JP4257679B2 - 電子ラベルおよび同製造方法 - Google Patents
電子ラベルおよび同製造方法 Download PDFInfo
- Publication number
- JP4257679B2 JP4257679B2 JP2003529527A JP2003529527A JP4257679B2 JP 4257679 B2 JP4257679 B2 JP 4257679B2 JP 2003529527 A JP2003529527 A JP 2003529527A JP 2003529527 A JP2003529527 A JP 2003529527A JP 4257679 B2 JP4257679 B2 JP 4257679B2
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- JP
- Japan
- Prior art keywords
- substrate
- conductive layer
- window
- adhesive layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
−両要素接点が導電性トラック上に直接接続によって導電性層に接続される。
−導電性層内に少なくとも一つのセグメントを形成するステップと、
−接着層内に少なくとも一つの窓を形成するステップと、
−基板内に少なくとも一つの窓を形成するステップにおいて、前記窓が電子要素を受けることを意図している前記ステップと、
−事前に作られた開口部と対応させて作るために基板上に接着層と導電性層を重畳させ積層させるステップと、
−電気回路を複数のトラックを作ることで実行し、基板の窓内に配置された電子要素のために少なくとも一つの接続表面を形成するステップと、
−基板内にこの目的のために形成された窓内に電子要素を配置し接続するステップと、
を含むことを特徴とする。
−電子要素を位置付けする前の化学手段、
−電子要素の接続(ハンダ付け、熱結合または熱圧着)中の蒸着または排気。
Claims (11)
- 少なくとも一つの薄い可撓性基板(7)と、導電性層(4)と接着層(1)を積層することによって実行され、少なくとも一つの電子要素(11)を含むカードないし電子ラベルを製造する方法であって、前記導電性層(4)が前記基板(7)の一面上に延在するアンテナを規定する複数の導電性トラックによって作られるカードないし電子ラベルの製造方法であって、
−導電性層(4)内に少なくとも一つのトラックセグメント(6)を切り抜くことによって、該導電性層(4)内に少なくとも一つの接続表面(4’)を形成するステップと、
−接着層(1)内に少なくとも一つの窓(2)を切り抜くステップと、
−基板(7)内に少なくとも一つの窓(8)を切り抜くステップにおいて、前記基板(7)の前記窓(8)が電子要素(11)を受けることを意図している前記ステップと、
−事前に前記接着層(1)内および前記基板(7)内に作られた前記窓(2)、(8)を対応させ、前記導電性層(4)内に形成された前記少なくとも一つの接続表面(4’)が該窓(2)、(8)内に配置されるように、前記基板(7)上に前記接着層(1)と前記導電性層(4)を重畳させ積層させるステップと、
−少なくとも前記アンテナを規定する複数のトラックからなる電気回路を、前記少なくとも一つの接続表面(4’)と電気的に接続させたまま、導電性層(4)内に形成するステップと、
−前記基板(7)の前記窓(8)内に電子要素(11)を配置し、当該電子要素(11)を事前に設けられた前記接続表面(4’)に接続するステップと、
を含むことを特徴とするカードないし電子ラベルの製造方法。 - 前記接着層(1)が接着フィルムで作られていることを特徴とする請求項1に記載の方法。
- 前記接着層(1)が、前記接続表面(4’)上に接着剤が付着するのを防止する、前記接着層(1)の前記窓(2)のための保護材料を伴うシルクスクリーンによって前記導電性層(4)上に設けられることを特徴とする請求項1に記載の方法。
- 前記接着層(1)が、前記接着層(1)の前記窓(2)のための保護域を伴うシルクスクリーンによって前記基板(7)上に設けられることを特徴とする請求項1に記載の方法。
- 前記電気回路の前記導電性層(4)内への形成が、前記基板(7)上に前記接着層(1)とともに積層させた導電性層(4)のスタンピング、機械的または化学的エッチングによって実行されることを特徴とする請求項1に記載の方法。
- 前記電子要素(11)の接続表面(4’)への接続がハンダ付け、導電性フィルム上への冷間または熱間導電性結合、または熱圧縮のような方法によって実行されることを特徴とする請求項1に記載の方法。
- 前記接着層(1)内および前記基板(7)内に窓(2)、(8)を切り抜くことがスタンピングによって実行されることを特徴とする請求項1に記載の方法。
- 電子要素(11)を前記電気回路に接続するために前記導電性層(4)に形成された少なくとも二つの接続表面(4’)が、前記基板(7)の窓(8)を部分的に覆って延長するように前記導電性層(4)を前記基板(7)に積層させることを特徴とする請求項1から7のいずれか1項に記載の方法。
- 電子要素(11)を前記電気回路に接続するために前記導電性層(4)に形成された少なくとも一つの第1接続表面(4’)が、前記基板(7)の窓(8)を覆って延長するように前記導電性層(4)を前記基板(7)に積層させ、前記電子要素(11)の第2の接続が前記電子要素(11)を前記導電性層(4)上のより離れた接続表面に接続するブリッジ(12、15)によって形成されていることを特徴とする請求項1から7のいずれか1項に記載の方法。
- 前記基板(7)の厚みが、最も高い電子要素(11)の高さに少なくとも等しいことを特徴とする請求項1から9のいずれか1項に記載の方法。
- 最終ステップが、積層体の両面上に絶縁材料のフィルムを積層させるこ とからなり、前記フィルムが保護および(または)マーキングの形成を許容する支持部として作用することを特徴とする請求項1から10のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH17182001 | 2001-09-18 | ||
