JP4252343B2 - Vacuum drying apparatus and vacuum drying method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for drying by reducing the pressure of a chemical solution present on a substrate.
[0002]
[Prior art]
In manufacturing processes such as semiconductor substrates and glass substrates for liquid crystals, various chemical solutions were used, such as a process of forming a thin film by applying a resist solution to the surface of the substrate, and a process of discharging and cleaning the substrate. Processing is performed. When a process using a chemical solution is performed on a substrate, it is necessary to perform a process of removing the chemical solution from the surface of the substrate after processing. Conventionally, as an apparatus for performing such a removal process, an atmosphere under a reduced pressure is used. There has been proposed a reduced-pressure drying apparatus that holds a substrate on the substrate and volatilizes the adhering chemical solution to dry it. For example, Patent Document 1 discloses such a vacuum drying apparatus.
[0003]
In the reduced pressure drying apparatus described in Patent Document 1, a substrate to be processed is held in a processing space sealed by a member such as a chamber, and the atmosphere in the processing space is sucked by a suction device such as a vacuum pump. To do. By reducing the atmosphere around the substrate in this way, the gas density in the atmosphere around the substrate is lowered, so that the chemical solution attached to the substrate can be volatilized efficiently. The volatilized chemical solution is sucked by a vacuum pump and exhausted from the processing space to the outside of the apparatus. The chemical liquid dried and removed by such a conventional vacuum drying apparatus may be the processing liquid itself used for the substrate, or may be a liquid component (solvent component) of the processing liquid. Good. The case where the solvent component of the processing liquid is removed by drying is, for example, when a resist liquid is used as the processing liquid, and the resist film is formed by the solid component of the resist liquid remaining on the surface of the substrate as a thin film. Is formed.
[0004]
In this way, when forming a thin film on the surface of the substrate, if an air stream hits an undried substrate, a flow pattern or a wind pattern due to the air current is formed on the surface of the thin film, and the film thickness is not uniform. Therefore, in the vacuum drying apparatus, a suction port for sucking the atmosphere is provided at a position relatively far from the surface of the substrate.
[0005]
[Patent Document 1]
JP 2002-263548 A
[0006]
[Problems to be solved by the invention]
However, when the suction port is provided at a position far from the surface of the substrate (mainly on the back surface side) as in the above-described vacuum drying apparatus, a portion of the airflow stays near the surface of the substrate, and the portion volatilizes from the surface of the substrate. There was a problem that the gas component of the chemical solution was not exhausted immediately. That is, there is a problem that the gas component of the chemical solution remains at a high concentration near the surface of the substrate. As described above, when the gas component of the chemical solution remains in a high concentration in the ambient atmosphere of the substrate, the subsequent volatilization of the chemical solution is inhibited, resulting in an increase in the drying process time. Further, the remaining gas component is condensed at the time of return pressure and reattached to the substrate.
[0007]
Further, in the above-described reduced-pressure drying apparatus, it is difficult to uniformly generate an air flow in the processing space due to the distribution state of the suction ports, etc. Especially when the substrate is enlarged, the air flow stays uneven near the surface of the substrate. For this reason, there has been a problem that uneven drying of the substrate and poor drying occur.
[0008]
The present invention has been made in view of the above problems, and an object of the present invention is to reduce processing time in reduced-pressure drying while suppressing unevenness in drying and poor drying of a chemical solution attached to a substrate.
[0009]
[Means for Solving the Problems]
  In order to solve the above problems, the invention of claim 1 is a vacuum drying apparatus for drying a chemical solution existing on a substrate by decompression, wherein the decompression chamber forms a processing space for decompressing and drying the substrate, A holding table for holding the substrate in the processing space; suction means for sucking an atmosphere in the processing space; and a removing means for removing a gas component of the chemical solution from the ambient atmosphere of the substrate held on the holding table.The removing unit includes a stirring unit that generates an air flow in the processing space, and the stirring unit stirs and removes the gas component of the chemical solution from the ambient atmosphere of the substrate.
[0011]
  Claims2The invention of claim1In the reduced-pressure drying apparatus according to the invention, the stirring unit includes a rotation mechanism that generates a rotational driving force, and a fan that is rotated by the rotational driving force and generates an air flow in the processing space.
[0012]
  Claims3The invention of claim1In the vacuum drying apparatus according to the invention, the stirring unit rotates a plate-shaped member that rotates about a predetermined rotation axis, and a rotation that rotates the plate-shaped member about the predetermined rotation axis. Moving mechanism.
