JP4293920B2 - Substrate processing apparatus, substrate processing method, and substrate manufacturing method - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for drying a substrate by blowing air onto the substrate using an air knife, and a substrate manufacturing method using them, and particularly suitable for drying a large substrate. The present invention relates to an apparatus, a substrate processing method, and a substrate manufacturing method using them.

  In a manufacturing process of a panel substrate for a flat panel display device such as a liquid crystal display device or a plasma display device, chemical processing such as development and etching is performed to form a circuit pattern, a color filter, and the like on the substrate. Before or after the chemical treatment, it is necessary to clean the substrate using cleaning water (pure water) and dry the substrate after cleaning. These series of processes including the cleaning and drying of the substrate are often performed while moving the substrate using a moving means such as a roller conveyor, and the drying of the substrate is performed by blowing air onto the substrate using an air knife. In general, a treatment liquid such as cleaning water is removed from the surface of the substrate.

As a technique for performing a series of processing on a substrate while moving the substrate in this way, there is a technique described in Patent Document 1. Moreover, there exists a technique of patent document 2 and patent document 3 as drying a board | substrate using an air knife.
JP 2002-252200 A JP 2001-50660 A JP 2001-284777 A

  In drying using an air knife, if a processing liquid such as cleaning water is unevenly distributed on the surface of the substrate, the processing liquid is not uniformly removed, and uneven drying occurs on the surface of the substrate. For this reason, conventionally, in order to uniformly dry a substrate using an air knife, it has been necessary to uniformly form a film of a treatment solution on the surface of the substrate before drying. However, when the area of the substrate increases with the recent increase in the size of the flat panel display device, a large amount of processing liquid has been required to uniformly form a film of the processing liquid on the surface of the substrate.

  Some of the substrates have a strong water repellency in which the surface repels cleaning water (pure water). For example, in the manufacture of a color filter for a liquid crystal display device, on a glass substrate, a black matrix for blocking light, an RGB coloring pattern for color display, a transparent protective film for protecting the coloring pattern, and a liquid crystal for driving the liquid crystal A transparent electrode film is formed. Among these, in particular, a resin film used for forming a black matrix or a colored pattern has strong water repellency. For this reason, when forming a black matrix or a colored pattern, the surface of the substrate has a strong water repellency.

  A substrate having a strong surface water repellency makes it difficult to uniformly form a cleaning water film on the surface, and a portion of the cleaning water film is interrupted on the surface of the substrate. Then, the cleaning water particles blown off with the air from the air knife adhere to the discontinuous portion of the cleaning water film, resulting in uneven drying called a watermark. Conventionally, such a watermark has been allowed to some extent, but with the fine pitch of circuit patterns formed on the surface of the substrate, such a watermark is also ignored as a cause of appearance problems and variations in surface resistance. It has become impossible.

  The subject of this invention is reducing the usage-amount of a process liquid, when drying a board | substrate using an air knife.

  Another object of the present invention is to prevent the generation of watermarks and dry the substrate evenly when drying the substrate using an air knife.

  Furthermore, the subject of this invention is shortening drying time and drying unevenness, when drying a board | substrate using an air knife.

  Furthermore, an object of the present invention is to produce a high-quality substrate with little drying unevenness.

The substrate processing apparatus of the present invention includes a substrate moving means for moving a substrate by a plurality of rollers, a first plate-like member provided at a predetermined distance from the substrate above the substrate moved by the substrate moving means, First, a treatment liquid having a temperature higher than room temperature is filled in a gap between the first plate-shaped member and the substrate, and a film of the treatment liquid is formed on the surface of the substrate that has passed under the first plate-shaped member. And a first air knife that blows air at a temperature higher than normal temperature onto the surface of the substrate that has passed under the first plate-like member and pushes the treatment liquid from the surface of the substrate. is there.

