JP4290893B2 - オプトエレクトロニクス・アセンブリ - Google Patents

オプトエレクトロニクス・アセンブリ Download PDF

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Publication number
JP4290893B2
JP4290893B2 JP2000594131A JP2000594131A JP4290893B2 JP 4290893 B2 JP4290893 B2 JP 4290893B2 JP 2000594131 A JP2000594131 A JP 2000594131A JP 2000594131 A JP2000594131 A JP 2000594131A JP 4290893 B2 JP4290893 B2 JP 4290893B2
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JP
Japan
Prior art keywords
package
optical
flexure
substrate
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000594131A
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English (en)
Japanese (ja)
Other versions
JP2002535709A (ja
JP2002535709A5 (enExample
Inventor
バーディエル，ジャン−マルク
Original Assignee
ライトロジック・インコーポレーテッド
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Filing date
Publication date
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Application filed by ライトロジック・インコーポレーテッド filed Critical ライトロジック・インコーポレーテッド
Publication of JP2002535709A publication Critical patent/JP2002535709A/ja
Publication of JP2002535709A5 publication Critical patent/JP2002535709A5/ja
Application granted granted Critical
Publication of JP4290893B2 publication Critical patent/JP4290893B2/ja
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
JP2000594131A 1999-01-11 2000-01-06 オプトエレクトロニクス・アセンブリ Expired - Fee Related JP4290893B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/229,395 US6207950B1 (en) 1999-01-11 1999-01-11 Optical electronic assembly having a flexure for maintaining alignment between optical elements
US09/229,395 1999-01-11
PCT/US2000/000416 WO2000042629A1 (en) 1999-01-11 2000-01-06 An optoelectronic assembly

Publications (3)

Publication Number Publication Date
JP2002535709A JP2002535709A (ja) 2002-10-22
JP2002535709A5 JP2002535709A5 (enExample) 2007-02-22
JP4290893B2 true JP4290893B2 (ja) 2009-07-08

Family

ID=22861055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000594131A Expired - Fee Related JP4290893B2 (ja) 1999-01-11 2000-01-06 オプトエレクトロニクス・アセンブリ

Country Status (8)

Country Link
US (2) US6207950B1 (enExample)
EP (1) EP1151454B1 (enExample)
JP (1) JP4290893B2 (enExample)
AU (1) AU2722500A (enExample)
CA (1) CA2360372C (enExample)
DE (1) DE60041811D1 (enExample)
HK (1) HK1042376B (enExample)
WO (1) WO2000042629A1 (enExample)

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Also Published As

Publication number Publication date
US6586726B2 (en) 2003-07-01
EP1151454A4 (en) 2005-02-16
US6207950B1 (en) 2001-03-27
HK1042376B (en) 2009-09-11
WO2000042629A1 (en) 2000-07-20
JP2002535709A (ja) 2002-10-22
AU2722500A (en) 2000-08-01
DE60041811D1 (de) 2009-04-30
US20010017376A1 (en) 2001-08-30
HK1042376A1 (en) 2002-08-09
CA2360372A1 (en) 2000-07-20
CA2360372C (en) 2010-07-13
EP1151454A1 (en) 2001-11-07
EP1151454B1 (en) 2009-03-18

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JPH10117043A (ja) 発光素子

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