JP4294305B2 - Film forming apparatus and film forming method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film forming apparatus and a film forming method used for forming a material that can be formed by vapor deposition (hereinafter referred to as vapor deposition material). In addition, the present invention relates to a cleaning method for removing a vapor deposition material attached to an inner wall or the like by vapor deposition. In particular, the present invention is an effective technique when an organic material is used as a vapor deposition material.
[0002]
[Prior art]
In recent years, research on a light-emitting device having an EL element as a self-luminous element has been actively conducted, and in particular, a light-emitting device using an organic material as an EL material has attracted attention. This light emitting device is also called an organic EL display (OELD) or an organic light emitting diode (OLED).
[0003]
Note that the EL element includes a layer containing an organic compound (hereinafter, referred to as an EL layer) from which luminescence generated by applying an electric field is obtained, an anode, and a cathode. Luminescence in an organic compound includes light emission (fluorescence) when returning from the singlet excited state to the ground state and light emission (phosphorescence) when returning from the triplet excited state to the ground state. The light-emitting device manufactured by the film formation method can be applied to either light emission.
[0004]
Unlike the liquid crystal display device, the light-emitting device is a self-luminous type and has a feature that there is no problem of viewing angle. That is, as a display used outdoors, it is more suitable than a liquid crystal display, and use in various forms has been proposed.
[0005]
An EL element has a structure in which an EL layer is sandwiched between a pair of electrodes, but the EL layer usually has a laminated structure. A typical example is a “hole transport layer / light emitting layer / electron transport layer” stacked structure proposed by Tang et al. Of Kodak Eastman Company. This structure has very high luminous efficiency, and most of the light emitting devices that are currently under research and development employ this structure.
[0006]
In addition, a hole injection layer / a hole transport layer / a light emitting layer / an electron transport layer, or a hole injection layer / a hole transport layer / a light emitting layer / an electron transport layer / an electron injection layer are sequentially laminated on the anode. Good structure. You may dope a fluorescent pigment | dye etc. with respect to a light emitting layer. These layers may all be formed using a low molecular weight material, or may be formed using a high molecular weight material.
[0007]
Note that in this specification, all layers provided between a cathode and an anode are collectively referred to as an EL layer. Therefore, the above-described hole injection layer, hole transport layer, light emitting layer, electron transport layer, and electron injection layer are all included in the EL layer.
[0008]
In this specification, a light-emitting element formed of a cathode, an EL layer, and an anode is referred to as an EL element. For this purpose, an EL layer is provided between two types of stripe-shaped electrodes provided so as to be orthogonal to each other. There are two types, a formation method (simple matrix method) and a method (active matrix method) in which an EL layer is formed between a pixel electrode connected to a TFT and arranged in a matrix and a counter electrode.
[0009]
The biggest problem in the practical application of EL elements is that the lifetime of the elements is insufficient. In addition, the deterioration of the element appears in the form of light emission for a long time and a non-light emitting region (dark spot) is widened. The cause is deterioration of the EL layer.
[0010]
The EL material forming the EL layer is deteriorated by impurities such as oxygen and water. In addition, it is conceivable that other impurities are included in the EL material to affect the deterioration of the EL layer.
[0011]
EL materials are roughly classified into low molecular (monomer) materials and high molecular (polymer) materials. Among these, low molecular materials are mainly formed by vapor deposition.
[0012]
When forming a film by the conventional vapor deposition method, the evaporation material is used as it is, but it is considered that impurities are mixed in the evaporation material at the time of vapor deposition. That is, oxygen, water, and other impurities that are one cause of deterioration of the EL element may be mixed.
[0013]
In addition, although the purity can be increased by purifying the evaporation material in advance, there is a possibility that impurities are mixed before the evaporation.
[0014]
The EL material is very easily deteriorated, and is easily oxidized and deteriorated in the presence of oxygen or water. Therefore, a photolithography process cannot be performed after the film formation, and in order to form a pattern, it is necessary to separate the film at the same time as the film formation with a mask having an opening (hereinafter referred to as an evaporation mask). Therefore, most of the sublimated organic EL material is attached to the vapor deposition mask or deposition shield (a protective plate for preventing the vapor deposition material from adhering to the inner wall of the film formation chamber) in the film formation chamber.
[0015]
In order to remove the organic EL material adhering to the deposition mask or deposition shield, the deposition chamber is temporarily released to the atmosphere, the deposition mask or deposition shield is taken out, cleaned, and returned to the deposition chamber again. Work was necessary. However, there is a possibility that water or oxygen adsorbed on the vapor deposition mask released to the atmosphere or the deposition shield may be detached during film formation of the organic EL material and taken into the film, which may promote deterioration of the organic EL material. There was concern.
[0016]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a film formation apparatus that can form an EL layer with high throughput, high density, and high purity. It is another object of the present invention to provide a film forming method using the film forming apparatus of the present invention.
[0017]
In addition, the present invention includes a jig provided inside the film forming apparatus, a cleaning method for removing the vapor deposition material adhering to the inner wall of the film forming apparatus without releasing to the atmosphere, and a mechanism for performing the cleaning method. It is an object to provide a film forming apparatus. In this specification, the jig provided in the film forming apparatus includes a substrate holder, a mask holder, an adhesion shield, or a vapor deposition mask.
[0018]
[Means for Solving the Problems]
The film forming apparatus of the present invention
A film forming apparatus for depositing an organic compound material from a vapor deposition source disposed facing a substrate to form a film on the substrate,
The film formation chamber in which the substrate is disposed has a vapor deposition source, a means for heating the vapor deposition source, and a heating means for heating the substrate or a mask (vapor deposition mask).
The film formation chamber is connected to an evacuation chamber that evacuates the film formation chamber.
[0019]
In the present invention, the substrate is heated by a heating means for heating the substrate, and further reduced pressure means (vacuum pump such as a turbo molecular pump, a dry pump, or a cryopump) connected to the film forming chamber is 5 × 10. ^-3 Torr (0.665 Pa) or less, preferably 1 × 10 ^-3 A method for forming a high-density EL layer by forming an organic compound material by vapor deposition from a vapor deposition source at a Torr (0.133 Pa) or lower is provided. Therefore, in the present invention, annealing can be performed in vacuum simultaneously with film formation. In addition, the substrate can be annealed in vacuum before film formation. Alternatively, the substrate can be annealed in vacuum after film formation. The temperature of the substrate (T ₁ ) Is the temperature of the deposition source (T _Three ). As a means for heating the substrate, a stage (which may have a function of fixing the substrate) provided with a heater or a heating wire, or a metal mask provided with a heater or a heating wire or the like is provided on the substrate. The temperature of the substrate (T ₁ ) Can be 50 to 200 ° C., preferably 65 to 150 ° C. In the present invention, by heating the substrate, the vapor deposition mask provided in close proximity to or in proximity to the heated substrate is also heated. Therefore, the vapor deposition mask is not easily deformed by heat (has a low coefficient of thermal expansion), and the substrate temperature (T ₁ It is desirable to use a metal material (for example, a refractory metal such as tungsten, tantalum, chromium, nickel, or molybdenum, an alloy containing these elements, stainless steel, Inconel, or Hastelloy). 4x10 ^-6 ~ 8.5 × 10 ^-6 ) And a thermal expansion coefficient of 42% nickel, iron 58% low thermal expansion alloy (42 alloy), nickel 36% low thermal expansion alloy (36 invar), and the like.
[0020]
In addition, it is preferable to provide an adhesion preventing means for preventing the organic compound from adhering to the inner wall of the film forming chamber during vapor deposition,
A film forming apparatus for depositing an organic compound material from a vapor deposition source disposed facing a substrate to form a film on the substrate,
In the film forming chamber in which the substrate is disposed, an adhesion preventing means for preventing film formation on the inner wall, a heating means for heating the adhesion preventing means, a vapor deposition source, and a means for heating the vapor deposition source, Heating means for heating the substrate or mask (evaporation mask),
The film formation chamber is connected to an evacuation chamber that evacuates the film formation chamber.
[0021]
As the adhesion preventing means, an adhesion shield is preferable, a heater is provided around the adhesion shield, the entire adhesion shield is heated, and the temperature of the adhesion shield (T ₂ ) For substrate temperature (T ₁ ), The organic compound that has not been deposited on the substrate can be adhered. In addition, by heating the deposition shield to a temperature higher than a certain temperature (sublimation temperature of the organic compound), the deposited organic compound can be vaporized to clean the film formation chamber.
[0022]
In the present invention, the temperature of the substrate (T ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three ) Is set lower.
[0023]
In addition, the film forming apparatus of the present invention can be used as an in-line type film forming apparatus.
A film forming apparatus in which a load chamber, a transfer chamber, and a film forming chamber are connected in series,
The film formation chamber has a function of aligning the mask and the substrate,
The film formation chamber is connected to an evacuation chamber that evacuates the film formation chamber, and prevents adhesion from being formed on the inner wall, heating means for heating the adhesion prevention means, and a vapor deposition source And a heating means for heating the evaporation source and a heating means for heating the substrate or the mask (evaporation mask).
[0024]
In addition, the film forming apparatus of the present invention can be used to form a multi-chamber film forming apparatus.
A film forming apparatus having a load chamber, a transfer chamber connected to the load chamber, and a film forming chamber connected to the transfer chamber,
The transfer chamber has a function of aligning the mask and the substrate,
The film formation chamber is connected to an evacuation chamber that evacuates the film formation chamber, and prevents adhesion from being formed on the inner wall, heating means for heating the adhesion prevention means, and a vapor deposition source And a heating means for heating the evaporation source and a heating means for heating the substrate or the mask (evaporation mask).
[0025]
In each of the film formation apparatuses, a plurality of vapor deposition sources are arranged in one film formation chamber, a plurality of functional regions are formed in the same film formation chamber, and a light emitting element having a mixed region is formed. be able to. Therefore, when an organic compound film composed of a plurality of functional regions is formed between the anode and the cathode of the light-emitting element, the first functional region and the second functional region are not the conventional stacked structure in which a clear interface exists. In between, a structure having a mixed region made of both the material constituting the first functional region and the material constituting the second functional region can be formed. According to the present invention, by performing vacuum annealing before film formation or during film formation, the molecules in the mixed region can be more fitted. By forming the mixed region, the energy barrier between the functional regions is relaxed. Therefore, it is possible to reduce the drive voltage and prevent the luminance from being lowered.
[0026]
Note that the first organic compound and the second organic compound have a hole injecting property that receives holes from the anode, a hole mobility that is higher than the electron mobility, and a hole mobility that is higher than the hole mobility. The electron mobility has a higher electron mobility, the electron injection property for receiving electrons from the cathode, the blocking property that can block the movement of holes or electrons, the light emission property that emits light, and the property selected from the group , Each having different properties.
[0027]
In addition, as an organic compound with high hole-injection property, a phthalocyanine-type compound is preferable, As an organic compound with high hole-transport property, an aromatic diamine compound is preferable, As an organic compound with high electron-transport property, A metal complex including a quinoline skeleton, a metal complex including a benzoquinoline skeleton, an oxadiazole derivative, a triazole derivative, or a phenanthroline derivative is preferable. Furthermore, as the organic compound that emits light, a metal complex including a quinoline skeleton that emits light stably, a metal complex including a benzoxazole skeleton, or a metal complex including a benzothiazole skeleton is preferable.
[0028]
More preferably, the luminescent region is composed of a host material and a luminescent material (dopant) having an excitation energy lower than that of the host material, and the excitation energy of the dopant depends on the excitation energy of the hole transport region and the electron transport layer. It is designed to be lower than the excitation energy. This prevents the diffusion of the molecular excitons of the dopant and allows the dopant to emit light effectively. Further, if the dopant is a carrier trap type material, the carrier recombination efficiency can also be increased.
[0029]
In addition, a case where a material capable of converting triplet excitation energy into light emission is added to the mixed region as a dopant is also included in the present invention. In forming the mixed region, a concentration gradient may be provided in the mixed region.
[0030]
Note that the film formation apparatus in the present invention can be used not only for an organic compound typified by an EL material but also for film formation of other materials such as a metal material used for vapor deposition.
[0031]
Further, it is possible to perform cleaning by irradiating a laser beam and causing the laser beam to scan the inner wall of the film forming chamber.
A film forming apparatus for depositing an organic compound material from a vapor deposition source disposed facing a substrate to form a film on the substrate,
The film formation chamber in which the substrate is disposed has a vapor deposition source, a means for heating the vapor deposition source, and a heating means for heating the substrate,
The film forming chamber is connected to an evacuation processing chamber that evacuates the film forming chamber, and is connected to a cleaning preliminary chamber that irradiates a laser beam on the inner wall of the processing chamber. Device.
[0032]
In the above structure, the laser light may be scanned by using a galvano mirror or a polygon mirror to vaporize the deposited material attached to the inner wall of the film formation chamber, the deposition shield, the deposition mask, or the like. With the above configuration, it is possible to clean the film formation chamber without touching the atmosphere during maintenance.
[0033]
The laser beam is a laser beam that uses a continuous wave or pulsed solid laser, or a continuous wave or pulsed excimer laser, an Ar laser, a Kr laser, or the like as a laser light source. The solid-state laser is a YAG laser, YVO _Four Laser, YLF laser, YAlO _Three One type or a plurality of types selected from a laser, a glass laser, a ruby laser, an alexandride laser, and a Ti: sapphire laser can be given.
[0034]
In addition, a film forming apparatus having a plasma generating means in a film forming apparatus provided with a vapor deposition source is also one aspect of the present invention, and other configurations relating to the film forming apparatus of the present invention include:
A film forming apparatus for depositing an organic compound material from a vapor deposition source disposed facing a substrate to form a film on the substrate,
The film formation chamber in which the substrate is disposed includes a vapor deposition source, a means for heating the vapor deposition source, a heating means for heating the substrate, a mask (vapor deposition mask), and an electrode facing the mask. ,
The film formation chamber is connected to an evacuation chamber that evacuates the film formation chamber, and generates a plasma in the film formation chamber.
[0035]
In the above structure, the mask is made of a conductive material, and a high frequency power source (frequency 13 MHz to 40 MHz, high frequency power 20 W to 200 W) is connected to either the mask or the electrode. The distance between the mask and the electrode may be 1 cm to 5 cm. In the above structure, Ar, H, F, and NF are formed in the deposition chamber. _Three Or a gas introduction means for introducing one or more kinds of gases selected from O, and a means for exhausting the vaporized deposit.
[0036]
Further, in the above structure, the evaporation mask serving as one electrode for generating plasma is made of a conductive material, is not easily deformed by heat (has a low coefficient of thermal expansion), and is a metal material that can withstand plasma (for example, It is desirable to use materials such as refractory metals such as tungsten, tantalum, chromium, nickel or molybdenum, alloys containing these elements, stainless steel, Inconel, Hastelloy, etc. In order to cool the deposited mask, A mechanism for circulating a cooling medium (cooling water, cooling gas) may be provided.
[0037]
Cleaning may be performed by generating plasma in the film formation chamber by the above-described plasma generation means, vaporizing a deposit deposited on the wall of the film formation chamber, the deposition shield, or the vapor deposition mask and exhausting it outside the film formation chamber. With the above configuration, it is possible to clean the film formation chamber without touching the atmosphere during maintenance.
[0038]
Further, a cleaning method using the film forming apparatus having the above configuration is also one aspect of the present invention, and is a cleaning method for removing an organic compound attached to a film forming chamber provided with a vapor deposition source,
A cleaning method is characterized by cleaning an inner wall, an adhesion preventing means for preventing a film from being generated in the film formation chamber, or a film on the inner wall, or a mask.
[0039]
In the configuration of the cleaning method, the plasma is generated between the mask and an electrode provided between the mask and the evaporation source.
[0040]
In the configuration of the cleaning method, the plasma may be Ar, H, F, NF. _Three Or one or a plurality of gases selected from O are excited and generated.
[0041]
In addition, a novel film forming method and film forming apparatus are provided.
[0042]
In the film forming method of the present invention, when a film is formed by evaporating the organic compound material from the evaporation source in the film forming chamber, a small amount of a gas composed of particles smaller than the organic compound material particles, that is, a material having a small atomic radius is flowed. The organic compound film includes a material having a small atomic radius.
[0043]
A film forming method of the present invention is a film forming method for depositing an organic compound on a substrate disposed in a film forming chamber,
1 × 10 in the film formation chamber ^-3 When forming a film on the substrate by depositing an organic compound material from a deposition source disposed opposite to the substrate, the material gas is introduced into the deposition chamber at the same time. This is a film forming method.
[0044]
In the above configuration, the material gas is monosilane, disilane, trisilane, or SiF. _Four , GeH _Four , GeF _Four , SnH _Four , CH _Four , C ₂ H ₂ , C ₂ H _Four Or C ₆ H ₆ It is characterized by being one kind or plural kinds selected from.
[0045]
Further, a film forming apparatus for carrying out the above film forming method is also one aspect of the present invention, and the film forming apparatus of the present invention includes:
A film forming apparatus for depositing an organic compound material from a vapor deposition source disposed facing a substrate to form a film on the substrate,
The film forming chamber in which the substrate is disposed has a vapor deposition source and means for heating the vapor deposition source,
The film formation chamber is connected to an evacuation treatment chamber for evacuating the film formation chamber, and has a means capable of introducing a material gas.
