JP2010181761A - Apparatus for drying substrate, method of drying substrate and method of manufacturing display panel substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve ability of drying a substrate without adding equipment on the downstream side of an air knife. <P>SOLUTION: While moving the substrate 1 in which a cleaning solution 2 is supplied to the surface or to the back surface thereof, air is blown to the surface or to the back surface of the substrate 1 from the air knife 30 disposed over the width of the direction vertical to a substrate moving direction of the substrate 1 on the upper side or the lower side of the substrate 1. By a first suction nozzle 40 disposed on the more upstream side than the air knife 30 on the upper side or the lower side of the substrate 1, the cleaning solution 1 washed away by the air from the air knife 30 is sucked from the surface or the back surface of the substrate 1. On a part on the surface or the back surface of the substrate 1 against which the air from the air knife 30 strikes, the thickness of liquid film of the cleaning solution 2 is controlled thinly and the liquid film of the cleaning solution 2 is easily removed by the air from the air knife 30. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate drying apparatus for drying a substrate, a substrate drying method, and a method for manufacturing a display panel substrate using them in manufacturing a display panel substrate such as a liquid crystal display device. The present invention relates to a conventional substrate drying apparatus, a substrate drying method, and a method of manufacturing a display panel substrate using them.

  In the manufacturing process of a TFT (Thin Film Transistor) substrate, a color filter substrate, a plasma display panel substrate, an organic EL (Electroluminescence) display panel substrate, etc. of a liquid crystal display device used as a display panel, circuit patterns and colors are formed on the substrate. In order to form a filter or the like, processing such as exposure, development, etching, and peeling of the substrate is performed. Before or after chemical treatment such as development, etching, and peeling, it is necessary to clean the substrate using a cleaning solution such as pure water and to dry the substrate after cleaning. A series of processing including chemical treatment, cleaning, and drying of a substrate is often performed while moving the substrate using a moving means such as a roller conveyor, and the substrate is dried by blowing air onto the substrate using an air knife. Accordingly, it is common to remove the cleaning liquid by pushing it away from the surface of the substrate.

  Drying of a substrate using an air knife has a high ability to dry the substrate, but mist of cleaning liquid blown off from the surface of the substrate by air from the air knife may reattach to the surface of the substrate, resulting in uneven drying. . On the other hand, in Patent Document 1, an air knife is used to form a continuous liquid film over the entire surface of the substrate, and the formed liquid film is sequentially removed from the edge of the substrate, thereby causing unevenness of the substrate. A technique for uniformly drying the film is disclosed.

JP 2007-117993 A

  When a series of processing is performed on a substrate while moving the substrate, it is necessary to move the substrate at a high speed in order to shorten the tact time. In particular, in order to keep the tact time below that of a conventional substrate as the size of the display panel increases, the series of processing is performed on the substrate while moving the substrate at a higher speed than before. It must be made.

  When drying a substrate using a conventional air knife, if the substrate is moved at a high speed, a part of the cleaning liquid remains scattered from the surface of the substrate, and the remaining part of the cleaning liquid becomes a stain after drying. As a result, uneven drying may occur. In particular, in the case where irregularities such as patterns are formed on the surface of the substrate, the movement of the cleaning liquid is hindered by the irregularities on the surface of the substrate, so that there is a high possibility of uneven drying due to the remaining cleaning liquid. In order to suppress such drying unevenness, it is necessary to blow a large amount of air at a higher speed as the substrate is moved at a higher speed.

  On the other hand, in the technique described in Patent Document 1, after forming a liquid film on the surface of the substrate using an air knife, a liquid film removing means such as a halogen lamp heater is provided downstream of the air knife in order to remove the formed liquid film. There is a problem that the installation area of the apparatus increases because the process becomes complicated.

  An object of the present invention is to improve the ability to dry a substrate without adding equipment downstream of the air knife. Another object of the present invention is to efficiently produce a high-quality display panel substrate.

