or other IR filter element (particularly for 矽 sensor embodiments) 605, sensor element 606 (Illustrated as being coupled to a flexible printed circuit FPC having a busbar connector), and a bottom sponge 607.

The dimensions of each side of the module may be less than 10 mm, and in some embodiments the dimensions of each side are less than 9 mm, and in the X and Y directions (the plane of the image sensor, perpendicular to the optical path), some embodiments are The size without EMI tape may be 8.6 mm or even 8.5 mm, and in the Z direction (parallel to the optical path, perpendicular to the sensor plane), some embodiments may be less than 8 mm or even less than 7 mm, and In some embodiments less than 6.5 mm or 6.4 mm, for example, 6.315 mm in the case of EMI tape, or less than 6.3 mm in the case of no EMI tape, for example, 6.215 mm.

Most of the elements 601 to 607 are described hereinafter with reference to one or more of the figures of FIGS. 7 to 14B, and thus the elements are here only briefly referred to FIGS. 6A to 6C. Overview. The light leakage baffle 602 is illustrated in the example of FIG. 6A as having an outer baffle diameter that substantially matches the diameter of the focus adjustment aperture 608 defined at the end of the camera module object. The inner baffle diameter is large enough to allow the image to be captured by the camera with some degree of exposure through the baffle, but the diameter is small enough to block improper light. In another embodiment, the outer diameter of the light leakage baffle 602 can be larger than the aperture 608, but the EMI cover material that overlaps the baffle 602 can be much thinner than the rest of the EMI case 601, or an EMI cover that overlaps the baffle. The shell material may be sufficiently convex in either case to allow movement of the lens assembly, for example, the lens assembly as shown in the example of Figure 1 or Figure 3 moves to the end of the range of the lens assembly. According to some The EMI masking characteristic of the light leakage baffle 602 of the embodiment provides supplemental EMI housing at the focus adjustment aperture 608.

The IR filter 605 is illustrated in Figure 6A as a separate component that mates with the sensor, or is coupled to the sensor, or is disposed on the sensor, or is spaced slightly from the sensor, but as above The IR filter 605 can also be formed at the wafer level together with the sensor and coupled to the sensor to form a sidewall of the cavity with the cavity, and at the same time, the lens closest to the image sensor (eg, L5) may also be formed at the wafer level, as appropriate, with the sensor and IR filter of the above embodiment.

The sponge 607 is illustrated as an L-shape in the example of FIG. 6A, which may be U-shaped, and may be four sides, and the fifth side may have a space to allow the FPC to protrude only through the space or in the space Prominent below, for example, substantially coplanar with the top of the bottom sponge in certain embodiments including the example of Figure 6A. Conductive trace 609A and conductive trace 609B are also illustrated as being disposed from the bottom of the bracket to the top of the bracket, the conductive traces being connectable to the FPC at the bottom of the bracket and to the actuator pad at the top of the bracket The sheet is used to energize the actuator and control the actuator to move the lens for auto focus.

Electromagnetic interference (ELECTROMAGNETIC INTERFERENCE; EMI) enclosure

FIG. 7 schematically illustrates an exploded view of an example of an autofocus camera module including an EMI housing 701 that includes, for example, a lens and MEMS actuator assembly 704, in accordance with some embodiments. Optical component and electronic component, the assembly includes, for example, an optical component string And a MEMS actuator comprising a plurality of lenses. The EMI enclosure 701 acts as an electromagnetic interference (EMI) mask for the components contained within the enclosure. In one embodiment, the EMI enclosure is made of a conductive or semiconductive material or comprises a conductive or semiconductive layer on a polymer frame or other insulated durable frame. The EMI housing 701 of the exemplary autofocus camera module of FIG. 7 also advantageously allows the enclosed mirror barrel or at least one or more lenses located at the end of the optical element string to move through the camera module object The focus at the end adjusts the aperture.

