JP2012190908A - Substrate processing device, substrate processing method, and manufacturing method of display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively remove foam of processing liquid collected in a processing chamber, by using a simple facility.SOLUTION: A substrate processing device has a suction port 30f, a discharging port 30g, and a compressed air introducing port 30h. Compressed air is made to flow into the discharging portion 30g from the compressed air introducing port 30h. By using an ejector 30 for discharging articles from the discharging portion 30g, sucked by pressure difference generated between the suction port 30f and the discharging portion 30g, from the suction port 30f with the compressed air, foam of processing liquid which is collected in a processing chamber 20 is sucked from the suction port 30f through first piping 31, and the sucked foam of the processing liquid is crushed by the pressure of the compressed air to be liquefied, and the liquefied processing liquid is discharged from the discharging port 30g into the processing chamber 20 through second piping 32, together with the compressed air.

Description

  The present invention relates to a substrate processing apparatus, a substrate processing method, and a display using the same, which perform processing such as development, etching, peeling, and cleaning of a substrate using a processing solution such as a developing solution, an etching solution, a peeling solution, and a cleaning solution. In particular, a substrate processing apparatus and a substrate processing method are disclosed in which a processing liquid is discharged from a nozzle to a substrate while the substrate is moved in a processing chamber, and the processing liquid discharged to the substrate is recovered and reused. And a method of manufacturing a display panel substrate using them.

  In the manufacturing process of a TFT (Thin Film Transistor) substrate, a color filter substrate, a plasma display panel substrate, an organic EL (Electroluminescence) display panel substrate, etc. of a liquid crystal display device used as a display panel, circuit patterns and colors are formed on the substrate. In order to form a filter or the like, processing such as exposure, development, etching, peeling, and washing of the substrate is performed. Of these, development, etching, stripping, and cleaning are often performed in a processing chamber while moving the substrate using a moving device such as a roller conveyor, and the developer, etching solution, stripping solution, and cleaning solution are used. A treatment liquid such as a liquid is discharged from the spray nozzle, shower nozzle, or slit nozzle onto the surface of the substrate. The processing liquid discharged from the nozzle to the substrate is collected from the processing chamber and returned to the processing liquid tank after the processing of the substrate. In this way, by circulating the processing liquid between the processing chamber and the processing liquid tank and reusing it, the consumption of expensive processing liquid is reduced and the manufacturing cost of the substrate is reduced.

  When the processing liquid discharged from the nozzle collides with the surface of the substrate in the processing chamber, bubbles of the processing liquid are generated. Further, when the processing liquid falls from the surface of the substrate and collides with the floor of the processing chamber or the processing liquid recovery chamber in the processing chamber, bubbles of the processing liquid are generated. Bubbles in the processing liquid cause problems such as defective ejection of the nozzle, bubble leakage from the processing liquid tank or the processing chamber, and poor substrate transfer due to bubbles in the processing chamber. Therefore, conventionally, measures have been taken to add an antifoaming agent to the processing liquid, stop the apparatus until the bubbles disappear, or replace the processing liquid. However, there has been a problem that the addition of an antifoaming agent causes deterioration of the processing liquid, the stoppage of the apparatus causes a reduction in operating rate, and the replacement of the processing liquid causes an increase in running cost.

  On the other hand, Patent Document 1 describes a technique for preventing bubbles from flowing into a processing liquid tank using a manual valve or an air vent pipe. Patent Document 2 discloses a technique in which a bypass pipe is provided in the middle of a recovery pipe for recovering a processing liquid from a processing chamber to a processing liquid tank, and bubbles in the processing liquid flowing through the bypass pipe are liquefied.

JP 2001-332528 A JP 2005-340322 A

  Although the technology described in Patent Document 1 requires simple equipment such as a manual valve and air vent piping, since bubbles cannot be positively removed, bubbles still remain in the processing chamber, foam leakage from the processing chamber, In addition, there is a problem of poor substrate transport due to bubbles in the processing chamber. In addition, the technique described in Patent Document 2 cannot erase the foam remaining in the processing chamber without flowing into the recovery pipe.

  An object of the present invention is to effectively remove bubbles of the processing liquid accumulated in the processing chamber using simple equipment. Another object of the present invention is to efficiently and inexpensively manufacture a high-quality substrate with little processing unevenness.