[0046]
In the above structure, the material gas is monosilane, disilane, trisilane, SiF. _Four , GeH _Four , GeF _Four , SnH _Four , CH _Four , C ₂ H ₂ , C ₂ H _Four Or C ₆ H ₆ It is characterized by being one kind or plural kinds selected from.
[0047]
Further, phosphine gas may be introduced in addition to monosilane. In place of monosilane, AsH _Three , B ₂ H ₂ , BF _Four , H ₂ Te, Cd (CH _Three ) ₂ , Zn (CH _Three ) ₂ , (CH _Three ) _Three In, H ₂ Se, BeH ₂ Various gases represented by trimethylgallium or triethylgallium can be used.
[0048]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0049]
(Embodiment 1)
The structure of the film forming apparatus in the present invention will be described with reference to FIG. FIG. 1 is an example of a cross-sectional view of a film forming apparatus of the present invention.
[0050]
When performing film formation by vapor deposition, it is preferable to employ a face-down method (also referred to as a deposition method), and the substrate 10 is set with a film formation surface facing downward. The face-down method refers to a method in which a film is formed with the deposition surface of the substrate facing down. According to this method, adhesion of dust and the like can be suppressed.
[0051]
As shown in FIG. 1, heating means, here, a heater 11 is provided in contact with the substrate 10. The substrate temperature (T ₁ ) Can be 50 to 200 ° C., preferably 65 to 150 ° C. Further, a metal mask 12a fixed to the holder 12b is provided below the substrate 10, and further, evaporation source holders 16a to 16c that can be heated to different temperatures are provided below the metal mask 12a. Yes. A vapor deposition source is provided so as to face the substrate. Here, an example of fixing with the holder 12b is shown, but the substrate may be fixed by sandwiching the substrate with a metal mask using a permanent magnet.
[0052]
In FIG. 1, since a metal mask (also referred to as a vapor deposition mask) 12a is disposed in contact with the substrate 10, when the substrate is heated, the metal mask is also heated at the same time. The entire substrate can be heated by the substrate heating means and the metal mask. Therefore, the metal mask (evaporation mask) is not easily deformed by heat, and the substrate temperature (T ₁ It is desirable to use a metal material that can withstand Further, the vapor deposition mask is not limited to a metal material, and the substrate temperature (T ₁ A mask (glass or quartz having a light shielding film provided on the surface) made of another material that can withstand the above may be used. Here, an example in which the metal mask 12a is disposed in contact with the substrate 10 is shown, but there is no particular limitation, and the substrate and the metal mask may be separated from each other.
[0053]
In addition, a heating means (heater or heating wire) is provided in contact with the metal mask, or a heating means (heater or heating wire) is provided on the metal mask itself to heat the metal mask, thereby heating the substrate in contact with the metal mask. May be. By heating the metal mask, the surface of the substrate on which the film is formed can be heated.
[0054]
Here, the vapor deposition source includes vapor deposition source holders 16a to 16c, an organic compound 17 (17a to 17c) that forms an organic compound film, a material chamber 18 (18a to 18c) in which the organic compound is provided, and a shutter. 19 (19a to 19c). In addition, it is preferable that the organic compound is introduced from a dedicated material exchange chamber (not shown) attached to the film formation chamber so that the film formation chamber is opened to the atmosphere as much as possible. By opening the film formation chamber to the atmosphere, various gases including moisture are adsorbed on the inner wall, and these gases are released again by evacuation. It takes several tens to several hundreds of hours until the release of the adsorbed gas is settled and the degree of vacuum is stabilized at the equilibrium value. For this reason, the wall of the film forming chamber is baked to shorten the time. However, since repeated release to the atmosphere is not an efficient method, it is desirable to provide a dedicated material exchange chamber.
[0055]
Note that in the film formation apparatus of the present invention, the evaporation source or the substrate to be evaporated is preferably moved (or rotated) so that the film is uniformly formed. FIG. 1 shows an example in which the substrate to be deposited can rotate, and the metal mask 12a and the holder 12b also rotate. Alternatively, the deposition holder may be moved in the X direction or the Y direction with respect to the substrate while the substrate is fixed.
[0056]
The material chamber 18 (18a to 18c) is a space for the vapor deposition source holders 16a to 16c made of a conductive metal material, and is provided with heating means provided in the vapor deposition source holder (resistance generated when voltage is applied ( Resistance heating)) causes the internal organic compounds 17 (17a to 17c) to undergo sublimation temperatures (T _Three , T _Three ', T _Three ”), It is vaporized and deposited on the surface of the substrate 10. The heating means is basically a resistance heating type, but a Knudsen cell may be used. In this specification, the surface of the substrate 10 includes a substrate and a thin film formed thereon, and here, an anode or a cathode is formed on the substrate.
[0057]
The shutter 19 (19a to 19c) controls vapor deposition of the vaporized organic compound 17 (17a to 17c). That is, when the shutter is open, the organic compound 17 (17a to 17c) vaporized by heating can be deposited. Further, one or a plurality of other shutters (for example, a shutter that covers the deposition source until sublimation from the deposition source is stabilized) may be provided between the substrate 10 and the shutter 19.
[0058]
The organic compound 17 (17a to 17c) is heated and vaporized before vapor deposition, and if the shutter 19 (19a to 19c) is opened during vapor deposition, the vapor deposition can be performed immediately. This is desirable because it can be shortened.
[0059]
In the film forming apparatus of the present invention, an organic compound film having a plurality of functional regions can be formed in one film forming chamber, and a plurality of vapor deposition sources are provided accordingly. The organic compound vaporized in each deposition source is scattered upward and deposited on the substrate 10 through an opening (not shown) provided in the metal mask 12a. Note that the openings of the metal mask may be rectangular, elliptical, or linear, and these may be a matrix arrangement or a delta arrangement.
[0060]
Further, by utilizing the difference in deposition temperature of the vapor deposition material, impurities (high temperature material) precipitated at a higher temperature than high purity EL material (medium temperature material) or impurities (low temperature material) precipitated at a low temperature are separated to obtain a high purity EL. You may form into a film only with material. In this specification, a substance (impurity) having a higher sublimation temperature than the high-purity EL material is referred to as a high-temperature material, and a substance (impurity) having a lower sublimation temperature is referred to as a low-temperature material. In addition, a high-purity EL material that sublimes at a temperature located between the high temperature and the low temperature is referred to as a medium temperature material. In addition, the sublimation temperature of a pure EL material can be investigated by investigating the material deposited for each temperature in advance by analysis such as mass spectrometry (GC-MS).
[0061]
Further, the vapor deposition material may be subjected to sublimation purification before vapor deposition. A zone purification method may be applied as purification of the vapor deposition material.
[0062]
In addition, an adhesion shield 15 is provided for preventing the organic compound from adhering to the inner wall of the film formation chamber during vapor deposition. By providing the deposition shield 15, it is possible to adhere an organic compound that has not been deposited on the substrate. Further, a heating wire 14 is provided around the deposition shield 15, and the entire deposition shield 15 can be heated by the heating wire 14. During film formation, the temperature (T ₂ ) Is the substrate temperature (T ₁ It is preferable that the temperature is controlled to be 10 ° C. or higher.
[0063]
Further, the film forming chamber 13 is connected to an evacuation processing chamber for evacuating the film forming chamber. As the vacuum evacuation processing chamber, a magnetic levitation type turbo molecular pump, a cryopump, or a dry pump is provided. As a result, the ultimate vacuum in the film formation chamber is 10 ^-Five -10 ^-6 Pa can be set, and the back diffusion of impurities from the pump side and the exhaust system can be controlled.
[0064]
In addition, the film forming chamber 13 is connected to a gas introduction system for bringing the film forming chamber into a normal pressure. In order to prevent impurities from being introduced into the apparatus, an inert gas such as nitrogen or a rare gas is used as the introduced gas. These gases introduced into the apparatus are those purified by a gas purifier before being introduced into the apparatus. Therefore, it is necessary to provide a gas purifier so that the gas is introduced into the film forming apparatus after being highly purified. Thereby, oxygen, water, and other impurities contained in the gas can be removed in advance, so that these impurities can be prevented from being introduced into the apparatus.
[0065]
Aluminum or stainless steel (SUS) that has been mirror-polished by electropolishing can be used as the material used in the film formation chamber because its surface area can be reduced to reduce the adsorptivity of impurities such as oxygen and water. Etc. are used for the inner wall surface. As a result, the degree of vacuum in the deposition chamber is 10 ^-Five -10 ^-6 Pa can be maintained. Further, a material such as ceramics that has been treated so that the pores are extremely small is used for the internal member. These preferably have surface smoothness with a center line average roughness of 3 nm or less.
[0066]
Note that in the film formation apparatus in FIG. 1, film formation is performed using a plurality of material chambers in the same film formation chamber, and thus an organic material used for film formation is provided in order to improve film formation. A function may be provided in which the material chamber moves to an optimal position below the substrate during film formation, or the substrate moves to an optimal position on the material chamber.
[0067]
With the film formation apparatus shown in FIG. 1, in one film formation chamber, a process of annealing in vacuum before film formation, a process of annealing in vacuum during film formation, or a process of annealing in vacuum after film formation is performed. And throughput is improved. In addition, an annealing chamber that can be evacuated is connected to the film formation chamber, and the substrate is transported in vacuum, so that annealing or vacuum annealing is performed before film formation in the annealing chamber connected to the film formation chamber. You may perform the process annealed in a vacuum after a film | membrane.
[0068]
An example of a manufacturing procedure of a light-emitting element having the anode, the organic compound layer in contact with the anode, and the cathode in contact with the organic compound layer is described below with reference to FIGS. FIG. 2 is a diagram showing a flow after carrying into the film forming chamber.
[0069]
First, the substrate on which the anode is formed is carried into a carry-in chamber (not shown). As a material for forming the anode, a transparent conductive material is used, and an indium / tin compound, zinc oxide, or the like can be used. Next, the film is transferred to a pre-deposition treatment chamber (not shown) connected to a carry-in chamber (not shown). In the pre-deposition treatment chamber, the anode surface may be cleaned, oxidized, heated, or the like. As the cleaning of the anode surface, ultraviolet irradiation is performed in vacuum to clean the anode surface. In addition, the oxidation treatment may be performed by irradiating ultraviolet rays in an atmosphere containing oxygen while heating at 100 to 120 ° C., and is effective when the anode is an oxide such as ITO. The heat treatment may be performed at a heating temperature of 50 ° C. or higher, preferably 65 to 150 ° C. that the substrate can withstand in vacuum, and is formed on the substrate by impurities such as oxygen and moisture attached to the substrate. Impurities such as oxygen and moisture in the deposited film are removed. In particular, since the EL material is easily deteriorated by impurities such as oxygen and water, it is effective to heat in vacuum before vapor deposition.
[0070]
Next, the substrate after the pretreatment is carried into the film formation chamber 13 without being exposed to the atmosphere. The film formation chamber 13 is set with the film formation surface of the substrate 10 facing downward. Note that the film formation chamber is preferably evacuated before the substrate is carried in.
[0071]
The vacuum evacuation means provided in connection with the film formation chamber evacuates from atmospheric pressure to about 1 Pa with an oil-free dry pump, and the pressure higher than that is evacuated with a magnetic levitation turbo molecular pump or a composite molecular pump. . A cryopump may be provided in the film formation chamber in order to remove moisture. In this way, contamination by organic substances such as oil is mainly prevented from the exhaust means. The inner wall surface is mirror-finished by electropolishing to reduce the surface area and prevent outgassing. For the purpose of reducing gas emission from the inner wall, it is desirable to perform a baking process by providing a heater outside the film formation chamber. Baking can significantly reduce outgassing. Further, in order to prevent impurity contamination due to outgassing, it is preferable to cool using a refrigerant during vapor deposition. Thus 1 × 10 ^-6 Realizes vacuum up to Pa.
[0072]
When the film forming chamber is evacuated, it is possible to remove adsorbed water and oxygen adhering to the film forming chamber wall, metal mask, deposition shield, and the like at the same time. Furthermore, it is preferable to heat the film formation chamber before carrying in the substrate. It takes a long time to slowly cool the substrate heated in the pretreatment, carry it into the film formation chamber, and then reduce the throughput. Desirably, the substrate heated by the heat treatment performed in the pretreatment is carried and set in the heated film formation chamber without being cooled. Note that since the apparatus illustrated in FIG. 1 is provided with a heating unit that heats the substrate, the heat treatment in vacuum, which is a pretreatment, can be performed in the deposition chamber.
[0073]
Here, heat treatment (annealing) is performed in a vacuum in a film formation chamber before vapor deposition. By this annealing (deaeration), impurities such as oxygen and moisture attached to the substrate and impurities such as oxygen and moisture in the film formed on the substrate are removed. In order to remove the impurities thus removed from the film formation chamber, it is preferable to perform evacuation, and the degree of vacuum may be further increased.
[0074]
Next, the degree of vacuum is 5 × 10 ^-3 Torr (0.665 Pa) or less, preferably 10 ^-Four -10 ^-6 Deposition is performed in the film forming chamber 13 evacuated to Pa. At the time of vapor deposition, the first organic compound 17a is vaporized in advance by resistance heating, and is scattered toward the substrate 10 when the shutter 19a is opened at the time of vapor deposition. The vaporized organic compound is scattered upward and deposited on the substrate 10 through an opening (not shown) provided in the metal mask 12a. Note that the temperature of the substrate (T ₁ ) Is 50 to 200 ° C, preferably 65 to 150 ° C. However, the temperature of the substrate (T ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three ). Also, the temperature (T ₂ ) For substrate temperature (T ₁ ), The organic compound that has not been deposited on the substrate can be adhered.
[0075]
In the apparatus shown in FIG. 1, heating means for heating the substrate is provided, and heat treatment is performed in vacuum during film formation. Since there is a possibility that impurities such as oxygen and moisture may be mixed in the evaporation material at the time of vapor deposition, it is effective to release the gas contained in the film by performing a heat treatment in vacuum during the vapor deposition. In this way, by performing vapor deposition while heating the substrate in vacuum and forming a film to a desired film thickness, a high-density and high-purity organic compound layer can be formed. In addition, the organic compound here refers to a hole injection property that receives holes from the anode, a hole mobility that is larger than the electron mobility, and an electron mobility that is higher than the hole mobility. Is an organic compound having properties such as a large electron transport property, an electron injection property of receiving electrons from the cathode, a blocking property capable of preventing the movement of holes or electrons, and a light emission property of emitting light.
[0076]
Thus, the vapor deposition of the organic compound 17a is completed, and a film made of the organic compound 17a is formed on the anode.
[0077]
Furthermore, in order to reduce moisture and oxygen impurities in the obtained organic compound layer, 1 × 10 ^-Four Heat treatment may be performed at a pressure equal to or lower than Pa to release moisture mixed during vapor deposition. Since there is a possibility that impurities such as oxygen and moisture may be mixed in the evaporation material at the time of vapor deposition, it is effective to release the gas contained in the film by performing a heat treatment in vacuum after the vapor deposition. In the case of performing annealing after vapor deposition, it is preferable to carry out the annealing in a vacuum by transporting the substrate to a processing chamber different from the deposition chamber without being exposed to the atmosphere.
[0078]
Since the apparatus illustrated in FIG. 1 is provided with a heating unit that heats the substrate, heat treatment in vacuum can be performed in the deposition chamber after deposition. It is preferable to perform annealing at 100 to 200 ° C. after the deposition, with a higher vacuum than the degree of vacuum at the time of deposition. Impurities such as oxygen and moisture in the organic compound layer formed on the substrate are further removed by annealing (deaeration) after the film formation, thereby forming a high-density and high-purity organic compound layer.
[0079]
The steps described so far are cases where a single layer of the organic compound 17a is formed, and corresponds to the flow shown in FIG.
[0080]
Thereafter, by repeating the single layer forming step, a desired organic compound layer is laminated, and finally a cathode is laminated. Note that when different vapor deposition materials (organic compounds and cathode materials) are stacked, they may be stacked in separate film forming chambers or may be stacked in the same film forming chamber. As a material for the cathode, a material containing magnesium (Mg), lithium (Li), or calcium (Ca) having a small work function is used. An electrode made of MgAg (a material in which Mg and Ag are mixed at Mg: Ag = 10: 1) is preferably used. Other examples include ytterbium (Yb), MgAgAl electrode, LiAl electrode, and LiFAl electrode. Thus, a light-emitting element having an anode, an organic compound layer in contact with the anode, and a cathode in contact with the organic compound layer can be manufactured. In addition, annealing before film formation can be performed in the film formation chamber, in which case throughput is improved. Further, annealing after film formation can be performed in the film formation chamber, and in this case, throughput is improved.
[0081]
An example in which three deposition sources are provided in one film formation chamber and three layers are stacked in the same film formation chamber will be described with reference to the flow shown in FIG. 2B and FIG. When the shutter 19a is closed in accordance with the procedure for forming the single layer described above and the vapor deposition (first vapor deposition) of the organic compound layer made of the organic compound 17a is completed, the internal organic compound 17b is previously heated by the heating means provided in the vapor deposition holder. The sublimation temperature (T _Three It heats up to '), and vapor deposition (2nd vapor deposition) is started by opening the shutter 19b, and the organic compound layer which consists of organic compounds 17b is formed on the organic compound layer which consists of organic compounds 17a. Subsequently, similarly, when the shutter 19b is closed and the vapor deposition of the organic compound layer made of the organic compound 17b (second vapor deposition) is completed, the internal organic compound 17c is sublimated by a heating means provided in advance in the vapor deposition holder. T _Three ”), And the deposition (third deposition) is started by opening the shutter 19c, and the organic compound layer made of the organic compound 17c is formed on the organic compound layer made of the organic compound 17b.