Light leakage baffle with EMI function

The light leakage shutter 702 is coupled to the outer side of the casing 701 in this exemplary embodiment, for example, by using an adhesive such as a conductive paste. The light leakage baffle may have an EMI characteristic portion 702A that overlaps the aperture 708 in a Z direction parallel to the optical path of the camera module. The aperture 702B defined in the light leakage baffle is surrounded by the EMI portion 702A, while the material of the EMI enclosure 701 overlaps the outer side portion 703C with or without EMI characteristics. As illustrated by the example in FIG. 6A, the outer portion 703C is optional, particularly when using another method: the method is used to couple the light leakage baffle 602 and the light leakage baffle 702 in place along the Z axis. Allowing one or more movable lens or lens barrels of the optical element string to move outwardly in a focusing movement such as auto focus search while causing the one or more movable lenses or lens barrels to pass through the XY plane Aligning to allow images from the camera module to have the desired exposure and sharpness, such as a light leakage baffle 602, a light leakage baffle 702 The end of the one or more movable lenses or lens barrels that are closest to the object.

The light leakage baffle 702 according to some embodiments is schematically illustrated in an exploded view of FIG. 7 coupled to the top of the EMI enclosure, for example, by using, for example, conductive glue or one or more passive pairs A quasi-clip or an adhesive of the combination of the two is coupled. The light leakage baffle may comprise a layer of electrically conductive material such as carbon feathers, or 2D carbon/graphite, or a thin conductive polymer, or a metal, or a combination of an insulator and a conductive layer, or the light leakage baffle 702 may be made of the same material as the EMI casing. However, the light leakage shutter 702 may be convex to allow the lens barrel to move, or the light leakage shutter 702 may be separately attached by an adhesive or a clip. The light leakage baffle 702 can define a camera aperture, or can limit or surround the camera module aperture, or prevent unwanted diffused light from entering or exiting the camera module via the first aperture while transmitting the desired exposure.

Figure 8 illustrates a camera module of Figure 7 with an EMI housing that is not exploded out of the lens and MEMS actuator assembly; and/or illustrated coupled to the lens and MEMS actuator total Into the EMI cover. The EMI enclosure 701 is illustrated in FIG. 8 as being spaced apart from the light leakage baffle 802 (for illustration) and the light leakage baffle 802 can include carbon feathers or other conductive materials having EMI mask characteristics.

FIG. 9 illustrates the camera module of FIGS. 7-8, which includes an EMI housing 901 to which the light leakage shutter 902 is attached. The light leakage shutter 902 of Figure 9 defines an aperture for the camera module in some embodiments, and at least shrinks in other embodiments. The amount of open area left by the larger focus adjustment aperture 608 (see FIG. 6A) of the EMI housing 901 is reduced to reduce the area around the internal camera module electronics that is not protected by the EMI mask material.

Conductive trace actuator control

10A and 10B schematically illustrate top and bottom views of an EMI enclosure 1001 for an autofocus camera module, in accordance with some embodiments. The EMI enclosure 1001 in Figures 10A through 10B can have an insulative frame, such as a durable polymer or plastic material, with an EMI coating 1002 on the outside of the frame. Alternatively, the housing 1001 may have an insulating layer on the conductive frame or semi-conductive frame, or the housing 1001 may be substantially conductive or semi-conductive, but the trace 1003 may be provided by providing conductive traces on the insulated traces or by An insulating tube is provided within the structural member of the frame 1004 or bracket 1004 within the housing 1001 to be electrically insulated from the conductive frame.

The EMI enclosure 1001 in the example illustrated in FIG. 10A has an EMI coating 1002 on the outer surface. Figure 10B illustrates the conductive traces provided along the inner surface of the EMI enclosure 1001. According to some embodiments, the conductive traces 1003 are configured to connect the electronic actuator elements of the camera module to an electronic shim or printed circuit. In this example, conductive trace 1003 is electrically insulated from EMI coating material 1002 because, in this embodiment, the material of enclosure component 1001 is non-conductive. Trace 1003 can be coupled to a pair of actuator control pads at the article end of the assembled camera module. At the sensor end of the camera module, conductive traces can be connected to the FPC contact pad. The internal structure 1004 of the casing 1001 can be built-in. Or formed with the outer casing 1001, or may be a separate bracket component such as the bracket 603 illustrated in the example of FIG. 6A, for example, microscopic integrated processing technology provided by Matsushita Electric Industrial Co., Ltd. may be used. ; MIPTEC) bracket, or another molded frame with a pair of precision electrical traces.