[0013]
  Claims4The invention ofA reduced-pressure drying apparatus that dries a chemical solution existing on a substrate under reduced pressure, a reduced-pressure chamber that forms a processing space for drying the substrate under reduced pressure, a holding table that holds the substrate in the processing space, and the processing space A suction means for sucking the atmosphere inside, and a removal means for removing a gas component of the chemical solution from the ambient atmosphere of the substrate held by the holding table,The removing means has changing means for changing a spatial volume between the main surface of the substrate and the decompression chamber by changing a relative distance between the substrate and the decompression chamber, and the changing means comprises: While the vacuum drying process is performed on the substrate, the relative distance is changed in a direction in which the space volume decreases.
[0014]
  Claims5The invention of claim4In the vacuum drying apparatus according to the invention, the changing means has an elastic member that expands and contracts according to the pressure in the processing space, the holding base is attached to the elastic member, and the elastic member is By contracting, the holding table moves in the direction of decreasing the space volume.
[0015]
  Claims6The invention of claim4In the vacuum drying apparatus according to the invention, the changing unit moves the substrate relative to the vacuum chamber, and the suction unit sucks the atmosphere in the processing space. And a control mechanism that drives and controls the moving mechanism in a direction to decrease the relative distance.
[0018]
  The invention of claim 7 is a vacuum drying method for drying a chemical solution existing on a substrate under reduced pressure, a holding step for holding the substrate in a processing space formed by a vacuum chamber, A suction process for sucking the atmosphere and in the processing space;The air flow is generated by moving the object in theAnd a stirring step of stirring the ambient atmosphere of the substrate held in the holding step.
  The invention of claim 8 is a reduced-pressure drying method for drying a chemical solution present on a substrate under reduced pressure, a holding step for holding the substrate in a processing space formed by a reduced-pressure chamber, A suction step of sucking an atmosphere, and a moving step of relatively moving the substrate and the decompression chamber in a direction to reduce the space volume between the main surface of the substrate held in the holding step and the decompression chamber And have.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
[0021]
<1. First Embodiment>
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 equipped with a reduced-pressure drying apparatus according to the present invention. The substrate processing apparatus 1 includes a transport mechanism 10 that transports a substrate while holding the substrate, an indexer 11 that receives a substrate from a transport mechanism (not shown), a coating device 12 that applies a resist solution to the substrate, and a coated resist. A vacuum drying device 13 for drying the liquid under reduced pressure, an indexer 19 for discharging the substrate to an external transport mechanism, and a control device 20 are provided. In FIG. 1, for convenience of illustration and explanation, the Z-axis direction is defined as the vertical direction, and the XY plane is defined as the horizontal plane, but these are defined for convenience in order to grasp the positional relationship. The direction is not limited. The same applies to the following figures.
[0022]
In the present embodiment, the substrate processing apparatus 1 uses a rectangular glass substrate for manufacturing a screen panel of a liquid crystal display device as the substrate to be processed 90, but the substrate processing apparatus 1 is not limited to a glass substrate for a liquid crystal display device. In general, various substrates such as a semiconductor wafer, a film liquid crystal flexible substrate, a photomask substrate, and a color filter substrate can be used.
[0023]
The transport mechanism 10 includes a plurality of transport shuttles (not shown) and transports the substrate 90 in the X-axis direction. Note that the transport mechanism 10 in the present embodiment is a so-called single-axis drive type transport mechanism, but the mechanism for transporting the substrate 90 between the apparatuses is not limited to this. For example, a transfer robot that can move the substrate 90 three-dimensionally may be used.
[0024]
The indexers 11 and 19 have an interface function for delivering the substrate 90 between the substrate processing apparatus 1 and an external transport mechanism, and rotate the substrate 90 in a horizontal plane by a rotation mechanism (not shown), thereby It also has a function to adjust
[0025]
The coating apparatus 12 holds the resist solution supplied from a resist solution supply unit (not shown) from the slit nozzle onto the surface of the substrate 90 while holding the substrate 90 transported from the indexer 11 by the transport mechanism 10 at a predetermined position. On the other hand, it is a so-called slit coater that applies a resist solution by discharging. The coating apparatus 12 in the present embodiment is configured as an apparatus for applying a resist solution to the surface of the substrate 90 in a process of selectively etching an electrode layer or the like formed on the surface of the substrate 90. Although a liquid is discharged, for example, a device for applying a color filter material or the like may be used.
[0026]
FIG. 2 is a schematic cross-sectional view of the reduced pressure drying apparatus 13 in the first embodiment. The reduced-pressure drying apparatus 13 includes a base 130 that functions as a base of each part constituting the reduced-pressure drying apparatus 13, a chamber 131 for covering the substrate 90, and a base plate 133 that holds the substrate 90. 132 is formed. In addition, although illustration is abbreviate | omitted in FIG. 2, each structure of the reduced pressure drying apparatus 13 is suitably connected with the control apparatus 20 as needed, and control by the control apparatus 20 is enabled.