  The substrate processing apparatus according to the present invention includes a processing chamber for processing a substrate using a processing liquid, a substrate moving means for moving the substrate in the processing chamber, and a substrate provided in the processing chamber and moved by the substrate moving means. A nozzle for discharging the liquid, a processing liquid tank for storing the processing liquid supplied to the nozzle, a processing liquid recovery means for recovering the processing liquid discharged from the nozzle to the substrate and returning it to the processing liquid tank, and a suction port and a discharge port And a compressed air introduction port, the compressed air flows from the compressed air introduction port to the discharge port, and the material sucked from the suction port due to the pressure difference generated between the suction port and the discharge port is discharged together with the compressed air. An ejector for discharging from the ejector, a first pipe connected to the suction port of the ejector, a second pipe connected to the discharge port of the ejector, and a pneumatic circuit for supplying compressed air to the compressed air inlet of the ejector Prepare, eject However, the bubbles of the processing liquid accumulated in the processing chamber are sucked from the suction port via the first pipe, and the sucked processing liquid bubbles are crushed and liquefied by the pressure of the compressed air, and the liquefied processing liquid is compressed air. At the same time, it is discharged from the discharge port into the processing chamber via the second pipe.

  The substrate processing method of the present invention supplies a processing liquid from a processing liquid tank storing a processing liquid to a nozzle provided in the processing chamber while moving the substrate in the processing chamber, and discharges the processing liquid from the nozzle to the substrate. Then, the processing liquid discharged from the nozzle to the substrate is collected and returned to the processing liquid tank, and has a suction port, a discharge port, and a compressed air introduction port, and the compressed air flows from the compressed air introduction port to the discharge port. Connect the first pipe to the ejector's suction port and connect the first pipe to the ejector's discharge port. Connect the second piping, supply compressed air to the compressed air inlet of the ejector, and suck the bubbles of the processing liquid accumulated in the processing chamber from the suction port of the ejector via the first piping. Liquid bubbles with compressed air pressure Rude liquefied is for discharging the liquefied treatment liquid from the discharge port of the ejector along with the compressed air into the processing chamber through the second pipe.

  The ejector used in the present invention has a suction port, a discharge port, and a compressed air introduction port, flows compressed air from the compressed air introduction port to the discharge port, and sucks due to a pressure difference generated between the suction port and the discharge port. This is a kind of fluid drive device that discharges an object sucked from a mouth from a discharge port together with compressed air. Using this ejector, the bubbles of the processing liquid accumulated in the processing chamber are sucked from the suction port of the ejector via the first pipe, and the sucked processing liquid bubbles are crushed with the pressure of compressed air to be liquefied and liquefied. Since the processing liquid is discharged together with the compressed air from the discharge port of the ejector into the processing chamber via the second pipe, the bubbles of the processing liquid accumulated in the processing chamber can be effectively removed using simple equipment. Therefore, bubble leakage from the processing chamber and substrate conveyance failure due to bubbles in the processing chamber are prevented. Since bubbles of the processing liquid accumulated in the processing chamber are crushed by the pressure of the compressed air, the processing liquid can be reused without being diluted or contaminated. Since the ejector and the pneumatic circuit for supplying the compressed air to the compressed air introduction port of the ejector can be configured in a small size, they can be freely arranged regardless of the installation location.

  Furthermore, the substrate processing apparatus of the present invention has an opening wider than the inner diameter of the first pipe, and is installed at a position higher than the liquid level of the processing liquid collected in the processing chamber in the processing chamber. It is equipped with a connected suction hood. In the substrate processing method of the present invention, the suction hood having an opening wider than the inner diameter of the first pipe is installed at a position higher than the liquid level of the processing liquid collected in the processing chamber. To be connected to the pipe. The bubbles of the processing liquid contain air and are lighter than the processing liquid itself, and float on the surface of the processing liquid. Since the suction hood having an opening wider than the inner diameter of the first pipe is installed at a position higher than the liquid level of the processing liquid collected in the processing chamber in the processing chamber and connected to the first pipe, Bubbles floating on the surface are efficiently sucked from the opening of the suction hood.