11A-11B schematically illustrate perspective and exploded views of an autofocus camera module including a lens barrel 1104, or a sensor, in accordance with some embodiments. Element 1107 is coupled and aligned, or configured to couple with sensor element 1107 (eg, as illustrated by the example of FIG. 2B). The lens barrel 1104 in this embodiment is at least partially enclosed within a bracket 1101 having conductive traces 1102 thereon. The conductive traces 1102 in this example travel along the outside of the cradle 1101, which can be packaged with a protective EMI protective cover (not shown in Figures 11A-1B). Conductive trace 1102 may also travel along the sensor element or sensor element housing, or along the outside of lens barrel 1104, or through a sensor housing or sensor, in other embodiments (eg, The use of thermal vias or through vias or conductive vias or through vias as described in U.S. Patent Application Serial No. 20112030013 or No. 20080157323, the disclosure of which is incorporated herein by reference. According to some embodiments, the conductive traces 1102 connect the contact pad 1103 of the electronic actuator element 1105 to the contact pad 1106 of the flexible printed circuit 1107 or printed circuit board 1107.

Sponge absorption system

Figure 12 is a schematic illustration of an exploded view of a cushion or absorbent sponge camera module including one or more sponges 1210 disposed between the casings 1201 (e.g., four sponges 1210 as illustrated) The module may include, for example, an EMI housing such as described above with reference to Figures 6A through 11, and an autofocus optical element of MEMS, or other movable lens actuated autofocus camera module 1205. The housing 1201 is configured to move independently of the internal camera module 1205 in response to external shocks that are absorbed by compression of one or more sponges 1210 in the sponge 1210 and are therefore not passed to the internal module 1205. In certain embodiments, a sponge 1210 is provided at each of the four sides of the EMI enclosure 1201. In some embodiments, the sponge 1210 advantageously does not overlap the inner module 1205 in the direction of the optical path or in the Z direction, and thus does not increase the Z-direction full height of the optical module 1205, but can be used to absorb the Z in the optical path. shock.

The sponge 1210 is each illustrated in the example of Fig. 12 as a cube having six rectangular faces or a hexahedron having three pairs of parallel faces. However, one or more of the sponges 1210 may have different shapes, such as having more or less than six faces, and/or having one or more curved and/or stepped sides. For example, one or more of the sponges 1210 may include a cutout portion for a passive element or an active element, such as a gyroscope, accelerometer, or orientation sensor, or for use with a face or other item. A hardware acceleration component for image analysis or image processing that detects, tracks, and/or identifies, or the cutout portion is used to accommodate autofocus digital photography with any regular or irregular size or shape The machine module component, or the passive alignment feature or the active alignment feature of the camera module. According to some embodiments, the sponge may be shaped to conform to the irregular inner surface shape of the casing 1201, for example, in which case the camera module housing 1201 is shaped to accommodate other components in the narrow embedded device .

A plurality of sponges can be used on each of the one or more sides, and the sponges may or may not overlap in either direction. For example, conductive traces or thinner batteries or other electrical components that connect printed circuits, image sensors, and/or processors to MEMS actuator contact pads can be placed in a pair of sponge halves or portions of sponges. between.

Another optional sponge 1211 can be included at the distal end of the camera module, adjacent to the image sensor but opposite the active image sensor plane of the optical device of the optical module 1205. Camera module 1205 can be coupled at the sensor end to a flexible printed circuit FPC in accordance with some embodiments, and optional bottom sponge 1211 can buffer the camera module on either side of the FPC. The bottom sponge 1211 is advantageously thinner or completely excludes the bottom sponge 1211 to maintain a thin profile of the camera module, while the XY-facing sponge 1210 and the cover 1201 are shock-absorbing and arranged relative to the optical module 1205 (see below) Reference is now made to the more detailed description of Figures 14A through 14C) still sufficient to adequately protect the camera module from Z-direction vibrations or vibrations, such as drops or other applications that may be applied along the optical axis or Z-axis of the camera module. Unexpected force. In another alternative embodiment, the sponge can be included at various locations along the optical path, for example, between the lens elements, and/or the light leakage baffle can include a sponge layer and an EMI coating or EMI layer, The EMI coating or EMI layer includes an aperture such that image light is unobstructed on the way to the image sensor.