  The substrate drying apparatus of the present invention includes a substrate moving means for moving a substrate supplied with a cleaning liquid on the front surface or the back surface, and a direction perpendicular to the substrate moving direction of the substrate above or below the substrate moved by the substrate moving means. An air knife that blows air to the front surface or back surface of the substrate and is provided upstream of the air knife above or below the substrate that is moved by the substrate moving means and is washed away by the air from the air knife. And a first suction nozzle for sucking from the front surface or the back surface of the substrate.

  Further, the substrate drying method of the present invention, from the air knife provided across the width in the direction orthogonal to the substrate movement direction of the substrate above or below the substrate, while moving the substrate supplied with the cleaning liquid on the front surface or back surface, Air is blown onto the front or back surface of the substrate, and the cleaning liquid swept away by the air from the air knife is sucked from the front or back surface of the substrate by a first suction nozzle provided upstream of the air knife above or below the substrate. is there.

  The first suction nozzle provided upstream of the air knife above or below the substrate sucks the cleaning liquid swept away by the air from the air knife from the front or back surface of the substrate. The thickness of the liquid film of the cleaning liquid is controlled to be thin, and the liquid film of the cleaning liquid is easily removed by the air from the air knife. Accordingly, the ability to dry the substrate is improved, and the first suction nozzle is provided on the upstream side of the air knife above or below the substrate, so that no equipment is added on the downstream side of the air knife, and the installation area of the apparatus is increased. Does not increase.

  Further, in the substrate drying apparatus of the present invention, the substrate moving means has a plurality of horizontally installed rollers, and the first suction nozzle is provided over a width in a direction perpendicular to the substrate moving direction of the substrate. The cleaning liquid swept away by the air from the air knife is sucked from the front or back surface of the substrate, and the mist of the cleaning liquid scattered by the air from the air knife is sucked.

  In the substrate drying method of the present invention, the substrate is moved horizontally, the first suction nozzle is provided across the width of the substrate in the direction orthogonal to the substrate movement direction, and the first suction nozzle is used to remove the air from the air knife. The cleaning liquid swept away by the air is sucked from the front surface or the back surface of the substrate, and the mist of the cleaning liquid scattered by the air from the air knife is sucked.

  When drying the substrate while moving the substrate horizontally, the first suction nozzle is provided across the width of the substrate in the direction orthogonal to the substrate movement direction, and is pushed away by the air from the air knife by the first suction nozzle. The cleaning liquid mist scattered by the air from the air knife and the mist of the cleaning liquid scattered by the air from the air knife is reattached to the front or back surface of the substrate. Occurrence of uneven drying is suppressed.

  Alternatively, in the substrate drying apparatus of the present invention, the substrate moving means has a plurality of rollers installed in a direction perpendicular to the substrate moving direction with respect to the horizontal, and the first suction nozzle is formed by the plurality of rollers. It is disposed above or below the lower side of the inclined substrate to be moved, and is disposed above or below the upper side of the inclined substrate that is moved by a plurality of rollers, and sucks the mist of the cleaning liquid scattered by the air from the air knife. A second suction nozzle is provided.

  In the substrate drying method of the present invention, the substrate is moved while being inclined in a direction orthogonal to the substrate movement direction with respect to the horizontal, and the first suction nozzle is disposed above or below the inclined substrate. The first suction nozzle sucks the cleaning liquid swept away by the air from the air knife from the front surface or the back surface of the substrate, and the second suction nozzle is disposed above or below the inclined substrate. The suction nozzle 2 sucks the mist of the cleaning liquid scattered by the air from the air knife.

  When drying the substrate while moving the substrate while being inclined in a direction perpendicular to the substrate moving direction with respect to the horizontal, the second suction nozzle is disposed above or below the inclined substrate, and the second Since the mist of the cleaning liquid scattered by the air from the air knife is sucked by the suction nozzle, it is possible to prevent the cleaning liquid mist scattered by the air from the air knife from reattaching to the surface of the substrate and causing uneven drying.

