JP6135957B2 - Autofocus camera module with flexible printed circuit extension - Google Patents

Description

[Priority claim]
This application is filed on Aug. 10, 2012, US Patent Application No. 13 / 571,393, August 10, 2012 entitled “CAMERA MODULE WITH COMPACT SPONGE ABSORBING DESIGN”. US Patent Application No. 13 / 571,395 entitled “Camera MODULE WITH EMI SHIELD” filed on August 10, 2012, entitled “Autofocus Camera with Internal Conductive Trace” US patent application Ser. No. 13 / 571,397, Aug. 10, 2012 entitled “Module (AUTO-FOCUS CAMERA MODULE WITH INTERIOR CONDUCTIVE TRACE)” Four simultaneously filed series, including US patent application No. 13 / 571,405, entitled “AUTO-FOCUS CAMERA MODULE FLEXIBLE PRINTED CIRCUIT EXTENSION” of Japanese Patent Application Claims the benefit of priority to any patent application. Each of these priority applications is hereby incorporated by reference.

  The present invention relates to small camera modules, and in particular, to those having an autofocus function and optionally a zoom function that are housed in an efficient, versatile and durable packaging environment.

  The camera module can be metaphorically or practically separated into two main components: a sensor component and an optical train component. The resulting electronic camera is said to be of fixed focus when the position of all the lenses of the optical train and / or the position of one or more constituent lenses is fixed relative to the position of the image sensor. Fixing the optical system firmly at a predetermined position means that only an object at a certain distance from the camera is focused on the image sensor. Fixed focus cameras have advantages in terms of small physical dimensions and cost, but limited performance. In particular, in many cases, the focal length is set to 1.2 m so that an object from 60 cm to infinity appears to an acceptable level. However, the image sharpness is not particularly good, and an object closer than 60 cm to the camera will always be blurred. To correct this problem, it is possible to set the focus to a closer location, which means that the sharpness of distant objects is reduced at the cost.

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  Therefore, it is desirable to have a small camera module with an autofocus function and optionally a zoom function housed in an efficient, versatile and durable packaging environment.

2 is a schematic cross-sectional view of an example autofocus camera module including a movable lens subset and a MEMS actuator according to one embodiment. FIG. FIG. 6 is a schematic diagram illustrating another example of an autofocus camera module including different subsets of one or more movable lenses and a MEMS actuator according to one embodiment. FIG. 2 shows a camera module including two main part components including an optical train component that can be coupled and separated to be interchangeable with a sensor component. FIG. 6 is a schematic diagram illustrating another example of an autofocus camera module including different subsets of one or more movable lenses and a MEMS actuator according to one embodiment. 1 is a schematic cross-sectional view of an example autofocus camera module including a wire-coupled image sensor configuration according to one embodiment. 1 is a schematic cross-sectional view of an example autofocus camera module including a flip chip image sensor configuration according to one embodiment. FIG. 6 is a schematic cross-sectional view of another camera module having a copper pillar interconnect according to one embodiment. It is a schematic plan view of the camera module of FIG. 5A. 2 is a schematic exploded view of a camera module having certain peripheral and / or internal components according to one embodiment. FIG. 2 is a schematic top view of a camera module having certain peripheral and / or internal components according to one embodiment. FIG. 2 is a schematic side view of a camera module having certain peripheral and / or internal components according to one embodiment. FIG. A housing that functions as an electromagnetic interference (EMI) shield or EMI housing and allows movement of the encapsulated lens barrel through the focusing aperture, defining the camera aperture or bounding or enclosing the camera module aperture; Alternatively, a schematic exploded view of a camera module including a light leakage baffle that transmits desired exposure light while preventing unwanted stray light from entering or exiting the camera module through a first aperture. FIG. 8 illustrates a camera module having the EMI housing of FIG. 7 (not disassembled) and a separate (for illustrative purposes) light leakage baffle. 2 is a schematic diagram illustrating a camera module having an EMI housing and a light leakage baffle according to one embodiment. FIG. 2 is a schematic top view of an EMI housing for an autofocus camera module having an EMI coating on the outer surface and conductive traces along the inner surface for connecting an electronic actuator component to an electronic pad or printed circuit, according to one embodiment. FIG. FIG. 6 is a schematic bottom view of an EMI housing for an autofocus camera module having an EMI coating on the outer surface and conductive traces along the inner surface for connecting electronic actuator components to an electronic pad or printed circuit according to one embodiment. 1 is a schematic perspective view of an autofocus camera module including a lens barrel at least partially enclosed within a bracket having conductive traces thereon for connecting an electronic actuator component to an electronic pad or printed circuit according to one embodiment. FIG. is there. 1 is a schematic exploded view of an autofocus camera module including a lens barrel at least partially enclosed in a bracket having conductive traces thereon for connecting an electronic actuator component to an electronic pad or printed circuit according to one embodiment. It is. FIG. 12 is a schematic exploded view of an impact protected camera module or sponge absorbing camera module including a plurality of sponges disposed between the EMI housing of FIGS. 6A-11 and the autofocus optical component of the camera module according to one embodiment. . 1 is a schematic assembly view of an xyz compressed sponge absorption camera module according to one embodiment. FIG. 2 is a schematic partially exploded view of an xyz compressed sponge absorption camera module according to one embodiment. FIG. 1 is a schematic cross-sectional view of an xyz compressed sponge absorption camera module according to one embodiment. FIG. 4 is a schematic diagram of a sponge absorption camera module showing an advantageous empty sponge z compression gap and initial sponge z length prior to z compression designed to optimize protective elasticity in combination with a gap according to one embodiment. FIG. 14B is a schematic illustration of the camera module of FIG. 14B after z-direction compression showing a sponge z compression gap and a shortened compression sponge z length sealed according to a synergistic camera module architecture, according to one embodiment. 1 or 2 for the camera module to be physically and electronically coupled to a bendable flexible printed circuit (FPC) at the sensor end so that the FPC makes electrical contact to the actuator pad at the image end of the lens barrel of the camera module It is the schematic of the camera module before FPC bending in the case of including the above conductive side surface pads. 1 or 2 for the camera module to be physically and electronically coupled to a bendable flexible printed circuit (FPC) at the sensor end so that the FPC makes electrical contact to the actuator pad at the image end of the lens barrel of the camera module It is the schematic of a camera module in the case of including the above conductive side surface pads. 1 or 2 for the camera module to be physically and electronically coupled to a bendable flexible printed circuit (FPC) at the sensor end so that the FPC makes electrical contact to the actuator pad at the image end of the lens barrel of the camera module It is the schematic of the camera module after FPC bending in the case of including the above conductive side surface pads. When the FPC is electrically coupled to the actuator contacts and configured to function as or couple to a light leakage baffle as an alternative to the embodiment described with reference to, eg, FIGS. 6A and 7-9 FIG. 15B is a schematic diagram of a camera module according to an embodiment prior to FPC bending similar to that in FIG. 15A. When the FPC is electrically coupled to the actuator contacts and configured to function as or couple to a light leakage baffle as an alternative to the embodiment described with reference to, eg, FIGS. 6A and 7-9 FIG. 15D is a schematic diagram of a camera module according to one embodiment after FPC bending similar to that in FIG. 15C.

  According to one embodiment, a small camera module is provided, the camera module being configured to couple to a flexible printed circuit to power the camera module and transmit an image captured by the image sensor; And an optical train aligned with the image sensor and including a plurality of lenses. At least one movable lens is coupled to an actuator, eg, a MEMS actuator, and automatically positions the at least one movable lens along the optical path to focus an object placed in the autofocus range of the camera module onto the image sensor. An optical system is formed that is configured to be adjusted in a controlled manner. The miniature camera module includes an EMI housing that includes an optical train and is configured to shield camera module components from electromagnetic interference (EMI). The EMI housing has a focusing aperture defined therein that is sufficiently large to allow the object end of the optical train to protrude at least partially therethrough at one end of the autofocus range. The light leakage baffle has a baffle aperture defined therein that partially overlaps the focus adjustment aperture along the optical path. The light leakage baffle includes an EMI blocking material that partially overlaps the focus adjustment aperture in the optical path direction but is located outside the autofocus range along the optical path direction.

  One or more lenses of the optical train can be placed in the lens barrel. The lens barrel can include at least one movable lens. The lens barrel can be movable with a lens fixed therein and / or one or more lenses can be movable within the lens barrel.

  The EMI housing can include an EMI coating. Alternatively, the EMI housing can be made of a conductive, semi-conductive, and / or separately EMI blocking material. The light leakage baffle can include a conductive, semiconductive, or other EMI blocking material that provides additional EMI blocking for the camera module components. The conductive material of the light leakage baffle can include carbon, for example, a carbon feather material. Conductive glue can be used to couple the light leakage baffle to the housing, for example, at the outer or inner recess of the housing.

  Another autofocus digital camera module includes a housing, an image sensor within the housing, and at least one movable lens within the housing, aligned with the image sensor to define an optical path, and coupled to a lens actuator. And an optical train in which a lens actuator is configured to move the at least one movable lens along the optical path to focus an object placed in the autofocus range of the camera module onto the image sensor. . A flexible printed circuit (FPC) includes a sensor segment coupled to an image sensor to power a camera module and carry an electronic signal including a digital image captured by the image sensor. The FPC has an electrical contact pad configured to electrically couple to the lens actuator contact pad and carry a lens actuator control signal when it is folded around the camera module from the sensor end to the object end. It further includes an extension segment spaced from the containing sensor segment.