[0082]
However, the substrate temperature (T) is also applied during the first vapor deposition, the second vapor deposition, or the third vapor deposition. ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three , T _Three ', T _Three Set lower than ''). In addition, since the temperature of each vapor deposition source changes with vapor deposition materials to be used, each substrate temperature (T ₁ ) And the temperature of the shield (T ₂ ) Can be changed as appropriate. Moreover, you may change a vacuum degree suitably in the case of 1st vapor deposition, 2nd vapor deposition, or 3rd vapor deposition, respectively.
[0083]
It is also possible to co-evaporate by simultaneously opening the shutters of a plurality of vapor deposition sources. Co-evaporation refers to a vapor deposition method in which different vapor deposition sources are heated and vaporized at the same time, and different substances are mixed in a film formation stage.
[0084]
In addition, in the first vapor deposition, the second vapor deposition, or the third vapor deposition, the vapor deposition is performed while heating the substrate in a vacuum, and the film is formed to a desired film thickness. An organic compound layer can be formed. In addition, it is possible to more fit between molecules between layers by performing vapor deposition a plurality of times while heating the substrate in vacuum without being exposed to the atmosphere.
[0085]
Thus, the vapor deposition of a plurality of different organic compounds is completed, and a stack of a layer made of the organic compound 17a, a layer made of the organic compound 17b, and a layer made of the organic compound 17c is formed on the anode.
[0086]
Next, in order to reduce moisture and oxygen impurities in the obtained organic compound layer as in the formation of the single layer, 1 × 10 ^-Four Heat treatment (annealing) may be performed at a pressure equal to or lower than Pa, and heat treatment for releasing moisture mixed at the time of vapor deposition may be performed. When performing annealing after vapor deposition, the annealing may be performed in a film forming chamber, or the substrate may be transferred to a processing chamber different from the film forming chamber without being exposed to the atmosphere, and annealing may be performed in a vacuum. .
[0087]
The steps described so far are cases where a stack of organic compounds is formed, and corresponds to the flow shown in FIG.
[0088]
When a desired organic compound layer is laminated according to the above steps, the cathode is finally laminated. Thus, a light-emitting element having an anode, an organic compound layer in contact with the anode, and a cathode in contact with the organic compound layer can be manufactured. When stacking in the same film formation chamber in this way, the transport of the substrate can be omitted, and the time for evacuating the film formation chamber and the time for heating and slowing the substrate can be shortened. Throughput is improved.
[0089]
In addition, it is preferable to perform cleaning after forming the organic compound layer as described above once or a plurality of times. Cleaning is performed by resublimation and exhaust. In order to re-sublimate, it is only necessary to heat the inner wall of the film forming apparatus and the jig provided inside the film forming apparatus. The heating method is any of heater heating, infrared light heating or ultraviolet light heating. These may be used in combination. Further, it is preferable that the vapor deposition material resublimated is immediately exhausted using a vacuum pump. Alternatively, a gas containing a halogen group element may be supplied from a gas introduction system to resublimate, and at the same time, the vapor deposition material may be exhausted as fluoride.
[0090]
Further, in the cleaning performed in a state where the substrate is not disposed, the film forming apparatus in FIG. 1 heats the holder and the metal mask by heating the heating means of the substrate, and vaporizes the organic compound attached thereto. be able to. Further, the organic compound adhering to the deposition shield can be vaporized by heating the deposition shield with the heating wire 14. If cleaning is performed, it is desirable that the heating means for the substrate and the heating means for the deposition shield can be controlled to a temperature at which the organic compound is vaporized. During cleaning, the vaporized organic compound can be recovered by an exhaust system (vacuum pump) or the like and reused.
[0091]
(Embodiment 2)
Here, a film formation apparatus different from that in Embodiment Mode 1 is shown in FIG.
[0092]
As shown in FIG. 3, an example is shown in which a heater furnace 31 and a cleaning preliminary chamber 22 are connected to a film forming chamber 33.
[0093]
The heater furnace 31 for heating the substrate is provided with a heater on the outside and can be annealed. The heater furnace 31 allows the substrate temperature (T ₁ ) Can be 50 to 200 ° C., preferably 65 to 150 ° C. Further, a gate or shutter indicated by a dotted line in FIG. 3 is provided between the heater furnace 31 and the film forming chamber 33. Although not shown here, a vacuum evacuation unit may be provided in the heater furnace 31 separately. In this embodiment, annealing is performed in vacuum by the heater furnace 31 before vapor deposition, and then vapor deposition is performed by opening the gate.
[0094]
The cleaning preliminary chamber 22 is provided with a laser 23 and an optical system 24, and the laser beam 21 emitted from the laser can be irradiated inside the film forming chamber 33 by the scanning means 20. Note that a window (quartz or the like) made of a material through which the laser beam 21 can pass is provided on the wall separating the cleaning preliminary chamber 22 and the film forming chamber 33. The scanning means 20 may be scanned by using a galvano mirror or a polygon mirror to vaporize the deposited material adhering to the inner wall of the film forming chamber or the deposition shield.
[0095]
In the cleaning performed in a state where the substrate is not disposed, the film forming apparatus in FIG. 3 heats the inner wall of the film forming apparatus and the jig provided in the film forming apparatus by irradiation with laser light, and resublimates. Let The laser beam 21 is a laser beam that uses a continuous wave or pulsed solid laser, or a continuous wave or pulsed excimer laser, an Ar laser, a Kr laser, or the like as a laser light source. The solid-state laser is a YAG laser, YVO _Four Laser, YLF laser, YAlO _Three One type or a plurality of types selected from a laser, a glass laser, a ruby laser, an alexandride laser, and a Ti: sapphire laser can be given. Among these, a pulsed excimer laser and an Ar laser that can increase the irradiation area on the irradiation surface by the optical system 24 are preferable.
[0096]
In addition, a metal mask 32a fixed to the holder is provided in contact with a location where the substrate is provided (location indicated by a dotted line in the figure), and it is also possible to heat to different temperatures below the metal mask 32a. A vapor deposition source holder 36 is provided. A vapor deposition source is provided so as to face the substrate.
[0097]
The material chamber 38 is a space of the vapor deposition source holder 36 made of a conductive metal material, and the organic chamber inside is formed by heating means (resistance generated when a voltage is applied (resistance heating)) provided in the vapor deposition holder. Compound 37 has sublimation temperature (T _Three ) Is vaporized and deposited on the surface of the substrate.
[0098]
The first shutter 39 controls the vapor deposition of the vaporized organic compound 37. Further, a second shutter 25 is provided between the heater furnace 31 and the first shutter 39. The second shutter 25 is a shutter for covering the vapor deposition source until the sublimation speed from the vapor deposition source is stabilized.
[0099]
In addition, an adhesion shield 35 is provided for preventing the organic compound from adhering to the inner wall of the film formation chamber during vapor deposition. Further, a heating wire 34 is provided around the deposition shield 35, and the entire deposition shield 35 can be heated by the heating wire 34. However, the temperature of the substrate (T ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three ). Also, the temperature (T ₂ ) For substrate temperature (T ₁ ), The organic compound that has not been deposited on the substrate can be adhered.
[0100]
Further, the film forming chamber 33 is connected to an evacuation processing chamber for evacuating the film forming chamber. In addition, the film forming chamber 33 is connected to a gas introduction system that brings the film forming chamber to normal pressure.
[0101]
Also in the apparatus shown in FIG. 3, heat treatment is performed in a vacuum during film formation by the heater furnace 31. Since there is a possibility that impurities such as oxygen and moisture may be mixed in the evaporation material at the time of vapor deposition, it is effective to release the gas contained in the film by performing a heat treatment in vacuum during the vapor deposition. In this way, by performing vapor deposition while heating the substrate in vacuum and forming a film to a desired film thickness, a high-density and high-purity organic compound layer can be formed.
[0102]
If the film formation apparatus shown in FIG. 3 is used, it is possible to perform a process of annealing in vacuum before film formation, a process of annealing in vacuum during film formation, or a process of annealing in vacuum after film formation. improves.
[0103]
Further, the cleaning with the laser beam may be performed for each film formation process, or may be performed after a plurality of film formation processes.
[0104]
Further, this embodiment mode can be freely combined with Embodiment Mode 1.
[0105]
(Embodiment 3)
The structure of the film forming apparatus in the present invention will be described with reference to FIG. FIG. 13 is an example of a cross-sectional view of the film forming apparatus of the present invention.
[0106]
As shown in FIG. 13, an example in which plasma 1301 is generated between an evaporation mask 1302a connected to a high-frequency power source 1300a via a capacitor 1300b and an electrode 1302b is shown.
[0107]
In FIG. 13, an evaporation mask 1302a fixed to the holder is provided in contact with a location where the substrate is provided (location indicated by a dotted line in the drawing), and further below it is heated to different temperatures. A possible deposition source holder 1306 is also provided. These vapor deposition sources are provided so as to face the substrate.
[0108]
The material chamber 1308 is a space for the vapor deposition holder 1306 made of a conductive metal material, and the internal organic compound 1307 is heated to a sublimation temperature (T by a heating means (typically, resistance heating method) provided in the vapor deposition holder. _Three ) Is vaporized and deposited on the surface of the substrate. Note that when vapor deposition is performed, the electrode 1302b is moved to a position where vapor deposition is not hindered.
[0109]
In addition, an adhesion shield 1305 is provided for preventing the organic compound from adhering to the inner wall of the film formation chamber during vapor deposition. Further, a heating wire 1304 is provided around the deposition shield 1305, and the entire deposition shield 1305 can be heated by the heating wire 1304. However, the temperature of the substrate (T ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three ). Also, the temperature (T ₂ ) For substrate temperature (T ₁ ), The organic compound that has not been deposited on the substrate can be adhered.
[0110]
FIG. 14A is an enlarged cross-sectional view of the vapor deposition mask 1302a. Since the deposition mask is a metal mask, the cross-section is not vertical but tapered when processed by an etching technique. FIG. 14B shows an example in which the cross-sectional structure of the evaporation mask is different. In any cross-sectional structure, the vicinity of the opening has a sharp shape. Accordingly, plasma is likely to be generated near the opening of the mask, and the portion where the deposit is most desired to be cleaned, that is, the portion near the opening where the mask accuracy is lowered when the deposit is deposited, can be cleaned. In addition, as a method for producing a metal mask other than the etching technique, there is an electroforming technique. In this case, the cross-sectional shape is an overhang shape having an R shape.
[0111]
After the vapor deposition is completed, the substrate is taken out and cleaning is performed to remove the jig provided in the film formation apparatus and the vapor deposition material attached to the inner wall of the film formation apparatus without releasing to the atmosphere. In this cleaning, the electrode 1302b is moved to a position facing the vapor deposition mask 1302a. Further, a gas is introduced into the film formation chamber 1303. As gases introduced into the deposition chamber 1303, Ar, H, F, and NF _Three Or one or a plurality of gases selected from O may be used. Next, a high frequency electric field is applied to the vapor deposition mask 1302a from the high frequency power source 1300a to form gases (Ar, H, F, NF). _Three Or O) is excited to generate plasma 1301. In this manner, plasma 1301 is generated in the film formation chamber 1303, vaporized substances attached to the wall of the film formation chamber, the deposition shield 1305, or the vapor deposition mask 1302 a are vaporized and exhausted outside the film formation chamber. With the film formation apparatus shown in FIG. 13, the film formation chamber can be cleaned without being exposed to the atmosphere during maintenance.
[0112]
Note that although an example in which the deposition mask 1302a is generated between the mask 1302b and the electrode 1302b disposed between the deposition source holder 1306 is shown here, the invention is not particularly limited and plasma generation means is provided. If you do. Further, a high frequency power source may be connected to the electrode 1302b, the electrode 1302b may be a mesh electrode, or an electrode into which a gas can be introduced like a shower head.
[0113]
The cleaning with plasma may be performed for each film formation process, or may be performed after a plurality of film formation processes.
[0114]
Further, this embodiment mode can be freely combined with Embodiment Mode 1.
[0115]
(Embodiment 4)
As a typical example of a physical film forming method, there is known a vacuum vapor deposition method in which an evaporation material is evaporated from an evaporation source under vacuum. As a typical example of a chemical film forming method, a CVD (chemical vapor deposition) method is known in which a source gas is supplied onto a substrate and a film is formed by a chemical reaction in a gas phase or on the surface of the substrate.
[0116]
In this embodiment, when a film is formed by evaporating the organic compound material from the evaporation source in the film formation chamber, a small amount of gas made of particles smaller than the organic compound material particles, that is, a material having a small atomic radius is flowed, Provided is a novel film forming method in which a material having a small atomic radius is included in a compound film.
[0117]
Specifically, as a material gas having a small atomic radius, silane-based gases (monosilane, disilane, trisilane, etc.), SiF _Four , GeH _Four , GeF _Four , SnH _Four Or hydrocarbon gas (CH _Four , C ₂ H ₂ , C ₂ H _Four , C ₆ H ₆ Or the like may be used. These gases introduced into the apparatus are those purified by a gas purifier before being introduced into the apparatus. Therefore, it is necessary to provide a gas purifier so that the gas is introduced into the vapor deposition apparatus after being highly purified. Thereby, oxygen, water, and other impurities contained in the gas can be removed in advance, so that these impurities can be prevented from being introduced into the apparatus.
[0118]
For example, when several sccm of monosilane gas is introduced into a film formation chamber where evaporation is performed by evaporating an organic material, SiH floating in the film formation chamber together with the organic material evaporated from the evaporation source and directed toward the substrate. _Four Is taken into the organic film. That is, SiH having a small atomic radius is inserted in a gap between organic material molecules having a relatively large particle radius. _Four As it is or SiH _X And can be included in the organic film. During the vapor deposition, the vapor deposition source is heated to about 100 ° C., but the decomposition temperature (decomposition temperature at atmospheric pressure) of monosilane is about 550 ° C., so it is not decomposed. Depending on the organic material to be evaporated, SiH _Four Or SiH _X In some cases to form compounds. In addition, a slight amount of oxygen (or moisture) remaining in the film formation chamber is captured to form SiO. _X Thus, oxygen (or moisture) that causes deterioration of the organic material in the film formation chamber and in the film can be reduced, and as a result, the reliability of the light-emitting element can be improved. Further, the generated SiOx may be included in the film as it is.
[0119]
If there is a gap between organic material molecules in the film, it is considered that oxygen easily enters the gap and deteriorates. Therefore, since it is sufficient to fill this gap, SiF _Four , GeH _Four , GeF _Four , SnH _Four Or hydrocarbon gas (CH _Four , C ₂ H ₂ , C ₂ H _Four , C ₆ H ₆ Etc.) can also improve the reliability of the light-emitting element.
[0120]
Examples of the organic material include α-NPD (4,4′-bis- [N- (naphthyl) -N-phenyl-amino] biphenyl), BCP (bathocuproin), MTDATA (4,4 ′, 4 ”- Tris (N-3-methylphenyl-N-phenyl-amino) triphenylamine), Alq _Three (Tris-8-quinolinolato aluminum complex) and the like.
[0121]
This embodiment is effective when the mixed region shown in FIG. 4 is formed by co-evaporation or when a functional region (region having an electron transport function) is deposited, and as a result, the reliability of the light-emitting element is improved. To do.
[0122]
The degree of vacuum in the deposition chamber is 10 ^-8 -10 ^-1 , Preferably 10 ^-7 -10 ^-2 Let it be Torr. The vacuum evacuation treatment chamber connected to the film formation chamber includes a magnetic levitation turbo molecular pump, a cryopump, or a dry pump. In addition, as the material used for the inner wall of the film formation chamber, the surface of the film can be made smaller so that the adsorptivity of impurities such as oxygen and water can be reduced. SUS) or the like is used. As a result, the degree of vacuum in the deposition chamber is 10 ^-8 -10 ^-1 Torr can be maintained. Further, a material such as ceramics that has been treated so that the pores are extremely small is used for the internal member. These preferably have surface smoothness with a center line average roughness of 3 nm or less.
[0123]
The structure of the film forming apparatus in the present invention will be described with reference to FIG. FIG. 15 is an example of a cross-sectional view of the film forming apparatus of the present invention.
[0124]
In FIG. 15, a vapor deposition mask 1502a fixed to a substrate 1501 is provided in contact with the substrate 150, and further below the vapor deposition source holder 1506, which can be heated to different temperatures. Note that these vapor deposition sources are provided so as to face the substrate 1501.
[0125]
The material chamber 1508 is a space for the vapor deposition holder 1506 made of a conductive metal material, and the internal organic compound 1507 is heated to the sublimation temperature by a heating means (typically a resistance heating method) provided in the vapor deposition holder. Then, it is vaporized and deposited on the surface of the substrate. Note that when vapor deposition is performed, the electrode 1502b is moved to a position where vapor deposition is not hindered. In addition, the organic compound 1507 is stored in a container (typically a crucible, a vapor deposition boat, or the like).