A sponge or other soft material attached to the inside of the EMI casing 1201 attached to the camera module absorbs vibration and vibration from the external environment in all three spatial directions. Alternatively, a soft or spongy material may be provided in one or more of the side walls of the casing 1201 or between two elements or materials of the casing 1201, such as between the EMI element and the insulating element of the casing 1201. Providing, or the insulating element itself may comprise a soft or sponge-like material to prevent or inhibit vibration or vibration, while also allowing one or more conductive traces to travel along the casing without being shorted by any EMI masking material. . The use of a sponge or soft material attached between the inside of the EMI housing and the camera module 1205 can advantageously prevent one or more components from malfunctioning due to the force of impacting the module housing 1201 from the external environment.

13A-13B schematically illustrate an assembled view and a partially exploded view, respectively, of a camera module having a cushion or absorbent sponge, in accordance with some embodiments. External EMI enclosure (not shown in Figures 13A-13B, but please refer to EMI mask 1201 in Figure 12A, which is coupled or uncoupled to a light leakage barrier such as Figure 9) It can be assembled to package the camera module as shown in the assembled view in Figure 13A to protect the camera module from physical shock and vibration, as well as from electromagnetic interference, dust and fingerprints.

Figure 14A schematically illustrates a cross-sectional view of an x-y-z three-way compression absorbing sponge camera module in accordance with some embodiments. sponge The 1402 is just inside the EMI mask 1401. There may be four sponges having a sponge at each of the four planar sides of the exemplary camera module of Figure 14A, including the left and right sides of the inner module 1404 in the cross-sectional view of Figure 14A. Two sponges 1402, and the two sponges overlap and are thinner in the horizontal dimension X or Y direction. In the cross-sectional view of Fig. 14A, the thinner portion of the sponge is perpendicular to the Z-direction optical axis of the camera module, while the sponge 1402 in this example is longer in the other two spatial dimensions. A sponge 1402 is disposed on either side of the internal optical device and the electronic device of the camera module of FIG. 14A. There may be different numbers of sponges (including three or two or one), or there may be one or two L-shaped sponges that protect each of the two sides, or a sponge with three or four sides, such as U, may be used. Shaped sponge or square sponge. In other embodiments, the bottom sponge 1403 can have a minimum thickness. In the embodiments illustrated in Figures 14A, 14B and 14C, Z-direction vibrations and vibrations are advantageously absorbed without increasing the Z-height thick sponge. In some embodiments, the improper Z-direction height is not increased due to the thickness of the bottom sponge 1403. Due to the advantageous design of the side sponge 1402, absorbing Z-direction vibration and Z-direction vibration, the side sponges 1402 are compressed to absorb vibrations, EMI hoods disposed within the sponge material between the EMI casing 1401 and the internal components 1404 of the camera module. The housing and the internal components are located within the camera module.

FIG. 14B schematically illustrates an absorbent sponge camera module according to an embodiment. The module has a feature of a sponge Z-direction compression gap 1405A and a sponge Z-direction compression gap 1405B. 1405A and 1405B are provided in the EMI housing 1401 and the molded carrier 1408 portion that overlaps the EMI housing in the Z direction. There may be one or more other such locations where the casing 1401 overlaps the carriage 1408 in the Z-direction, and one or more of the gaps 1405A, 1405B having a Z-direction depth are also provided at such locations.

At the object end, the aforementioned light leakage baffle (602, 702, 802, 902) has been placed further away from the first lens surface at the object end of the optical element string 1404 to accommodate one or more movable Autofocus lens movement. When one or two sponges 1402 are compressed to absorb the Z-direction vibration, the casing 1401 is movable in the Z direction, and during this compression movement, as long as the Z-direction vibration is not so strong that the Z-direction vibration compresses the sponge 140 in the Z direction. When the sponge compression gap 1405A is exceeded, the casing 1401 does not come into contact with the inner module 1404. The initial sponge Z-direction length 1406 is illustrated in Figure 14B, and according to some embodiments, the initial sponge Z-direction length 1406 is designed to incorporate the gaps 1405A, 1405B to optimize protection elasticity.