  The flexible printed circuit may include an intermediate segment that encapsulates at least one side of the camera module between the sensor segment and the extension segment. The extension segment can be coupled at the object end of the camera module opposite to the sensor segment coupled at the sensor end of the camera module. The housing can include an electromagnetic interference (EMI) coating on the outer surface.

  The housing can define a focusing aperture therein that is sufficiently large to allow it to protrude at least partially through the object end of the optical train at one end of the autofocus range. The light leakage baffle can partially overlap the focusing aperture outside the autofocus range at the object end of the optical train. Within the light leakage baffle, a baffle cavity can be defined that is smaller than the focusing aperture and that allows light to enter the camera module to acquire an image.

  Another for an autofocus digital camera that includes a housing configured to contain imaging optics and digital electronics for capturing and transmitting images and to isolate electronic components from electromagnetic interference (EMI) A small camera module is provided. The optical train is coupled and aligned with the image sensor and is configured to define an optical path for focusing the subject on the image sensor located at the focal plane of the optical train. A flexible printed circuit is coupled to the image sensor to carry an electronic signal including a digital image captured by the image sensor. A light leakage baffle is coupled to the flexible printed circuit, the light leakage baffle defines a baffle cavity at a predetermined distance from the image sensor, and the light leakage baffle is the object of the optical train when the FPC is folded onto the housing. So that the baffle cavity overlaps the optical path.

  In the FPC, when the FPC is folded on the housing, one or more electrical contact pads arranged on the object side of the optical train are electrically coupled to the FPC, and a lens actuator control signal from the FPC is sent to the lens actuator therefrom. It can be configured to be able to communicate directly. The light leakage baffle is either through a focusing aperture that is predetermined within the housing to allow the object end of the optical train to protrude at least partially therethrough at one end of the autofocus range. It can be configured to prevent ambient light from entering the camera. The light leakage baffle can include a conductive or semiconductive material that provides EMI shielding, such as carbon. Within the light leakage baffle, a baffle cavity can be defined that is smaller than the focusing aperture and that allows light to enter the camera module to acquire an image. The flexible printed circuit may include an intermediate segment that encapsulates at least one side of the camera module between the sensor segment and the extension segment.

  Furthermore, for an autofocus digital camera including a housing configured to contain imaging optics and digital electronics for capturing and transmitting images and to isolate electronic components from electromagnetic interference (EMI) A small camera module is provided. An optical train is coupled and aligned with the image sensor, the optical train including a plurality of lenses and defining an optical path within the housing for focusing a subject on the image sensor located at a focal plane of the optical train. Composed. A MEMS actuator is coupled to at least one movable lens of the optical train that is movable from end to end of the auto-focus range of the camera module formed by aligning the image sensor component with the miniature optical module. A flexible printed circuit is coupled to the image sensor to carry an electronic signal including a digital image captured by the image sensor. The FPC includes an extension segment that is electrically coupled to one or more electrical contact pads located on the subject side of the optical train when the FPC is folded onto the housing. The MEMS actuator control signal from the FPC can be directly transmitted to the MEMS lens actuator therefrom.

  The housing may have a predetermined shaped focusing aperture therein configured to allow the object end of the optical train to protrude at least partially therethrough at one end of the autofocus range. And the FPC extension segment partially overlaps the focusing aperture to prevent unwanted light from entering the housing, and the light leakage baffle located outside the autofocus range at this object end of the optical train including.

  A housing having an outer surface for encapsulating a camera module and an inner frame, an image sensor in the housing, an optical that is coupled and aligned with the image sensor in the inner frame of the housing to define an optical path, and includes a plurality of lenses Another autofocus digital camera module including a train is provided. A lens actuator, for example a MEMS actuator, moves at least one movable lens of the optical train along the optical path to focus an image of a subject placed in the autofocus range of the camera module on the working plane of the image sensor. Configured as follows. In order to power the camera module and carry an electronic signal including a digital image captured by the image sensor, the image sensor may include a printed circuit, eg, a flexible printed circuit, a rigid printed circuit, a rigid-flexible printed circuit, or A printed circuit board is coupled. The printed circuit is also electronically coupled to the lens actuator to carry the lens actuator control signal. An electromagnetic interference (EMI) barrier coating is provided on the outer surface of the housing. Conductive traces are provided on one or more surfaces of the inner frame of the housing to allow lens actuator control signals to be conveyed from the electrical contact pads on the printed circuit to the lens actuator contact pads.

  Another autofocus digital camera module is provided that includes an EMI blocking housing that includes a bracket that forms an internal frame inside the housing. To define the optical path, an optical train that includes a plurality of lenses is coupled and aligned with an image sensor in the housing. In order to focus an image of a subject placed in the autofocus range of the camera module, at least one movable lens is connected to a lens actuator, such as a MEMS actuator, configured to move these movable lenses along an optical path. Combined. A printed circuit is coupled to the image sensor for powering the camera module and carrying an electronic signal including a digital image captured by the image sensor. One or more, for example, a pair, of electrical contact pads on the printed circuit is electrically coupled to the contact pads on the lens actuator between the electrical contact pads on the printed circuit and the contact pads on the lens actuator. One or two conductive traces are formed along one or more surfaces of the bracket to enable carrying lens actuator control signals.

  The EMI shielding housing can include an electromagnetic interference (EMI) coating on at least one surface, and / or the EMI shielding housing can include an electromagnetic interference (EMI) shielding substrate material.

  A light leakage baffle with a focus adjustment aperture defined at the subject end of the autofocus digital camera module to allow at least partial projection through at least one movable lens at one end of the autofocus range along the optical path; Overlapping baffle openings can be defined therein. The light leakage baffle can include an EMI blocking material that partially overlaps the focusing aperture and is positioned just outside the subject end of the autofocus range of the digital camera module.

  The light leakage baffle can include a conductive or semiconductive material that provides EMI shielding to the optical module components, such as carbon or carbon feather. The conductive glue can couple the light leakage baffle to the EMI housing. The light leakage baffle can be located outside the housing.

  Another miniature optical module is provided that is configured to couple with an image sensor component of an autofocus digital camera module. The optical train of the miniature optical module includes a plurality of lenses, including at least one movable lens, and a printed circuit for carrying an electronic signal including a digital image located at the focal plane of the optical train and captured by an image sensor. A lens actuator configured to move at least one movable lens along the optical path to focus the subject on the combined image sensor. The inner housing is configured as a frame for alignment including the optical train and the image sensor, whereas the outer housing includes the inner housing and the optical train, and the optical train and the image sensor are electromagnetic interference (EMI). And configured to be shielded from both external physical shocks. Between the outer housing and the inner housing are disposed one or more shock absorbing sponges configured to compress in three spatial axial directions to absorb external physical shocks. One or more sponge volume compression gaps are defined between the outer housing and the inner housing to allow relative movement in the optical path direction from the outer housing to the inner housing without contact.

  The lens actuator includes a pair of lens actuator control pads for receiving lens actuator control signals from the printed circuit along a pair of conductive traces that electrically couple the printed circuit to the pair of lens actuator bond pads. Can be included. The outer housing can be formed integrally with the inner frame, and the conductive traces can be formed along the inner frame. Within the outer housing, a molded bracket can be placed as an inner frame, and conductive traces can be formed on or along one or more surfaces of the bracket.

  The lens barrel can include one or more of a plurality of lenses including at least one movable lens therein. The EMI outer housing can include an EMI coating that provides EMI shielding to the optical module components. The EMI outer housing can include a conductive or semi-conductive material that provides EMI shielding to the optical module components.

  Between the outer housing and the inner housing, one or more shock absorbing sponges do not overlap the optical train in the direction of the optical path, thereby compressing the optical train without adding Z height to absorb Z shock Can be arranged as follows.

  One or more shock absorbing sponges can be arranged so as not to overlap the inner housing in the optical path direction. Thereby, one or more sponges can be compressed to absorb Z impact without adding Z height to the inner housing.

  One or more sponge volume compression gaps may be configured not to overlap the inner housing in the optical path direction so as not to add Z height to the optical train.

  One or more sponge volume compression gaps may be defined to at least an estimated sponge compression depth between one or more area portions of the inner housing and the outer housing overlapping in the optical path direction. One or more overlapping area portions pass through the EMI housing with an outer contour approximately in the range between the outermost radius of the overlapping area of the inner housing and the inner wall of the radially adjacent shock absorbing sponge. An extension of the optical train is predetermined in the housing to allow reaching the outer boundary of the autofocus range of the small camera module formed by coupling and aligning the image sensor module with the small optical module. And an inner profile having an inner radius of the outer housing ring defining a defined focusing aperture.

  A second sponge comprising at least an area between the inner and outer contours of the side wall of the EMI housing along one or more segments to allow independent movement of the side wall of the outer housing in the optical path direction without contact; The volume compression gap can be determined at least to the estimated sponge compression depth. The second sponge volume compression gap can include at least a sidewall section of an outer housing configured to overlap a flexible printed circuit FPC configured to couple a small camera module including a small optical module. The second sponge volume compression gap overlaps with one or more other obstacles to independent movement of the outer housing in the optical path direction and / or with one or more contours on the inner and outer surfaces of the side walls of the outer housing. One or more additional side wall sections of the outer housing determined to be fully overlapping may be included.

  The miniature camera module can include, for example, a fixed lens coupled in front of the image sensor that is coupled along an optical path that can be combined with electronic zoom image processing.