  The method for producing a display panel substrate of the present invention is to dry a substrate using any one of the above-described substrate drying apparatuses or substrate drying methods. Since the ability to dry the substrate is improved and drying unevenness is suppressed, a high-quality display panel substrate is efficiently manufactured.

  According to the substrate drying apparatus and the substrate drying method of the present invention, the first suction nozzle provided on the upstream side of the air knife above or below the substrate causes the cleaning liquid swept away by the air from the air knife from the front surface or the back surface of the substrate. By sucking, the ability to dry the substrate can be improved without adding equipment on the downstream side of the air knife.

  Further, the substrate is moved horizontally, the first suction nozzle is provided across the width of the substrate in the direction orthogonal to the substrate movement direction, and the cleaning liquid pushed away by the air from the air knife is supplied to the substrate by the first suction nozzle. When suctioning from the front or back surface of the substrate and suctioning the mist of the cleaning solution scattered by the air from the air knife, the cleaning solution mist scattered by the air from the air knife reattaches to the front or back surface of the substrate, resulting in uneven drying. Can be suppressed.

  Alternatively, the substrate is moved while being inclined in a direction orthogonal to the substrate moving direction with respect to the horizontal, and the first suction nozzle is disposed above or below the inclined substrate, and the first suction nozzle The cleaning liquid swept away by the air from the air knife is sucked from the front surface or the back surface of the substrate, and the second suction nozzle is disposed above or below the inclined substrate. By sucking the mist of the cleaning liquid scattered by the air, it is possible to prevent the cleaning liquid mist scattered by the air from the air knife from reattaching to the front surface or the back surface of the substrate and causing uneven drying.

  According to the method for manufacturing a display panel substrate of the present invention, the ability to dry the substrate can be improved and uneven drying can be suppressed, so that a high-quality display panel substrate can be efficiently manufactured. Can do.

FIG. 1A is a top view of a substrate drying apparatus according to an embodiment of the present invention, and FIG. 1B is a side view thereof. 2A is a side view of the suction nozzle, and FIG. 2B is a cross-sectional view taken along the line AA of FIG. 2A. It is a figure explaining operation | movement of the suction nozzle of the board | substrate drying apparatus by one embodiment of this invention. FIG. 4A is a top view of a substrate drying apparatus according to another embodiment of the present invention, and FIG. 4B is a front view thereof. It is a figure explaining operation | movement of the suction nozzle of the board | substrate drying apparatus by other embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1A is a top view of a substrate drying apparatus according to an embodiment of the present invention, and FIG. 1B is a side view thereof. This embodiment shows an example of a substrate drying apparatus that dries a substrate while moving the substrate horizontally. The substrate drying apparatus includes a roller 10, an air knife 30, and a suction nozzle 40. As will be described later, a wall is provided between the air knife 30 and the suction nozzle 40 to prevent air from flowing from the suction nozzle 40 side to the air knife 30 side. , (B), this wall is omitted.

  1A and 1B, the substrate 1 is mounted on a plurality of rollers 10 and is moved in the substrate movement direction indicated by an arrow by the rotation of the rollers 10. Each roller 10 is installed horizontally and is rotated by a driving mechanism (not shown) to move the substrate 1 horizontally.

  The nozzle header 20 is orthogonal to the substrate moving direction of the substrate 1 on the upstream side (the left side of the drawings in FIGS. 1A and 1B) above and below the substrate drying apparatus moved by the roller 10. It is installed in parallel with the substrate 1 over the width L in the direction. In FIG. 1B, the nozzle header 20 is provided with a plurality of nozzles 20a in a direction orthogonal to the substrate movement direction (the drawing depth direction in FIG. 1B). A cleaning liquid is supplied from a cleaning liquid supply source (not shown) to the nozzle header 20. The nozzle header 20 supplies the cleaning liquid from the nozzle 20 a to the front surface or the back surface of the substrate 1 moved by the roller 10. The substrate 1 supplied with the cleaning liquid on the front surface and the back surface is carried into a substrate drying apparatus by a roller 10.

