JP4291197B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP4291197B2 JP4291197B2 JP2004111926A JP2004111926A JP4291197B2 JP 4291197 B2 JP4291197 B2 JP 4291197B2 JP 2004111926 A JP2004111926 A JP 2004111926A JP 2004111926 A JP2004111926 A JP 2004111926A JP 4291197 B2 JP4291197 B2 JP 4291197B2
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- 239000004065 semiconductor Substances 0.000 title claims description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 229910052738 indium Inorganic materials 0.000 claims description 54
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 48
- 229910052710 silicon Inorganic materials 0.000 claims description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 46
- 239000010703 silicon Substances 0.000 claims description 46
- 238000009792 diffusion process Methods 0.000 claims description 36
- 229910021341 titanium silicide Inorganic materials 0.000 claims description 26
- 229910052796 boron Inorganic materials 0.000 claims description 23
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 21
- 239000010936 titanium Substances 0.000 claims description 21
- 238000002513 implantation Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 229910052719 titanium Inorganic materials 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000001133 acceleration Effects 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 238000005468 ion implantation Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 53
- 239000002184 metal Substances 0.000 description 53
- 230000004888 barrier function Effects 0.000 description 19
- 239000013078 crystal Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 239000003870 refractory metal Substances 0.000 description 12
- 229910052721 tungsten Inorganic materials 0.000 description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 229910021332 silicide Inorganic materials 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000002003 electron diffraction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/02—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels
- B24B31/023—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving rotary barrels with tiltable axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
- H01L21/743—Making of internal connections, substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Description
前記高融点金属とシリコンとの化合物結晶が前記コンタクトプラグから突出して形成されていることを特徴としている。
12:素子分離領域
13:ゲート電極
14:p型高濃度拡散層(p+拡散層)
15:絶縁膜
16:上部配線層
17:コンタクト孔
18:コンタクトメタル層
19:バリアメタル層
20:タングステン層
21:コンタクトプラグ
22:コンタクト孔
23:コンタクトメタル層
24:バリアメタル層
25:タングステン層
26:ビアプラグ
27:p型不純物添加層
28:インジウム注入層
29:チタンシリサイド層
30:酸化シリコン層
Claims (7)
- シリコン基板の表面領域にホウ素を含む不純物を注入して第1のP型拡散層を形成する工程と、
前記シリコン基板上に絶縁膜を形成する工程と、
前記絶縁膜にコンタクトホールを開口し、前記第1のP型拡散層の一部を露出させる工程と、
前記コンタクトホールからインジウムの注入を行い、該コンタクトホールの底部にインジウム注入層を形成する工程と、
少なくとも前記コンタクトホール底部にチタン膜を形成する工程と、
熱処理を行うことによって前記チタン膜と前記シリコン基板の反応を起こし、前記コンタクトホールの下方領域にのみ、略球状又は半球状のチタンシリサイド層の突出部を形成する工程と、
を有することを特徴とする半導体装置の製造方法。 - 前記チタンシリサイドの突出部の長さは50nm以上であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記コンタクトホールの開口形成後に、ホウ素を含む不純物の注入を行い、前記コンタクトホールの底部に第2のP型拡散層を形成する工程を有することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記インジウム注入層を形成する工程の後に、800℃以上の温度で熱処理を行い、その後に、前記チタン膜を形成する工程を有することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記インジウム注入層を形成する際のイオン注入の加速エネルギーが、40〜120KeVの範囲であることを特徴とする請求項1乃至4のいずれか1項に記載の半導体装置の製造方法。
- シリコン基板の表面領域に形成され、不純物としてホウ素を含むP型拡散層と、前記シリコン基板上に形成した絶縁膜と、前記絶縁膜中に形成され、前記P型拡散層と接触しているコンタクトプラグとを備える半導体装置であって、
前記P型拡散層内における前記コンタクトプラグの下方領域にはインジウム注入層が形成されており、前記インジウム注入層の形成された部分には、前記シリコンプラグ底部から略球状又は半球状のチタンシリサイドの突出層が形成されていることを特徴とする半導体装置。 - 前記チタンシリサイドの突出層は、前記コンタクトプラグの底面から前記突出層の先端までの長さが50nm以上であることを特徴とする請求項6に記載の半導体装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004111926A JP4291197B2 (ja) | 2004-04-06 | 2004-04-06 | 半導体装置及びその製造方法 |
DE102005015789A DE102005015789A1 (de) | 2004-04-06 | 2005-04-06 | Halbleitervorrichtung und Verfahren zur Herstellung derselben |