  Another miniature camera module that includes a miniature optical module coupled to the sensor module and that otherwise includes any of the miniature optical module, miniature camera module, and / or sensor module functions described herein. provide. Yet another embodiment includes a combination of features described herein.

Autofocus Camera Module A camera module according to embodiments described herein includes an image sensor that converts an image in the optical domain to an electronic format, and an optical train that focuses the scene of interest onto the image sensor. Embodiments include a camera configured to have high performance that accurately captures details in a scene. The quality of the optical train and / or the resolution of the image sensor can be selected according to the desired performance to accurately capture such details. An image sensor can include millions of pixels (pixels) and an autofocus camera module according to one embodiment can include two, three, four, five, or more than six lenses. .

  The position of the at least one movable lens of the optical train is not fixed with respect to the position of the image sensor, and thus the autofocus camera module according to the embodiments described herein allows an object to be focused on the image sensor. The distance from the electronic camera can be changed. A system according to an embodiment that determines one or more distances from a camera to one or more main objects in a scene can be utilized. According to the determined distance, at least one movable lens can be moved until one or more main objects are focused on the image sensor. These objects can range from the immediate vicinity of the camera (10 cm or closer) to very far (infinity).

  This document provides camera embodiments that provide superior image quality over conventional autofocus and fixed focus cameras. The camera module according to one embodiment shows not only a small size, but also an efficient and durable packaging environment that provides advantageous power efficiency and protection against undesirable physical shocks and electromagnetic interference.

  An electronic camera according to one embodiment exhibits the advantageous performance of significantly changing the field of view. For example, when a conventional camera is used, a family photo taken in front of home may inadvertently include a garbage container at the edge of the scene. The camera according to one embodiment can be adjusted to limit the field of view and remove this perturbation from the captured image. Conversely, family photos taken on a hill can be further improved by using a camera according to one embodiment and adjusting to a wide field of view that captures a larger panorama.

  A camera according to one embodiment shows a clear improvement by incorporating a dynamic field of view function with an autofocus mechanism. In one embodiment, the camera optical train design includes a fixed portion and a portion movable along the optical axis of the camera by an actuator. In one embodiment, code embedded in a fixed or removable storage device on the camera and / or using a remote processor allows any image processing, eg, image distortion removal.

  One embodiment provides an advantageous camera that integrates all three of these into a small camera module. Such a camera module can be a stand-alone camera product or can be included in a fixed or portable electronic product and / or in various other environments such as an automobile.

  Several embodiments will now be described with reference to the figures. The present specification provides an electronic camera that advantageously incorporates an integrated autofocus and optional zoom function. In one embodiment, the autofocus and zoom feature utilizes a combination of advantageous optical train and processor-based image processing, and in one embodiment includes the same or similar components in both cases.

  Another way to add autofocus can include moving one or more other lenses in the optical train as a group. An autofocus zoom camera based on this operating principle is described in US patent application 61 / 609,293, which is incorporated by reference. The movable lens group can include more than one movable lens, can include four lenses as described in the '293 application, and can further include one or more forming a movable lens group. Depending on the specific number and geometry of the lenses, various numbers of stops and apertures can be included.

  An optical train according to one embodiment that includes autofocus and optionally also includes zoom, includes two general components: a movable lens group and a fixed lens group. FIG. 1 shows a first movable lens group (for example, L1 to L4) including one or more movable lenses that can move along the optical axis of the camera, and at least one lens fixed at a predetermined position. An autofocus zoom camera including a fixed lens group including L5 (for example, L5) is shown. The one or more moving lenses include four lenses L1-L4 that are closest to the scene in the example of FIG. 1, whereas the fixed lens L5 is closest to the image sensor.

  In general terms, the movable lens group performs the function of changing the focal length of the camera, and in an embodiment of the camera module that further includes zoom, at least one fixed lens adapts the PSF function of the optical system to the imager. And an optional electronic zoom function that compensates for field curvature induced by the movable lens group. The fixed lens that can perform this function in the particular embodiment described in the '293 application is the lens closest to the image sensor. At least one moving lens is provided at a suitable distance along the optical axis to obtain the desired focal length, whereas at least one fixed lens is subsequently placed with a lateral focal length between the lens and the imager. Provided to fit the distance.

  The processor programmed with the embed code is a pixel in the image sensor to allow zooming and numerous other image processing enhancements as disclosed in the patents and pending patents incorporated by reference below. Information can be collected, some can be made automatically, others can be modified based on user input, and related electronic files. For example, the degree of zoom can be adjustable. The processor can be programmed to attempt to correct distortions and other distortions generated in a predictable manner by the optical train. The image processing mechanism can be implemented in either hardware or software. In one embodiment, these mechanisms are placed early in an image processing pipeline, such as an RTL (resistive transistor logic) code embedded in an image sensor, whereas in other embodiments, an external DSP (Digital signal processor) or entirely in software in a processor such as a baseband chip in a mobile phone.

  The example of an autofocus zoom camera according to the example shown in FIG. 1 can range from 10 cm to 9 m in one embodiment, generally from 15 cm to 5 m, preferably from 20 cm to 3 m. The zoom function can range from x0.5 to x5, and in general can be from x1 to x4, More specifically, in one embodiment, it can be between x1 and x3. Special characteristics of the final electronic file generated by the advantageous camera module according to one embodiment are that the file size and the effective resolution of the image contained within the file are independent of the focal length and zoom setting in one embodiment. It can be made almost constant.

  Variable optical cameras according to one embodiment include cameras in which the optical train is divided into groups, some of these groups are fixed in function and position, and others are variable in function and position. By this means, a higher degree of control of the optical train can be provided. For example, the field of view of the camera can be changed by moving two specific lens groups along the optical axis. In one embodiment, limiting the field of view results in effective magnification of objects in the scene, since the camera resolution can generally be fixed by other parameters. As a result, this type of camera is called a zoom camera or an autofocus zoom camera.

Autofocus Zoom Camera Module Some different embodiments include an advantageous autofocus zoom camera and / or components or subsets of its mechanisms. In one embodiment, the autofocus and zoom function comprises (i) one lens configured to provide electronic zoom in combination with a zoom algorithm and fixed in place with respect to the image sensor; ) One lens that can move along the optical axis of the camera, or alternatively two or more moving lenses, or a combination of one moving lens and two or more fixed lenses And (iii) a combination of a zoom algorithm programmable image processing component that modifies the electronic form of the image. In an alternative embodiment, zoom is achieved using a movable lens component. In other embodiments, an autofocus camera module is provided that does not include a zoom component, in which case an autofocus camera module (i.e., does not include zoom) within the autofocus zoom camera module herein. The example lens array described can be used, or the lens array can be simplified, especially with respect to lens L5. In particular, related embodiments and alternative features relating to the zoom mechanism of this embodiment are described in U.S. Reissue Patent RE 42,898, which is incorporated by reference, and U.S. Patent Application Publication Nos. US 2009/0115885 and US 2009. This is considered to be described in the specification of / 0225171. In another embodiment, the zoom function is achieved by one or more moving lenses. One lens that can move in the electronic zoom embodiment may be centered in the optical train and movable to provide an autofocus function. In other embodiments, more than one lens can be movable, and in other embodiments, more than one fixed lens is included.

  In different embodiments, one or more apertures, apertures, and / or other optical components such as infrared filters that are not always specifically described in each embodiment are included in various combinations. Infrared filters can be included between the image sensor and the last lens of the optical train or elsewhere along the optical path. One or more openings can be fixed to the lens surface or independently fixed to the camera module housing, lens barrel housing, or other fixed component of the camera module or camera device. One or more apertures can move on or with the movable lens, like a movable aperture. In one embodiment, the aperture to the movable lens is movable on or near the movable lens surface, otherwise the movable lens can be moved together using an actuator so that the aperture and the movable body can move together. It is fixed against. In other embodiments, the aperture for the movable lens can be fixed relative to the image sensor.

  An electronic camera incorporating a fixed lens of the type described can provide dynamic field of view changes, in other words zoom, by image cropping. Cropping typically degrades image quality because information from the scene is discarded, but in one embodiment, the fixed lens magnifies the center of the image so that the fidelity of the cropped image is preserved. The In one embodiment, this fixed lens is used to manufacture a dynamic field camera, which will produce an image distortion that resembles a barrel distortion unless corrected. The degree of distortion is fixed and controlled by the lens design. Thereby either inside the camera module itself or outside the camera module, but inside a device such as a camera phone, mobile camera, tablet, or laptop, or other device that contains the camera module as a device component Image processing operations performed by one on-board processor or other processor that is physically, electronically, or coupled to the device by radio signal and programmed by a certain algorithm designed for a specific purpose By constructing the image data at, it becomes relatively efficient to correct and remove distortions and other predictable disturbances. Some embodiments of a camera having a zoom based on this principle of operation are disclosed in US Pat. No. RE42,898, US Patent Application Publication No. 20120063761, 20110221936, 20110216158, 20090115885 and 20090225171 and / or U.S. Patent Application Nos. 61 / 609,293 and 13 / 445,857, which are incorporated by reference. It is. This algorithm can be stored on or outside the camera module within an electronic device that is internally composed of the camera module until the processor applies it to the data so that the image can be displayed in a zoomed-in representation. Or used by a camera module configured to apply an algorithm to image data that is not stored, transmitted, or displayed as fixed image data, eg, original data from an image sensor or preprocessed image data It can be stored on the cloud or otherwise as long as the processor is accessible.