PCT/IB2002/003953 WO2003026010A1 (fr) | 2001-09-18 | 2002-09-17 | Étiquette électronique de faible épaisseur et procédé de fabrication d'une telle étiquette |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005503625A JP2005503625A (ja) | 2005-02-03 |
JP4257679B2 true JP4257679B2 (ja) | 2009-04-22 |
Family
ID=4566019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003529527A Expired - Fee Related JP4257679B2 (ja) | 2001-09-18 | 2002-09-17 | 電子ラベルおよび同製造方法 |
Country Status (12)
Country | Link |
---|---|
US (1) | US7150406B2 (ja) |
EP (1) | EP1428258B1 (ja) |
JP (1) | JP4257679B2 (ja) |
CN (1) | CN100359682C (ja) |
AU (1) | AU2002337402B2 (ja) |
BR (1) | BRPI0212612B1 (ja) |
CA (1) | CA2460840C (ja) |
ES (1) | ES2649545T3 (ja) |
MX (1) | MXPA04002588A (ja) |
RU (1) | RU2300159C2 (ja) |
WO (1) | WO2003026010A1 (ja) |
ZA (1) | ZA200402147B (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4109039B2 (ja) * | 2002-08-28 | 2008-06-25 | 株式会社ルネサステクノロジ | 電子タグ用インレットおよびその製造方法 |
JP4066929B2 (ja) * | 2003-10-08 | 2008-03-26 | 株式会社日立製作所 | 電子装置及びその製造方法 |
FR2885718B1 (fr) * | 2005-05-11 | 2007-09-21 | Gemplus Sa | Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication |
EP1724712A1 (fr) * | 2005-05-11 | 2006-11-22 | Stmicroelectronics Sa | Micromodule, notamment pour carte à puce |
SI2036007T1 (sl) * | 2006-06-19 | 2013-05-31 | Nagraid S.A. | Postopek izdelave kartic, ki vsaka obsega elektronski modul, in vmesni izdelki |
MX2008016464A (es) * | 2006-06-19 | 2009-04-02 | Nagraid Sa | Metodo para la manufactura de tarjetas que comprende al menos un modulo electronico, montaje producido durante este metodo y productos intermedios. |
WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
AU2008217056B2 (en) * | 2007-02-09 | 2012-12-20 | Nagravision S.A. | Method for producing electronic cards including at least one printed pattern |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
GB2453765A (en) * | 2007-10-18 | 2009-04-22 | Novalia Ltd | Product packaging with printed circuit and means for preventing a short circuit |
FI121592B (fi) * | 2008-03-26 | 2011-01-31 | Tecnomar Oy | Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti |
CN101345330A (zh) * | 2008-08-25 | 2009-01-14 | 合隆科技(杭州)有限公司 | 射频天线及其制作方法 |
WO2013175261A1 (en) * | 2012-05-21 | 2013-11-28 | Linxens Holding | Interconnection substrate and method of manufacturing the same |
FR2992141B1 (fr) * | 2012-06-14 | 2015-03-20 | Microconnections Sas | Procede de realisation de circuit electronique a protection de couche conductrice |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
WO2015085086A1 (en) | 2013-12-04 | 2015-06-11 | Temptime Corporation | Condition change labels |
USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
CN110077135B (zh) * | 2019-04-23 | 2020-07-17 | 捷卡(厦门)工业科技有限公司 | 一种带窗口的标签的生产工艺 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3019207A1 (de) | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