  Furthermore, the substrate processing apparatus of the present invention is provided with a cover that is installed near the tip of the second pipe in the processing chamber and that collides with the compressed air discharged from the second pipe. Moreover, the substrate processing method of this invention installs the cover which the compressed air discharged from 2nd piping collides near the front-end | tip of 2nd piping in a processing chamber. The compressed air discharged from the second pipe collides with the cover and the momentum is weakened, and the turbulence of the air flow in the processing chamber due to the compressed air discharged from the second pipe is prevented. Moreover, it is prevented that the compressed air discharged from the second pipe directly collides with the processing liquid accumulated in the processing chamber to generate bubbles.

  The method for producing a display panel substrate according to the present invention is to perform substrate processing using any one of the above-described substrate processing apparatuses or substrate processing methods. Since the bubbles of the processing liquid collected in the processing chamber are effectively removed using simple equipment, the processing liquid deteriorates due to the addition of an antifoaming agent, the operating rate decreases due to the shutdown of the apparatus, and the processing liquid is replaced. Thus, an increase in running cost due to the above is suppressed, and a display panel substrate with high quality with little processing unevenness is efficiently and inexpensively manufactured.

  According to the substrate processing apparatus and the substrate processing method of the present invention, a suction port, a discharge port, and a compressed air introduction port are provided, compressed air is allowed to flow from the compressed air introduction port to the discharge port, and between the suction port and the discharge port. Using an ejector that discharges the material sucked from the suction port due to the pressure difference generated from the discharge port together with the compressed air, the bubbles of the processing liquid accumulated in the processing chamber are sucked from the suction port of the ejector through the first pipe. Then, the bubble of the sucked processing liquid is liquefied by compressing the compressed air, and the liquefied processing liquid is discharged into the processing chamber through the second pipe from the discharge port of the ejector together with the compressed air. The bubbles of the accumulated processing liquid can be effectively removed using simple equipment. Accordingly, it is possible to prevent bubble leakage from the processing chamber and substrate conveyance failure due to bubbles in the processing chamber. Since bubbles of the processing liquid accumulated in the processing chamber are crushed by the pressure of the compressed air, the processing liquid can be reused without being diluted or contaminated. Since the ejector and the pneumatic circuit for supplying the compressed air to the compressed air introduction port of the ejector can be configured in a small size, they can be freely arranged regardless of the installation location.

  Furthermore, according to the substrate processing apparatus and the substrate processing method of the present invention, the suction hood having an opening wider than the inner diameter of the first pipe is positioned higher than the liquid level of the processing liquid accumulated in the processing chamber. By installing and connecting to the first pipe, the bubbles floating on the surface of the treatment liquid can be efficiently sucked from the opening of the suction hood.

  Furthermore, according to the substrate processing apparatus and the substrate processing method of the present invention, the cover on which the compressed air discharged from the second pipe collides is installed in the vicinity of the tip of the second pipe in the processing chamber. Disturbance of the air flow in the processing chamber due to the compressed air discharged from the pipe can be prevented. Further, it is possible to prevent the compressed air discharged from the second pipe from directly colliding with the processing liquid accumulated in the processing chamber and generating bubbles.

  According to the method for manufacturing a display panel substrate of the present invention, the bubbles of the processing liquid accumulated in the processing chamber can be effectively removed using simple equipment. It is possible to efficiently and inexpensively manufacture a display panel substrate with low processing unevenness and high quality while suppressing deterioration, a reduction in operating rate due to the stop of the apparatus, and an increase in running cost due to replacement of the processing liquid.

It is a figure which shows schematic structure of the substrate processing apparatus by one embodiment of this invention. 2A is a side view of the ejector, and FIG. 2B is a sectional view of the inside of the ejector. It is an external view of a suction hood. It is a figure explaining operation | movement of a cover. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. The substrate processing apparatus includes a roller 10, a processing chamber 20, a nozzle 21, a processing liquid recovery pipe 22, a processing liquid tank 23, a processing liquid supply pipe 24, a pump 25, a filter 26, an ejector 30, a suction pipe 31, a discharge pipe 32, and a compression. An air supply source 33, a pneumatic circuit, a suction hood 40a, and a cover 50 are included.

  The substrate 1 is mounted on a plurality of rollers 10, and is moved in the substrate movement direction indicated by an arrow by the rotation of the rollers 10. In the present embodiment, the substrate 1 is moved in a horizontal state. However, the present invention is not limited to this, and the substrate 1 is moved in a direction orthogonal to the horizontal direction or a predetermined angle in the substrate movement direction. You may move in an inclined state.