  In one embodiment, the fixed lens required to generate the zoom in combination with the algorithm is advantageously placed as the lens closest to the image sensor for physical reasons. An alternative way to add autofocus can include moving one or more other lenses in the optical train as a group. An autofocus zoom camera based on this operating principle is described in US patent application 61 / 609,293, which is incorporated by reference. The movable lens group can include more than one movable lens, can include four lenses as described in the '293 application, and can further include one or more forming a movable lens group. Depending on the specific number and geometry of the lenses, various numbers of stops and apertures can be included. Only one lens, such as a central lens L3, is movable with respect to two fixed lens pairs L1-L2 and L4-L5 provided on any side as schematically shown in FIGS. 2A-2B. The embodiment that is not included has the advantage of a small mass, so that a relatively weak force is required to move it, and it is also surprising that an actuator with a small displacement distance can be used It has further advantages.

  Another feature of an autofocus zoom camera module according to one embodiment is that a central lens in an optical train in one embodiment, for example L3 in an optical train comprising five lenses, in an optical train composed of seven lenses. Including autofocus in combination with zoom from a fixed zoom lens of the type described above by moving L4 or L2 in a row composed of three lenses. In other embodiments, the movable lens is offset from the center anywhere between the at least one fixed lens and the rest of the optical train, eg, L2 or L4, or 7 lenses in a 5 lens embodiment. L2, L3, L5, or L6 in the embodiment. Still other embodiments include movable lenses at one or both ends of the optical train.

  Referring now to FIGS. 2A-2B, another example of an autofocus camera module is schematically shown, wherein the central lens L3 is movable between two fixed lens pairs L1-L2 and L4-L5. This embodiment is described in US Patent Application No. 61 / 643,331, which is incorporated by reference. Embodiments in which the movable lens group includes only one lens, such as the central lens L3, which is movable relative to the two fixed lens pairs L1-L2 and L4-L5 provided on any side, has a low mass. So that only a relatively weak force is required to move it. One movable lens embodiment also has the surprising further advantage that a small displacement distance actuator can be used. This is, in one embodiment, a central lens in the optical train, for example L3 in an optical train that includes five lenses, L4 in an optical train that consists of seven lenses, or a column that consists of three lenses. This is due to the movement of L2. In other embodiments, the movable lens is offset from the center anywhere between the at least one fixed lens and the rest of the optical train, eg, L2 or L4 in a 5 lens embodiment, or 7 lens implementation. L2, L3, L5, or L6 in the form. Still other embodiments include movable lenses at one or both ends of the optical train.

  Contrary to sensory expectations, it can be seen that the central lens in the example of FIG. 2A is moved only a relatively short distance, typically around 100 um, to obtain a focus range similar to a conventional autofocus camera. it can. This allows the use of new forms of actuators, such as MEMS, to move the lens, resulting in some indirect advantages from the inherent properties of such devices. Among the many advantages of this design are the small size, low power consumption, low noise, high speed and accuracy of movement, and other improvements.

  FIG. 2B also schematically illustrates a cross section through an autofocus zoom camera according to one embodiment utilizing an assembly having a lens array fabricated as a pre-aligned single component. The image sensor 201 is positioned on the substrate 202 attached to the sleeve 203. The sleeve has threads 204 in the example shown in FIG. 2B. The holder 205 including the lens array 206 has an alignment thread 207. By rotating the holder relative to the sleeve, the entire lens array is moved along the optical axis 208 of the camera in this exemplary embodiment, allowing the focus to be set. Variations on the matching threads 204 and 207 include grooves and lands that fit in various patterns, and set the distance between the image sensor 201 and one or more fixed lenses in the lens array 206. Focus can be continuous or discrete, such as using a series of notches, spring-loaded pins, levers, or elastic materials, or other techniques to join the lens array holder 205 and sleeve 204 in a manner that allows It is possible to set to.

  High precision alignment according to one embodiment of the optical train allows for transmission of images with high fidelity. One embodiment includes alignment with certain accuracy with respect to the various elements of the row, primarily the tilt, centering, and rotation of the lenses relative to each other. In one embodiment, active alignment techniques can be used to provide very accurate alignment of one lens to another, but in one embodiment, a generally passive method is possible. Used, which is due to the high assembly speed and low cost of this scheme. In one embodiment, the autofocus zoom module accepts passive alignment tolerances in all but one of the lens array junctions.

  In another embodiment, the autofocus camera can have an all-optical train that is moved during the autofocus process. Further, advantageous cameras according to embodiments described herein including an optical train having both movable and stationary components are configured according to many examples other than those shown in FIGS. 1 and 2A-2B. be able to. For example, the example autofocus camera module shown in FIG. 3 includes a MEMS actuator coupled to the lens L1 furthest from the image sensor or the image end of the optical train. In the case of this MEMS actuator location, using different camera module embodiments with different numbers of lenses and / or differently configured lenses, L1-L4, L1-L3, L1-L2, or even just one lens L1 (or L3 in the case of FIGS. 2A-2B, in some embodiments L2, L4, or even L5, or in other embodiments only 3 or 4 lenses are included in the optical train, or The lens barrel, including 6 or 7 lenses in others, may be movable. The MEMS actuator uses one or more conductive traces following the flexible printed circuit coupled to the camera module at the sensor end, outside the lens barrel in the camera module bracket, or at the sensor end at the second end. At the location of the lens L1 at the most image side of the lens barrel using a flexible printed circuit extension that is electrically connected to the contact pad of the actuator at the image end of the camera module while still connected to the FPC at the location. Can be electrically coupled. These advantageous autofocus zoom cameras have one or more fixed parts and one or more moving parts of the optical train. In one embodiment, the camera exhibits accurate centering and tilt alignment of the moving lens relative to a fixed lens that is different from a conventional fixed camera or autofocus camera.

  Camera modules according to some embodiments are schematically illustrated using physical, electronic, and optical architectural examples in this application and other patent applications or other patents by the same applicant. For example, other camera module embodiments that can be included in alternative embodiments, as well as embodiments of camera module features and components, are disclosed in US Pat. Nos. 7,224,056, 7,683,468. , No. 7,936,062, No. 7,935,568, No. 7,927,070, No. 7,858,445, No. 7,807,508 No. 7,569,424, No. 7,449,779, No. 7,443,597, No. 7,768,574, No. 7,593,636 No. 7,566,853, No. 8,005,268, No. 8,014,662, No. 8,090,252, No. 8,004,780 , No. 8, 119, 51 No. 7,920,163, No. 7,747,155, No. 7,368,695, No. 7,095,054, No. 6,888,168 No. 6,583,444, and 5,882,221, and US Patent Application Publication Nos. 2012/0063761, 2011/0317013, 2011/0255182. No., 2011/0274423, 2010/0053407, 2009/0212381, 2009/0023249, 2008 / 0296,717, 2008/0099907 No. specification, 2008/0099900 specification, 2008/0029879 specification, 2007/0190 No. 47, No. 2007/0190691, No. 2007/0145564, No. 2007/0138664, No. 2007/0096312, No. 2007/0096311, No. 2007/0096295 No. 2005/0095835, No. 2005/0087861, No. 2005/0085016, No. 2005/0082654, No. 2005/0082653, No. 2005/0067688 , And US patent application 61 / 609,293, and PCT applications PCT / US12 / 24018 and PCT / US12 / 25758, all of which are cited. Is incorporated herein by reference.

MEMS Actuator In the example of FIGS. 2A-2B, the MEMS actuator is coupled to L3 (in the example of FIG. 1, to movable lens groups L1-L4) to provide an autofocus function in one embodiment. In other embodiments, a voice coil motor (VCM) or a piezoelectric actuator can be used to provide a moving function.

  Suitable MEMS actuators are described in some of the U.S. patents and U.S. patent applications incorporated herein by reference, e.g., U.S. Patent Application No. 61 / 622,480. Please refer. Another MEMS actuator having a somewhat different design is described in US-PCT Application No. PCT / US 12/24018. Both of these US patent applications are incorporated by reference, and in the following, other examples of MEMS actuators and components thereof are cited and incorporated as providing alternative embodiments. Such actuators can be made of silicon or a substantially polymeric material and can have a stroke around 100 um. In addition, these actuators also exhibit several other advantageous properties that are provided for an autofocus zoom camera module of the type described. These advantageous properties include very low power consumption, fast and accurate operation, low noise, negligible particulate contamination, and low cost.

  While a MEMS actuator according to one embodiment allows for advantageous alignment in three axial directions, a MEMS actuator according to one embodiment may be any centering movement or tilt alignment that can be attributed to the actuator component. If movement is excluded for the time being, it can generally be considered a unidirectional device. That is, the MEMS actuator according to one embodiment has a rest position and is driven in one axial direction from the rest position, that is, when used to implement an autofocus mechanism. This drive has an advantage in the assembly of autofocus camera modules in that it allows the entire lens array or a substantial portion thereof to be assembled as a single pre-aligned component. In this case, in the subsequent assembly and calibration phases, this lens array can be processed in the same way or in the same manner as the lens array of a fixed focus camera, i.e. the holder containing the lens array is placed on the image sensor. Focus can be set by inserting it into a fixed sleeve. In one embodiment, the holder and the sleeve are joined by a thread.