[0126]
Further, the material gas is included in the film by introducing several sccm of the material gas at the time of vapor deposition. In the film, the material gas or the main component of the material gas is contained in an amount of about 0.01 atom% to 5 atom%, preferably about 0.1 atom% to 2 atom%. Examples of gases introduced into the deposition chamber 1503 include silane-based gases (monosilane, disilane, trisilane, etc.), SiF _Four , GeH _Four , GeF _Four , SnH _Four Or hydrocarbon gas (CH _Four , C ₂ H ₂ , C ₂ H _Four , C ₆ H ₆ Or the like may be used.
[0127]
A film containing an organic compound formed using FIG. 15 contains a material gas or a main component of the material gas and is difficult to take in oxygen and moisture. Therefore, a light-emitting element using the film containing the organic compound is Reliability is improved.
[0128]
Further, when co-evaporating by evaporating a plurality of different materials, two kinds of organic compounds are simultaneously deposited, and by introducing the material gas, the material gas or the main component of the material gas is included, and A mixed region containing two kinds of organic compounds can also be formed.
[0129]
Moreover, after vapor-depositing the first organic compound, the second organic compound is vapor-deposited in the vapor-deposition atmosphere, and by introducing the material gas, the first functional region and the second functional region are A mixed region may be formed between them. In this embodiment mode, the first organic compound is vaporized by resistance heating in advance, and is scattered in the direction of the substrate by opening the first shutter 1509 during vapor deposition. Thus, the first functional region shown in FIG. 4A can be formed. Next, the second shutter 1519 is also opened and vapor deposition is performed to form a mixed region.
[0130]
In forming the mixed region, a concentration gradient may be provided in the mixed region. In addition, a case where a material capable of converting triplet excitation energy into light emission is added to the mixed region as a dopant is also included in the present invention. Moreover, when performing co-evaporation, it is desirable to make the direction of evaporation cross | intersect the position of a to-be-deposited object so that an organic compound may mutually mix.
[0131]
In addition, an adhesion shield 1505 is provided for preventing the organic compound from adhering to the inner wall of the film formation chamber during vapor deposition.
[0132]
Further, the vapor deposition holder 1506 provided with heating means such as a heater has a high temperature, and thus is preferably covered with a heat insulating material 1504.
[0133]
Further, plasma may be formed in a condition range that does not damage the film containing the organic compound. It is also possible to generate plasma between the vapor deposition mask 1502a connected to the high frequency power source 1500a via the capacitor 1500b and the electrode 1502b.
[0134]
Further, phosphine gas may be introduced in addition to monosilane. In place of monosilane, AsH _Three , B ₂ H ₂ , BF _Four , H ₂ Te, Cd (CH _Three ) ₂ , Zn (CH _Three ) ₂ , (CH _Three ) _Three In, H ₂ Se, BeH ₂ Various gases represented by trimethylgallium or triethylgallium can be used.
[0135]
Further, this embodiment mode can be freely combined with any one of Embodiment Modes 1 to 3.
[0136]
The present invention having the above-described configuration will be described in more detail with the following examples.
[0137]
(Example)
[Example 1]
In this example, an energy barrier existing in an organic compound film is relaxed to improve carrier mobility, and at the same time, an element having functions of a plurality of materials as in the functional separation of a stacked structure is manufactured. Show.
[0138]
Regarding the relaxation of the energy barrier in the laminated structure, it is noticeable in the technique of inserting the carrier injection layer. That is, the energy barrier can be designed in a step shape by inserting a material that relaxes the energy barrier at the interface of the stacked structure having a large energy barrier. As a result, the carrier injection property from the electrode can be improved and the drive voltage can be lowered to some extent. However, the problem is that by increasing the number of layers, the number of organic interfaces increases conversely. This is considered to be the reason why the single layer structure holds the top data of the driving voltage and power efficiency. In other words, by overcoming this point, while taking advantage of the laminated structure (a variety of materials can be combined and no complicated molecular design is required), the driving voltage and power efficiency of the single layer structure can be achieved. I can catch up.
[0139]
Therefore, in this example, when an organic compound film composed of a plurality of functional regions is formed between the anode and the cathode of the light emitting element, the first functional region and the first functional region are not the conventional laminated structure in which a clear interface exists. A structure having a mixed region made of both the material constituting the first functional region and the material constituting the second functional region is formed between the two functional regions.
[0140]
By applying such a structure, it is considered that the energy barrier existing between the functional regions is reduced as compared with the conventional structure, and the carrier injection property is improved. That is, the energy barrier between the functional regions is relaxed by forming a mixed region. Therefore, it is possible to reduce the drive voltage and prevent the luminance from being lowered.
[0141]
From the above, in this example, the region in which the first organic compound can function (the first functional region) and the second organic compound different from the substance constituting the first functional region function. In the manufacture of a light emitting element including at least a region that can be expressed (second functional region) and a light emitting device having the light emitting element, the first functional region and the second function are formed using the film formation apparatus illustrated in FIG. A mixed region composed of the organic compound constituting the first functional region and the organic compound constituting the second functional region is prepared between the regions.
[0142]
In the film forming apparatus shown in FIG. 1, an organic compound film having a plurality of functional regions is formed in one film forming chamber, and a plurality of vapor deposition sources are provided accordingly. A substrate on which the anode is formed is carried in and set. The substrate is heated by a heating means, and the temperature of the substrate (T ₁ ) Is 50 to 200 ° C, preferably 65 to 150 ° C. In addition, the temperature of the substrate (T ₁ ) Is the temperature (T ₂ ) Lower than the temperature of the deposition shield (T ₂ ) Is the temperature of the deposition source (T _Three ).
[0143]
First, the first organic compound 17a provided in the first material chamber 18a is deposited. The first organic compound 17a is previously vaporized by resistance heating, and is scattered in the direction of the substrate when the shutter 19a is opened during vapor deposition. Thereby, the first functional region 210 shown in FIG. 4A can be formed.
[0144]
Then, with the first organic compound 17a deposited, the shutter 19b is opened, and the second organic compound 17b provided in the second material chamber 18b is deposited. Note that the second organic compound is also vaporized by resistance heating in advance, and is scattered in the direction of the substrate when the shutter 19b is opened during vapor deposition. Here, the first mixed region 211 composed of the first organic compound 17a and the second organic compound 17b can be formed.
[0145]
Then, after a while, only the shutter 19a is closed, and the second organic compound 17b is deposited. Thereby, the second functional region 212 can be formed.
[0146]
In this example, a method of forming a mixed region by simultaneously depositing two kinds of organic compounds was shown. However, after depositing the first organic compound, the second organic compound was deposited in the deposition atmosphere. By vapor-depositing, a mixed region can be formed between the first functional region and the second functional region.
[0147]
Next, with the second organic compound 17b deposited, the shutter 19c is opened, and the third organic compound 17c provided in the third material chamber 18c is deposited. The third organic compound 17c is also vaporized by resistance heating in advance, and is scattered in the direction of the substrate when the shutter 19c is opened at the time of vapor deposition. Here, a second mixed region 213 composed of the second organic compound 17b and the third organic compound 17c can be formed.
[0148]
Then, after a while, only the shutter 19b is closed, and the third organic compound 17c is deposited. Thereby, the third functional region 214 can be formed.
[0149]
Finally, a light emitting element formed by the film forming apparatus of the present invention is completed by forming a cathode.
[0150]
Furthermore, as another organic compound film, as shown in FIG. 4B, after the first functional region 220 is formed using the first organic compound 17a, the first organic compound 17a and the second organic compound film 17a are formed. A first mixed region 221 composed of the organic compound 17b is formed, and further, a second functional region 222 is formed using the second organic compound 17b. During the formation of the second functional region 222, the second mixed region 223 is formed by temporarily opening the shutter 19c and simultaneously depositing the third organic compound 17c.
[0151]
After a while, the second functional region 222 is formed again by closing the shutter 19c. And a light emitting element is formed by forming a cathode.
[0152]
The film formation apparatus of FIG. 1 capable of forming the organic compound film as described above can form an organic compound film having a plurality of functional regions in the same film formation chamber. Without being contaminated, a mixed region can be formed at the functional region interface. As described above, a light-emitting element having a plurality of functions can be manufactured without showing a clear stacked structure (that is, without a clear organic interface).
[0153]
In addition, the film formation apparatus in FIG. 1 can perform vacuum annealing before film formation, during film formation, or after film formation. Can be fitted. Therefore, it is possible to further reduce the driving voltage and prevent the luminance from being lowered. In addition, impurities such as oxygen and moisture in the organic compound layer formed on the substrate can be further removed by annealing (deaeration) after film formation, so that a high-density and high-purity organic compound layer can be formed. .
[0154]
Further, this embodiment can be freely combined with Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 3, or Embodiment Mode 4.
[0155]
[Example 2]
The structure of the film forming apparatus in this embodiment will be described with reference to FIG. 5A is a top view of the film formation apparatus, and FIG. 5B is a cross-sectional view. Note that common symbols are used for common portions. In this embodiment, an example in which three types of organic compound films (red, green, and blue) are formed in each film forming chamber of an in-line film forming apparatus having three film forming chambers is shown. Note that the first film formation chamber 305, the second film formation chamber 308, and the third film formation chamber 310 correspond to the film formation chamber 13 shown in FIG.
[0156]
In FIG. 5A, reference numeral 300 denotes a load chamber. After the load chamber is evacuated to reduce the pressure, the substrate provided in the load chamber is transferred to the first transfer chamber 301. In the first transfer chamber 301, the alignment of the metal mask 303 fixed to the holder 302 in advance is performed for each holder, and the substrate 304 before vapor deposition is placed on the metal mask 303 after the alignment. Accordingly, the substrate 304 and the metal mask 303 are integrated and transferred to the first film formation chamber 305. In this embodiment, a vacuum exhaust unit and a substrate heating unit are provided in the first transfer chamber 301, and vacuum annealing is performed before vapor deposition to remove moisture contained in the substrate. Further, the first transfer chamber 301 may include a substrate reversing mechanism.
[0157]
The holder 302 includes a mask holder, a shaft, a substrate holder, a control mechanism, auxiliary pins, and the like. A metal mask 303 is fixed in accordance with the protrusion on the mask holder, and a substrate 304 is placed on the metal mask 303. The substrate 304 on the metal mask 303 is fixed with auxiliary pins.
[0158]
When the alignment of the metal mask 303 is completed, the axis is moved in the Z-axis direction, the metal mask 303 is moved again, and the metal mask 303 and the substrate 304 are fixed by the auxiliary pins, thereby aligning the metal mask 303 and the metal mask. The alignment between 303 and the substrate 304 can be completed. Here, the case of the alignment by the pin alignment method is shown, but the alignment by the CCD alignment method using a CCD camera may be performed.
[0159]
In addition, when the substrate is transferred from the first transfer chamber 301 to the first film formation chamber 305, it is preferable to maintain the degree of vacuum without being exposed to the air. Therefore, before the substrate is transferred, the first film formation chamber 305 is previously set to a vacuum degree equivalent to that of the first transfer chamber 301 by the vacuum exhaust unit.
[0160]
In the first film formation chamber 305 in FIG. 5, a plurality of vapor deposition sources 306 are provided. The vapor deposition source 306 includes a material chamber (not shown) in which an organic compound is provided and a shutter (not shown) that controls opening and closing of the organic compound vaporized in the material chamber from scattering outside the material chamber. Has been. The first film formation chamber 305 is provided with a substrate heating means. Although not shown here, it also has a mechanism for aligning the substrate heating means and the metal mask 303 (including the substrate).
[0161]
In addition, the plurality of vapor deposition sources 306 provided in the first film formation chamber 305 are each provided with a plurality of organic compounds having different functions constituting the organic compound film of the light emitting element.
[0162]
In the first film formation chamber 305, the first organic compound having a plurality of functional regions is formed by sequentially depositing organic compounds provided in these vapor deposition sources by the method described in Embodiment 1 or Example 1. A compound film (here, red) is formed. Note that, during vapor deposition, film formation is performed while rotating the substrate 304 in order to improve the uniformity of the obtained thin film within the substrate surface.
[0163]
Next, the substrate 304 is transferred to the second transfer chamber 307. In addition, when the substrate is transferred from the first film formation chamber 305 to the second transfer chamber 307, it is preferable to maintain the degree of vacuum without being exposed to the air. When the metal mask 303 having the same opening pattern is used, the substrate 304 and the metal mask 303 are once separated in the second transfer chamber 307 and then moved so as to match the position where the second organic compound film is formed. 303 may be aligned. After the alignment is completed, the substrate 304 and the metal mask 303 are overlapped and fixed again. In the case of using a metal mask having a different pattern, a new mask is prepared in advance, and alignment with the substrate may be performed in the second transfer chamber or the second film formation chamber.
[0164]
Then, the substrate 304 is transferred to the second film formation chamber 308. In addition, when the substrate is transferred from the second transfer chamber 307 to the second film formation chamber 308, it is preferable to maintain the degree of vacuum without being exposed to the atmosphere. Similarly, the second film formation chamber is provided with a plurality of vapor deposition sources and substrate heating means, and similarly to the first film formation chamber 305, vapor deposition is performed using a plurality of organic compounds in order. Then, a second organic compound film (here, green) composed of a region having a plurality of functions is formed.
[0165]
Further, the substrate 304 is transferred to the third transfer chamber 309. In addition, when the substrate is transferred from the second deposition chamber 308 to the third transfer chamber 309, it is preferable to maintain the degree of vacuum without being exposed to the atmosphere. When the metal mask 303 having the same opening pattern is used, the substrate 304 and the metal mask 303 are once separated in the third transfer chamber 309, and then the metal mask 303 is aligned with the position where the third organic compound film is formed. Alignment may be performed. After the alignment is completed, the substrate 304 and the metal mask 303 are overlapped and fixed again. In the case where a metal mask having a different pattern is used, a new mask is prepared in advance, and alignment with the substrate may be performed in the third transfer chamber or the third film formation chamber.
[0166]
Then, the substrate 304 is transferred to the third film formation chamber 310. In addition, when the substrate is transferred from the third transfer chamber 309 to the third deposition chamber 310, it is preferable to maintain the degree of vacuum without being exposed to the atmosphere. Similarly, the third film formation chamber is provided with a plurality of vapor deposition sources and substrate heating means, and in the same manner as the other film formation chambers, a plurality of organic compounds are sequentially used for vapor deposition. A third organic compound film (here, blue) made of a region having a function is formed.
[0167]
Then, the substrate 304 is transferred to the annealing chamber 312. In addition, when the substrate is transferred from the third film formation chamber 310 to the annealing chamber 312, it is preferable to maintain the degree of vacuum without being exposed to the atmosphere. After the substrate is transferred to the annealing chamber 312, annealing is performed in a vacuum. It is preferable to perform annealing at 100 to 200 ° C. after the deposition, with a higher vacuum than the degree of vacuum at the time of deposition. Impurities such as oxygen and moisture in the organic compound layer formed on the substrate are further removed by this annealing (deaeration) to form a high-density and high-purity organic compound layer. Further, the annealing chamber 312 may be provided with a substrate inversion mechanism.
[0168]
Finally, the substrate 304 is transferred to the unload chamber 311, and after returning to normal pressure by introducing an inert gas, the substrate 304 is taken out of the deposition apparatus.
[0169]
Alternatively, annealing may be performed after introducing an inert gas in the annealing chamber 312 and returning to normal pressure. After annealing in vacuum in the annealing chamber 312, the pressure may be returned to normal pressure by introducing an inert gas into the annealing chamber 312.
[0170]
In this way, by aligning the metal mask 303 in the transfer chamber (or film formation chamber) each time a different organic compound film is formed, a plurality of organic compound films can be formed in the same apparatus while maintaining the degree of vacuum. Can be formed. As described above, since the functional region for forming one organic compound film is formed in the same film formation chamber, impurity contamination between the functional regions can be avoided. Further, in this film formation apparatus, a mixed region can be formed between different functional regions; thus, a light-emitting element having a plurality of functions can be manufactured without showing a clear stacked structure.
[0171]
In this embodiment, an apparatus for forming an organic compound film is shown. However, the film forming apparatus of the present invention is not limited to this configuration, and forms a cathode formed on the organic compound film. A structure in which a film formation chamber or a treatment chamber capable of sealing the light emitting element may be provided. Further, the order in which the organic compound films that emit red, green, and blue light are formed may be any order.
[0172]
Furthermore, a means for cleaning the transfer chamber and the film formation chamber shown in this embodiment may be provided. A cleaning preliminary chamber 22 as shown in FIG. 3 can be provided.
[0173]
Moreover, you may provide the mask preliminary | backup chamber for stocking the used vapor deposition mask and the vapor deposition mask before use in each conveyance chamber and each film-forming chamber.
[0174]
This embodiment can be freely combined with Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 3, Embodiment Mode 4 or Example 1.
[0175]
[Example 3]
In the second embodiment, an example of an apparatus that performs the formation up to the formation of the organic compound film is shown. However, in this embodiment, the case where the apparatus that performs the sealing is an in-line method will be described with reference to FIG.
[0176]
In FIG. 6, reference numeral 501 denotes a load chamber from which the substrate is transferred. Note that the substrate in this embodiment refers to a substrate formed up to the anode or cathode of the light emitting element (up to the anode in this embodiment) on the substrate. The load chamber 501 includes an exhaust system 500a. The exhaust system 500a includes a first valve 51, a turbo molecular pump 52, a second valve 53, a third valve 54, and a dry pump 55.