CNB2005100648369A CN100483629C (zh) | 2004-04-06 | 2005-04-06 | 半导体器件及其制备方法 |
TW094110860A TWI251260B (en) | 2004-04-06 | 2005-04-06 | Semiconductor device and method of manufacturing the same |
KR1020050028739A KR100725437B1 (ko) | 2004-04-06 | 2005-04-06 | 반도체 장치 및 그의 제조 방법 |
US11/099,511 US7414291B2 (en) | 2004-04-06 | 2005-04-06 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004111926A JP4291197B2 (ja) | 2004-04-06 | 2004-04-06 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005302757A JP2005302757A (ja) | 2005-10-27 |
JP4291197B2 true JP4291197B2 (ja) | 2009-07-08 |
Family
ID=35067602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004111926A Expired - Fee Related JP4291197B2 (ja) | 2004-04-06 | 2004-04-06 | 半導体装置及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7414291B2 (ja) |
JP (1) | JP4291197B2 (ja) |
KR (1) | KR100725437B1 (ja) |
CN (1) | CN100483629C (ja) |
DE (1) | DE102005015789A1 (ja) |
TW (1) | TWI251260B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4049119B2 (ja) * | 2004-03-26 | 2008-02-20 | セイコーエプソン株式会社 | 強誘電体メモリ素子の製造方法 |
JP4503627B2 (ja) * | 2007-03-29 | 2010-07-14 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
CN104347484B (zh) * | 2013-08-02 | 2019-07-26 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件以及制作半导体器件的方法 |
JP6650719B2 (ja) * | 2015-09-30 | 2020-02-19 | キヤノン株式会社 | 撮像装置、撮像システムおよび半導体装置の製造方法 |
EP4261871A1 (fr) * | 2022-04-11 | 2023-10-18 | STMicroelectronics Crolles 2 SAS | Circuit intégré comportant un pilier métallique en contact avec une région en silicium sur une région de couplage ohmique, et procédé de fabrication correspondant |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01233726A (ja) | 1988-03-14 | 1989-09-19 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPH10242077A (ja) | 1997-02-24 | 1998-09-11 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP3201318B2 (ja) | 1997-11-05 | 2001-08-20 | 日本電気株式会社 | 半導体装置の製造方法 |
EP0942460A1 (fr) * | 1998-03-13 | 1999-09-15 | STMicroelectronics SA | Procédé de formation d'une couche de siliciure de titane de faible résistivité sur un substrat semiconducteur de silicium et dispositif obtenu |
JP3666315B2 (ja) | 1999-08-26 | 2005-06-29 | 株式会社日立製作所 | 蒸気タービン発電プラントにおける低圧蒸気タービン翼の製造方法 |
KR20010065303A (ko) * | 1999-12-29 | 2001-07-11 | 박종섭 | 반도체 소자의 트랜지스터 제조방법 |
JP2003052236A (ja) | 2001-08-16 | 2003-02-25 | Mitsubishi Agricult Mach Co Ltd | コンバインの穀粒タンク |
JP4139105B2 (ja) * | 2001-12-20 | 2008-08-27 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US20040079997A1 (en) * | 2002-10-24 | 2004-04-29 | Noriyuki Miura | Semiconductor device and metal-oxide-semiconductor field-effect transistor |
KR100578212B1 (ko) * | 2003-06-30 | 2006-05-11 | 주식회사 하이닉스반도체 | 엠티피 구조의 강유전체 캐패시터 및 그 제조 방법 |
US7268065B2 (en) * | 2004-06-18 | 2007-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of manufacturing metal-silicide features |
-
2004
- 2004-04-06 JP JP2004111926A patent/JP4291197B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-06 KR KR1020050028739A patent/KR100725437B1/ko not_active IP Right Cessation
- 2005-04-06 CN CNB2005100648369A patent/CN100483629C/zh not_active Expired - Fee Related
- 2005-04-06 US US11/099,511 patent/US7414291B2/en not_active Expired - Fee Related
- 2005-04-06 TW TW094110860A patent/TWI251260B/zh not_active IP Right Cessation
- 2005-04-06 DE DE102005015789A patent/DE102005015789A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW200539280A (en) | 2005-12-01 |
TWI251260B (en) | 2006-03-11 |
DE102005015789A1 (de) | 2005-11-10 |
CN100483629C (zh) | 2009-04-29 |
CN1681089A (zh) | 2005-10-12 |
US7414291B2 (en) | 2008-08-19 |
KR100725437B1 (ko) | 2007-06-07 |
US20050230712A1 (en) | 2005-10-20 |
KR20060045538A (ko) | 2006-05-17 |
JP2005302757A (ja) | 2005-10-27 |
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