In one embodiment of a camera module having a protective cover, an optical surface can be added to the image sensor as a single component. This optical surface serves as a cover made of clear glass or polymer to prevent dust or other contaminants from reaching the working surface of the sensor and at the same time allow visible light to pass to the sensor. Can function. This optical surface can function as an infrared (IR) filter, particularly for silicon sensors. The cover can use an IR absorbing material, or an IR coating can be applied to a glass, polymer, or other optically clear protective cover. The optical surface can be formed to give a refractive power as in the case of the lens L1 facing backward, as in the example of FIGS. 4A to 4B, and the IR filter can be formed between the sensor and the lens L1. (See US patent application Ser. No. 13 / 445,857, incorporated by reference, not shown). The process for forming a single component in the wafer process prior to dicing will be described only briefly below, and this process is described in more detail in the '857 application.

  FIGS. 4A-4B illustrate a unitary component that includes an active image sensor protected from contamination using, for example, a wafer level hybrid optics. This scheme reduces the overall physical Z height of the camera module, i.e., along the optical path perpendicular to the sensor plane, by incorporating such hybrid optics with camera module components. It has another advantage that it can.

  The working image area on the image sensor is protected according to one embodiment in the wafer process prior to dicing or isolating the image sensor wafer into discrete dies. In one embodiment, the protection of this working image area is transparent to glass wafers such as blue glass or IR-coated glass, or other materials such as polymers, or visible light and absorbs IR light, This is achieved by attaching other materials besides blocking. By adding wafer level optics elements as in the example of FIGS. 4A-4B, this improved protection of glass protection can be obtained.

  FIG. 4A schematically illustrates an example of a camera module that includes a wire bond coupled to a camera module component. FIG. 4B schematically shows an example of a camera module including a flip chip. The example of a camera module schematically shown in FIG. 4B can use a thermocompression bonding process or an ultrasonic thermocompression bonding process. These steps are described in more detail in the exemplary embodiment in US patent application Ser. No. 13 / 445,857, which is incorporated by reference.

  Within the autofocus and optical zoom camera module according to various embodiments, a distortion correction component, a chromatic aberration correction component, luminance, chromaticity, and / or luminance contrast or chromatic contrast enhancement component, blur correction component, And / or there are processor-based components such as extended depth of field (EDOF) and / or extended dynamic range or high dynamic range (EDR or HDR) components.

  Another example is shown schematically in FIGS. 5A and 5B, which is also described in US patent application Ser. No. 13 / 445,857, incorporated by reference above.

  5A-5B include examples of structural components of a camera module according to one embodiment illustrated in cross-sectional and plan views, respectively. The planar substrate forms the base of the camera module of FIGS. 5A to 5B. The purpose of this substrate is to provide structural support, and thus suitable materials include metals (eg, titanium), ceramics (eg, alumina), and rigid polymers such as bakelite. The substrate material can be molded, or one or more other methods for making an array of through holes therein can be used. In one embodiment, these through holes will eventually be completely or partially filled with a conductive material as part of a structure that provides an electrical interface to the camera module. The substrate is very thin because it contributes to the overall height of the camera module, but is nevertheless sufficiently rigid. In one embodiment, the mechanical properties of the substrate material, including modulus and fracture toughness, are carefully selected. The substrate can be around 200 microns thick and can have a thickness in the range between about 50 microns and 400 microns.

  In the exemplary embodiment illustrated in FIGS. 5A-5B, the image sensor and cover glass are combined on approximately the central portion of the substrate. Image sensors can be magnetically bonded using adhesive joints, using one or more clips or complementary slide-fixed or twist-fixed components, or static bonded, heat shrink or compressed shrink, or stretched It can be attached to the substrate using a mating joint that utilizes a mating or otherwise. A flexible circuit is attached in this example over a significant portion of the remaining portion of the substrate. The attachment method can be an adhesive joint or one of the methods just described above, or another technique. In one embodiment, the flexible circuit may include a thin conductive line made of copper or other metal or conductive polymer embedded in and / or within a soft polymer material such as polyimide. . An opening or other mechanism can be used to provide access to the copper line for the purpose of making electrical connections.

  As shown in the example of FIGS. 5A to 5B, the flexible circuit has an opening smaller than the image sensor in a plan view area. Thereby, the flexible circuit can be arranged on the image sensor such that the bonding pad on the image sensor is covered by the flexible circuit. In this way, an electrical joint can be made between the bond pad on the image sensor and the appropriate land on the flexible circuit. In accordance with some embodiments, various methods and materials are used to make such a joint, examples of which include conductive adhesives, hot pressure bonding, solder joints, and ultrasonic welding.

  The image sensor is electrically coupled or connectable to a flexible circuit and, according to one embodiment, routes electrical connections to other locations that can include active and / or passive components. Allows tracking on a flexible circuit to specify. Active and / or passive components can be attached and interconnected to the flexible circuit using existing methods and techniques in various embodiments. In FIGS. 5A-5B, three passive components are included in the camera module, along with 10 bond pads and 8 through-hole solder interconnects, but these numbers, installation points, shapes, and The size is provided as an embodiment, and many variations are possible.

  In one embodiment, the external electrical connection to the camera module includes an electrical connection to an appropriate land on the flexible circuit. By design, these lands are advantageously provided over the through holes in the substrate. 5A-5B depict copper pillars for these electrical interconnects, the electrical interconnects may include various materials including solder pillars, stacked stud bumps, conductive adhesives, and / or deep access wire bonds. And can be manufactured from the structure. Other embodiments include mechanical structures such as spring-loaded elements and pogo pins. When solder pillars are used, during solder reflow, the external interface of the camera module changes shape to a hemisphere around to resemble an interconnect in a semiconductor package similar to a ball grid array. The structural example shown in FIGS. 5A-5B includes a planar flexible printed circuit, but in other embodiments it has one or more weak bends, in others, the FPC is bent into a U shape. It is done.

  5A-5B schematically illustrate an image sensor disposed in a recess in the substrate such that the image sensor bond pad is on the same level as the bottom surface of the flexible circuit, but in other embodiments, offset them. be able to. Any fine adjustment of this alignment can take into account the thickness of the bonding medium used to attach and connect the flexible circuit to the bonding pad.

Example Camera Module Overview FIGS. 6A-6C are exploded views, top views, and examples of camera modules that include certain components that can be included with the image sensor and optical train components, respectively, in an exemplary overview. It is shown in the side view. The other components shown in FIG. 6A include an EMI shield or EMI housing 601, a light leakage baffle 602, a lens barrel bracket 603, an actuator and lens barrel assembly 604, blue glass or other IR filter components (especially silicon). 605 in the sensor embodiment, a sensor component 606 (shown to be coupled to the flexible printed circuit FPC using a bus connector), and a bottom sponge 607.

  The module size may be less than 10 mm on each side, and in one embodiment may be less than 9 mm on each side, one embodiment of the X and Y directions (image sensor plane perpendicular to the optical path). Can be 8.6 mm without EMI tape, or even 8.5 mm, and in one embodiment in the Z direction (parallel to the optical path perpendicular to the sensor plane) is less than 8 mm with EMI tape, Or even less than 7 mm, and in one embodiment, less than 6.5 mm or 6.4 mm, such as 6.315 mm, and less than 6.3 mm without EMI tape, such as 6.215 mm. It can be.

  In the following, most of the components 601-607 will be described with reference to one or more of FIGS. 7-14B, here briefly summarized with reference to FIGS. 6A-6C. To do. In the example of FIG. 6A, the light leakage baffle 602 is shown having a baffle outer diameter that substantially matches the diameter of the focusing aperture 608 defined at the object end of the camera module. The baffle inner diameter is large enough to allow an image to be captured by the camera at some exposure, but small enough to block unwanted light. In another embodiment, the outer diameter of the light leaking baffle 602 is larger than the opening 608, but the EMI housing material overlying the baffle 602 can be significantly thinner than the rest of the EMI housing 601, or The overlapping EMI housing material can in any case be placed high enough to allow movement of this assembly to the end of the range of the lens assembly of the example of FIG. 1 or FIG. The light leakage baffle 602 according to one embodiment has EMI blocking properties that assist the EMI housing at the focusing aperture 608.

  In FIG. 6A, the IR filter 605 is shown as a separate component that is attached to, coupled to, disposed on, or slightly spaced from the sensor, but as described above, the IR filter 605 Can be formed at the wafer level along with the sensor to be coupled to the sensor so as to form a cavity by the cavity wall, and at the same time, in the above-described embodiment, a lens, for example, L5, optionally closest to the image sensor, It is formed at the wafer level together with a sensor and an IR filter.

  In the example of FIG. 6A, the sponge 607 is shown in an L-shape, which can be U-shaped and can be four sides, and the fifth side is where the FPC just penetrates the sponge. Up to or below, for example, one embodiment including the example of FIG. 6A may have a space that allows it to protrude substantially coplanar with the top of the bottom sponge. In addition, the brackets connectable to the actuator pad from the bottom of the bracket where these traces can be connected to the FPC to control the conductive traces 609A and 609B by biasing the actuator to move the lens for autofocus. It is shown extending to the top.

Electromagnetic Interference (EMI) Housing FIG. 7 illustrates an EMI housing 701 that physically includes optical and electronic components such as a lens and MEMS actuator assembly 704 including an optical train including a plurality of lenses and MEMS actuators, for example. 1 schematically illustrates an exploded view of an example autofocus camera module according to one embodiment. The EMI housing 701 functions as an electromagnetic interference (EMI) shield for the components contained therein. In one embodiment, the EMI housing is made of a conductive or semiconductor material, or includes a conductive or semiconductor layer over a polymer or other insulating durable frame. The EMI housing 701 of the example autofocus camera module of FIG. 7 moves the encapsulated lens barrel through a focusing aperture at the object end of the camera module or at least one or more lenses at the object end of the optical train. Movement is also advantageously possible.

