JP4283088B2 - 工作物表面加工方法 - Google Patents
工作物表面加工方法 Download PDFInfo
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- JP4283088B2 JP4283088B2 JP2003371192A JP2003371192A JP4283088B2 JP 4283088 B2 JP4283088 B2 JP 4283088B2 JP 2003371192 A JP2003371192 A JP 2003371192A JP 2003371192 A JP2003371192 A JP 2003371192A JP 4283088 B2 JP4283088 B2 JP 4283088B2
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- Japan
- Prior art keywords
- wafer
- processing
- silicon wafer
- grindstone
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
CeO2+2Si−O2−→SiO=Ce=O−Si+O2 (1)
比較例1として本発明の砥石を用いる代わりに3000番のダイヤモンド砥石を用いて加工実施例1と同じ加工を行なった。
Claims (1)
- 酸化セリウム砥粒微粒子と、炭酸またはホウ酸のいずれかの弱酸とアルカリ金属またはアルカリ土類金属から選ばれたアルカリ金属よりなる塩類、および合成樹脂よりなる砥石を、定圧あるいは定寸方式の研削加工機に取り付け、平板状のシリコンウェーハ表面に接触せしめ、水あるいはその他の加工液を使用しない乾式の条件で、砥石およびシリコンウェーハの少なくとも一方を回転させることにより、前記シリコンウェーハの表面温度を200℃以上、500℃以下の温度範囲内に保ちつつ表面加工を行なうことを特徴とするシリコンウェーハ表面加工方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003371192A JP4283088B2 (ja) | 2003-10-30 | 2003-10-30 | 工作物表面加工方法 |
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JP2003371192A JP4283088B2 (ja) | 2003-10-30 | 2003-10-30 | 工作物表面加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005136227A JP2005136227A (ja) | 2005-05-26 |
JP4283088B2 true JP4283088B2 (ja) | 2009-06-24 |
Family
ID=34647955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003371192A Expired - Fee Related JP4283088B2 (ja) | 2003-10-30 | 2003-10-30 | 工作物表面加工方法 |
Country Status (1)
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JP (1) | JP4283088B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE550144T1 (de) * | 2007-03-26 | 2012-04-15 | Tokyo Diamond Tools Mfg Co Ltd | Synthetischer schleifstein |
US8894731B2 (en) | 2007-10-01 | 2014-11-25 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
CN102076462B (zh) | 2008-07-02 | 2013-01-16 | 圣戈班磨料磨具有限公司 | 用于电子工业中的磨料切片工具 |
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2003
- 2003-10-30 JP JP2003371192A patent/JP4283088B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005136227A (ja) | 2005-05-26 |
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