[0177]
In this embodiment, the material used in each processing chamber such as a load chamber, a transfer chamber, a film formation chamber, a sealing chamber, and an unload chamber blocked by a gate can be reduced by reducing its surface area. Since the adsorptivity of impurities such as water and water can be reduced, aluminum or stainless steel (SUS) or other material that has been mirror-polished by electrolytic polishing is used for the inner wall surface, and the pores are extremely reduced. An internal member made of a material such as ceramics is used. These materials have surface smoothness such that the center average roughness is 30 mm or less.
[0178]
The first valve 51 is a main valve having a gate valve, but a butterfly valve may also be used as a conductance valve. The second valve 53 and the third valve 54 are fore valves. First, the second valve 53 is opened, the load chamber 501 is roughly decompressed by the dry pump 55, and then the first valve 51 and the third valve 54 are opened to make a turbo. The load chamber 501 is depressurized to a high vacuum by the molecular pump 52. A mechanical booster pump may be used instead of the turbo molecular pump, or the turbo molecular pump may be used after increasing the degree of vacuum with the mechanical booster pump.
[0179]
Next, reference numeral 502 denotes a transfer chamber. Here, the alignment of the metal mask and the placement of the substrate on the metal mask may be performed for film formation in the film formation chamber to be transported next. Further, the transfer chamber 502 may be provided with a substrate reversing mechanism.
The alignment method here may be performed by the method described in FIG. Further, alignment may be performed in the film formation chamber 503. The transfer chamber (A) 502 includes an exhaust system 500b. The load chamber 501 is hermetically shut off by a gate (not shown).
[0180]
Further, the transfer chamber (A) 502 is provided with a cleaning preliminary chamber 513a, and cleaning in the transfer chamber (A) 502 is possible. Note that a metal mask can be cleaned by providing a used metal mask in the transfer chamber (A) 502 in advance.
[0181]
Next, reference numeral 503 denotes a film formation chamber for forming a first organic compound film by an evaporation method, and is referred to as a film formation chamber (A). The film formation chamber (A) 503 includes an exhaust system 500c. The transfer chamber (A) 502 is hermetically sealed by a gate (not shown).
[0182]
In addition, the film formation chamber (A) 503 is provided with a cleaning preliminary chamber 513b in the same manner as the transfer chamber (A) 502.
[0183]
In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (A) 503, and a first organic compound film that emits red light is formed. In addition, as a deposition source, a first deposition source including a hole-injecting organic compound, a second deposition source including a hole-transporting organic compound, a host of an organic compound having a light-emitting property, and A third deposition source comprising a hole transporting organic compound, a fourth deposition source comprising a light emitting organic compound, a fifth deposition source comprising a blocking organic compound, A sixth evaporation source including an electron transporting organic compound is provided.
[0184]
In this example, copper phthalocyanine (hereinafter referred to as Cu-Pc) and a hole transporting organic compound provided in the second vapor deposition source are used as the hole injecting organic compound provided in the first vapor deposition source. 4,4′-bis [N- (1-naphthyl) -N-phenyl-amino] -biphenyl (hereinafter referred to as α-NPD), an organic compound serving as a host for the third vapor deposition source (hereinafter referred to as “α-NPD”) 4,4′-dicarbazole-biphenyl (hereinafter referred to as CBP) as the host material, and 2,3,7,8,12,13,17 as the luminescent organic compound provided in the fourth evaporation source. , 18-octaethyl-21H, 23H-porphyrin-platinum (hereinafter referred to as PtOEP), as a blocking organic compound for the fifth vapor deposition source, bathocuproine (hereinafter referred to as BCP), sixth steam Tris (8-quinolinolato) aluminum (hereinafter referred to as Alq) is an electron transporting organic compound provided for the source. _Three Is used).
[0185]
By depositing these organic compounds in order, an organic compound film composed of a region having a hole injecting property, a hole transporting property, a light emitting property, and an electron transporting property can be formed on the anode. it can.
[0186]
In this embodiment, a mixed region is formed at the interface between different functional regions by simultaneously depositing an organic compound that forms both functional regions. That is, a mixed region is formed at the interface between the hole injecting region and the hole transporting region and at the interface between the hole transporting region and the electron transporting region including the light emitting region.
[0187]
Specifically, Cu—Pc is formed to a thickness of 15 nm to form the first functional region, and then Cu—Pc and α-NPD are simultaneously deposited to form a first thickness of 5 to 10 nm. One mixed region is formed, α-NPD is formed to a thickness of 40 nm to form a second functional region, and α-NPD and CBP are simultaneously deposited to form a second thickness of 5 to 10 nm. After forming the mixed region, CBP is deposited to a film thickness of 25 to 40 nm to form the third functional region, and by simultaneously depositing CBP and PtOEP at the time of forming the third functional region, A third mixed region is formed in the whole or part of the third functional region. Here, the third mixed region has a light emitting property. Further, a fourth mixed region is formed by simultaneously depositing CBP and BCP with a film thickness of 5 to 10 nm. Further, the fourth functional region is formed by forming BCP with a thickness of 8 nm. In addition, BCP and Alq _Three Are simultaneously deposited in a thickness of 5 to 10 nm to form a fifth mixed region. Finally Alq _Three By forming the film with a thickness of 25 nm, the fifth functional region can be formed, and the first organic compound film is formed as described above.
[0188]
Here, as the first organic compound film, six kinds of organic compounds having different functions are provided in six vapor deposition sources, respectively, and an organic compound film is formed by vapor-depositing them. The example is not limited to this, and may be plural. Further, the number of organic compounds provided in one vapor deposition source is not necessarily one, and a plurality of organic compounds may be provided. For example, in addition to one kind of material provided as a light-emitting organic compound in the vapor deposition source, another organic compound that can serve as a dopant may be provided together. Note that a known material may be used as an organic compound that forms an organic compound film that has these multiple functions and emits red light.
[0189]
Note that the deposition source can be controlled by a microcomputer so that the deposition rate can be controlled. In addition, it is preferable that the mixing ratio at the time of forming a plurality of organic compounds at the same time can be controlled.
[0190]
Next, a transfer chamber 506 is also shown. Here, the alignment of the metal mask and the placement of the substrate on the metal mask may be performed for film formation in the film formation chamber to be transported next. Further, alignment may be performed in the film formation chamber 507. Note that the transfer chamber (B) 506 includes an exhaust system 500d. The film formation chamber (A) 503 is hermetically sealed with a gate (not shown). Further, similarly to the alignment chamber (A) 502, a cleaning preliminary chamber 513c hermetically sealed by a gate (not shown) is provided.
[0191]
Next, reference numeral 507 denotes a film formation chamber for forming a second organic compound film by an evaporation method, and is called a film formation chamber (B). The film formation chamber (B) 507 is provided with an exhaust system 500e. The transfer chamber (B) 506 is hermetically shut off by a gate (not shown). Further, similarly to the film formation chamber (A) 503, a cleaning preliminary chamber 513d sealed with a gate (not shown) is provided.
[0192]
In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (B) 507, and a second organic compound film that emits green light is formed. In addition, as a deposition source, a first deposition source including a hole injecting organic compound, a second deposition source and a third deposition source including a hole transporting organic compound, a hole transporting property, A fourth evaporation source including the host material, a fifth evaporation source including the light-emitting organic compound, a sixth evaporation source including the blocking organic compound, and an electron-transporting organic compound A seventh vapor deposition source comprising:
[0193]
In this example, Cu-Pc is used as the hole injecting organic compound provided in the first vapor deposition source, MTDATA is used as the hole transporting organic compound provided in the second vapor deposition source, and the third vapor deposition is provided. Α-NPD as a hole transporting organic compound provided in the source, CBP as a hole transporting host material provided in the fourth deposition source, and Tris (2−2) as a light emitting organic compound provided in the fifth deposition source Phenylpyridine) iridium (Ir (ppy) _Three ), BCP as the blocking organic compound provided for the sixth vapor deposition source, Alq as the organic compound for electron transport provided for the seventh vapor deposition source _Three Is used.
[0194]
In addition, by depositing these organic compounds in order, a second organic compound film comprising a region having a hole transporting property, a light emitting property, a blocking property, and an electron transporting property is formed on the anode. Can do.
[0195]
In this embodiment, a mixed region is formed at the interface between different functional regions by simultaneously depositing an organic compound that forms both functional regions. That is, mixed regions are formed at the interface between the hole transporting region and the blocking region and at the interface between the blocking region and the electron transporting region, respectively.
[0196]
Specifically, Cu—Pc is formed to a thickness of 10 nm to form the first functional region, and then Cu—Pc and MTDATA are vapor-deposited at the same time to form the first thickness of 5 to 10 nm. A mixed region is formed, MTDATA is deposited to a thickness of 20 nm, a second functional region is formed, and MTDATA and α-NPD are vapor-deposited simultaneously to form a second mixed layer with a thickness of 5 to 10 nm. Forming a region, forming α-NPD to a thickness of 10 nm, forming a third functional region, and simultaneously depositing α-NPD and CBP to form a third layer with a thickness of 5 to 10 nm. A mixed region is formed, CBP is formed to a thickness of 20 to 40 nm, a fourth functional region is formed, and when the fourth functional region is formed, a part or the whole thereof (Ir (ppy) _Three ) Are simultaneously deposited to form a fourth mixed region, and CBP and BCP are simultaneously deposited to form a fifth mixed region with a thickness of 5 to 10 nm, and BCP is formed to a thickness of 10 nm. To form a fifth functional region, and BCP and Alq _Three To form a sixth mixed region with a thickness of 5 to 10 nm, and finally Alq _Three Is formed to a thickness of 40 nm, thereby forming a sixth functional region and forming a second organic compound film.
[0197]
Here, as the second organic compound film, organic compounds having different functions are provided in seven vapor deposition sources, respectively, and the case where these are vapor-deposited to form an organic compound film has been described. It is not limited to this, and it is sufficient if it is plural. Note that a known material may be used as an organic compound that forms an organic compound film that has these multiple functions and emits green light.
[0198]
Next, reference numeral 508 denotes a transfer chamber. Here, the alignment of the metal mask and the placement of the substrate on the metal mask may be performed for film formation in the film formation chamber to be transported next. Further, alignment may be performed in the film formation chamber 509. The transfer chamber (C) 508 is provided with an exhaust system 500f. The film formation chamber (B) 507 is hermetically sealed by a gate (not shown). Further, similar to the transfer chamber (A) 502, a cleaning preliminary chamber 513e hermetically sealed by a gate (not shown) is provided.
[0199]
Next, reference numeral 509 denotes a film formation chamber for forming a third organic compound film by an evaporation method, and is referred to as a film formation chamber (C). The film formation chamber (C) 509 is provided with an exhaust system 500 g. The transfer chamber (C) 508 is hermetically cut off by a gate (not shown). Further, similarly to the film formation chamber (A) 503, a cleaning preliminary chamber 513f hermetically sealed by a gate (not shown) is provided.
[0200]
In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (C) 509, and a third organic compound film that emits blue light is formed. In addition, as a deposition source, a first deposition source having a hole-injecting organic compound, a second deposition source having a light-emitting organic compound, and a first organic compound having a blocking property are provided. Three vapor deposition sources and a fourth vapor deposition source including an electron-transporting organic compound are provided.
[0201]
In this embodiment, Cu-Pc is used as the hole injecting organic compound provided in the first vapor deposition source, and α-NPD is used as the light emitting organic compound provided in the second vapor deposition source. As a blocking organic compound provided in the source, BCP, as an electron transporting organic compound provided in the fourth deposition source, Alq _Three Is used.
[0202]
By depositing these organic compounds in order, a third organic compound film composed of a region having a hole injection property, a light emission property, a blocking property, and an electron transport property can be formed on the anode. it can.
[0203]
In this embodiment, a mixed region is formed at the interface between different functional regions by simultaneously depositing an organic compound that forms both functional regions. That is, mixed regions are formed at the interface between the hole injecting region and the light emitting region, the interface between the light emitting region and the blocking region, and the interface between the blocking region and the electron transporting region.
[0204]
Specifically, Cu—Pc is formed to a thickness of 20 nm to form the first functional region, and then Cu—Pc and α-NPD are simultaneously deposited to form a first thickness of 5 to 10 nm. One mixed region is formed, α-NPD is formed to a thickness of 40 nm to form a second functional region, and α-NPD and BCP are simultaneously deposited to form a second thickness of 5 to 10 nm. The mixed region is formed, and BCP is formed to a thickness of 10 nm to form the third functional region, and BCP and Alq are formed. _Three To form a third mixed region with a film thickness of 5 to 10 nm, and finally Alq _Three Is formed with a film thickness of 40 nm to form a third organic compound film.
[0205]
Here, as the third organic compound film, four kinds of organic compounds having different functions are provided in four vapor deposition sources, respectively, and the organic compound film is formed by sequentially vapor-depositing them. The number is not limited to the above, and any number may be used. Further, the number of organic compounds provided in one vapor deposition source is not necessarily one, and a plurality of organic compounds may be provided. For example, in addition to one kind of material provided as a light-emitting organic compound in the vapor deposition source, another organic compound that can serve as a dopant may be provided together. Note that a known material may be used as an organic compound that forms an organic compound film that has these multiple functions and emits blue light.
[0206]
In this embodiment, an organic compound film that emits red light is formed in a film formation chamber (A) 503 which is a first film formation chamber, and a film formation chamber (B) which is a second film formation chamber. ) 507, an organic compound film that emits green light is formed, and an organic compound film that emits blue light is formed in the film formation chamber (C) 509 that is the third film formation chamber. The order of formation is not limited to this. In the film formation chamber (A) 503, the film formation chamber (B) 507, and the film formation chamber (C) 509, an organic compound film that emits red light, and green light emission. Either an organic compound film exhibiting blue or an organic compound film exhibiting blue light emission may be formed. Furthermore, another film formation chamber may be provided to form an organic compound film that emits white light.
[0207]
Further, an annealing furnace may be provided here, and annealing may be performed in a vacuum after the film formation of these organic compounds is completed. By this annealing (deaeration) after the film formation, impurities such as oxygen and moisture in the organic compound layer formed on the substrate can be further removed, and a high-density and high-purity organic compound layer can be formed.
[0208]
Next, reference numeral 510 denotes a film formation chamber for forming a conductive film that serves as an anode or a cathode of the light emitting element (in this embodiment, a metal film that serves as a cathode) by vapor deposition, and is referred to as a film formation chamber (D). The film formation chamber (D) 510 includes an exhaust system 500h. The film formation chamber (C) 509 is hermetically sealed with a gate (not shown). Further, similarly to the film formation chamber (A) 503, a cleaning preliminary chamber 513g sealed with a gate (not shown) is provided.
[0209]
In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (D) 510. Accordingly, the detailed operation of the film formation chamber (D) 510 may be referred to the description of FIG.
[0210]
In this embodiment, in the film formation chamber (D) 510, an Al—Li alloy film (an alloy film of aluminum and lithium) is formed as a conductive film to be a cathode of the light emitting element. Note that it is possible to co-evaporate an element belonging to Group 1 or Group 2 of the periodic table and aluminum.
[0211]
Further, a CVD chamber may be provided here, and an insulating film such as a silicon nitride film, a silicon oxide film, or a DLC film may be formed as a protective film (passivation film) of the light-emitting element. In the case where a CVD chamber is provided, a gas purifier for purifying a material gas used in the CVD chamber in advance is preferably provided.
[0212]
Next, reference numeral 511 denotes a sealing chamber, which includes an exhaust system 500i. The film formation chamber (D) 510 is hermetically sealed by a gate (not shown). In the sealing chamber 511, a process for finally sealing the light emitting element in the sealed space is performed. This treatment is a treatment for protecting the formed light emitting element from oxygen and moisture, and means such as mechanically encapsulating with a cover material or encapsulating with a thermosetting resin or an ultraviolet light curable resin is used.
[0213]
As the cover material, glass, ceramics, plastic, or metal can be used. However, when light is emitted to the cover material side, it must be translucent. In addition, the cover material and the substrate on which the light emitting element is formed are bonded together using a sealing material such as a thermosetting resin or an ultraviolet light curable resin, and the resin is cured by heat treatment or ultraviolet light irradiation treatment to form a sealed space. Form. It is also effective to provide a hygroscopic material typified by barium oxide in this sealed space.
[0214]
In addition, the space between the cover material and the substrate over which the light-emitting element is formed can be filled with a thermosetting resin or an ultraviolet light curable resin. In this case, it is effective to add a moisture absorbing material typified by barium oxide in the thermosetting resin or the ultraviolet light curable resin.
[0215]
In the film forming apparatus shown in FIG. 6, a mechanism for irradiating ultraviolet light (hereinafter referred to as an ultraviolet light irradiation mechanism) is provided inside the sealing chamber 511, and ultraviolet light emitted from the ultraviolet light irradiation mechanism. Thus, the ultraviolet light curable resin is cured.
[0216]
Finally, 512 is an unload chamber, which is provided with an exhaust system 500j. The substrate on which the light emitting element is formed is taken out from here.