Further, in the substrate processing method of the present invention, the first plate-shaped member is provided above the substrate at a predetermined interval while the substrate is moved by a plurality of rollers , and the first plate-shaped member and the substrate are provided. Is filled with a processing liquid having a temperature higher than room temperature, a film of the processing liquid is formed on the surface of the substrate that has passed under the first plate-like member, and passes under the first plate-like member. The air having a temperature higher than room temperature is blown from the first air knife to the surface of the substrate, and the processing liquid is swept away from the surface of the substrate.

  A first plate-like member is provided above the substrate at a predetermined interval from the substrate, and a treatment liquid is filled in a gap between the first plate-like member and the substrate, so that a small amount of the treatment liquid is applied to the surface of the substrate. A film of the treatment liquid can be formed uniformly. Further, since the surface of the substrate is covered with the first plate-like member, the treatment liquid particles blown off with the air from the first air knife do not adhere to the surface of the substrate, and a watermark is generated. Can be prevented.

Furthermore, the substrate processing apparatus of the present invention has a plurality of openings into which a plurality of rollers are inserted, and is provided below the substrate moved by the plurality of rollers at a distance smaller than the diameter of the plurality of rollers from the substrate. A processing liquid having a temperature higher than room temperature is filled in the gap between the plate-shaped member and the second plate-shaped member and the substrate, and the processing liquid is applied to the back surface of the substrate that has passed above the second plate-shaped member. The second processing liquid passage for forming the film and the back surface of the substrate that has passed over the second plate-shaped member are blown with air having a temperature higher than room temperature to push the processing liquid from the back surface of the substrate. It is equipped with an air knife.

In the substrate processing method of the present invention, the second plate-like member having a plurality of openings into which a plurality of rollers enter is placed below the substrate moved by the plurality of rollers at an interval smaller than the diameter of the rollers. provided, filled with a treatment liquid higher than room temperature in the gap between the second plate member and the substrate, forming a film of the processing liquid to the back surface of the substrate passing above the second plate-like member Then, air having a temperature higher than room temperature is blown from the second air knife to the back surface of the substrate that has passed over the second plate-shaped member, and the processing liquid is washed away from the back surface of the substrate.

A second plate-like member having a plurality of openings for receiving a plurality of rollers is provided below the substrate moved by the plurality of rollers at an interval smaller than the diameter of the plurality of rollers . By filling the gap between the member and the substrate with the treatment liquid, a film of the treatment liquid can be uniformly formed on the back surface of the substrate with a small amount of the treatment liquid. Further, since the back surface of the substrate is covered with the second plate-like member, the particles of the processing liquid blown off with the air from the second air knife do not adhere to the back surface of the substrate, and a watermark is generated. Can be prevented.

  Here, by adjusting the flow rate of the processing liquid supplied from the first processing liquid passage, the processing liquid that fills the gap between the first plate-shaped member and the substrate and flows out from the side surface of the substrate is The first processing liquid passage may also be used as the second processing liquid passage so that the gap between the plate-shaped member 2 and the substrate is filled.

  In addition, if a treatment liquid having a temperature higher than room temperature is filled in the gap between the first plate-shaped member and the substrate or the gap between the second plate-shaped member and the substrate, the viscosity of the treatment liquid becomes lower. Due to the air blown from the first or second air knife, the processing liquid is easily pushed away from the front surface or the back surface of the substrate. Further, since the vapor pressure of the processing liquid is increased, the processing liquid is easily vaporized from the front surface or the back surface of the substrate. Accordingly, the drying time is shortened, and the drying unevenness is reduced.

  The same effect can be obtained by heating the treatment liquid filled in the gap between the first plate-like member and the substrate or the treatment liquid filled in the gap between the second plate-like member and the substrate. Is obtained. A mechanism (for example, a heater) for heating the processing liquid may be provided on the first plate-like member, the second plate-like member, or both of them. In addition, a mechanism for heating the processing liquid is not provided directly on the first plate-like member, and a third plate-like member having a mechanism for heating the processing liquid is used as the first plate-like member and the substrate. You may provide between. Similarly, a mechanism for heating the processing liquid is not provided directly on the second plate-like member, and a fourth plate-like member having a mechanism for heating the processing liquid is used as the second plate-like member and the substrate. You may provide between.