  The substrate 1 is carried into the processing chamber 20 by the roller 10. In the processing chamber 20, a plurality of nozzles 21 are installed above the substrate 1 mounted on the roller 10. The nozzle 21 includes a spray nozzle, a shower nozzle, or a slit nozzle, and discharges a processing liquid such as a developing solution, an etching solution, a stripping solution, and a cleaning solution onto the surface of the substrate 1 that is moved by the roller 10. As the substrate 1 moves, the processing liquid discharged from the nozzle 21 is supplied to the entire surface of the substrate 1, and processing such as development, etching, peeling, and cleaning of the substrate 1 is performed.

  In the present embodiment, three stages of nozzles 21 are provided in the substrate movement direction, but the number of stages of nozzles 21 is not limited to this.

  The floor of the processing chamber 20 is gently inclined, and a processing liquid recovery pipe 22 is provided at the lowest position on the floor. The lower end of the processing liquid recovery pipe 22 extends into the processing liquid tank 23 that stores the processing liquid 2. The processing liquid discharged from the nozzle 21 onto the surface of the substrate 1 flows down from the surface of the substrate 1 to the floor of the processing chamber 20 and flows into the processing liquid tank 23 from the processing liquid recovery pipe 22. The processing liquid 2 stored in the processing liquid tank 23 is supplied to the nozzle 21 through the processing liquid supply pipe 24. The processing liquid supply pipe 24 is provided with a pump 25 for flowing the processing liquid 2 in the processing liquid tank 23 into the processing liquid supply pipe 24 and a filter 26 for removing foreign matters and impurities mixed in the processing liquid 2. Yes.

  In the present embodiment, the processing liquid discharged from the nozzle 21 to the substrate 1 is recovered from the floor of the processing chamber 20, but a processing liquid recovery chamber is provided in the processing chamber 20, and the processing liquid recovery chamber The processing liquid accumulated in the processing liquid may flow into the processing liquid tank 23.

  Hereinafter, a substrate processing method according to an embodiment of the present invention will be described. When the processing liquid discharged from the nozzle 21 collides with the surface of the substrate 1 in the processing chamber 20, bubbles of the processing liquid are generated. Also, when the processing liquid falls from the surface of the substrate 1 and collides with the floor of the processing chamber 20 or the processing liquid recovery chamber in the processing chamber 20, bubbles of the processing liquid are generated. In the present invention, bubbles of the processing liquid accumulated in the processing chamber 20 are removed using the ejector 30. The ejector 30 used in the present invention has a suction port, a discharge port, and a compressed air introduction port, and allows compressed air to flow from the compressed air introduction port to the discharge port. Due to the pressure difference generated between the suction port and the discharge port. This is a kind of fluid drive device that discharges an object sucked from a suction port together with compressed air from a discharge port.

  2A is a side view of the ejector, and FIG. 2B is a sectional view of the inside of the ejector. 2A, the ejector 30 includes a main body 30a, a suction part 30b, a discharge part 30c, and a compressed air introduction part 30d. As shown in FIG. 2B, a fluid passage 30e connected in the horizontal direction of the drawing is formed in the suction portion 30b, the main body 30a, and the discharge portion 30c, and one end of the fluid passage 30e is formed in the suction portion 30b. The other end of the fluid passage 30e is formed as a discharge port 30g in the discharge portion 30c. On the other hand, the compressed air introduction portion 30d is provided with a compressed air introduction port 30h. The main body 30a extends obliquely from the compressed air introduction port 30h toward the discharge port 30g, and includes a fluid passage 30e. A compressed air passage 30i that merges is formed.

  When compressed air flows from the compressed air introduction port 30h to the discharge port 30g through the compressed air passage 30i and the fluid passage 30e, a pressure difference is generated between the suction port 30f and the discharge port 30g. The fluid is sucked from 30f. The fluid sucked from the suction port 30f passes through the fluid passage 30e and is discharged from the discharge port 30g together with the compressed air.

  In FIG. 1, a suction pipe 31 is connected to the suction port of the ejector 30, and the tip of the suction pipe 31 is connected to a suction hood 40 a installed in the processing chamber 20. On the other hand, a discharge pipe 32 is connected to the discharge port of the ejector 30, and the tip of the discharge pipe 32 is installed in the processing chamber 20. A cover 50 is provided in the processing chamber 20 near the tip of the discharge pipe 32.