The amount of space provided between the last object end surface of the inner module 1404 and the light leakage baffle is determined by the space allocated for the movable lens group to extend to the edge of the auto focus range. Thus, for example, the light leakage baffle may be spaced from the end of the focus range of the camera module by a gap 1405A from the location of the last object end surface of the camera module. This can vary with the design of the camera module. For example, in the design of Figure 2A with a fixed outer lens group G1, the housing with a smaller aperture or light leakage baffle can itself be attached to the lens L1 closest to the object. table The face is only spaced apart by the sponge compression gap 1405, while in other embodiments, such as in the design of Figure 1, the sponge compression gap 1405A can be added to the longest extended position of the L1 surface closest to the object. A variety of gaps can be provided so that the cover 1401 can relatively independently move the sponge compression length 1405 toward the carrier 1408 and/or to the components of the inner module 1404 so that the sponge 1402 can be in the housing 1401 without contacting the bracket 1408 or the internal module. In the case of any part of 1404, it is fully compressed to absorb shock.

In some embodiments, the casing 1401 on the side of the flexible printed circuit coupled to one of the camera modules is shorter than the casing 1401 on the other side. At the bottom of the FPC side housing 1401 is spaced at least a sponge compression gap 1405 from the FPC to accommodate movement of the housing 1401 to the FPC without contacting the FPC. The other three sides of the camera module housing 1401 also have a gap to allow the housing 1401 to move without touching any portion. The cover 1401 can be coupled to one or more clips 1409 of the inner bracket 1408 by defining one or more apertures in the housing 1401 or a cutout portion or segmented cutout from the inner surface of the housing. In some embodiments, one or more clips 1409 are latched or correspond to one or more of the housings 1401 when the housing 1401 is coupled and passively aligned with the bracket 1408 and the inner module 1404. In the case of aperture occlusion, the sponge 1402 is slightly compressed as shown in the examples in Figures 14A through 14C. In FIG. 14B, for example, another clip 1409 can be included in an alternative embodiment, and the clip 1409 can be provided on the back side, for example such that the bracket 1408 has three clips 1409 coupled to the cover. Three apertures in the shell 1401. Each aperture in the housing includes a gap 1405B to receive the housing The relative movement between the 1401 and the bracket 1408, especially the relative movement with the clip 1409.

In other embodiments, the cover 1401 can be shortened at the image end or the sensor end (or at the bottom in FIG. 14B) to allow the cover 1401 to be compressed relative to the printed circuit or sensor substrate or other during sponge compression. The movement of the nearest component obstacle in the Z direction. The cover gap 1405B is as illustrated in FIG. 14B, and the EMI mask cover 1401 is free to move into the gap 1405B as the sponge 1402 is compressed due to the Z-direction shock. Below the gap 1405B, the bracket 1408 (see bracket 603 of FIG. 6A or bracket 1101 of FIG. 11B) may be configured, for example, with a clip 1409 or a curved/tilted protruding portion that is located in contact with The lower portion of the casing at the outer diameter of the camera module below the gap 1405B. Alternatively, the diameter of the camera module below the casing 1401 can be reduced in diameter over the remainder of the movement. The gap 1407 can extend around the entire extent of the XY plane of the casing 1401, or a continuous portion of the casing can have a definition defined in various combinations below, around or across the sensor substrate or FPC through the sensor substrate or FPC More similar gaps are allowed to allow the outer casing 1401 to move while the sponge 1402 is compressing without striking the inner camera module 1404.

Figure 14C schematically illustrates a camera module of Figure 14B after/after Z-direction compression, according to certain embodiments of camera module architectures with advantageous synergy, illustrating when the sponge is free length 1406 is shortened to the shortened compression sponge Z to the length 1407 when the cover 1401 extends into the gap 1405A and the gap 1405B. By overlapping the object end of the internal camera module 1404 or the bracket 1408 with the overlapping cover portion Between 1401 (i.e., gap 1405A) and between clip 1409 and casing 1401 at the top of the clip aperture (i.e., gap 1405B), and possibly at other locations between, for example, the FPC and the bottom of casing 1401 There is a gap 1405A and a gap 1405B, which advantageously prevents the internal module 1404 from being damaged or a performance error due to Z-direction vibration, which is advantageously absorbed by utilizing the in-plane sponge or softness of the sponge 1402. At the same time, the X-direction vibration and the Y-direction vibration are also absorbed by utilizing the sponge and softness and wide area of the same sponge 1402 in the xy plane dimension.