  Further, when air having a temperature higher than normal temperature is blown from the first or second air knife, the processing liquid is easily vaporized from the front surface or the back surface of the substrate. Accordingly, the drying time is shortened, and the drying unevenness is reduced.

  When drying a substrate using an air knife, a layer of air is caught in the air of the air knife from the subsequent stage of the air knife and hits the front or back surface of the substrate. If this air layer is at a lower temperature than the air of the air knife, the effect of shortening the drying time is reduced. Therefore, when blowing hot air from the first or second air knife at a temperature higher than normal temperature, supplying hot air from the subsequent stage of the first or second air knife prevents the drying time from being reduced. Drying unevenness is further reduced.

  Further, when the surface of the substrate is heated before the substrate passes under the first plate-like member, during the passage, or after the passage, the processing liquid is easily vaporized from the surface of the heated substrate. Similarly, when the back surface of the substrate is heated before, during, or after passing over the second plate-shaped member, the processing liquid is easily vaporized from the back surface of the heated substrate. Accordingly, the drying time is shortened, and the drying unevenness is reduced.

In addition, when the substrate is moved in a state inclined at a predetermined angle with respect to the horizontal, a chemical solution such as a developing solution or an etching solution is efficiently replaced with the processing solution without stagnation on the surface of the substrate, thereby obtaining a high cleaning effect. It is done. Furthermore, since the processing liquid does not stay on the surface of the substrate, the foreign matter floating from the surface of the substrate is difficult to reattach to the surface of the substrate, and a high foreign matter removing effect is obtained. Then, if the substrate is moved in a state inclined at a predetermined angle in the substrate moving direction, the floor area in the substrate moving direction can be reduced as a whole apparatus. Also, when you move the substrate in a state inclined by a prescribed angle in the direction perpendicular to the substrate movement direction, only a small floor area in the direction orthogonal to the substrate moving direction as a whole device, further, a chemical treatment such as developing and etching When performing, since a chemical | medical solution flows to the side part of a board | substrate, a chemical | medical solution can be easily collect | recovered with the installation in each process process.

  The substrate manufacturing method of the present invention is to dry a substrate using any one of the above-described substrate processing apparatuses or substrate processing methods. By using the substrate processing apparatus or the substrate processing method, unevenness in drying is reduced and a high-quality substrate can be manufactured.

  According to the substrate processing apparatus and the substrate processing method of the present invention, when the substrate is dried using an air knife, the amount of processing liquid used can be reduced.

  Further, according to the substrate processing apparatus and the substrate processing method of the present invention, when the substrate is dried using an air knife, the generation of a watermark can be prevented and the substrate can be uniformly dried.

  Furthermore, according to the substrate processing apparatus and the substrate processing method of the present invention, when the substrate is dried using an air knife, the drying time can be shortened and uneven drying can be reduced.

  According to the substrate manufacturing method of the present invention, it is possible to manufacture a high-quality substrate with little drying unevenness.

  FIG. 1 is a partial cross-sectional side view of a substrate processing apparatus according to an embodiment of the present invention. This embodiment shows an example in which the substrate is moved horizontally. The substrate processing apparatus includes a plurality of rollers 10, air knives 11 a and 11 b, an upper plate 12, a pipe 13, a lower plate 14, and a pipe 15.

  The substrate 1 is mounted on a plurality of rollers 10 and is moved in the substrate movement direction indicated by an arrow by the rotation of the rollers 10. Each roller 10 is installed at regular intervals in the substrate moving direction, and is rotated at a predetermined speed by a driving means (not shown). Each roller 10 is horizontally installed at the same height, and thereby the plurality of rollers 10 moves the substrate 1 horizontally.