[0217]
As described above, by using the film formation apparatus illustrated in FIG. 6 (or FIG. 1), it is not necessary to expose the light-emitting element to the outside until the light-emitting element is completely enclosed in a sealed space; thus, a highly reliable light-emitting device is manufactured. It becomes possible.
[0218]
Further, this embodiment can be freely combined with Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 3, Embodiment Mode 4, Example 1, or Example 2.
[0219]
[Example 4]
A film forming apparatus of the present invention will be described with reference to FIG. In FIG. 7, reference numeral 701 denotes a transfer chamber. The transfer chamber 701 is provided with a transfer mechanism (A) 702 to transfer the substrate 703. The transfer chamber 701 is in a reduced-pressure atmosphere, and is connected to each processing chamber by a gate. The transfer of the substrate to each processing chamber is performed by the transfer mechanism (A) 702 when the gate is opened. In order to depressurize the transfer chamber 701, an exhaust pump such as a dry pump, a mechanical booster pump, a turbo molecular pump (magnetic levitation type), or a cryopump can be used. In order to obtain, a magnetic levitation type turbo molecular pump is preferable.
[0220]
Hereinafter, each processing chamber will be described. Since the transfer chamber 701 is in a reduced pressure atmosphere, all the processing chambers directly connected to the transfer chamber 701 are provided with an exhaust pump (not shown). As the exhaust pump, the above-described dry pump, mechanical booster pump, turbo molecular pump (magnetic levitation type) or cryopump is used, and here, the magnetic levitation type turbo molecular pump is preferable.
[0221]
First, reference numeral 704 denotes a load chamber in which a substrate is set (installed). The load chamber 704 is connected to the transfer chamber 701 by a gate 700a, and a carrier (not shown) on which a substrate 703 is set is disposed. Note that the load chamber 704 also serves as a transfer chamber for the substrate that has been completed up to the element formation to the sealing chamber. It should be noted that the load chamber 704 may be distinguished for substrate loading and substrate transfer. The load chamber 704 includes the above-described exhaust pump and a purge line for introducing high-purity nitrogen gas or rare gas. As the exhaust pump, a turbo molecular pump is desirable. Further, the purge line is provided with a gas purifier, and impurities (oxygen and water) of gas introduced into the apparatus are previously removed.
[0222]
Note that in this embodiment, as the substrate 703, a substrate formed up to a transparent conductive film to be an anode of a light emitting element is used. In this embodiment, the substrate 703 is set on the carrier with the deposition surface facing downward.
[0223]
Reference numeral 705 denotes an alignment chamber for aligning the metal mask and aligning the metal mask with the substrate formed up to the anode or cathode (anode in this embodiment) of the light emitting element. The alignment chamber 705 is a gate. 700b is connected to the transfer chamber 701. Note that each time a different organic compound film is formed, the alignment of the metal mask and the alignment of the substrate and the metal mask are performed in the alignment chamber. Further, the alignment chamber 705 includes a CCD (Charge Coupled Device) known as an image sensor, so that the substrate and the metal mask are accurately aligned when the film is formed using the metal mask. Make it possible.
[0224]
Further, a cleaning preliminary chamber 722 a is connected to the alignment chamber 705. The configuration of the cleaning preliminary chamber 722a is as shown in FIG. 3 and the second embodiment. In addition, cleaning may be performed using a reactive gas. In addition, a preliminary cleaning chamber is not provided, and gases (Ar, H, F, NF) are formed in the film formation chamber as shown in the third embodiment. _Three Or one or a plurality of gases selected from O) may be introduced to generate plasma in the deposition chamber for dry cleaning, or Ar gas or the like may be introduced to perform physical cleaning by sputtering. Cleaning may be performed.
[0225]
When cleaning is performed using a reactive gas, a μ-wave oscillator for generating a μ-wave is provided, and the generated μ-wave is sent to a plasma discharge tube through a waveguide. The μ wave oscillator used here emits a μ wave of about 2.45 GHz. Further, a reactive gas is supplied to the plasma discharge tube from a gas introduction tube. As reactive gas, NF _Three , CF _Four Or ClF _Three Etc. may be used. In the plasma discharge tube, the reactive gas is decomposed by the μ wave to generate radicals. This radical passes through the gas introduction pipe and is introduced into the alignment chamber 705 connected through the gate. The alignment chamber 705 is provided with a metal mask to which an organic compound film is attached. A radical can be introduced into the alignment chamber 705 by opening a gate provided between the cleaning preliminary chamber 722 a and the alignment chamber 705. Thereby, the metal mask can be cleaned.
[0226]
Next, reference numeral 706 denotes a film formation chamber for forming an organic compound film by an evaporation method, and is referred to as a film formation chamber (A). The film formation chamber (A) 706 is connected to the transfer chamber 701 through a gate 700c. In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (A) 706.
[0227]
In this embodiment, a first organic compound film that emits red light is formed in the film formation portion 707 in the film formation chamber (A) 706.
[0228]
Note that by sequentially depositing the organic compound, an organic compound film including a region having a hole injection property, a hole transport property, a light emission property, and an electron transport property can be formed on the anode.
[0229]
The film formation chamber (A) 706 is connected to the material exchange chamber 714 through a gate 700g. Note that the material exchange chamber 714 is provided with a heater for heating the exchanged organic compound. Impurities such as water can be removed by heating the organic compound in advance. The temperature applied at this time is desirably 200 ° C. or lower. In addition, since the material exchange chamber 714 is provided with an exhaust pump capable of reducing the inside of the material exchange chamber 714, an organic compound is added or exchanged from the outside and the heat treatment is performed, and then the inside is reduced. The gate 700g is opened when the pressure is the same as in the film formation chamber, and an organic compound can be provided in the evaporation source in the film formation chamber. Note that the organic compound is provided in an evaporation source in the deposition chamber by a transport mechanism or the like.
[0230]
Note that the film formation process in the film formation chamber (A) 706 may refer to the description of FIG. 1 described in Embodiment Mode 1 or Example 1.
[0231]
Note that a preliminary cleaning chamber 722 b is also connected to the film forming chamber (A) 706 via a gate (not shown), as in the alignment chamber 705. Note that the specific structure is the same as that of the cleaning preliminary chamber 722a, and an organic compound or the like attached to the inside of the deposition chamber (A) 706 can be removed.
[0232]
Next, reference numeral 708 denotes a film formation chamber for forming a second organic compound film by an evaporation method, and is referred to as a film formation chamber (B). The film formation chamber (B) 708 is connected to the transfer chamber 701 through a gate 700d. In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (B) 708. In this embodiment, an organic compound film that emits green light is formed in the film formation portion 709 in the film formation chamber (B) 708.
[0233]
In addition, the organic compound film which consists of the area | region which has a function of hole transport property, light-emitting property, blocking property, and electron transport property on an anode can be formed by vapor-depositing an organic compound in order.
[0234]
The film formation chamber (B) 708 is connected to a material exchange chamber 715 through a gate 700h. Note that the material exchange chamber 715 is provided with a heater for heating the exchanged organic compound. Impurities such as water can be removed by heating the organic compound in advance. The temperature applied at this time is preferably 200 ° C. or lower. In addition, since the material exchange chamber 715 is provided with an exhaust pump capable of reducing the inside of the material exchange chamber 715, the inside of the material exchange chamber 715 is reduced in pressure after the organic compound is introduced from outside. The gate 700h is opened when the pressure is the same as that in the film formation chamber, and an organic compound can be provided in the evaporation source in the film formation chamber. Note that the organic compound is provided in an evaporation source in the deposition chamber by a transport mechanism or the like.
[0235]
Note that for the film formation process in the film formation chamber (B) 708, the description of FIG. Note that a cleaning preliminary chamber 722c is also connected to the film forming chamber (B) 708 through a gate (not shown), as in the alignment chamber 705.
[0236]
Next, reference numeral 710 denotes a film formation chamber for forming a third organic compound film by an evaporation method, and is referred to as a film formation chamber (C). The film formation chamber (C) 710 is connected to the transfer chamber 701 through a gate 700e. In this embodiment, a film formation chamber having the structure shown in FIG. 1 is provided as the film formation chamber (C) 710. In this embodiment, an organic compound film that emits blue light is formed in the film formation portion 711 in the film formation chamber (C) 710.
[0237]
Note that, by sequentially depositing the organic compound, an organic compound film composed of a region having a hole injecting property, a light emitting property, a blocking property, and an electron transporting property can be formed on the anode.
[0238]
The film formation chamber (C) 710 is connected to a material exchange chamber 716 through a gate 700i.
[0239]
Note that for the film formation process in the film formation chamber (C) 710, the description of FIG.
[0240]
Note that a cleaning preliminary chamber 722d is also connected to the film forming chamber (C) 710 through a gate (not shown) in the same manner as the alignment chamber 705.
[0241]
Next, reference numeral 712 denotes a film formation chamber for forming a conductive film that serves as an anode or a cathode of a light emitting element (in this embodiment, a metal film that serves as a cathode) by vapor deposition, and is referred to as a film formation chamber (D). The film formation chamber (D) 712 is connected to the transfer chamber 701 through a gate 700f. In this embodiment, an Al—Li alloy film (an alloy film of aluminum and lithium) is formed as a conductive film to be a cathode of a light emitting element in a film formation portion 713 in the film formation chamber (D) 712. It is also possible to co-evaporate an element belonging to Group 1 or Group 2 of the periodic table and aluminum.
[0242]
The film formation chamber (D) 712 is connected to a material exchange chamber 717 through a gate 700j. Note that the material exchange chamber 717 is provided with a heater for heating the exchanged conductive material. Note that a cleaning preliminary chamber 722e is also connected to the film forming chamber (D) 712 through a gate (not shown) in the same manner as the alignment chamber 705.
[0243]
The film formation chamber (A) 706, the film formation chamber (B) 708, the film formation chamber (C) 710, and the film formation chamber (D) 712 are each provided with a mechanism for heating each film formation chamber. Thus, part of the impurities in the deposition chamber can be removed.
[0244]
The deposition chamber (A) 706, the deposition chamber (B) 708, the deposition chamber (C) 710, and the deposition chamber (D) 712 are depressurized by an exhaust pump. The ultimate vacuum at this time is 10 ^-6 For example, the exhaust speed is preferably 10,000 l / s (H ₂ The surface area inside the film formation chamber is 10 m using the cryopump of O). ² When the inside of the film forming chamber is made of aluminum, the amount of leakage inside the film forming chamber is 4.1 × 10 in 20 hours. ^-7 Pa · m ^Three ・ S ^-1 Must be:
[0245]
Next, reference numeral 718 denotes a sealing chamber (also referred to as a sealing chamber or a glove box), which is connected to the load chamber 704 via a gate 700k. In the sealing chamber 718, a process for finally sealing the light emitting element in the sealed space is performed. This treatment is a treatment for protecting the formed light emitting element from oxygen and moisture, and means such as mechanically encapsulating with a cover material or encapsulating with a thermosetting resin or an ultraviolet light curable resin is used.
[0246]
As the cover material, glass, ceramics, plastic, or metal can be used. However, when light is emitted to the cover material side, it must be translucent. Further, the cover material and the substrate on which the light emitting element is formed are bonded together using a sealant such as a thermosetting resin or an ultraviolet light curable resin, and the resin is cured by a heat treatment or an ultraviolet light irradiation treatment to thereby form a sealed space. Form. It is also effective to provide a hygroscopic agent typified by barium oxide in this sealed space.
[0247]
In addition, the space between the cover material and the substrate over which the light-emitting element is formed can be filled with a thermosetting resin or an ultraviolet light curable resin. In this case, it is effective to add a moisture absorbing material typified by barium oxide in the thermosetting resin or the ultraviolet light curable resin.
[0248]
In the film forming apparatus shown in FIG. 7, a mechanism (hereinafter referred to as an ultraviolet light irradiation mechanism) 719 for irradiating ultraviolet light is provided inside the sealing chamber 718, and emitted from the ultraviolet light irradiation mechanism 719. An ultraviolet light curable resin is cured by ultraviolet light. Further, the inside of the sealing chamber 718 can be decompressed by attaching an exhaust pump. In the case where the sealing step is mechanically performed by robot operation, mixing of oxygen and moisture can be prevented by performing it under reduced pressure. Specifically, the concentration of oxygen or water is desirably 0.3 ppm or less. Conversely, the inside of the sealing chamber 718 can be pressurized. In this case, the pressure is increased while purging with high-purity nitrogen gas or rare gas to prevent oxygen or the like from entering from the outside air.
[0249]
Next, a delivery chamber (pass box) 720 is connected to the sealing chamber 718. A delivery mechanism (B) 721 is provided in the delivery chamber 720, and the substrate in which the light emitting element is completely sealed in the sealing chamber 718 is delivered to the delivery chamber 720. The delivery chamber 720 can also be decompressed by attaching an exhaust pump. The delivery chamber 720 is a facility for preventing the sealing chamber 718 from being directly exposed to the outside air, from which the substrate is taken out. In addition, it is also possible to provide a member supply chamber (not shown) for supplying members used in the sealing chamber.
[0250]
Although not shown in the present embodiment, insulation including a compound containing silicon such as silicon nitride or silicon oxide and a DLC (Diamond Like Carbon) film containing carbon on these compounds after the light emitting element is formed. A film may be formed over the light emitting element. DLC (Diamond Like Carbon) film is a diamond bond (sp ^Three Bond) and graphite bond (SP) ² It is an amorphous film in which (bonding) is mixed. In this case, a film forming chamber provided with a CVD (chemical vapor deposition) apparatus for generating a plasma by applying a self-bias and forming a thin film by plasma discharge decomposition of the source gas may be provided.
[0251]
As described above, by using the film formation apparatus illustrated in FIG. 7, it is not necessary to expose the light-emitting element to the outside air until the light-emitting element is completely enclosed in the sealed space. Therefore, a highly reliable light-emitting device can be manufactured. .
[0252]
Further, this embodiment can be freely combined with Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 4, Example 1, or Example 2.
[0253]
[Example 5]
In this example, a light-emitting device manufactured using the film formation apparatus of the present invention will be described. FIG. 8 is a cross-sectional view of an active matrix light-emitting device. Here, a thin film transistor (hereinafter referred to as “TFT”) is used as an active element, but a MOS transistor may be used.
[0254]
Further, although a top gate TFT (specifically, a planar TFT) is exemplified as the TFT, a bottom gate TFT (typically an inverted staggered TFT) can also be used.
[0255]
In this embodiment, the substrate 800 may be a substrate made of glass such as barium borosilicate glass or alumino borosilicate glass, a quartz substrate, a silicon substrate, a metal substrate, or a stainless substrate on which an insulating film is formed. Further, a plastic substrate having heat resistance that can withstand the processing temperature of this embodiment may be used, or a flexible substrate may be used.
[0256]
First, as a lower layer 801 of a base insulating film by a plasma CVD method on a heat resistant glass substrate (substrate 800) having a thickness of 0.7 mm, a deposition temperature of 400 ° C. by a plasma CVD method, a source gas SiH _Four , NH _Three , N ₂ A silicon oxynitride film made of O (composition ratio Si = 32%, O = 27%, N = 24%, H = 17%) is formed to 50 nm (preferably 10 to 200 nm). Next, after cleaning the surface with ozone water, the oxide film on the surface is removed with dilute hydrofluoric acid (1/100 dilution). Next, as the upper layer 802 of the base insulating film, a film formation temperature of 400 ° C. and a source gas SiH by plasma CVD _Four , N ₂ A silicon oxynitride film made of O (composition ratio Si = 32%, O = 59%, N = 7%, H = 2%) is laminated to a thickness of 100 nm (preferably 50 to 200 nm), and Deposition temperature 300 ° C., deposition gas SiH by plasma CVD method without opening to the atmosphere _Four A semiconductor film having an amorphous structure (here, an amorphous silicon film) is formed to a thickness of 54 nm (preferably 25 to 200 nm).
[0257]
Although the base insulating film is shown as a two-layer structure in this embodiment, it may be formed as a single layer film of an insulating film containing silicon as a main component or a structure in which two or more layers are stacked. The material of the semiconductor film is not limited, but preferably silicon or silicon germanium (Si _X Ge _1-X (X = 0.0001 to 0.02)) An alloy or the like may be used and may be formed by a known means (such as sputtering, LPCVD, or plasma CVD). The plasma CVD apparatus may be a single wafer type apparatus or a batch type apparatus. Alternatively, the base insulating film and the semiconductor film may be successively formed without being exposed to the air in the same film formation chamber.
[0258]
Next, after cleaning the surface of the semiconductor film having an amorphous structure, an extremely thin oxide film of about 2 nm is formed on the surface with ozone water. Next, a small amount of impurity element (boron or phosphorus) is doped in order to control the threshold value of the TFT. Here, diborane (B ₂ H ₆ ) Using a plasma-excited ion doping method without mass separation, a doping condition of an acceleration voltage of 15 kV, a gas obtained by diluting diborane to 1% with hydrogen at a flow rate of 30 sccm, and a dose of 2 × 10 ¹² / Cm ² Then, boron is added to the amorphous silicon film.
[0259]
Next, a nickel acetate salt solution containing 10 ppm of nickel in terms of weight was applied with a spinner. Instead of coating, a method of spreading nickel element over the entire surface by sputtering may be used.