The camera module of Fig. 14C is shown in a compressed state of the two sponges shown on the left and right sides of the inner module 1404. For example, an external shock with a significant component guided through the optical path parallel to the camera module in the Z direction or perpendicular to the optical path of the camera module as shown in FIG. 14C has been utilized by the free length 1406 from Figure 14B. The sponge shortened to the compression length 1407 of Fig. 14C is compressed and absorbed. The outer casing 1401 moves toward the carriage 1408 relative to the carriage 1408 while not contacting the bracket 1408 due to the advantageous design of the camera module schematically illustrated in Figures 14A-14C in accordance with certain embodiments. .

With respect to the passive alignment feature 1409 of the bracket 1408 and the aperture latch shown on the right side of the housing 1401, the housing material defining the top of the passive alignment aperture of Figure 14C has been relative to the bracket 1408 and the clip. The sheet 1409 is moved into the gap 1405B such that the cover 1401 does not come into contact with the carrier 1408 at the clip 1409. During the compression of the camera module after undergoing a Z-direction shock, the cover 1401 is in the camera mode The three sides of the bottom left side 1410B, the right side 1410C, and the back side 1410D have been moved below the bottom layer 1411 of the sensor module, where the sides do not touch any portion.

The bottom side of the fourth side of the camera module in this embodiment is higher than the other three sides so that the flexible printed circuit (FPC) coupled to the image sensor can transmit the digital element. Signals of image data, metadata, commands, and/or power, or may carry other camera module electronic connectors, and during operation, external shock causes the fourth side of the cover 1401 to be relative to the image sensor and When moved to the FPC of the casing 1401, the FPC is not damaged by contact with the bottom edge of the fourth side of the casing, and so that the FPC can be configured, for example, on the fourth side of the relative elevation The camera module is coupled to the camera at or near the image sensor element by (see, for example, Fig. 12) or by a slot in the fourth side of the housing 1401 or otherwise. Module.

FPC extension

In another embodiment, the electrical connection of the FPC to the MEMS actuator control signal and/or the power input pad is provided at or near the camera module object end, or at least significantly away from the original connection of the FPC and the sensor element. In order to include a trace connection to the actuator contact pad, at least a non-trivial trace connection. The FPC in the embodiment of FIGS. 15A-15C surrounds the camera module, is bent from the original entity and the electronic FPC connection at the sensor component, and is opposite to the sensor module end of the camera module. Electronic actuator spacer for the second electronic connection Pick up. The FPC can have a specific shaped end or FPC extension that is physically and electronically coupled to the actuator pad for alignment accuracy to prevent the optical path of the light from being sufficiently exposed on the image sensor. Image.

15A through 15C are schematic views respectively illustrating an FPC bending front perspective view of a camera module, a top view during FPC bending, and a rotating perspective view after FPC bending, respectively, according to some embodiments. In FIG. 15A, the camera module 1501 is physically and electronically coupled to the sensor element of the bendable flexible printed circuit (FPC) 1502 at the sensor connection section 1502A. Certain electronic devices 1503 can be coupled to side segments 1503A at which their electronic devices are mated into a blank space, such as using a U-shaped bracket or an internal EMI housing frame, such brackets or frames There is space on one side that is filled with electronic device 1503 and is enclosed by side section 1503A of FPC 1502. An accelerometer and/or azimuth sensor may also be included in one of the blank spaces (see, for example, U.S. Patent Nos. 61/622,480 and 61/675,812, the patents being assigned to the same assignee, And incorporated herein by reference). The FPC 1502 in the embodiment of FIG. 15A also includes an FPC extension 1504, which may be an end segment or an FPC segment 1504 that is only removed from the sensor connection segment 1502, the FPC segment 1504 being in the sensor connection segment and The side section 1503 is then displaced by a precise distance. The FPC extension 1504 includes two or more conductive side pads 1504A for electrically connecting actuator pads at the image end of the lens barrel of the camera module. FPC extension 1504 or end section can define part, semicircle Or a complete cutout portion 1505 to overlap the aperture of the camera module such that the desired imaging light is unobstructed upon entering the camera module and to block unwanted light further away from the central portion of the optical path . In an alternative embodiment, the FPC 1502 can be coupled to the camera module sensor end located at the end section of the FPC and bent to connect to the actuator pad and continue from the actuator connection section 1504 (not as The figure shows the connection from the sensor section 1502A) to the outside of the camera module. The FPC extension 1504 can have EMI mask characteristics similar to any of the exemplary light leakage baffle 602, light leakage baffle 702, light leakage baffle 802, and light leakage baffle 902 of Figures 6A-9 above.