  Above the substrate 1 mounted on the roller 10, an upper plate 12 is installed in parallel with the substrate 1 at a predetermined interval over a width in a direction orthogonal to the substrate movement direction of the substrate 1. A pipe 13 is attached to the upper plate 12 closer to the substrate moving direction than the center of the upper plate 12. The pipe 13 fills the gap between the upper plate 12 and the substrate 1 with the cleaning water 2a by supplying the cleaning water at a predetermined flow rate. Thereby, when passing under the upper plate 12, a film of cleaning water is uniformly formed on the surface of the substrate 1.

  A lower plate 14 is disposed below the substrate 1 mounted on the roller 10 in parallel with the substrate 1 at a predetermined interval across the width of the substrate 1 in the direction orthogonal to the substrate moving direction. In the present embodiment, the distance between the lower plate 14 and the substrate 1 is larger than the diameter of the roller 10, and the lower plate 14 is positioned below the roller 10. The roller 10 positioned above the lower plate 14 is surrounded by a side wall 14 a provided around the lower plate 14. A pipe 15 is attached to the lower plate 14 closer to the substrate moving direction than the center of the lower plate 14. The pipe 15 fills the gap between the lower plate 14 and the substrate 1 with the cleaning water 2b by supplying the cleaning water at a predetermined flow rate. As a result, when passing over the lower plate 14, a film of cleaning water is uniformly formed on the back surface of the substrate 1.

  Further, an air knife 11 a is installed above the substrate 1 mounted on the roller 10 in parallel with the substrate 1 in the vicinity of the upper plate 12 over a width in a direction orthogonal to the substrate moving direction of the substrate 1. . An air knife 11b is similarly installed below the substrate 1 mounted on the roller 10. The air knives 11a and 11b are configured, for example, by forming a pressurizing chamber inside a long casing and providing an air passage leading to the pressurizing chamber in a slit shape in the longitudinal direction. Air is supplied from an air supply means (not shown) to the air knives 11a and 11b, and the air knives 11a and 11b discharge air uniformly from the front end of the air passage in the longitudinal direction. The air discharged from the air knives 11a and 11b is blown obliquely at a predetermined incident angle to the front surface or back surface of the substrate 1 in the direction opposite to the substrate moving direction, as indicated by the dashed arrows in the figure. Accordingly, the cleaning water is washed away from the front surface of the substrate 1 that has passed under the upper plate 12 and the back surface of the substrate 1 that has passed above the lower plate 14.

  FIG. 2 is a partial cross-sectional side view of a substrate processing apparatus according to another embodiment of the present invention. This embodiment is different from the embodiment shown in FIG. 1 in that the gap between the upper plate 12 and the substrate 1 is filled by adjusting the flow rate of the cleaning water supplied from the pipe 13. The cleaning water that has flowed out from the side surface is also filled in the gap between the lower plate 14 and the substrate 1, thereby eliminating the need for the pipe 15. Other configurations are the same as those of the embodiment shown in FIG.

  FIG. 3 is a partial cross-sectional side view of a substrate processing apparatus according to still another embodiment of the present invention. This embodiment shows an example in which the substrate is moved in a state where the substrate is inclined at a predetermined angle in the substrate moving direction with respect to the horizontal. The substrate processing apparatus includes a plurality of rollers 20, air knives 21 a and 21 b, an upper plate 22, a pipe 23, a lower plate 24, and a pipe 25. The installation height of each roller 20 becomes higher as the substrate moves in the substrate moving direction, whereby the plurality of rollers 20 move in a state where the substrate 1 is inclined by a predetermined angle θ1 in the substrate moving direction with respect to the horizontal. . The air knives 21 a and 21 b, the upper plate 22 and the lower plate 24 are installed to be inclined according to the inclination of the substrate 1. Other configurations are the same as those of the embodiment shown in FIG.

  According to the embodiment shown in FIG. 3, since the substrate is moved in a state inclined in the substrate movement direction with respect to the horizontal, the floor area in the substrate movement direction can be reduced as a whole apparatus.