  In the present embodiment, only one nozzle header 20 is provided, but two or more nozzle headers 20 may be provided in the substrate movement direction.

  In FIG. 1A, an air knife 30 is installed in parallel with the substrate 1 over a width L in a direction orthogonal to the substrate moving direction of the substrate 1 above and below the substrate 1 moved by the roller 10. ing. The air knife 30 is provided so as to be inclined by a predetermined angle θ1 with respect to a direction orthogonal to the substrate movement direction of the substrate 1. The air knife 30 is configured, for example, by forming a pressurizing chamber inside a long casing and providing an air passage leading to the pressurizing chamber in a slit shape in the longitudinal direction. Air is supplied to the air knife 30 from an air supply source (not shown). The air knife 30 uniformly blows air over the longitudinal direction at a predetermined incident angle in the direction opposite to the substrate moving direction from the front end of the air passage to the front or back surface of the substrate 1.

  Further, on the upstream side (left side in the drawing) of the air knife 30 above and below the substrate 1 moved by the roller 10, the suction nozzle 40 extends over a width L in a direction perpendicular to the substrate moving direction of the substrate 1. 1 is installed in parallel. Similar to the air knife 30, the suction nozzle 40 is provided to be inclined by a predetermined angle θ1 with respect to a direction orthogonal to the substrate movement direction of the substrate 1.

  2A is a side view of the suction nozzle, and FIG. 2B is a cross-sectional view taken along the line AA of FIG. 2A. As shown in FIG. 2A, the suction nozzle 40 includes a long casing 40a and a joint 40b provided at one end of the casing 40a. As shown in FIG. 2 (b), the casing 40a has a diamond-shaped cross section and a space formed inside. At the lower end of the casing 40a, a suction port 40c having a width W that communicates with the internal space is provided in a slit shape in the longitudinal direction (the front side and the depth direction in FIG. 2B). A suction path 40d communicating with the space inside the casing 40a is provided inside the joint 40b, and the suction path 40d is connected to a pump (not shown). When a pump (not shown) is operated, the liquid or gas sucked from the suction port 40c is sucked from the space inside the casing 40a through the suction path 40d to the pump.

  FIG. 3 is a diagram for explaining the operation of the suction nozzle of the substrate drying apparatus according to the embodiment of the present invention. As shown in FIG. 3, a wall 50 is provided between the air knife 30 and the suction nozzle 40 to prevent air from flowing from the suction nozzle 40 side to the air knife 30 side. The cleaning liquid 2 on the front surface and the back surface of the substrate 1 is pushed away by the air blown from the air knife 30 to the side opposite to the substrate moving direction. The suction nozzle 40 sucks the cleaning liquid 2 washed away by the air from the air knife 30 from the front surface or the back surface of the substrate 1.

  As a result of the experiment, when the suction pressure is 1.8 kPa, the maximum installation height of the suction nozzle 40 that can suck the cleaning liquid 2 (height from the liquid surface of the cleaning liquid 2 to the suction port 40c) is 3.5 ±. It was 0.5 mm. When the suction pressure was 5.0 kPa, the maximum installation height of the suction nozzle 40 capable of sucking the cleaning liquid 2 was 4.3 ± 0.5 mm. When the suction pressure was 8.8 kPa, the maximum installation height of the suction nozzle 40 capable of sucking the cleaning liquid 2 was 5.1 ± 0.5 mm.