  A pneumatic circuit is connected to the compressed air introduction port of the ejector 30. The pneumatic circuit includes a pressure regulating valve 34, a pressure gauge 35, a flow meter 36, a flow control valve 37, an automatic valve 38, and a filter 39. The pressure adjustment valve 34 adjusts the pressure of the compressed air supplied from the compressed air supply source 33 to the compressed air introduction port of the ejector 30. The flow rate control valve 37 controls the flow rate of the compressed air supplied from the compressed air supply source 33 to the compressed air introduction port of the ejector 30.

  When compressed air is supplied from the compressed air supply source 33 to the compressed air introduction port of the ejector 30 through the pneumatic circuit, the ejector 30 removes bubbles of the processing liquid accumulated in the processing chamber 20 from the suction hood 40a and the suction pipe. The air is sucked from the suction port 31, the bubble of the sucked processing liquid is crushed by the pressure of compressed air, and liquefied, and the liquefied processing liquid is discharged into the processing chamber 20 from the discharge port together with the compressed air through the discharge pipe 32. To do. The bubbles of the processing liquid accumulated in the processing chamber 20 are effectively removed using simple equipment. Accordingly, bubble leakage from the processing chamber 20 and poor conveyance of the substrate 1 due to bubbles in the processing chamber 20 are prevented. Since the bubbles of the processing liquid accumulated in the processing chamber 20 are crushed by the pressure of the compressed air, the processing liquid can be reused without being diluted or contaminated. Since the ejector 30 and the pneumatic circuit that supplies the compressed air to the compressed air introduction port of the ejector 30 can be configured in a small size, they can be freely arranged regardless of the installation location. Further, the pressure of the compressed air supplied to the compressed air introduction port of the ejector 30 is adjusted and the flow rate of the compressed air is controlled by the pneumatic circuit in accordance with the amount of bubbles of the processing liquid generated in the processing chamber 20. Can do.

  FIG. 3 is an external view of the suction hood. As shown in FIG. 3A, the suction hood 40 a has an opening wider than the inner diameter of the suction pipe 31, and is positioned higher than the liquid level of the processing liquid accumulated in the processing chamber 20 in the processing chamber 20. is set up. The bubbles of the processing liquid contain air and are lighter than the processing liquid itself, and float on the surface of the processing liquid. Since the suction hood 40a having an opening wider than the inner diameter of the suction pipe 31 is installed at a position higher than the liquid level of the processing liquid accumulated in the processing chamber 20 in the processing chamber 20, and connected to the suction pipe 31. Bubbles floating on the surface of the treatment liquid are efficiently sucked from the opening of the suction hood 40a.

  FIGS. 3B, 3C, and 3D are external views of other examples of the suction hood. The suction hood 40a shown in FIG. 3 (a) and the suction hood 40b shown in FIG. 3 (b) both have round openings, but the suction hood 40a has a shape in which a part of a cone is cut off. On the other hand, the suction hood 40b has a cylindrical outer shape. Further, both the suction hood 40c shown in FIG. 3 (c) and the suction hood 40d shown in FIG. 3 (d) have a square opening, and the suction hood 40c has a shape in which a part of a quadrangular pyramid is cut off. The suction hood 40d has a fan shape when viewed from above. The opening of the suction hood can be appropriately selected depending on the installation location and space as long as the pressure loss is small and the foam of the treatment liquid can be sucked in a wide range. Further, as the arrangement of the suction hood, when there is a flow in the bubbles of the processing liquid, the suction hood is arranged so that the opening faces from the downstream side to the upstream side of the flow. When there is no flow in the bubbles of the processing liquid, the processing liquid is disposed near the place where the bubbles of the processing liquid are generated or where the bubbles of the processing liquid are gathered. The suction hood is made of a material that is not altered by a processing solution such as a developing solution, an etching solution, a stripping solution, or a cleaning solution.