[0260]
Next, heat treatment is performed for crystallization, so that a semiconductor film having a crystal structure is formed. For this heat treatment, heat treatment in an electric furnace or irradiation with strong light may be used. When the heat treatment is performed in an electric furnace, the heat treatment may be performed at 500 ° C. to 650 ° C. for 4 to 24 hours. Here, after heat treatment for dehydrogenation (500 ° C., 1 hour), heat treatment for crystallization (550 ° C., 4 hours) was performed to obtain a silicon film having a crystal structure. Although crystallization is performed here using heat treatment using a furnace, crystallization may be performed using a lamp annealing apparatus capable of crystallization in a short time.
[0261]
Next, after removing the oxide film on the surface of the silicon film having a crystal structure with dilute hydrofluoric acid or the like, a solid-state laser capable of continuous oscillation is used to obtain a crystal having a large grain size, and the second harmonic to the second fundamental wave Irradiate the semiconductor film with the fourth harmonic. Laser irradiation is performed in the air or in an oxygen atmosphere. Note that since the reaction is performed in the air or in an oxygen atmosphere, an oxide film is formed on the surface by laser light irradiation. Typically, Nd: YVO _Four A second harmonic (532 nm) or a third harmonic (355 nm) of a laser (fundamental wave 1064 nm) may be applied. Output 10W continuous oscillation YVO _Four Laser light emitted from the laser is converted into a harmonic by a non-linear optical element. Also, YVO in the resonator _Four There is also a method of emitting harmonics by inserting a crystal and a nonlinear optical element. Then, it is preferably formed into a rectangular or elliptical laser beam on the irradiation surface by an optical system, and irradiated to the object to be processed. The energy density at this time is 0.01 to 100 MW / cm. ² Degree (preferably 0.1-10 MW / cm ² )is required. Then, irradiation may be performed by moving the semiconductor film relative to the laser light at a speed of about 10 to 2000 cm / s.
[0262]
Of course, continuous oscillation YVO _Four Although a TFT can be manufactured using a silicon film having a crystal structure before irradiation with the second harmonic of the laser, the crystallinity of the silicon film having a crystal structure after irradiation with laser light is improved. This is desirable because the electrical characteristics of the TFT are improved. For example, when a TFT is manufactured using a silicon film having a crystal structure before laser light irradiation, the mobility is 300 cm. ² / Vs, but when a TFT is manufactured using a silicon film having a crystal structure after laser light irradiation, the mobility is 500 to 600 cm. ² It is remarkably improved to about / Vs.
[0263]
Here, after crystallization using nickel as a metal element for promoting crystallization of silicon, continuous oscillation YVO is performed. _Four The second harmonic of the laser was irradiated, but there is no particular limitation, and after forming a silicon film having an amorphous structure and performing a heat treatment for dehydrogenation, the above continuous wave YVO _Four A silicon film having a crystal structure may be obtained by irradiating the second harmonic of the laser.
[0264]
In addition, a pulsed laser can be used instead of the continuous wave laser. When a pulsed excimer laser is used, the frequency is 300 Hz and the laser energy density is 100 to 1000 mJ / cm. ² (Typically 200-800mJ / cm ² ) Is desirable. At this time, the laser beams may be overlapped by 50 to 98%.
[0265]
Next, in addition to the oxide film formed by the laser light irradiation, the surface is treated with ozone water for 120 seconds to form a barrier layer made of an oxide film having a total thickness of 1 to 5 nm. In this embodiment, ozone water is used to form the barrier layer. However, the surface of the semiconductor film having a crystal structure is formed by a method of oxidizing the surface of the semiconductor film having a crystal structure by irradiation with ultraviolet rays in an oxygen atmosphere or by oxygen plasma treatment. The barrier layer may be formed by depositing an oxide film of about 1 to 10 nm by an oxidation method, a plasma CVD method, a sputtering method, an evaporation method, or the like. Further, the oxide film formed by laser light irradiation may be removed before forming the barrier layer.
[0266]
Next, an amorphous silicon film containing an argon element serving as a gettering site is formed with a thickness of 50 nm to 400 nm, here 150 nm, over the barrier layer by plasma CVD or sputtering. In this embodiment, a silicon target is used by a sputtering method, and a film is formed at a pressure of 0.3 Pa in an argon atmosphere.
[0267]
After that, heat treatment is performed for 3 minutes in a furnace heated to 650 ° C., and gettering is performed to reduce the nickel concentration in the semiconductor film having a crystal structure. A lamp annealing apparatus may be used instead of the furnace.
[0268]
Next, the amorphous silicon film containing an argon element as a gettering site is selectively removed using the barrier layer as an etching stopper, and then the barrier layer is selectively removed with dilute hydrofluoric acid. Note that during gettering, nickel tends to move to a region with a high oxygen concentration, and thus it is desirable to remove the barrier layer made of an oxide film after gettering.
[0269]
Next, after forming a thin oxide film with ozone water on the surface of the obtained silicon film having a crystal structure (also called a polysilicon film), a mask made of resist is formed and etched into a desired shape to form islands. A separated semiconductor layer is formed. After the semiconductor layer is formed, the resist mask is removed.
[0270]
Next, the oxide film is removed with an etchant containing hydrofluoric acid, and at the same time, the surface of the silicon film is washed, and then an insulating film containing silicon as a main component to be the gate insulating film 803 is formed. Here, a silicon oxynitride film (composition ratio: Si = 32%, O = 59%, N = 7%, H = 2%) with a thickness of 115 nm is formed by plasma CVD.
[0271]
Next, a first conductive film with a thickness of 20 to 100 nm and a second conductive film with a thickness of 100 to 400 nm are stacked over the gate insulating film. In this embodiment, a tantalum nitride film having a thickness of 50 nm and a tungsten film having a thickness of 370 nm are sequentially stacked on the gate insulating film 803, and patterning is performed in the following procedure to form each gate electrode and each wiring.
[0272]
The conductive material for forming the first conductive film and the second conductive film is an element selected from Ta, W, Ti, Mo, Al, and Cu, or an alloy material or a compound material containing the element as a main component. Form. Alternatively, a semiconductor film typified by a polycrystalline silicon film doped with an impurity element such as phosphorus, or an AgPdCu alloy may be used as the first conductive film and the second conductive film. Further, the present invention is not limited to the two-layer structure. For example, a three-layer structure in which a 50 nm-thickness tungsten film, a 500 nm-thick aluminum and silicon alloy (Al-Si) film, and a 30 nm-thickness titanium nitride film are sequentially stacked Also good. In the case of a three-layer structure, tungsten nitride may be used instead of tungsten of the first conductive film, or aluminum instead of the aluminum and silicon alloy (Al-Si) film of the second conductive film. A titanium alloy film (Al—Ti) may be used, or a titanium film may be used instead of the titanium nitride film of the third conductive film. Moreover, a single layer structure may be sufficient.
[0273]
An ICP (Inductively Coupled Plasma) etching method may be used for the etching of the first conductive film and the second conductive film (first etching process and second etching process). Using the ICP etching method, the film is formed into a desired taper shape by appropriately adjusting the etching conditions (the amount of power applied to the coil-type electrode, the amount of power applied to the substrate-side electrode, the electrode temperature on the substrate side, etc.) Can be etched. Here, after a mask made of resist is formed, 700 W RF (13.56 MHz) power is applied to the coil-type electrode at a pressure of 1 Pa as a first etching condition, and CF is used as an etching gas. _Four And Cl ₂ And O ₂ Each gas flow rate ratio is 25/25/10 (sccm), 150 W RF (13.56 MHz) power is applied to the substrate side (sample stage), and a substantially negative self-bias voltage is applied. To do. The electrode area size on the substrate side is 12.5 cm × 12.5 cm, and the coil-type electrode area size (here, the quartz disk provided with the coil) is a disk having a diameter of 25 cm. The W film is etched under this first etching condition so that the end portion is tapered. Then, the resist mask is not removed and the second etching condition is changed, and the etching gas is changed to CF. _Four And Cl ₂ The gas flow ratio is 30/30 (sccm), and 500 W of RF (13.56 MHz) power is applied to the coil-type electrode at a pressure of 1 Pa to generate plasma and etching for about 30 seconds. Went. 20 W of RF (13.56 MHz) power is also applied to the substrate side (sample stage), and a substantially negative self-bias voltage is applied. CF _Four And Cl ₂ Under the second etching condition in which is mixed, the W film and the TaN film are etched to the same extent. Here, the first etching condition and the second etching condition are referred to as a first etching process.
[0274]
Next, a second etching process is performed without removing the resist mask. Here, as the third etching condition, CF as an etching gas is used. _Four And Cl ₂ The gas flow ratio was 30/30 (sccm), and 500 W of RF (13.56 MHz) power was applied to the coil type electrode at a pressure of 1 Pa to generate plasma and perform etching for 60 seconds. . 20 W of RF (13.56 MHz) power is also applied to the substrate side (sample stage), and a substantially negative self-bias voltage is applied. Then, the resist mask is not removed and the etching condition is changed to the fourth etching condition. _Four And Cl ₂ And O ₂ The gas flow ratio is 20/20/20 (sccm), and 500 W of RF (13.56 MHz) power is applied to the coil-type electrode at a pressure of 1 Pa to generate plasma for about 20 seconds. Etching was performed. 20 W of RF (13.56 MHz) power is also applied to the substrate side (sample stage), and a substantially negative self-bias voltage is applied. Here, the third etching condition and the fourth etching condition are referred to as a second etching process. At this stage, the gate electrode 804 and the electrodes 805 to 807 having the first conductive layer 804a as a lower layer and the second conductive layer 804b as an upper layer are formed.
[0275]
Next, after removing the resist mask, a first doping process is performed to dope the entire surface using the gate electrodes 804 to 807 as a mask. The first doping process may be performed by an ion doping method or an ion implantation method. The condition of the ion doping method is that the dose is 1.5 × 10 ¹⁴ atoms / cm ² The acceleration voltage is set to 60 to 100 keV. Typically, phosphorus (P) or arsenic (As) is used as the impurity element imparting n-type conductivity. The first impurity region (n ^- Regions) 822-825 are formed.
[0276]
Next, a new resist mask is formed. At this time, in order to reduce the off-current value of the switching TFT 903, the mask covers the channel formation region and a part of the semiconductor layer in which the switching TFT 903 of the pixel portion 901 is formed. Form. The mask is also provided to protect the channel formation region of the semiconductor layer forming the p-channel TFT 906 of the driver circuit and the surrounding region. In addition, the mask is formed so as to cover the channel formation region of the semiconductor layer forming the current control TFT 904 of the pixel portion 901 and its peripheral region.
[0277]
Next, a second doping process is selectively performed using the mask made of the resist, so that an impurity region (n ^- Region). The second doping process may be performed by an ion doping method or an ion implantation method. Here, phosphine (PH _Three Gas) diluted to 5% with hydrogen at a flow rate of 30 sccm and a dose of 1.5 × 10 ¹⁴ atoms / cm ² And the acceleration voltage is 90 keV. In this case, the resist mask and the second conductive layer serve as a mask for the impurity element imparting n-type conductivity, and second impurity regions 311 and 312 are formed. In the second impurity region, 1 × 10 ¹⁶ ~ 1x10 ¹⁷ /cm ^Three An impurity element imparting n-type is added in a concentration range of. Here, a region having the same concentration range as the second impurity region is n ^- Also called a region.
[0278]
Next, a third doping process is performed without removing the resist mask. The third doping process may be performed by an ion doping method or an ion implantation method. Typically, phosphorus (P) or arsenic (As) is used as the impurity element imparting n-type conductivity. Here, phosphine (PH _Three Gas) diluted to 5% with hydrogen at a flow rate of 40 sccm and a dose of 2 × 10 ¹⁵ atoms / cm ² And the acceleration voltage is 80 keV. In this case, the resist mask, the first conductive layer, and the second conductive layer serve as a mask for the impurity element imparting n-type conductivity, and third impurity regions 813, 814, and 826 to 828 are formed. The third impurity region has 1 × 10 ²⁰ ~ 1x10 ^{twenty one} /cm ^Three An impurity element imparting n-type is added in a concentration range of. Here, a region having the same concentration range as the third impurity region is n ⁺ Also called a region.
[0279]
Next, after removing the resist mask, a new resist mask is formed and a fourth doping process is performed. Through the fourth doping treatment, fourth impurity regions 818, 819, 832, 833 in which an impurity element imparting p-type conductivity is added to the semiconductor layer forming the semiconductor layer for forming the p-channel TFT, and the 5 impurity regions 816, 817, 830, and 831 are formed.
[0280]
The fourth impurity regions 818, 819, 832, and 833 have 1 × 10 6 ²⁰ ~ 1x10 ^{twenty one} /cm ^Three An impurity element imparting p-type is added in a concentration range of. Note that the fourth impurity regions 818, 819, 832, and 833 are regions (n) to which phosphorus (P) is added in the previous step. ^- The concentration of the impurity element imparting p-type is 1.5 to 3 times that of the impurity element, and the conductivity type is p-type. Here, a region having the same concentration range as the fourth impurity region is represented by p. ⁺ Also called a region.
[0281]
The fifth impurity regions 816, 817, 830, and 831 are formed in a region overlapping the tapered portion of the second conductive layer, and 1 × 10 ¹⁸ ~ 1x10 ²⁰ /cm ^Three An impurity element imparting p-type is added in a concentration range of. Here, a region having the same concentration range as the fifth impurity region is represented by p. ^- Also called a region.
[0282]
Through the above steps, impurity regions having n-type or p-type conductivity are formed in each semiconductor layer. The conductive layers 804 to 807 serve as TFT gate electrodes.
[0283]
Next, an insulating film (not shown) that covers substantially the entire surface is formed. In this example, a 50 nm-thickness silicon oxide film was formed by plasma CVD. Of course, this insulating film is not limited to the silicon oxide film, and another insulating film containing silicon may be used as a single layer or a laminated structure.
[0284]
Next, a step of activating the impurity element added to each semiconductor layer is performed. This activation step is performed by a rapid thermal annealing method (RTA method) using a lamp light source, a laser irradiation method, a heat treatment using a furnace, or a method combined with any of these methods.
[0285]
Further, in this embodiment, an example in which an insulating film is formed before the activation is shown, but an insulating film may be formed after the activation.
[0286]
Next, a first interlayer insulating film 808 made of a silicon nitride film is formed and subjected to heat treatment (heat treatment at 300 to 550 ° C. for 1 to 12 hours) to hydrogenate the semiconductor layer. This step is a step of terminating dangling bonds in the semiconductor layer with hydrogen contained in the first interlayer insulating film 808. The semiconductor layer can be hydrogenated regardless of the presence of an insulating film (not shown) made of a silicon oxide film. As another means of hydrogenation, plasma hydrogenation (using hydrogen excited by plasma) may be performed.
[0287]
Next, a second interlayer insulating film 809 made of an organic insulating material is formed on the first interlayer insulating film 808. In this embodiment, an acrylic resin film 809a having a thickness of 1.6 μm is formed by a coating method, and a 200 nm silicon nitride film 809b is stacked by a sputtering method.
[0288]
Next, a pixel electrode 834 is formed so as to be in contact with and overlapping with a connection electrode to be formed later in contact with the drain region of the current control TFT 904 formed of a p-channel TFT. In this embodiment, the pixel electrode functions as an anode of the OLED, and the light emission of the OLED is passed through the pixel electrode, so that it is a transparent conductive film.
[0289]
Next, a contact hole reaching the conductive layer to be a gate electrode or a gate wiring and a contact hole reaching each impurity region are formed. In this embodiment, a plurality of etching processes are sequentially performed. In this embodiment, after the third interlayer insulating film is etched using the second interlayer insulating film as an etching stopper, the second interlayer insulating film is etched using the first interlayer insulating film as an etching stopper, and then the first interlayer insulating film is etched. The insulating film was etched.
[0290]
After that, electrodes 835 to 841, specifically source wirings, power supply lines, lead electrodes, connection electrodes, and the like are formed using Al, Ti, Mo, W, or the like. Here, patterning was performed using a laminated film of a Ti film (film thickness: 100 nm), an Al film containing silicon (film thickness: 350 nm), and a Ti film (film thickness: 50 nm) as materials for these electrodes and wirings. Thus, a source electrode and a source wiring, a connection electrode, a lead electrode, a power supply line, and the like are appropriately formed. The lead electrode for making contact with the gate wiring covered with the interlayer insulating film is provided at the end of the gate wiring, and the end of each other wiring is also connected to an external circuit or an external power source. An input / output terminal portion provided with a plurality of electrodes is formed. In addition, the connection electrode 841 provided so as to be in contact with and overlap with the previously formed pixel electrode 834 is in contact with the drain region of the current control TFT 904.
[0291]
As described above, an n-channel TFT 905, a p-channel TFT 906, and a driver circuit 902 having a CMOS circuit in which these are complementarily combined, and a plurality of n-channel TFTs 903 or p-channel TFTs 904 are provided in one pixel. The pixel portion 901 can be formed.
[0292]
When the patterning of each electrode is completed, the resist is removed and heat treatment is performed. Then, insulators 842a and 842b called banks are formed at both ends so as to cover the end portion of the pixel electrode 834. The banks 842a and 842b may be formed using an insulating film or a resin film containing silicon. Here, after the bank 842a is formed by patterning an insulating film made of an organic resin film, a silicon nitride film is formed by sputtering, and the bank 842b is formed by patterning.