The light leakage baffle 702 with EMI capability is coupled to the outer surface of the housing 701 in this exemplary embodiment using an adhesive such as, for example, conductive glue. The light leakage baffle can have an EMI characteristic portion 702A that overlaps the opening 708 in the Z direction parallel to the optical path of the camera module. The opening 702B defined in the light leakage baffle is surrounded by the EMI portion 702A, while the outer portion 703C that overlaps the material of the EMI housing 701 in the Z direction may or may not have EMI characteristics. In particular, the outward movement of one or more movable lenses or lens barrels of the optical train in a focus movement, such as an autofocus search, to allow the camera module to capture the desired exposure and sharpness images. Coupling light leakage baffles 602, 702 to a location along the Z axis that allows alignment while remaining in the XY plane, eg, light leakage baffles 602, 702 of one or more movable lenses or lens barrels In another approach, such as coupling to the object extreme, the outer portion 703C is optional, as shown in the example of FIG. 6A.

  In the exploded view of FIG. 7, the light leakage baffle 702 according to one embodiment is used with an adhesive such as conductive glue, or alternatively with one or more passive alignment clips. Or it is shown schematically to be coupled to the top of the EMI housing using a combination thereof. The light leakage baffle can include a layer of conductive material such as carbon feather, 2D carbon or graphene, conductive polymer thin film, metal, or a combination of insulator and conductive layer, or alternatively light leakage baffle 702. Can be made of the same material as the EMI housing, except that this baffle can be elevated to allow movement of the lens barrel, or can be attached separately by an adhesive or clip. . The light leakage baffle 702 can define a camera aperture or bound or surround the camera module aperture or otherwise transmit desired exposure light while unwanted stray light is transmitted through the first aperture. It can be prevented from entering or exiting the camera module.

  FIG. 8 shows the camera module of FIG. 7 without the EMI housing being disassembled from the lens and MEMS actuator assembly and / or showing the EMI housing coupled to the lens and MEMS actuator assembly. FIG. 8 illustrates an EMI housing 701 spaced (for illustrative purposes) from a light leakage baffle 802 that may include carbon feathers or other conductive materials having EMI blocking properties.

  FIG. 9 shows the camera module of FIGS. 7-8 including an EMI housing 901 with a light leakage baffle 902 mounted on the outer surface. The light leakage baffle 902 of FIG. 9 defines an opening to the camera module in one embodiment, and in other embodiments, a small portion of the area surrounding the camera module internal electronics remains unprotected by the EMI shielding material. As such, at least the amount of open area left by the larger focusing aperture 608 (see FIG. 6A) of the EMI housing 901 is at least reduced.

Conductive Trace Actuator Control FIGS. 10A and 10B schematically show top and bottom views of an EMI housing 1001 for an autofocus camera module according to one embodiment. The EMI housing 1001 of FIGS. 10A-10B may have an insulating frame made of a durable polymer or plastic material having an EMI coating 1002 on the outer surface, for example. Alternatively, the housing 1001 can have an insulating layer on a conductive or semiconductive frame, or can be generally conductive or semiconductive, but nevertheless. The zigzag trace 1003 is electrically separated from the conductive frame by providing a conductive trace on the insulating trace or by providing an insulating tube within the frame 1004 or the structural component of the bracket 1004 inside the housing 1001. Is done.

  The EMI housing 1001 in the example shown in FIG. 10A has an EMI coating 1002 on the outer surface. FIG. 10B shows conductive traces provided according to the inner surface of the EMI housing 1001. The conductive trace 1003 is configured to connect the electronic actuator component of the camera module to an electronic pad or printed circuit according to one embodiment. In this example, conductive trace 1003 is electrically isolated from EMI coating material 1002 because the material of housing component 1001 is non-conductive. Trace 1003 can be connected to a pair of actuator control pads at the object end of the assembled camera module. At the sensor end of the camera module, conductive traces can be connected to the FPC contact pads. The internal structure 1004 of the housing 1001 can be built-in or formed with the outer housing 1001, or can be a separate bracket component, such as the bracket 603 shown in the example of FIG. For example, a MIPTEC (microscopic integrated processing technology) bracket from Panasonic can be used, or another molded frame with a pair of fine electrical traces can be used.

  FIGS. 11A-11B include an embodiment that includes a lens barrel 1104 that is both coupled to and aligned with a sensor component 1107, or a lens barrel 1104 that is configured to be coupled with a sensor component 1107. 1 schematically shows a perspective view and an exploded view of an autofocus camera module according to FIG. The lens barrel 1104 in this embodiment is at least partially enclosed within a bracket 1101 having a conductive trace 1102 at the top. The conductive trace 1102 in this example extends along the outer surface of a bracket 1101 that can be packaged with a protective EMI housing (not shown in FIGS. 11A-11B). In other embodiments, the conductive traces 1102 are incorporated along the sensor component or sensor component housing, or partially along the outer surface of the lens barrel 1104, or through the sensor housing or sensor (e.g., incorporated by reference). Can be extended using thermal vias, through-silicon vias, conductive vias, or copper vias in US20110200133 or 200801573323. Conductive trace 1102 connects contact pad 1103 of electronic actuator component 1105 to contact pad 1106 of flexible printed circuit 1107 or printed circuit board 1107 according to one embodiment.

Sponge Absorption System FIG. 12 schematically illustrates an exploded view of an impact protected camera module or sponge absorption camera module that includes one or more sponges 1210, such as those described above with reference to FIGS. For example, four sponges 1210 are shown disposed between a housing 1201 that can include an EMI housing such as this and an autofocus optical component of a MEMS or other movable lens activated autofocus camera module 1205. The housing 1201 is configured to move independently of the internal camera module 1205 in response to an external impact that is absorbed by compression of one or more of the sponges 1210 and is not transmitted to the internal module 1205. In one embodiment, the sponge 1210 is provided on each of the four sides of the EMI housing 1201. Advantageously, in one embodiment, the sponge 1210 does not overlap the internal module 1205 in the optical path direction or Z direction, and therefore does not add to the overall Z height of the optical module 1205, but nevertheless the optical path. It functions to absorb the impact in the Z direction.

  In the example of FIG. 12, each sponge 1210 is illustrated as a rectangular parallelepiped having six rectangular surfaces or a hexahedron having three pairs of parallel surfaces. However, one or more of the sponges 1210 have different shapes, such as having more or less than six faces and / or having one or more curved and / or stepped faces. Can be. For example, one or more of the sponges 1210 may include gyroscopes, accelerometers, orientation setting sensors for image analysis or image processing such as detection, tracking, and / or recognition of faces or other objects. Or a notch for passive or active components such as hardware acceleration components, or any regular or irregular size or shape, passive or active alignment features An autofocus digital camera module component or a notch for receiving the camera module can be included. The sponge is of a shape that is conformal to the irregular inner shape of the housing 1201 according to one embodiment in which the camera module housing 1201 is shaped to match other components in the tightly embedded device. It can be.

  A plurality of sponges may be used that may or may not overlap in either direction on each of the one or more surfaces. For example, placing conductive traces, thin batteries, or other electrical components connecting a printed circuit, image sensor, and / or processor with a MEMS actuator contact pad between a pair of sponge halves or partial sponges Can do.

  Another optional sponge 1211 can be included on the back side of the camera module that is close to the image sensor but opposite the working image sensor plane from the optics of the optical module 1205. According to one embodiment, the camera module 1205 can be coupled to the flexible printed circuit FPC at the sensor end, and the optional bottom sponge 1211 can protect the camera module from impact on either side of the FPC. . The bottom sponge 1211 is advantageously thin or completely eliminated to maintain the thin profile of the camera module, but as will be described in more detail below with reference to FIGS. 14A-14C. The shock absorbing sponge nature and placement of the XY sponge 1210 and housing 1201 relative to the optical module 1205 can be applied along the Z impact or vibration, such as falling, or the optical axis or Z axis of the camera module. It nevertheless achieves the role of sufficiently protecting the camera module from unexpected external forces. In another alternative embodiment, the sponge can be included at various locations along the optical path, for example, between the lens components, and / or the light leakage baffle described above can be added to the image in addition to the EMI coating or EMI layer. A sponge-like layer having an opening may be included so that light rays are not blocked on the way to the image sensor.

  The use of a sponge-like or other soft material mounted inside the EMI housing 1201 of the camera module absorbs all three spatial vibrations and shocks from the external environment. Alternatively, the soft or sponge-like material is insulated from the interior of one or more walls of the housing 1201 or between two components or materials of the housing 1201, for example, EMI components of the housing 1201. Can be provided between the components, or the insulating component itself functions to prevent or dampen shocks or vibrations, while at the same time one or more conductive traces do not short circuit with any EMI blocking material A soft or sponge-like material that can also extend along the housing can be included. The use of a sponge-like or other soft material mounted between the inner surface of the EMI housing and the camera module 1205 favors the failure of one or more components due to forces that impact the module housing 1201 from the outside environment. Stop.