16A through 16B respectively schematically illustrate camera modules before and after FPC bending, respectively, which are similar to those described above with reference to Figures 15A through 15B, respectively, in accordance with some embodiments. Example. The FPC 1601 is configured to control the contact point by using staggered and/or clamped hook attachment means or other passive complementary features on the actuator end (eg, FPC conductive pad cutout portion 1604 and raised actuators) The spacer 1603 and/or the dedicated body is coupled to the protruding portion and/or the cutout portion and is physically and electrically connected to the sensor terminal of the camera module 1602, and is electrically coupled to the actuator with sufficient physical coupling stability. Point 1603. The same FPC section 1605 including the actuator pad conductive contact 1604 can have an aperture 1606 configured to act as a light leakage baffle or coupled to a light leakage baffle, for example, the aperture is used as a reference to FIGS. 6A-9. An alternative to the light leakage baffle 602, the light leakage baffle 702, the light leakage baffle 802, and the light leakage baffle 902 in the described embodiment, and is more similar to the 15A Figure to the embodiment of Figure 15B. In the embodiments of Figures 15A through 16B, and in the embodiments of Figures 6A through 9, providing space in the Z direction to facilitate movement of the lens group, the space provides an advantageous auto focus range, otherwise When the outer optical device does not extend through the autofocus aperture, light is leaking in the gap between the outer optical device and the autofocus aperture (e.g., aperture 708 of Fig. 7). As with the above embodiments, the FPC section 1605 can have EMI masking characteristics that provide the FPC section 1605 with a number of advantages and multiple functions.

While the invention has been described with respect to the embodiments of the embodiments of the present invention, it is understood that the scope of the invention is not limited to the specific embodiments discussed herein. Therefore, the embodiments are to be considered as illustrative and not restrictive, and it is understood that the embodiments may be modified by those skilled in the art without departing from the scope of the invention.

Moreover, in methods that may be performed in accordance with the preferred embodiments herein and described above, the operations have been described in the order in which they have been selected. However, the order is selected and ordered for reasons of printing convenience, and is not intended to imply any particular order for performing the operations, but in the case where a particular order is explicitly presented or Except for those orders where necessary.

In addition, all references to the prior art and the prior art, the abstract and the disclosure of the drawings are incorporated herein by reference, and U.S. Patent Application Serial No. 12/213,472, No. 12/225,591, No. 12/ 289,339, 12/774,486, 13/026,936 No. 13/026,937, 13/036,938, 13/027,175, 13/027,203, 13/027,219, 13/051,233, 13/163,648, 13/264,251, And PCT Application No. WO2007/110097, and U.S. Patent No. 6,873,358, the disclosure of each of each of each of

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L1‧‧ lens L1

L2‧‧ lens L2

L3‧‧‧Lens L3

L4‧‧ lens L4

L5‧‧ lens L5

Claims (16)