  FIG. 4 is a perspective view of a substrate processing apparatus according to still another embodiment of the present invention. This embodiment shows an example in which the substrate is moved in a state where the substrate is inclined at a predetermined angle in a direction orthogonal to the substrate moving direction with respect to the horizontal. The substrate processing apparatus includes a plurality of rollers 30, air knives 31a and 31b, an upper plate 32, a pipe 33, a lower plate 34, and a pipe 35. In FIG. 4, the pipe 35 is hidden behind the lower plate 34 and cannot be seen. Each roller 30 is inclined and installed such that one end thereof is higher than the other end, so that the plurality of rollers 30 allows the substrate 1 to be moved by a predetermined angle θ2 in a direction perpendicular to the substrate moving direction with respect to the horizontal. Move in an inclined state. The air knives 31 a and 31 b, the upper plate 32, and the lower plate 34 are installed to be inclined according to the inclination of the substrate 1. Further, the pipe 33 and the pipe 35 are moved to the vicinity of the higher measuring portion of the inclined upper plate 32 and lower plate 34. Other configurations are the same as those of the embodiment shown in FIG.

  According to the embodiment shown in FIG. 4, since the substrate is moved while being inclined in a direction orthogonal to the substrate moving direction with respect to the horizontal, the floor area in the direction orthogonal to the substrate moving direction as a whole is small. That's it. Further, in the embodiment shown in FIG. 3, when chemical processing such as development and etching is performed, it is necessary to prevent the chemical from flowing into the equipment of the previous processing step along the inclination of the substrate. According to the embodiment described above, since the chemical solution flows to the side portion of the substrate, the chemical solution can be easily collected by the equipment in each processing step.

  According to the embodiment shown in FIG. 3 and FIG. 4, since the substrate is moved in a state inclined at a predetermined angle with respect to the horizontal, the chemical solution such as a developing solution or an etching solution does not stagnate on the surface of the substrate. It is often replaced with washing water, and a high washing effect is obtained. Further, since the cleaning water does not stay on the surface of the substrate, the foreign matter floating from the surface of the substrate is not easily reattached to the surface of the substrate, and a high foreign matter removing effect is obtained.

  FIG. 5 is a partial cross-sectional side view of a substrate processing apparatus according to still another embodiment of the present invention. This embodiment is different from the embodiment shown in FIG. 1 in that the diameter of the roller 40 is large and the distance between the lower plate 44 and the substrate 1 is smaller than the diameter of the roller 40. The lower plate 44 is provided with an opening for exposing the roller 40, and a pipe 45 is attached closer to the substrate moving direction than the center of the lower plate 44. The pipe 45 fills the gap between the lower plate 44 and the substrate 1 with the cleaning water 2b by supplying the cleaning water at a predetermined flow rate. Other configurations are the same as those of the embodiment shown in FIG.

  FIG. 6 is a partial cross-sectional side view of a substrate processing apparatus according to still another embodiment of the present invention. The present embodiment is different from the embodiment shown in FIG. 5 in that a plurality of lower plates 54 are arranged between two rollers 40. A pipe 55 is attached to each lower plate 54 closer to the substrate moving direction than the center of the lower plate 54. Each pipe 55 fills the gap between each lower plate 54 and the substrate 1 with the cleaning water 2b by supplying the cleaning water at a predetermined flow rate. Other configurations are the same as those of the embodiment shown in FIG.

  According to the embodiment described above, the upper plates 12, 22, and 32 are provided above the substrate 1 at a predetermined distance from the substrate 1, and the cleaning water 2a is filled in the gap between the upper plates 12, 22, and 32 and the substrate. By doing so, a film of cleaning water can be uniformly formed on the surface of the substrate 1 with a small amount of cleaning water. Further, since the surface of the substrate 1 is covered with the upper plates 12, 22, 32, the cleaning water particles blown off by the air from the air knives 11 a, 21 a, 31 a do not adhere to the surface of the substrate 1, and the watermark Can be prevented.