  In FIG. 3, the suction nozzle 40 sucks the cleaning liquid 2 from the front surface or the back surface of the substrate 1, so that the liquid film thickness of the cleaning liquid 2 is thin at the portion where the air from the air knife 30 on the front surface or the back surface of the substrate 1 hits. The liquid film of the cleaning liquid 2 is easily removed by the air from the air knife 30 under control. Accordingly, the ability to dry the substrate 1 is improved, and the suction nozzle 40 is provided on the upstream side of the air knife 30 above or below the substrate 1, so that no equipment is added downstream of the air knife 30, and the apparatus Installation area does not increase.

  On the front side and the back side of the substrate 1, the cleaning liquid 2 is scattered by the air from the air knife 30, and mist of the cleaning liquid is generated. The wall 50 provided between the air knife 30 and the suction nozzle 40 prevents air containing the mist of the cleaning liquid from flowing from the suction nozzle 40 side to the air knife 30 side. The suction nozzle 40 sucks the cleaning liquid 2 swept away by the air from the air knife 30 from the front or back surface of the substrate 1 and sucks the mist of the cleaning liquid scattered by the air from the air knife 30. In FIG. 3, the flow of mist of this cleaning liquid is indicated by arrows.

  When drying the substrate 1 while moving the substrate 1 horizontally, the suction nozzle 40 is provided over a width L in the direction orthogonal to the substrate movement direction of the substrate 1, and the suction nozzle 40 causes the air from the air knife 30 to be used. Since the washed cleaning liquid 2 is sucked from the front or back surface of the substrate 1 and the mist of the cleaning liquid scattered by the air from the air knife 30 is sucked, the mist of the cleaning liquid scattered by the air from the air knife 30 is Generation of uneven drying due to reattachment to the back surface is suppressed.

  FIG. 4A is a top view of a substrate drying apparatus according to another embodiment of the present invention, and FIG. 4B is a front view thereof. The present embodiment shows an example of a substrate drying apparatus that dries a substrate while moving the substrate while being inclined in a direction perpendicular to the substrate moving direction with respect to the horizontal. The substrate drying apparatus includes a roller 11, an air knife 31, and suction nozzles 41 and 42. In FIG. 4B, the cleaning liquid nozzle 21, the air knife 31, and the suction nozzles 41 and 42 provided below the substrate 1 are omitted.

  In FIG. 4A, the substrate 1 is mounted on a plurality of rollers 11 and is moved in the substrate moving direction indicated by the arrow by the rotation of the rollers 11. As shown in FIG. 4B, each roller 11 is installed at a predetermined angle α in a direction perpendicular to the substrate moving direction with respect to the horizontal, and is rotated by a driving mechanism (not shown) so that the substrate 1 Is moved in a state inclined with respect to the horizontal direction perpendicular to the substrate moving direction. A lowermost roller 11 installed at an angle is provided with a flange 12 for guiding the side surface of the substrate 1.

  In FIG. 4A, a cleaning liquid nozzle 21 is installed on the upstream side (the left side of the drawing in FIG. 4A) above and below the substrate drying apparatus moved by the roller 11. The cleaning liquid nozzle 21 is configured, for example, in a long casing, with nozzle openings provided in a slit shape or at predetermined intervals in the longitudinal direction, and is provided above the inclined substrate 1 along the substrate movement direction. ing. A cleaning liquid is supplied from a cleaning liquid supply source (not shown) to the cleaning liquid nozzle 21. The cleaning liquid nozzle 21 supplies the cleaning liquid to the upper side of the front surface or the back surface of the substrate 1 from the nozzle port. The cleaning liquid supplied to the upper side of the front surface and the back surface of the substrate 1 flows down to the lower side of the front surface and the back surface of the substrate 1 along the inclination of the substrate 1. The substrate 1 supplied with the cleaning liquid on the front surface and the back surface is carried into a substrate drying apparatus by a roller 11.