  FIG. 4 is a diagram for explaining the operation of the cover. The compressed air discharged from the discharge pipe 32 in the processing chamber 20 may disturb the airflow in the processing chamber 20 due to the momentum, and may collide with the processing liquid accumulated in the processing chamber 20 to generate bubbles. . In the present embodiment, the compressed air discharged from the discharge pipe 32 in the processing chamber 20 collides with the cover 50 installed near the tip of the discharge pipe 32, and its momentum is weakened and discharged from the discharge pipe 32. Disturbance of the airflow in the processing chamber 20 due to the compressed air is prevented. Further, it is possible to prevent the compressed air discharged from the discharge pipe 32 from directly colliding with the processing liquid accumulated in the processing chamber 20 and generating bubbles. The shape of the cover 50 can be appropriately selected according to the direction in which the momentum of the compressed air is released. As shown in FIG. 4, when the cover 50 having a shape inclined toward the floor of the processing chamber 20 is provided on the front surface of the discharge pipe 32. The air that has collided with the cover 50 flows toward the floor of the processing chamber 20 as indicated by arrows. The liquefied processing liquid discharged from the discharge pipe 32 together with the compressed air in the processing chamber 20 collides with the cover 50 and falls to the floor of the processing chamber 20, and is recovered from the processing liquid recovery pipe 22 to the processing liquid tank 23. The

  According to the embodiment described above, the suction port 30f, the discharge port 30g, and the compressed air introduction port 30h are provided. The compressed air flows from the compressed air introduction port 30h to the discharge port 30g, and the suction port 30f and the discharge port 30g. Using the ejector 30 that discharges the object sucked from the suction port 30f due to the pressure difference generated between the two and the compressed air from the discharge port 30g, the bubbles of the processing liquid accumulated in the processing chamber 20 are passed through the suction pipe 31. Then, the bubbles of the processing liquid sucked from the suction port 30f of the ejector 30 are liquefied by compressing with the pressure of the compressed air, and the liquefied processing liquid is processed through the discharge pipe 32 from the discharge port 30g of the ejector 30 together with the compressed air. By discharging into the chamber 20, bubbles of the processing liquid accumulated in the processing chamber 20 can be effectively removed using simple equipment. Therefore, it is possible to prevent bubble leakage from the processing chamber 20 and substrate conveyance failure due to bubbles in the processing chamber 20. Since the bubbles of the processing liquid accumulated in the processing chamber 20 are crushed by the pressure of the compressed air, the processing liquid can be reused without being diluted or contaminated. The ejector 30 and the pneumatic circuit for supplying the compressed air to the compressed air inlet 30h of the ejector 30 can be configured in a small size, and can be freely arranged regardless of the installation location. Further, the pressure of the compressed air supplied to the compressed air inlet 30h of the ejector 30 is adjusted by the pneumatic circuit according to the amount of bubbles of the processing liquid generated in the processing chamber 20, and the flow rate of the compressed air is controlled. be able to.

  Furthermore, the suction hoods 40a, 40b, 40c, and 40d having an opening wider than the inner diameter of the suction pipe 31 are installed at a position higher than the liquid level of the processing liquid accumulated in the processing chamber 20 in the processing chamber 20, By connecting to the suction pipe 31, the bubbles floating on the surface of the treatment liquid can be efficiently sucked from the openings of the suction hoods 40a, 40b, 40c, and 40d.

  Furthermore, the cover 50 with which the compressed air discharged from the discharge pipe 32 collides is installed in the vicinity of the tip of the discharge pipe 32 in the processing chamber 20, so that the compressed air discharged from the discharge pipe 32 in the processing chamber 20 Airflow disturbance can be prevented. Further, it is possible to prevent the compressed air discharged from the discharge pipe 32 from directly colliding with the processing liquid accumulated in the processing chamber 20 and generating bubbles.

  By processing the substrate using the substrate processing apparatus or the substrate processing method of the present invention, the bubbles of the processing liquid accumulated in the processing chamber can be effectively removed using simple equipment. Suppressing the deterioration of the processing liquid due to the addition of the agent, the reduction in the operating rate due to the shutdown of the equipment, and the increase in the running cost due to the replacement of the processing liquid, making the display panel substrate of high quality with little processing unevenness efficient and inexpensive. Can be manufactured.

  For example, FIG. 5 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning step and a drying step are performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 6 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning step and a drying step are performed as necessary.

  In the manufacturing process of the TFT substrate shown in FIG. 5, in the development process (step 104), the etching process (step 105), the peeling process (step 106), and the cleaning process, in the manufacturing process of the color filter substrate shown in FIG. The substrate processing apparatus or the substrate processing method of the present invention can be applied in the development process, etching process, peeling process, and cleaning process in the black matrix forming process (step 201) and the colored pattern forming process (step 202).