  Similarly, the lower plates 14, 24, 34, 44, 54 are provided below the substrate 1 at a predetermined interval from the substrate 1, and the cleaning water 2 b is placed in the gap between the lower plates 14, 24, 34, 44, 54 and the substrate. By filling, a film of cleaning water can be uniformly formed on the back surface of the substrate 1 with a small amount of cleaning water. Further, since the back surface of the substrate 1 is covered with the lower plates 14, 24, 34, 44, 54, the cleaning water particles blown off with the air from the air knives 11 b, 21 b, 31 b adhere to the back surface of the substrate 1. Therefore, the occurrence of a watermark can be prevented.

  Further, in the embodiment described above, cleaning water having a temperature higher than room temperature is provided in the gap between the upper plates 12, 22, 32 and the substrate 1 or in the gap between the lower plates 14, 24, 34, 44, 54 and the substrate 1. Since the viscosity of the cleaning water is lowered, the cleaning water is easily washed away from the front surface or the back surface of the substrate 1 by the air blown from the air knives 11a, 11b, 21a, 21b, 31a, 31b. In addition, since the cleaning water has a high vapor pressure, the cleaning water is easily vaporized from the front surface or the back surface of the substrate 1. Accordingly, the drying time is shortened, and the drying unevenness is reduced.

  Further, cleaning water 2a filled in the gap between the upper plates 12, 22, 32 and the substrate 1 or washing water 2b filled in the gap between the lower plates 14, 24, 34, 44, 54 and the substrate 1 is added. Even if heated, the same effect can be obtained. A mechanism (for example, a heater) for heating the cleaning water 2a, 2b may be provided on the upper plate 12, 22, 32, the lower plate 14, 24, 34, 44, 54, or both. Further, a mechanism for heating the cleaning water 2a is not directly provided on the upper plates 12, 22, 32, and a third plate-like member having a mechanism for heating the cleaning water 2a is used as the upper plates 12, 22, 32. It may be provided between the substrate 1. Similarly, a mechanism for heating the cleaning water 2b is not directly provided on the lower plates 14, 24, 34, 44, and 54, and a fourth plate member having a mechanism for heating the cleaning water 2b is used as the lower plate 14. , 24, 34, 44, 54 and the substrate 1 may be provided.

  Further, when air having a temperature higher than room temperature is blown from the air knives 11 a, 11 b, 21 a, 21 b, 31 a, 31 b, the cleaning water is easily vaporized from the front surface or the back surface of the substrate 1. Accordingly, the drying time is shortened, and the drying unevenness is reduced.

  FIG. 7 is a partial sectional side view of a substrate processing apparatus according to still another embodiment of the present invention. In this embodiment, in the embodiment shown in FIG. 1, heaters 60a and 60b are provided in front of the upper plate 12 and lower plate 14, and hot air supply devices 80a and 80b are provided in the rear of the air knives 11a and 11b. Is. Other configurations are the same as those of the embodiment shown in FIG.

  In the present embodiment, cleaning water having a temperature higher than normal temperature is filled in the gap between the upper plate 12 and the substrate 1 from the pipe 13, and cleaning water having a temperature higher than normal temperature is supplied from the pipe 15 to the lower plate 14 and the substrate 1. Fill the gap. Then, air having a temperature higher than normal temperature is blown from the air knife 11a onto the surface of the substrate 1 that has passed below the upper plate 12, and air having a temperature higher than normal temperature is blown from the air knife 11b to the back surface of the substrate 1 that has passed above the lower plate 14. Spray.

  At this time, the temperature of the air blown from the air knives 11 a and 11 b is preferably higher than the temperature of the cleaning water filled in the gap between the upper plate 12 and the substrate 1 and the gap between the lower plate 14 and the substrate 1. In the present embodiment, for example, when the temperature of the cleaning water filled in the gap between the upper plate 12 and the substrate 1 and the gap between the lower plate 14 and the substrate 1 is about 40 ° C., the cleaning water is dried as compared with the case where the cleaning water is at room temperature. Time is reduced by about 30%. If the temperature of the air blown from the air knives 11a and 11b is about 55 ° C., the drying time is further shortened by about 10% compared to the case where the air is at room temperature.