  Above and below the substrate 1 moved by the roller 11, an air knife 31 is installed in parallel with the substrate 1 over a width L in a direction perpendicular to the substrate moving direction of the substrate 1. The air knife 31 is provided to be inclined by a predetermined angle θ2 with respect to a direction orthogonal to the substrate moving direction of the substrate 1. The air knife 31 is configured, for example, by forming a pressurizing chamber inside a long casing and providing an air passage leading to the pressurizing chamber in a slit shape in the longitudinal direction. Air is supplied from an air supply source (not shown) to the air knife 31. The air knife 31 uniformly blows air over the longitudinal direction at a predetermined incident angle in the direction opposite to the substrate moving direction from the front end of the air passage to the front or back surface of the substrate 1.

  Furthermore, suction nozzles 41 and 42 are installed in parallel with the substrate 1 on the upstream side (the left side of the drawing in FIG. 4A) above and below the air knife 31 moved by the roller 11. The suction nozzle 41 is provided above or below the inclined substrate 1 along the substrate moving direction. The suction nozzle 42 is provided above or below the inclined substrate 1 along the substrate moving direction. The structure of the suction nozzles 41 and 42 is the same as the structure of the suction nozzle 40 shown in FIG.

  FIG. 5 is a diagram for explaining the operation of the suction nozzle of the substrate drying apparatus according to another embodiment of the present invention. The cleaning liquid 2 supplied from the cleaning liquid nozzle 21 to the upper side of the front and back surfaces of the substrate 1 flows down to the lower side of the substrate 1 along the inclination of the substrate 1, and is opposite to the substrate moving direction by the air blown from the air knife 31. Washed away. In FIG. 5A, the suction nozzle 41 installed above the lower side of the inclined substrate 1 sucks the cleaning liquid 2 washed away by the air from the air knife 31 from the surface of the substrate 1. When the suction nozzle 41 sucks the cleaning liquid 2 from the surface of the substrate 1, the thickness of the liquid film of the cleaning liquid 2 is controlled to be thin at a portion where the air from the air knife 31 hits the surface of the substrate 1. Thus, the liquid film of the cleaning liquid 2 is easily removed. Accordingly, the ability to dry the substrate 1 is improved, and the suction nozzle 41 is provided on the upstream side of the air knife 31 above the substrate 1, so that no equipment is added downstream of the air knife 31 and the installation area of the apparatus is increased. Does not increase.

  On the front side and the back side of the substrate 1, the cleaning liquid 2 is scattered by the air from the air knife 31, and mist of the cleaning liquid is generated. In FIG. 5B, the suction nozzle 42 installed above the inclined substrate 1 sucks the mist of the cleaning liquid scattered by the air from the air knife 31. In FIG. 5B, the flow of mist of the cleaning liquid is indicated by an arrow.

  When drying the substrate 1 while moving the substrate 1 while being inclined in a direction orthogonal to the substrate moving direction with respect to the horizontal, the suction nozzle 41 is disposed above or below the inclined substrate, and the suction nozzle is arranged. 41, the mist of the cleaning liquid scattered by the air from the air knife 31 is sucked, so that it is suppressed that the mist of the cleaning liquid scattered by the air from the air knife 31 reattaches to the surface of the substrate 1 and the drying unevenness occurs. .

  According to the embodiment described above, the cleaning liquid 2 washed away by the air from the air knives 30 and 31 by the suction nozzles 40 and 41 provided upstream of the air knives 30 and 31 above or below the substrate 1 is supplied to the substrate 1. The ability to dry the substrate 1 can be improved without adding equipment on the downstream side of the air knives 30 and 31.

  Further, the substrate 1 is moved horizontally, the suction nozzle 40 is provided over a width L in the direction orthogonal to the substrate movement direction of the substrate 1, and the cleaning liquid 2 pushed away by the air from the air knife 30 by the suction nozzle 40. While sucking from the front or back surface of the substrate 1 and sucking the mist of the cleaning liquid scattered by the air from the air knife 30, the mist of the cleaning liquid scattered by the air from the air knife 30 is reattached to the front or back surface of the substrate 1. Thus, the occurrence of uneven drying can be suppressed.