  13A-13B schematically illustrate an assembly view and a partially exploded view of an impact-protected camera module or sponge absorption camera module according to one embodiment. The outer EMI housing (not shown in FIGS. 13A-13B, see, eg, the EMI shield 1201 of FIG. 12A coupled to or not coupled to the light leakage baffle of FIG. 9) allows the camera module to The camera module can be assembled to be packaged as shown in the assembly diagram of FIG. 13A to be protected from physical shock and vibration, and electromagnetic interference and dust, fingerprints, and the like.

  FIG. 14A schematically illustrates a cross-sectional view of an xyz compression sponge absorption camera according to one embodiment. Immediately inside the EMI shield 1401 is a sponge 1402. One on each of the four planes of the example camera module of FIG. 14A, on the left and right sides of the internal module 1404 in the cross-sectional view of FIG. 14A, with a wide spread over the horizontal axis direction X or Y There can be four sponges including two sponges 1402. In the cross-sectional view of FIG. 14A, the thin axial direction of the sponge is perpendicular to the optical Z axis of the camera module, while the sponge 1402 in this example is longer than the other two spatial axial directions. One sponge 1402 is placed on any side of the internal optical electronics of the camera module of FIG. 14A. There can be a different number of sponges, including three, two, or one, or there can be one or two L-shaped sponges each protecting two sides, or a U-shape A three-sided or four-sided sponge, such as a sponge or a square surrounding sponge, can be used. In other embodiments, a very thin bottom sponge 1403 can be provided. In the embodiment illustrated in FIGS. 14A, 14B, and 14C, shock and vibration in the Z direction are advantageously absorbed without adding a thick sponge to the Z height. In one embodiment, undesirable Z height due to the thickness of bottom sponge 1403 is not added. Z-impact and Z-vibration are absorbed due to the advantageous design of the side sponge 1402 that compresses and absorbs shock into the sponge material disposed between the EMI housing 1401 and the internal component 1404 that the camera module has inside. Is done.

  FIG. 14B shows a sponge absorption camera module according to one embodiment featuring advantageous sponge Z compression gaps 1405A and 1405B provided between the EMI housing 1401 and the portion of the molded bracket 1408 that overlaps the EMI housing in the Z direction. Is abbreviated. There may be one or more other such locations where the housing 1401 overlaps the bracket 1408 in the Z direction and is further provided with one or more gaps 1405A, 1405B having a Z depth.

  At the object end, the light leakage baffles (602, 702, 802, 902) described above are located at the object end of the optical train 1404 so as to allow movement of one or more movable autofocus lenses. It is previously arranged away from the lens surface. The housing 1401 can move along the Z direction when one or both sponges 1402 compress and absorb the Z impact, but during this compression movement, the Z impact causes the sponge 1402 to move in the Z direction. No contact is made between the housing 1401 and the internal module 1404 unless it is larger than the sponge compression gap 1405A. FIG. 14B shows an initial sponge z length 1406, which is designed in combination with these gaps 1405A, 1405B to optimize the protective elasticity according to one embodiment.

  The amount of space provided between the last object end face of the internal module 1404 and the light leakage baffle is determined by the combination of the space allocated so that the movable lens group can extend to the edge of the autofocus range. Thus, for example, the light leakage baffle can be separated by a gap 1405A from the last object end face of the camera module at the extreme end of the camera module focus range. This gap may vary with the camera module design, for example, in the design of FIG. 2A with a fixed outer lens group G1, the housing itself with a small aperture or light leakage baffle is the most object side of the lens L1. In other embodiments, such as in the design of FIG. 1, the sponge compression gap 1405A may add only to the longest extension of the most object-side surface of L1. can do. The housing 1401 is directed toward the bracket 1408 and / or the interior such that the sponge 1402 can be sufficiently compressed to absorb shock without the housing 1401 contacting any part of the bracket 1408 or the internal module 1404. Various gaps can be provided such that the sponge 140 can be independently moved relative to the components of the module 1404 by a sponge compression length 1405.

  In one embodiment, the housing 1401 has a shorter side on which the flexible printed circuit is coupled to the camera module than the other side. In order to allow movement of the housing 1401 toward the FPC without contact with the FPC, the bottom of the FPC side housing 1401 is separated from the FPC by at least the sponge compression gap 1405. The other three sides of the camera module housing 1401 also have a clearance to move without touching anything. The housing 1401 can be coupled to one or more clips 1409 of the internal bracket 1408 by defining therein one or more openings, notches, or stepped milling portions from its inner surface. In one embodiment, as in the example shown in FIGS. 14A-14C, one or more clips 1409 engage or fit with corresponding one or more openings in the housing 1401 to provide the housing 1401. When coupled with the bracket 1408 and the internal module 1404 and passively aligned, the sponge 1402 compresses slightly. For example, in FIG. 14B, another clip 1409 can be included in an alternative embodiment, the clip 1409 can be provided, for example, on the back surface, whereby the bracket 1408 is coupled to three openings in the housing 1401 3. There are two clips 1409. Each opening in the housing includes a gap 1405B to allow relative movement between the housing 1401 and the bracket 1408, particularly the clip 1409.

  In other embodiments, the housing 1401 has an image end or sensor end (or view) to allow movement in the Z direction relative to a printed circuit or sensor board or other closest component obstacle during sponge compression. 14B at the bottom). FIG. 14B shows a housing gap 1405B through which the EMI blocking housing 1401 can freely enter when the sponge 1402 compresses due to a Z impact. Below the gap 1405B, the lower housing segment 1408 (see bracket 603 in FIG. 6A or bracket 1101 in FIG. 11B) is used with the clip 1409 or at the outer diameter location of the camera module below the gap 1405B. It can be configured using a curved or inclined protrusion that contacts with.

  Alternatively, the diameter of the camera module below the housing 1401 can be reduced in all further portions. To allow the outer housing 1401 to move with the compression of the sponge 1402 without impacting the inner camera module 1404, the gap 1407 can extend around the full extent of the XY plane of the housing 1401. Or a continuous portion of the housing may be around the sensor substrate or FPC or have similar gaps therethrough or gaps defined below in various combinations.

  FIG. 14C is an illustration of after / Z-compression showing a housing 1401 extending into the gaps 1405A and 1405B when the sponge is reduced from a free length 1406 to a short compressed sponge z-length 1407 according to one embodiment of the advantageously synergistic camera module architecture. FIG. 14B schematically shows the camera module of FIG. 14B in the middle. Gaps 1405A, 1405B are provided, ie, a gap 1405A is provided between the object end of the internal camera module 1404 or bracket 1408 and the overlapping housing portion 1401, and a gap 1405B is provided between the clip 1409 and the housing 1401 at the top of the clip opening. And possibly by providing a gap elsewhere, for example, between the FPC and the bottom of the housing 1401, the internal module 1404 can be damaged or have performance errors due to Z impact. This Z impact is advantageously absorbed using the sponge or softness in the plane of the sponge 1402, while the X and Y impacts are also spongy in the xy plane axial direction of the same sponge 1402. Absorbed using, soft, and large area.

  The camera module in FIG. 14C is shown in a compressed state of two sponges shown on the left and right sides of the internal module 1404. For example, an external impact having a significant component in the direction along the Z direction perpendicular to the optical path of the camera module or perpendicular to FIG. 14C is caused by sponge compression from the free length 1406 of FIG. 14B to the compression length 1407 of FIG. 14C. It has just been absorbed. The outer housing 1401 is moving toward the bracket 1408 relative to the bracket 1408 without contacting the bracket 1408 due to the advantageous design of the camera module schematically illustrated in FIGS. 14A-14C according to one embodiment. .

  With respect to one passive alignment feature 1409 of bracket 1408 that locks into the opening shown on the right side within housing 1401, the housing material defining the top of the passive alignment opening of FIG. 14C is relative to bracket 1408 and clip 1409. The clip 1409 has no contact between the housing 1401 and the bracket 1408. Each of the three sides on the left 1410B, right 1410C, and back 1410D of the housing 1401 at the bottom of the camera module moves lower than the bottom layer 1411 of the sensor module during compression following a Z-direction impact on the camera module. There is nothing that touches these sides.

  The fourth side of the camera module in this embodiment has a higher bottom position than the other three sides, so that a flexible printed circuit (FPC) coupled to the image sensor is exposed to external impact during operation. When moving the fourth side of the housing 1401 relative to the sensor and the FPC coupled thereto, the digital image data, metadata, without touching and damaging the bottom edge of the fourth side of the housing, Signals including commands and / or power can be carried or other camera module electronic interconnections can be retained and the FPC couples to the camera module at or near the image sensor component, for example, Under a fourth side (eg, see FIG. 12) placed at a relatively high position, or the fourth of the deformation housing 1401 It is possible to configure the FPC to leave or therefrom approaching through the slot in the side surface.