[0027]
The chamber 131 is moved in the Z-axis direction by a drive mechanism (not shown). When the substrate 90 is carried in and out of the vacuum drying apparatus 13 by the transport mechanism 10, the chamber 131 moves to the transport position (not shown) by moving in the (+ Z) direction, and the transport mechanism 10 (and the transport mechanism 10) is transported. So as not to interfere with the substrate 90). Further, while the vacuum drying apparatus 13 performs the vacuum drying process on the substrate 90, the chamber 131 moves to the processing position (position shown in FIG. 2) by moving in the (−Z) direction and is in close contact with the base 130. Thus, the processing space 132 which is a sealed space is formed.
[0028]
A plurality of support pins that advance and retreat in the Z-axis direction are provided on the (+ Z) side surface of the base plate 133, and the substrate 90 is placed in the processing space 132 by the tips of the support pins coming into contact with the back surface of the substrate 90. Hold horizontally in place. Note that the base plate 133 is disposed at a predetermined position with respect to the base 130 by a support member (not shown).
[0029]
In addition to these configurations, the vacuum drying apparatus 13 further includes a suction mechanism 14 and a stirring mechanism 16.
[0030]
The suction mechanism 14 includes a vacuum pump 140 that is driven according to a control signal from the control device 20, a suction pipe 141 that serves as a flow path for guiding the sucked atmosphere, and a suction port 142 that is connected to the suction pipe 141. Composed. The suction mechanism 14 has a function of sucking the atmosphere of the processing space 132 from the suction port 142 via the suction pipe 141 by driving the vacuum pump 140. The atmosphere in the processing space 132 sucked by the suction mechanism 14 is further exhausted outside the apparatus through an exhaust pipe (not shown). 2 shows a state in which only one suction port 142 is provided in the central portion of the base 130, the vacuum drying apparatus 13 in the present embodiment has a plurality of suction ports 142. These suction ports 142 are also arranged at positions other than the central portion of the base 130.
[0031]
The agitation mechanism 16 includes a rotation motor 160 driven in accordance with a control signal from the control device 20, a drive shaft 161 that propagates a rotational driving force generated by the rotation motor 160, and a fan 162 attached to the drive shaft 161. The chamber 131 is attached at a position facing the substrate 90.
[0032]
The stirring mechanism 16 rotates the fan 162 attached to the drive shaft 161 around the axis P by driving the rotation motor 160 in accordance with a control signal from the control device 20. Since the air flow is generated in the processing space 132 due to the rotation of the fan 162, the atmosphere in the processing space 132 is agitated. In other words, the stirring mechanism 16 has a function of eliminating the stagnation of the air flow and uniformizing the atmosphere in the processing space 132 by stirring the surrounding atmosphere of the substrate 90. The stirring mechanism 16 in the present embodiment is arranged so that the position of the rotation axis P of the rotary motor 160 is near the center position of the substrate 90 held by the base plate 133 in order to uniformly stir the processing space 132. Has been.
[0033]
Returning to FIG. 1, the control device 20 is a device having a function as a general microcomputer, and mainly includes an arithmetic device (CPU), a storage device (RAM and ROM), and the like. In addition, the control device 20 is connected in a state where signals can be exchanged between each device and each component of the substrate processing apparatus 1, and operates according to a program, so that each component can be appropriately selected. Output control signals and control them. In FIG. 1, the control device 20 is illustrated outside the substrate processing apparatus 1, but the control device 20 is actually provided inside the substrate processing apparatus 1.
[0034]
The above is description of the structure and function of the substrate processing apparatus 1 in this Embodiment. Next, the operation of the substrate processing in the substrate processing apparatus 1 will be described. In the substrate processing apparatus 1, unless otherwise specified, the following operations are executed by the control device 20 controlling each device and each component.
[0035]
In the substrate processing apparatus 1, when the substrate 90 is loaded by an external conveyance mechanism (not shown), the orientation of the substrate 90 loaded by the indexer 11 is adjusted, and then the substrate 90 is conveyed to the coating apparatus 12 by the conveyance mechanism 10. Is done.
[0036]
Next, the coating device 12 applies the resist solution to the main surface of the substrate 90 by discharging the resist solution from the slit nozzle while holding the transported substrate 90 at a predetermined position. The substrate 90 coated with the resist solution is unloaded from the coating device 12 by the transport mechanism 10 and transported to the vacuum drying device 13.