[0293]
Next, an EL layer 843 and an OLED cathode 844 are formed on the pixel electrode 834 whose both ends are covered with banks. In this example, the EL layer 843 and the cathode 844 of the OLED are deposited using the film formation apparatus described in Embodiment Mode 1. As the evaporation method, according to Embodiment 1 or Example 1, a high-density and high-purity EL layer may be formed by evaporation in vacuum while heating the substrate.
[0294]
As the EL layer 843, an EL layer (a layer for emitting light and moving carriers therefor) may be formed by freely combining a light-emitting layer, a charge transport layer, or a charge injection layer. For example, a low molecular organic EL material or a high molecular organic EL material may be used. As the EL layer, a thin film made of a light emitting material (singlet compound) that emits light (fluorescence) by singlet excitation, or a thin film made of a light emitting material (phosphorescence) that emits light (phosphorescence) by triplet excitation can be used. It is also possible to use an inorganic material such as silicon carbide for the charge transport layer or the charge injection layer. As these organic EL materials and inorganic materials, known materials can be used.
[0295]
As a material used for the cathode 844, it is preferable to use a metal having a low work function (typically, a metal element belonging to Group 1 or 2 of the periodic table) or an alloy containing these metals. The smaller the work function is, the better the light emission efficiency is. Therefore, among them, the material used for the cathode is preferably an alloy material containing Li (lithium), which is one of alkali metals. Note that the cathode also functions as a wiring common to all the pixels, and has a terminal electrode in the input terminal portion via the connection wiring.
[0296]
FIG. 8 shows a stage where the steps so far are completed. In FIG. 8, the switching TFT 903 and the TFT (current control TFT 904) for supplying current to the OLED are shown, but various circuits including a plurality of TFTs are provided at the tip of the gate electrode of the TFT. Needless to say, there is no particular limitation.
[0297]
Next, the OLED having at least a cathode, an organic compound layer, and an anode is sealed with an organic resin, a protective film, a sealing substrate, or a sealing can, thereby completely blocking the OLED from the outside, It is preferable to prevent entry of a substance that promotes deterioration of the EL layer due to oxidation, such as oxygen. However, a protective film or the like is not necessarily provided in the input / output terminal portion that needs to be connected to the FPC later.
[0298]
Next, an FPC (flexible printed circuit) is attached to each electrode of the input / output terminal portion with an anisotropic conductive material. The anisotropic conductive material is composed of resin and conductive particles having a diameter of several tens to several hundreds μm whose surface is plated with Au or the like, and is formed on each electrode and FPC of the input / output terminal portion by the conductive particles. Electrical connection with wiring.
[0299]
If necessary, an optical film such as a circularly polarizing plate composed of a polarizing plate and a retardation plate may be provided, or an IC chip or the like may be mounted.
[0300]
Through the above steps, a modular light emitting device to which an FPC is connected is completed.
[0301]
In addition, this embodiment can be freely combined with any one of Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 4, and Examples 1 to 4.
[0302]
[Example 6]
The top view and sectional drawing of the module type light-emitting device (it is also called EL module) obtained by Example 5 are shown.
[0303]
9A is a top view showing the EL module, and FIG. 9B is a cross-sectional view taken along line AA ′ of FIG. 9A. In FIG. 9A, a base insulating film 401 is provided over a substrate 400 (eg, heat resistant glass), and a pixel portion 402, a source side driver circuit 404, and a gate side driver circuit 403 are formed thereon. Yes. These pixel portions and driving circuits can be obtained according to the fifth embodiment.
[0304]
Reference numeral 418 denotes an organic resin, 419 denotes a protective film, and the pixel portion and the driver circuit portion are covered with the organic resin 418, and the organic resin is covered with the protective film 419. Furthermore, you may seal with a cover material using an adhesive agent. As the cover material, a sealing substrate or a sealing can is used, and an inert gas or silicon oil may be sealed in the gap between the EL layer and the cover material.
[0305]
Reference numeral 408 denotes a wiring for transmitting signals input to the source side driver circuit 404 and the gate side driver circuit 403, and receives a video signal and a clock signal from an FPC (flexible printed circuit) 409 serving as an external input terminal. Although only the FPC is shown here, a printed wiring board (PWB) may be attached to the FPC. The light-emitting device in this specification includes not only a light-emitting device body but also a state in which an FPC or a PWB is attached thereto.
[0306]
Next, a cross-sectional structure is described with reference to FIG. A base insulating film 401 is provided in contact with the substrate 400. A pixel portion 402 and a gate side driver circuit 403 are formed above the insulating film 401. The pixel portion 402 is electrically connected to the current control TFT 411 and its drain. And a plurality of pixels including a pixel electrode 412 connected to the. The gate side driver circuit 403 is formed using a CMOS circuit in which an n-channel TFT 413 and a p-channel TFT 414 are combined.
[0307]
These TFTs (including 411, 413, and 414) may be manufactured in accordance with the n-channel TFT of Example 5 and the p-channel TFT of Example 5. In FIG. 9, only the TFT for supplying current to the OLED (current control TFT 411) is shown. However, various circuits including a plurality of TFTs may be provided at the tip of the gate electrode of the TFT, and there is no particular limitation. Needless to say.
[0308]
Note that the pixel portion 402, the source side driver circuit 404, and the gate side driver circuit 403 are formed over the same substrate in accordance with Embodiment 5.
[0309]
The pixel electrode 412 functions as a cathode of a light emitting element (OLED). A bank 415 is formed at both ends of the pixel electrode 412, and an organic compound layer 416 and a light emitting element anode 417 are formed on the pixel electrode 412.
[0310]
As the organic compound layer 416, the film formation apparatus shown in FIG. 1 or the apparatus shown in FIG. 3 is used, and an organic compound layer (light emission and carrier transfer therefor) is freely combined with a light emitting layer, a charge transport layer, or a charge injection layer. A layer for performing the above-described process may be formed.
[0311]
The anode 417 also functions as a wiring common to all pixels, and is electrically connected to the FPC 409 via the connection wiring 408. Further, all elements included in the pixel portion 402 and the gate side driver circuit 403 are covered with an anode 417, an organic resin 418, and a protective film 419.
[0312]
Note that as the organic resin 418, a material that is as transparent or translucent as possible to visible light is preferably used. The organic resin 418 is desirably a material that does not transmit moisture and oxygen as much as possible.
[0313]
In addition, after completely covering the light-emitting element with the organic resin 418, it is preferable to provide a protective film 419 on the surface (exposed surface) of the organic resin 418 at least as shown in FIG. Further, a protective film may be provided on the entire surface including the back surface of the substrate 400. Here, it is necessary to pay attention so that a protective film is not formed on the portion where the external input terminal (FPC) is provided. The protective film may be prevented from being formed using a mask, or the protective film may not be formed by covering the external input terminal portion with a tape such as Teflon (registered trademark) used as a masking tape in a CVD apparatus. Also good. As the protective film 419, a silicon nitride film, a DLC film, or AlN _X O _Y A film may be used.
[0314]
By encapsulating the light-emitting element with the protective film 419 with the above structure, the light-emitting element can be completely blocked from the outside, and a substance that promotes deterioration due to oxidation of the organic compound layer such as moisture and oxygen enters from the outside. Can be prevented. Therefore, a highly reliable light-emitting device can be obtained. Further, the steps from film formation to encapsulation of the EL layer may be performed using the apparatus shown in FIGS.
[0315]
Alternatively, the pixel electrode may be an anode, and an organic compound layer and a cathode may be stacked to emit light in the direction opposite to that in FIG. An example is shown in FIG. Since the top view is the same, it is omitted.
[0316]
The cross-sectional structure shown in FIG. 10 will be described below. An insulating film 610 is provided over the substrate 600, and a pixel portion 602 and a gate side driver circuit 603 are formed above the insulating film 610. The pixel portion 602 is electrically connected to the current control TFT 611 and its drain. The pixel electrode 612 is formed by a plurality of pixels. The gate side driver circuit 603 is formed using a CMOS circuit in which an n-channel TFT 613 and a p-channel TFT 614 are combined.
[0317]
These TFTs (including 611, 613, and 614) may be manufactured according to the n-channel TFT of Example 5 and the p-channel TFT of Example 5. In FIG. 10, only the TFT (current control TFT 611) for supplying current to the OLED is shown, but various circuits including a plurality of TFTs may be provided at the tip of the gate electrode of the TFT. It goes without saying that it is not limited.
[0318]
The pixel electrode 612 functions as a cathode of a light emitting element (OLED). A bank 615 is formed on both ends of the pixel electrode 612, and an organic compound layer 616 and an anode 617 of the light emitting element are formed on the pixel electrode 612.
[0319]
The anode 617 also functions as a wiring common to all pixels, and is electrically connected to the FPC 609 via the connection wiring 608. Further, all elements included in the pixel portion 602 and the gate side driver circuit 603 are covered with a cathode 617, an organic resin 618, and a protective film 619. Further, the cover material 620 may be bonded with an adhesive. Further, the cover material 620 may be provided with a recess, and the desiccant 621 may be provided.
[0320]
In FIG. 10, since the pixel electrode is the anode and the organic compound layer and the cathode are stacked, the light emission direction is the direction of the arrow shown in FIG.
[0321]
Although the top gate type TFT has been described as an example here, the present invention can be applied regardless of the TFT structure. For example, it can be applied to a bottom gate type (reverse stagger type) TFT or a forward stagger type TFT. Is possible.
[0322]
Further, this embodiment can be freely combined with any one of Embodiment Mode 1, Embodiment Mode 2, Embodiment Mode 4, and Examples 1-5.
[0323]
[Example 7]
By implementing the present invention, an EL module (an active matrix EL module, a passive EL module) can be completed. That is, by implementing the present invention, all electronic devices incorporating them are completed.
[0324]
Such electronic devices include video cameras, digital cameras, head mounted displays (goggles type displays), car navigation systems, car stereos, personal computers, personal digital assistants (mobile computers, mobile phones, electronic books, etc.) and the like. . Examples of these are shown in FIGS.
[0325]
FIG. 11A illustrates a personal computer, which includes a main body 2001, an image input portion 2002, a display portion 2003, a keyboard 2004, and the like.
[0326]
FIG. 11B shows a video camera, which includes a main body 2101, a display portion 2102, an audio input portion 2103, operation switches 2104, a battery 2105, an image receiving portion 2106, and the like.
[0327]
FIG. 11C illustrates a mobile computer, which includes a main body 2201, a camera unit 2202, an image receiving unit 2203, operation switches 2204, a display unit 2205, and the like.
[0328]
FIG. 11D shows a goggle type display, which includes a main body 2301, a display portion 2302, an arm portion 2303, and the like.
[0329]
FIG. 11E shows a player using a recording medium (hereinafter referred to as a recording medium) on which a program is recorded, and includes a main body 2401, a display portion 2402, a speaker portion 2403, a recording medium 2404, an operation switch 2405, and the like. This player uses a DVD (Digital Versatile Disc), CD, or the like as a recording medium, and can perform music appreciation, movie appreciation, games, and the Internet.
[0330]
FIG. 11F illustrates a digital camera, which includes a main body 2501, a display portion 2502, an eyepiece portion 2503, operation switches 2504, an image receiving portion (not shown), and the like.
[0331]
FIG. 12A shows a cellular phone, which includes a main body 2901, an audio output portion 2902, an audio input portion 2903, a display portion 2904, operation switches 2905, an antenna 2906, an image input portion (CCD, image sensor, etc.) 2907, and the like.
[0332]
FIG. 12B illustrates a portable book (electronic book), which includes a main body 3001, display portions 3002 and 3003, a storage medium 3004, operation switches 3005, an antenna 3006, and the like.
[0333]
FIG. 12C illustrates a display, which includes a main body 3101, a support base 3102, a display portion 3103, and the like.
[0334]
Incidentally, the display shown in FIG. 12C is a medium or small size display, for example, a screen size of 5 to 20 inches. Further, in order to form a display portion having such a size, it is preferable to use a substrate having a side of 1 m and perform mass production by performing multiple chamfering.
[0335]
As described above, the applicable range of the present invention is so wide that the present invention can be applied to methods for manufacturing electronic devices in various fields. In addition, the electronic device of this example can be realized by using any combination of the first embodiment, the second embodiment, the third embodiment, the fourth embodiment, and the first to sixth embodiments. it can.
[0336]
【The invention's effect】
According to the present invention, a high-density and high-purity organic compound layer can be formed by performing deposition while heating a substrate in vacuum and forming a film to a desired thickness.
[0337]
In addition, according to the present invention, it is possible to fit more molecules between layers by performing vapor deposition a plurality of times while heating the substrate in vacuum without being exposed to the atmosphere. In particular, when the mixed region is formed, the molecules in the mixed region can be more fitted. Therefore, it is possible to further reduce the driving voltage and prevent the luminance from being lowered.
[0338]
Further, according to the present invention, in one film formation chamber, it is possible to perform a process of annealing in vacuum before film formation, a process of annealing in vacuum during film formation, or a process of annealing in vacuum after film formation. Throughput is improved.
[0339]
Further, according to the present invention, the jig provided in the film forming apparatus and the vapor deposition material attached to the inner wall of the film forming apparatus can be removed without releasing to the atmosphere.
[Brief description of the drawings]
FIG. 1 shows a film forming apparatus of the present invention (Embodiment 1).
FIG. 2 is a diagram showing a flow of the present invention. (Embodiment 1)
FIG. 3 shows a film forming apparatus of the present invention (Embodiment 2).
4A and 4B illustrate an element structure manufactured by a film formation apparatus of the present invention. Example 1
FIG. 5 illustrates a film formation apparatus. (Example 2)
FIG. 6 illustrates a film formation apparatus. (Example 3)
FIG. 7 illustrates a film formation apparatus. (Example 4)
FIG. 8 illustrates a light-emitting device.
FIG 9 illustrates a light-emitting device.
FIG 10 illustrates a light-emitting device.
FIG. 11 illustrates an example of an electrical device.
FIG 12 illustrates an example of an electrical device.
FIG. 13 shows a film forming apparatus of the present invention (Embodiment 3).
FIG. 14 is an enlarged cross-sectional view of a vapor deposition mask.
FIG. 15 shows an example of a film formation apparatus (Embodiment 4).

Claims (9)

A film formation chamber connected to a vacuum exhaust means;
An evaporation source provided in the film formation chamber; a holder for fixing the substrate so as to face the evaporation source; an evaporation mask provided between the evaporation source and the substrate; and a movable electrode. And
During the deposition, the movable electrode is disposed at a position that does not interfere with the deposition on the substrate,
After vapor deposition, when the plasma is generated between the movable electrode and the vapor deposition mask after the substrate is taken out of the film formation chamber, the movable electrode is disposed at a position facing the vapor deposition mask. A film forming apparatus. A film formation chamber connected to a vacuum exhaust means;
A deposition source provided in the deposition chamber; a holder for fixing the substrate so as to face the deposition source; a deposition mask provided between the deposition source and the substrate; a movable electrode; An adhesion shield, and means for heating the adhesion shield,
During vapor deposition, the movable electrode is disposed at a position that does not interfere with vapor deposition on the substrate, and the deposition shield is heated above the sublimation temperature of the vapor deposition material by the heating means,
After vapor deposition, when the plasma is generated between the movable electrode and the vapor deposition mask after the substrate is taken out of the film formation chamber, the movable electrode is disposed at a position facing the vapor deposition mask. A film forming apparatus.   3. The film forming apparatus according to claim 1, wherein the vapor deposition mask is made of a conductive material.   4. The film formation apparatus according to claim 1, wherein the evaporation mask is provided so as to be in contact with the substrate.   5. The film forming apparatus according to claim 1, wherein the vapor deposition material is an organic compound.   6. The film forming apparatus according to claim 1, wherein the movable electrode has a mesh shape or a shower head shape.   7. The film forming apparatus according to claim 1, wherein a high frequency power source is connected to the vapor deposition mask or the movable electrode. A film formation chamber connected to a vacuum exhaust means;
A deposition source provided in the film formation chamber; a holder for fixing the substrate so as to face the deposition source; a deposition mask provided between the deposition source and the substrate; and a movable electrode. Using a film deposition system,
In a state where the movable electrode is disposed at a position that does not prevent vapor deposition on the substrate, the vapor deposition material is vaporized from the vapor deposition source, and the vapor deposition material is vapor deposited on the substrate.
After completion of the vapor deposition, the substrate is taken out of the film formation chamber,
Moving the movable electrode to a position facing the vapor deposition mask;
A film forming method, wherein plasma is generated between the movable electrode and the vapor deposition mask. A film formation chamber connected to a vacuum exhaust means;
A deposition source provided in the deposition chamber; a holder for fixing the substrate so as to face the deposition source; a deposition mask provided between the deposition source and the substrate; a movable electrode; Using a deposition apparatus having a deposition shield and means for heating the deposition shield,
The movable electrode is disposed at a position that does not prevent vapor deposition on the substrate, and the deposition shield is heated by the heating means so as to be higher than the substrate temperature and lower than the temperature of the vapor deposition source. And evaporating the deposition material from the deposition source, depositing the deposition material on the substrate,
After completion of the vapor deposition, the substrate is taken out of the film formation chamber,
Moving the movable electrode to a position facing the vapor deposition mask;
A film forming method, wherein plasma is generated between the movable electrode and the vapor deposition mask.

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