DESCRIPTION OF SYMBOLS 1 Substrate 2 Processing liquid 10 Roller 20 Processing chamber 21 Nozzle 22 Processing liquid recovery piping 23 Processing liquid tank 24 Processing liquid supply piping 25 Pump 26 Filter 30 Ejector 30a Main body 30b Suction part 30c Discharge part 30d Compressed air introduction part 30e Fluid passage 30f Suction 30 g Discharge port 30 h Compressed air introduction port 30 i Compressed air passage 31 Suction piping 32 Discharge piping 33 Compressed air supply source 34 Pressure regulating valve 35 Pressure gauge 36 Flow meter 37 Flow control valve 38 Automatic valve 39 Filters 40 a, 40 b, 40 c, 40 d Suction hood 50 cover

Claims (8)

A processing chamber for processing a substrate using a processing liquid;
Substrate moving means for moving the substrate in the processing chamber;
A nozzle that is provided in the processing chamber and that discharges the processing liquid to the substrate moved by the substrate moving means;
A processing liquid tank for storing a processing liquid to be supplied to the nozzle;
Processing liquid recovery means for recovering the processing liquid discharged from the nozzle to the substrate and returning it to the processing liquid tank;
It has a suction port, a discharge port, and a compressed air introduction port, flows compressed air from the compressed air introduction port to the discharge port, and sucks from the suction port due to a pressure difference generated between the suction port and the discharge port. An ejector that discharges with compressed air from the outlet;
A first pipe connected to the suction port of the ejector;
A second pipe connected to the discharge port of the ejector;
A pneumatic circuit for supplying compressed air to the compressed air inlet of the ejector,
The ejector sucks the bubbles of the processing liquid accumulated in the processing chamber from the suction port via the first pipe, and the sucked processing liquid bubbles are crushed with the pressure of compressed air to be liquefied and liquefied. A substrate processing apparatus, wherein a liquid is discharged together with compressed air from a discharge port into the processing chamber through the second pipe.   A suction hood having an opening wider than the inner diameter of the first pipe, installed at a position higher than the liquid level of the processing liquid accumulated in the processing chamber in the processing chamber, and connected to the first pipe The substrate processing apparatus according to claim 1, further comprising a substrate processing apparatus.   3. The substrate according to claim 1, further comprising a cover that is installed near a tip of the second pipe in the processing chamber and that collides with compressed air discharged from the second pipe. 4. Processing equipment. While moving the substrate in the processing chamber,
The processing liquid is supplied from the processing liquid tank storing the processing liquid to the nozzle provided in the processing chamber, and the processing liquid is discharged from the nozzle to the substrate.
Collect the processing liquid discharged from the nozzle to the substrate and return it to the processing liquid tank.
It has a suction port, a discharge port, and a compressed air introduction port, flows compressed air from the compressed air introduction port to the discharge port, and sucks from the suction port due to a pressure difference generated between the suction port and the discharge port. Using an ejector that discharges from the discharge port with compressed air,
Connect the first pipe to the suction port of the ejector,
Connect the second pipe to the ejector outlet,
Supply compressed air to the compressed air inlet of the ejector,
The bubbles of the processing liquid accumulated in the processing chamber are sucked from the suction port of the ejector through the first pipe, and the sucked processing liquid bubbles are crushed and liquefied by the pressure of the compressed air, and the liquefied processing liquid is compressed air. In addition, a substrate processing method characterized by discharging from the discharge port of the ejector into the processing chamber through the second pipe.   A suction hood having an opening wider than the inner diameter of the first pipe is installed at a position higher than the liquid level of the processing liquid accumulated in the processing chamber in the processing chamber, and is connected to the first pipe. The substrate processing method according to claim 4.   The substrate processing method according to claim 4 or 5, wherein a cover with which the compressed air discharged from the second pipe collides is installed in the vicinity of the tip of the second pipe in the processing chamber.   A method for manufacturing a display panel substrate, wherein the substrate is processed using the substrate processing apparatus according to claim 1.   A method for manufacturing a display panel substrate, wherein the substrate is processed using the substrate processing method according to claim 4.

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