  When air is blown from the air knives 11a and 11b, a layer of air is caught in the air of the air knives 11a and 11b from the subsequent stage of the air knives 11a and 11b and hits the front or back surface of the substrate 1. When this air layer is at a lower temperature than the air of the air knives 11a and 11b, the effect of shortening the drying time is reduced. In the present embodiment, hot air supply devices 80a and 80b are provided after the air knives 11a and 11b separated by the partition walls 70a and 70b. The hot air supply devices 80a and 80b generate hot air having a temperature similar to that of the air blown by the air knives 11a and 11b. Thereby, it can prevent that the drying time shortening effect falls and can further reduce drying unevenness.

  In addition, by using the heater 60 a provided in the front stage of the upper plate 12, the surface of the substrate 1 is heated before the substrate 1 passes under the upper plate 12, so that cleaning water is discharged from the heated surface of the substrate 1. It becomes easy to vaporize. Similarly, by using the heater 60b provided in the front stage of the lower plate 14, the back surface of the substrate 1 is heated before the substrate 1 passes over the lower plate 14, thereby cleaning water from the back surface of the heated substrate 1. It becomes easy to vaporize. Therefore, the drying time can be shortened and uneven drying can be reduced.

  The heating of the front surface or the back surface of the substrate 1 is not limited to before the substrate 1 passes below the upper plate 12 or above the lower plate 14, but may be performed during or after the passage.

  In the embodiment described above, only one pipe 13, 23, 33 is provided on the upper plates 12, 22, 32, but the pipes 13, 23, 33 are provided on the upper plates 12, 22, 32. A plurality may be provided depending on the size. The same applies to the pipes 15, 25, 35, 45, and 55 of the lower plates 14, 24, 34, 44, and 54.

  In the above-described embodiment, the example of forming the cleaning water film on the front surface and the back surface of the substrate has been described. However, the present invention is not limited to the cleaning water, and is applied to the processing of the substrate using various processing liquids. Is done.

  By drying the substrate using the substrate processing apparatus described above or the substrate processing method using them, the unevenness of drying of the substrate is reduced, and a high-quality substrate can be manufactured.

It is a partial cross section side view of the substrate processing apparatus by one embodiment of the present invention. It is a partial cross section side view of the substrate processing apparatus by other embodiment of this invention. It is a partial cross section side view of the substrate processing apparatus by further another embodiment of this invention. It is a perspective view of the substrate processing apparatus by further another embodiment of this invention. It is a partial cross section side view of the substrate processing apparatus by further another embodiment of this invention. It is a partial cross section side view of the substrate processing apparatus by further another embodiment of this invention. It is a partial cross section side view of the substrate processing apparatus by further another embodiment of this invention.

Explanation of symbols

1 Substrate 2a, 2b Washing water 10, 20, 30, 40 Rollers 11a, 11b, 21a, 21b, 31a, 31b Air knives 12, 22, 32 Upper plate 13, 23, 33 Pipes 14, 24, 34, 44, 54 Lower Plates 15, 25, 35, 45, 55 Pipes 60a, 60b Heaters 70a, 70b, partition walls 80a, 80b Hot air supply device

Claims (21)