An autofocus digital camera module, comprising: a casing; an image sensor in the casing; an optical component string in the casing, the optical component string and the image sense Aligning the detector, the optical element string defines an optical path, and the optical element string comprises a plurality of lenses, the lenses comprising at least one movable lens coupled to a lens actuator, the lens The actuator is configured to move the at least one movable lens along the optical path to focus an object image onto the image sensor, the image sensor being disposed within an auto focus range of the camera module; A flexible printed circuit (FPC), the FPC includes a sensor segment coupled to the image sensor to activate the camera module and transmit electronic signals, the electronic signals Included in the digital image captured by the image sensor; and wherein the FPC further includes an extension, the extension includes an electrical contact pad configured to be electrically coupled to Mirror actuator pad contact points, so that when the camera module of the folded lens actuator control signals from the sensor to the terminal end of the object around the FPC. The camera module of claim 1, wherein the flexible printed circuit includes an intermediate segment between the sensor segment and the extension, the intermediate segment enclosing at least one side of the camera module. The camera module of claim 1, wherein the extension is coupled to an object end of the camera module, the extension is opposite to the sensor segment, and the sensor segment is coupled to the camera module The sensor end. The camera module of claim 1, wherein the casing comprises an electromagnetic interference (EMI) coating on an outer surface. The camera module of claim 1, wherein a focus adjustment aperture is defined in the housing, the aperture being large enough to allow an object end of the optical element string to at least partially protrude at one end of the auto focus range Passing through the aperture; and wherein the light leakage baffle overlaps the focus adjustment aperture portion outside of the auto focus range of the object end of the optical element string. The camera module of claim 1, wherein a baffle cavity is defined within the light leakage baffle, the baffle cavity being smaller than the focus adjustment aperture and allowing light to enter the camera module to capture an image. A compact camera module for an autofocus digital camera, the module comprising: a cover configured to include imaging optics and digital electronics for capturing and transmitting images, and the cover The shell is configured to mask electronic components from electromagnetic interference (EMI); An image sensor; an optical element string coupled to the image sensor and aligned, and the optical element string configured to define an optical path to focus an object image to an image sensing The image sensor is disposed at the focal plane of the string of optical elements; a flexible printed circuit coupled to the image sensor for transmission comprising capturing by the image sensor An electronic signal of the digital image; and a light leakage baffle coupled to the flexible printed circuit and defining a predetermined distance between a baffle cavity and the image sensor for After folding the FPC onto the casing, the light-damping baffle is placed on the object image side of the optical element string, and the baffle cavity is overlapped with the optical path. The compact camera module of claim 7, wherein the FPC is configured to be disposed on one or more of the image side of the optical element string after the FPC is folded over the housing A contact pad is electrically coupled to the FPC, whereby the lens actuator control signal can be transmitted directly from the FPC to the lens actuator. The compact camera module of claim 7, wherein the light leakage baffle is configured to block some ambient light from entering the camera via a focus adjustment aperture defined in the housing to allow one of the optical element strings to end The aperture is at least partially protruded at one end of an autofocus range. The compact camera module of claim 7, wherein the light leakage barrier comprises a conductive material that provides an EMI mask. The compact camera module of claim 10, wherein the electrically conductive material of the light leakage barrier comprises carbon. The compact camera module of claim 7, wherein a focus adjustment aperture is defined in the housing, the aperture being large enough to allow an object end of the optical element string to be at least partially at one end of the auto focus range Projecting through the aperture; and wherein the light leakage baffle overlaps the focus adjustment aperture portion outside of the auto focus range of the object end of the optical element string. The compact camera module of claim 12, wherein a baffle cavity is defined in the light leakage baffle, the baffle cavity being smaller than the focus adjustment aperture and allowing light to enter the camera module to capture an image. The compact camera module of claim 7, wherein the flexible printed circuit includes an intermediate segment between the sensor segment and the extension, the intermediate segment enclosing at least one side of the camera module . A compact camera module for an autofocus digital camera, the module comprising: an image sensor; An optical element string coupled and aligned with the image sensor, the optical element string comprising a plurality of lenses, the lenses comprising at least one movable lens configured to define an optical a path for focusing an object image onto the image sensor, the image sensor being disposed at the focal plane of the string of optical elements; a MEMS actuator coupled to the at least one MEMS actuator a movable lens, and the MEMS actuator is configured to move the at least one movable lens through an autofocus range of one of the compact camera modules; a compact camera module housing, the compact camera module The set of housings is configured to shield the string of optical elements, MEMS actuators, and image sensors contained within the housing from electromagnetic interference (EMI); a flexible printed circuit that is flexible a curved printed circuit coupled to the image sensor for transmitting an electronic signal comprising a digital image captured by the image sensor; and wherein the FPC includes an extension segment configured to be in the FPC fold After the cover, one or more electrical contact pads disposed on the object side of the optical element string are electrically coupled to the contact pad on the FPC extension, thereby A MEMS actuator control signal can be transmitted directly from the FPC to the MEMS lens actuator. The compact camera module of claim 15 wherein the housing defines a focus adjustment aperture having a predetermined shape configured to allow an object end of the optical element string to be within the auto focus range One end At least partially protruding through the aperture; and wherein the extension includes a light leakage baffle that is outside the autofocus range of the object end of the optical element string in the direction of one of the optical paths Adjust the aperture overlap.