In another embodiment of the FPC extension , at least some size to the actuator contact pad at or near the object end of the camera module or at least significantly away from the original FPC connection to the sensor component. FPC electrical connections to MEMS actuator control signal pads and / or power input pads are provided to include trace connections. The FPC in the embodiment of FIGS. 15A-15C is bent around the camera module from the original physical and electronic FPC connection in the sensor component and to the electronic actuator pad opposite the sensor end of the camera module. Make a second electronic connection. The FPC is an actuator pad that is physically and electronically aligned so that the alignment is sufficiently precise to the extent that it does not block the optical path of light that forms an image with sufficient exposure on the image sensor. Can have specially shaped ends or FPC extensions that connect to

  15A-15C schematically illustrate a camera module according to one embodiment with a perspective view before FPC bending, a top view during FPC bending, and a perspective view from another angle after FPC bending. The camera module 1501 is physically and electronically coupled to the sensor connection segment 1502A of the foldable flexible printed circuit (FPC) 1502 of FIG. 15A at the location of the sensor component. Certain electronic devices 1503 can be coupled to side segment 1503A, in which case these electronic devices occupy a single side that is occupied by electronic device 1503 and encapsulated by side segment 1503A of FPC 1502 For example, use of a U-shaped bracket or an internal EMI housing frame fits within the open space. A portion of this empty space may include an accelerometer and / or orientation sensor (eg, US patent application 61 / 622,480 assigned to the same applicant as the present application and incorporated by reference). And 61 / 675,812). The FPC 1502 in the embodiment of FIG. 15A includes an FPC extension 1504 that can be a sensor connection segment and side segment 1503 followed by an end segment displaced by a strict amount from the sensor connection segment 1502 or simply an FPC segment 1504. In addition. The FPC extension segment 1504 includes two or more conductive side pads 1504A for making electrical contact with actuator pads at the image end of the lens barrel of the camera module. The FPC extension 1504 or end segment is a partial overlap with the aperture of the camera module so that the desired imaging beam is not blocked from entering the camera module and the unwanted beam is blocked from the central portion of the optical path. A semi-circular or complete cutout 1505 can be defined. In an alternative embodiment, FPC 1502 is connected to the sensor end of the camera module at the FPC end segment, bent at the periphery to connect to the actuator pad, and from actuator connection segment 1504 (from sensor segment 1502A as shown). (But not) can follow the connection outside the camera module. The FPC extension 1504 may have EMI blocking properties similar to any of the light leakage baffle examples 602, 702, 802, 902 of FIGS. 6A-9 referenced above.

  16A-16B schematically illustrate a camera module according to one embodiment before and after FPC bending similar to the embodiment described immediately above with reference to FIGS. 15A-15B. The FPC 1601 is physically and electrically coupled to the sensor end of the camera module 1602 and uses a pinching and / or gripping hook fitting or FPC conductive pad notch 1604 on the actuator end and Protruding actuator control contact pads 1603 and / or other passive complementary features such as dedicated physical coupling protrusions and / or notches can be used to attach the actuator contacts 1603 with sufficient physical coupling stability. Configured to be electrically coupled. Does the same FPC segment 1605 including the actuator pad conductive contact 1604 function as a light leakage baffle, for example, as an alternative to the light leakage baffles 602, 702, 802, 902 of the embodiment described with reference to FIGS. 6A-9? Or it may have an opening 1606 similar to the embodiment of FIGS. 15A-15B configured to couple thereto. In addition to the embodiment of FIGS. 6A-9, the embodiment of FIGS. 15A-16B provides room in the Z direction that provides an advantageous autofocus range for lens group movement. Without this, it is believed that light leaked in the gap between the outer optical system and the autofocus aperture (eg, aperture 708 in FIG. 7) when the outer optical system was not extended through the autofocus aperture. . Similar to conventional embodiments, the FPC segment 1605 can have EMI blocking properties that make this segment multi-beneficial and multifunctional.

  While illustrative drawings and specific embodiments of the present invention have been illustrated and illustrated, it should be understood that the scope of the present invention is not limited to the specific embodiments described. Accordingly, these embodiments should be considered exemplary rather than limiting, and one of ordinary skill in the art will appreciate that changes can be made to these embodiments without departing from the scope of the present invention. There must be.

  In addition, in the method described above, which can be performed according to the preferred embodiments herein, the operation has been described in a selected representative order. However, these orders are chosen for convenience of explanation and are ordered as such, and if a specific order can be clearly indicated or a person skilled in the art thinks that a specific order is necessary. It is not intended to imply any particular order in which the actions are performed, except where possible.

  In addition, all references contained herein above and below are incorporated by reference, as well as “Background”, “Summary”, and “Brief Description of the Drawings”, and US Patent Application No. No. 12 / 213,472, No. 12 / 225,591, No. 12 / 289,339, No. 12 / 774,486, No. 13 / 026,936, No. No. 13 / 026,937, No. 13 / 036,938, No. 13 / 027,175, No. 13 / 027,203, No. 13 / 027,219, No. 13 / 051,233, 13 / 163,648, 13 / 264,251, and PCT application WO 2007/110097, and US Pat. No. 6,873,358 and Each RE42,898 Pat are incorporated by reference as disclosing alternative embodiments within the detailed description of embodiments.

  The following documents are also incorporated by reference as disclosing alternative embodiments: US Pat. Nos. 8,055,029, 7,855,737, 7,995,804. , No. 7,970,182, No. 7,916,897, No. 8,081,254, No. 7,620,218, No. 7,995,855 , No. 7,551,800, No. 7,515,740, No. 7,460,695, No. 7,965,875, No. 7,403,643 , No. 7,916,971, No. 7,773,118, No. 8,055,067, No. 7,844,076, No. 7,315,631 , No. 7,792,335, No. 7,680 No. 342, No. 7,692,696, No. 7,599,577, No. 7,606,417, No. 7,747,596, No. 7,506 No. 057, No. 7,685,341, No. 7,694,048, No. 7,715,597, No. 7,565,030, No. 7,636, No. 486, No. 7,639,888, No. 7,536,036, No. 7,738,015, No. 7,590,305, No. 7,352 No. 394, No. 7,564,994, No. 7,315,658, No. 7,630,006, No. 7,440,593, No. 7,317, 815 and 7,289,278, as well as US patents Application Nos. 13 / 306,568, 13 / 282,458, 13 / 234,149, 13 / 234,146, 13 / 234,139 13 / 220,612 specification, 13 / 084,340 specification, 13 / 078,971 specification, 13 / 077,936 specification, 13 / 077,891 specification 13 / 035,907, 13 / 028,203, 13 / 020,805, 12 / 959,320, 12 / 944,701 , And 12 / 944,662 as well as US Patent Application Publication Nos. 20120019614, 20120019613, 2012080002, 20111021. No. 6156, No. 20110205381, No. 20100007942, No. 20110112227, No. 201101250506, No. 20110102553, No. 2011039582, No. 2011017474, No. 20100321537 Specification, 201101141226, 201100141787, 2011081052, 20100066822, 20160026831, 20090303343, 20090238419, 20100272363 , 20090189998, 20090189997, 20090190303, No. 0090179999, No. 20090168793, No. 20090179998, No. 20080803769, No. 20080266419, No. 20080220750, No. 20080219517, No. 20080196466, No. 20090130663 Specification, 20080112599 specification, 20090080713 specification, 20090080797 specification, 20090080796 specification, 20080219581 specification, 20090111515 specification, 20080309770 specification, 20070296833 specification , And 20070269108.

L1, L2, L3, L4 Movable lens L5 Fixed lens

Claims (11)

An autofocus digital camera module,
A housing;
An image sensor in the housing;
At least one movable lens in the optical path for focusing a subject on the image sensor located in the housing, aligned with the image sensor to define an optical path and disposed within an autofocus range of a camera module An optical train including a plurality of lenses including the at least one movable lens coupled to a lens actuator configured to move along;
A flexible printed circuit (FPC) that includes a sensor segment coupled to the image sensor to power a camera module and carry an electronic signal including a digital image captured by the image sensor;
Including
The FPC is configured to electrically couple to a lens actuator contact pad and carry a lens actuator control signal when the FPC is folded around the camera module from the sensor end to the object side end. Further comprising an extension segment including a contact pad ;
The extension segment of the FPC is a light leakage baffle such that when the FPC is folded onto the housing, the light leakage baffle is disposed on the subject side of the optical train and a baffle cavity overlaps the light path. A light leakage baffle defining a baffle cavity at a predetermined distance from the image sensor,
A camera module characterized by that.   The camera module according to claim 1, wherein the flexible printed circuit includes an intermediate segment that encloses at least one side portion of the camera module between the sensor segment and the extension segment. The camera module according to claim 1, wherein the extension segment is coupled to an object side end of the camera module opposite to the sensor segment coupled to the sensor end of the camera module.   The camera module of claim 1, wherein the housing includes an electromagnetic interference (EMI) coating on an outer surface. The housing forms therein the autofocus range at least partially sufficiently large focusing opening as to protrude therethrough the object-side end portion of the optical train at one end of,
A light leakage baffle partially overlaps the focusing aperture outside the autofocus range at the object side end of the optical train;
The camera module according to claim 1. 6. The camera module of claim 5 , wherein a baffle cavity is formed in the light leaking baffle that is smaller than the focusing aperture and that allows light to enter the camera module to acquire an image. The light leakage baffle passes through a focusing aperture defined in the housing to allow an object side end of the optical train to protrude at least partially therethrough at one end of an autofocus range. The camera module of claim 1 , wherein the camera module is configured to prevent any ambient light from entering the camera . The camera module according to claim 1 , wherein the light leakage baffle includes a conductive material that provides EMI shielding. The camera module according to claim 8 , wherein the conductive material of the light leakage baffle includes carbon. The lens actuator is a MEMS actuator,
The housing shields the optical train, MEMS actuator, and image sensor housed in the housing from electromagnetic interference (EMI) ;
The camera module according to claim 1 . Said housing, said auto-focus range end in the optical train of focusing opening of a predetermined shape configured to the object side end make it possible to at least partially protrude through it Form the
The light leakage baffle partially overlaps the focus adjustment aperture in the direction of the optical path outside the autofocus range at the object side end of the optical train ;
The camera module according to claim 10 .