US4727246A (en) * | 1984-08-31 | 1988-02-23 | Casio Computer Co., Ltd. | IC card |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
FR2673041A1 (fr) | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
FR2674681A1 (fr) | 1991-03-28 | 1992-10-02 | Em Microelectronic Marin Sa | Composant electronique ultramince et procede pour sa fabrication. |
US5776278A (en) * | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
DE4403513A1 (de) * | 1994-02-04 | 1995-08-10 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
JPH08316411A (ja) * | 1995-05-18 | 1996-11-29 | Hitachi Ltd | 半導体装置 |
CN1179295C (zh) * | 1997-11-14 | 2004-12-08 | 凸版印刷株式会社 | 复合ic模块及复合ic卡 |
FR2796183B1 (fr) * | 1999-07-07 | 2001-09-28 | A S K | Ticket d'acces sans contact et son procede de fabrication |
WO2001026910A1 (en) | 1999-10-08 | 2001-04-19 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and ic chip |
JP2001175829A (ja) * | 1999-10-08 | 2001-06-29 | Dainippon Printing Co Ltd | 非接触式データキャリアおよびicチップ |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
-
2002
- 2002-09-17 MX MXPA04002588A patent/MXPA04002588A/es active IP Right Grant
- 2002-09-17 AU AU2002337402A patent/AU2002337402B2/en not_active Ceased
- 2002-09-17 ES ES02772644.7T patent/ES2649545T3/es not_active Expired - Lifetime
- 2002-09-17 CN CNB028183177A patent/CN100359682C/zh not_active Expired - Fee Related
- 2002-09-17 CA CA2460840A patent/CA2460840C/en not_active Expired - Fee Related
- 2002-09-17 WO PCT/IB2002/003953 patent/WO2003026010A1/fr active Application Filing
- 2002-09-17 US US10/489,476 patent/US7150406B2/en not_active Expired - Fee Related
- 2002-09-17 RU RU2004107999/28A patent/RU2300159C2/ru not_active IP Right Cessation
- 2002-09-17 EP EP02772644.7A patent/EP1428258B1/fr not_active Expired - Lifetime
- 2002-09-17 BR BRPI0212612A patent/BRPI0212612B1/pt not_active IP Right Cessation
- 2002-09-17 JP JP2003529527A patent/JP4257679B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-17 ZA ZA2004/02147A patent/ZA200402147B/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2005503625A (ja) | 2005-02-03 |
ZA200402147B (en) | 2005-07-27 |
EP1428258A1 (fr) | 2004-06-16 |
WO2003026010A1 (fr) | 2003-03-27 |
MXPA04002588A (es) | 2004-06-18 |
CN100359682C (zh) | 2008-01-02 |
CA2460840C (en) | 2011-12-20 |
CA2460840A1 (en) | 2003-03-27 |
RU2300159C2 (ru) | 2007-05-27 |
BRPI0212612B1 (pt) | 2016-01-19 |
US7150406B2 (en) | 2006-12-19 |
US20040256466A1 (en) | 2004-12-23 |
EP1428258B1 (fr) | 2017-08-30 |
ES2649545T3 (es) | 2018-01-12 |
AU2002337402B2 (en) | 2007-08-16 |
CN1555576A (zh) | 2004-12-15 |
BR0212612A (pt) | 2004-08-17 |
RU2004107999A (ru) | 2005-05-10 |
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