A substrate moving means for moving the substrate by a plurality of rollers ;
A first plate-like member provided at a predetermined interval above the substrate moved by the substrate moving means;
A gap between the first plate-like member and the substrate is filled with a treatment liquid having a temperature higher than room temperature, and a film of the treatment liquid is formed on the surface of the substrate that has passed under the first plate-like member. A first treatment liquid passage;
A first air knife that blows air at a temperature higher than room temperature onto the surface of the substrate that has passed under the first plate-like member to push the processing liquid from the surface of the substrate ;
A second plate-like member having a plurality of openings into which the plurality of rollers enter, and provided below the substrate moved by the plurality of rollers at a distance smaller than the diameter of the plurality of rollers from the substrate;
A gap between the second plate-like member and the substrate is filled with a treatment liquid having a temperature higher than room temperature, and a film of the treatment liquid is formed on the back surface of the substrate that has passed over the second plate-like member. A second processing liquid passage;
Substrate processing comprising: a second air knife that blows air at a temperature higher than normal temperature onto the back surface of the substrate that has passed over the second plate-shaped member to flush the processing liquid from the back surface of the substrate. apparatus.   The substrate processing apparatus according to claim 1, further comprising means for heating a processing liquid filled in a gap between the first plate-shaped member and the substrate.   2. The substrate processing apparatus according to claim 1, further comprising means for supplying warm air to a subsequent stage of the first air knife.   2. The substrate processing apparatus according to claim 1, further comprising means for heating the surface of the substrate before, during, or after passing through the lower side of the first plate-like member. 2. The substrate processing apparatus according to claim 1 , wherein the first processing liquid passage is also used as the second processing liquid passage. The substrate processing apparatus according to claim 1 , further comprising means for heating a processing liquid filled in a gap between the second plate-shaped member and the substrate. 2. The substrate processing apparatus according to claim 1 , further comprising means for supplying warm air to a subsequent stage of the second air knife. 2. The substrate processing apparatus according to claim 1 , further comprising means for heating the back surface of the substrate before, during, or after the substrate passes above the second plate-like member. The substrate processing apparatus according to claim 1 , wherein the substrate moving unit moves the substrate in a state inclined at a predetermined angle in the substrate moving direction with respect to the horizontal. The substrate processing apparatus according to claim 1 , wherein the substrate moving unit moves the substrate in a state inclined at a predetermined angle in a direction perpendicular to the substrate moving direction with respect to the horizontal. While moving the substrate with multiple rollers ,
A first plate-like member is provided above the substrate at a predetermined interval from the substrate,
Filling the gap between the first plate-shaped member and the substrate with a treatment liquid having a temperature higher than room temperature, forming a film of the treatment liquid on the surface of the substrate that has passed under the first plate-shaped member,
To the surface of the substrate passes below the first plate-shaped member from the first air knife blowing high temperature air than the room temperature, and flow down the processing solution from the surface of the substrate,
A second plate-like member having a plurality of openings into which a plurality of rollers enter is provided below the substrate moved by the plurality of rollers at an interval smaller than the diameter of the plurality of rollers from the substrate,
Fill the gap between the second plate-shaped member and the substrate with a treatment liquid at a temperature higher than room temperature, and form a film of the treatment liquid on the back surface of the substrate that has passed over the second plate-shaped member,
The substrate processing method of the second plate-shaped rear surface to the second air knife substrate passing above the member by blowing high temperature air from the ambient temperature, and wherein the press flow Succoth the processing liquid from the back surface of the substrate. The substrate processing method according to claim 11 , wherein the processing liquid filled in a gap between the first plate-shaped member and the substrate is heated. The substrate processing method according to claim 11 , wherein hot air is supplied from a subsequent stage of the first air knife. The substrate processing method according to claim 11, wherein the surface of the substrate is heated before, during, or after the substrate passes under the first plate-like member. The substrate processing method according to claim 11 , wherein the processing liquid filled in the gap between the second plate-shaped member and the substrate is heated. The substrate processing method according to claim 11 , wherein hot air is supplied from a subsequent stage of the second air knife. The substrate processing method according to claim 11, wherein the back surface of the substrate is heated before, during, or after the substrate passes over the second plate-like member. The substrate processing method according to claim 11 , wherein the substrate is moved while being inclined at a predetermined angle in a substrate moving direction with respect to the horizontal. 12. The substrate processing method according to claim 11 , wherein the substrate is moved in a state inclined at a predetermined angle with respect to the horizontal direction in a direction orthogonal to the substrate moving direction. A method for manufacturing a substrate, comprising drying the substrate using the substrate processing apparatus according to claim 1 . A method for manufacturing a substrate, comprising drying the substrate using the substrate processing method according to any one of claims 11 to 19 .

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