  Alternatively, the substrate 1 is moved in a state inclined with respect to the horizontal direction perpendicular to the substrate moving direction, and the suction nozzle 41 is disposed above or below the inclined substrate 1, and the suction nozzle 41 causes the air knife to move. The cleaning liquid pushed away by the air from 31 is sucked from the front or back surface of the substrate 1, and the suction nozzle 42 is arranged above or below the inclined substrate 1, and the air from the air knife 31 is drawn by the suction nozzle 42. By sucking the mist of the cleaning liquid splattered by the above, it is possible to prevent the mist of the cleaning liquid splattered by the air from the air knife 31 from reattaching to the front surface or the back surface of the substrate 1 and causing uneven drying.

  FIG. 6 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning step and a drying step are performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 7 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning step and a drying step are performed as necessary.

  By drying the substrate using the substrate drying apparatus or the substrate drying method of the present invention, the ability to dry the substrate can be improved and uneven drying can be suppressed. A board | substrate can be manufactured efficiently.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Cleaning liquid 10,11 Roller 12 Flange 20 Nozzle header 21 Cleaning liquid nozzle 30,31 Air knife 40,41,42 Suction nozzle 40a Casing 40b Joint 40c Suction port 40d Suction path 50 Wall

Claims (8)

Substrate moving means for moving the substrate supplied with the cleaning liquid on the front surface or the back surface;
An air knife provided above or below the substrate moved by the substrate moving means over a width in a direction perpendicular to the substrate moving direction of the substrate, and for blowing air to the front or back surface of the substrate;
A first suction nozzle which is provided upstream of the air knife above or below the substrate moved by the substrate moving means and sucks the cleaning liquid swept away by the air from the air knife from the front surface or the back surface of the substrate; A substrate drying apparatus. The substrate moving means has a plurality of rollers installed horizontally,
The first suction nozzle is provided over a width in a direction orthogonal to the substrate movement direction of the substrate, sucks the cleaning liquid swept away by the air from the air knife from the front surface or the back surface of the substrate, and from the air knife. 2. The substrate drying apparatus according to claim 1, wherein the mist of the cleaning liquid scattered by the air is sucked. The substrate moving means has a plurality of rollers installed to be inclined in a direction perpendicular to the substrate moving direction with respect to the horizontal,
The first suction nozzle is disposed above or below a tilted substrate moved by the plurality of rollers,
2. A second suction nozzle that is disposed above or below an inclined substrate that is moved by the plurality of rollers and that sucks mist of cleaning liquid scattered by the air from the air knife. 2. The substrate drying apparatus according to 1. While moving the substrate supplied with cleaning liquid on the front or back side,
Air is blown onto the front surface or back surface of the substrate from an air knife provided over the substrate in the direction perpendicular to the substrate movement direction above or below the substrate,
A substrate drying method, wherein a cleaning liquid pushed away by air from an air knife is sucked from a front surface or a back surface of a substrate by a first suction nozzle provided upstream of an air knife above or below the substrate. Move the board horizontally,
A first suction nozzle is provided across the width of the substrate in a direction orthogonal to the substrate movement direction;
5. The cleaning liquid swept away by the air from the air knife is sucked from the front surface or the back surface of the substrate by the first suction nozzle, and the mist of the cleaning liquid scattered by the air from the air knife is sucked. Substrate drying method. Move the substrate in a state tilted in the direction perpendicular to the substrate moving direction with respect to the horizontal,
The first suction nozzle is disposed above or below the inclined substrate, and the first suction nozzle sucks the cleaning liquid swept away by the air from the air knife from the front surface or the back surface of the substrate.
The second suction nozzle is disposed above or below the upper side of the inclined substrate, and the mist of the cleaning liquid scattered by the air from the air knife is sucked by the second suction nozzle. Substrate drying method.   A method of manufacturing a display panel substrate, comprising: drying a substrate using the substrate drying apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is dried using the substrate drying method according to claim 4.

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