[0037]
FIG. 3 is a flowchart showing the operation of the reduced pressure drying apparatus 13 in the present embodiment. In the vacuum drying apparatus 13, prior to the processing for the substrate 90, initial setting is first performed (step S11). In the initial setting, the chamber 131 is arranged at the loading position by a driving mechanism (not shown), and the support pins of the base plate 133 are in a state of being retracted into the base plate 133.
[0038]
Next, the process waits until the substrate 90 coated with the resist solution is loaded by the transport shuttle of the transport mechanism 10 (step S12). When the substrate 90 is carried in by the transport mechanism 10, the support pin of the base plate 133 is advanced in the (+ Z) direction, and the support pin is brought into contact with the back surface of the substrate 90, thereby holding the substrate 90 in a predetermined position ( Step S13). When the substrate 90 is held on the base plate 133, the transport shuttle of the transport mechanism 10 leaves the reduced pressure drying device 13.
[0039]
When the transport shuttle of the transport mechanism 10 is withdrawn, the reduced pressure drying apparatus 13 moves the chamber 131 to the processing position to form the processing space 132 (Step S14), and starts suction by the suction mechanism 14 (Step S15). Specifically, the suction mechanism 14 drives the vacuum pump 140 to suck the atmosphere of the processing space 132 from the suction port 142 through the suction pipe 141. In the reduced-pressure drying apparatus 13, the processing space 132 is formed as a sealed space, and thus the decompression of the processing space 132 is started when the suction mechanism 14 starts suction (the reduced-pressure drying processing on the substrate 90 is started). )
[0040]
When a predetermined time has elapsed since the start of the vacuum drying process, the stirring mechanism 16 drives the rotary motor 160 to start the rotation of the fan 162, thereby starting stirring by the stirring mechanism 16 (step S16). .
[0041]
As described above, in the reduced pressure drying apparatus 13, the atmosphere in the processing space 132 is stirred by the stirring mechanism 16 during the execution of the reduced pressure drying process, whereby the atmosphere having a high solvent gas component concentration is removed from the ambient atmosphere of the substrate. That is, since the gaseous component of the solvent is removed from the ambient atmosphere of the substrate 90 by reducing the concentration of the gaseous component of the solvent in the ambient atmosphere, the time required for the reduced-pressure drying process without hindering further volatilization of the solvent. Can be shortened.
[0042]
In addition, by such agitation, the gas component concentration of the volatilized solvent can be made uniform in the atmosphere around the substrate 90, so that drying unevenness and poor drying can be prevented.
[0043]
In addition, as with the vacuum drying apparatus 13 in the present embodiment, the stirring by the stirring mechanism 16 is performed after a predetermined time has elapsed from the start of the vacuum drying process and the resist solution applied to the substrate 90 has been dried to some extent. It is preferable to start. This is because coating unevenness (non-uniform film pressure) occurs when the air flow generated by stirring hits the undried resist film. In addition, in a state where the drying under reduced pressure is not sufficiently performed (a state before a predetermined time elapses), the gas component concentration of the solvent in the ambient atmosphere of the substrate 90 is low, and the necessity for stirring is low. .
[0044]
In addition, the rotation motor 160 of the stirring mechanism 16 is driven at a sufficiently low speed so as not to cause uneven coating on the resist film due to the generated airflow. Thus, even if the rotary motor 160 of the stirring mechanism 16 is rotated at a low speed, it is sufficient to eliminate the stagnation of the air current, and the vacuum drying apparatus 13 in the present embodiment can obtain the above-described effects. .
[0045]
When the processing space 132 is depressurized to a predetermined pressure, suction by the suction mechanism 14 is stopped (step S17), and further, the decompression drying process by the predetermined pressure is continued for a predetermined time, and then the stirring by the stirring mechanism 16 is performed. Is stopped (step S18).
[0046]
Next, the reduced pressure drying apparatus 13 moves the chamber 131 to the loading position (step S19), opens the processing space 132 to the atmosphere, and ends the reduced pressure drying processing of the substrate 90. In the reduced-pressure drying apparatus 13, as described above, the atmosphere in the processing space 132 is agitated by the agitation mechanism 16, so that the gas component concentration of the solvent in the ambient atmosphere of the substrate 90 is lower than that in the conventional apparatus. Has been. Therefore, it is possible to prevent the solvent from condensing and reattaching to the substrate 90 due to the double pressure (atmospheric release) accompanying the completion of the reduced pressure drying process.
[0047]
Further, when the transport shuttle of the transport mechanism 10 moves to the receiving position of the substrate 90, the reduced pressure drying apparatus 13 retracts the support pins of the base plate 133 in the (−Z) direction and delivers the substrate 90 to the transport shuttle. .
[0048]
The vacuum drying apparatus 13 waits until the substrate 90 is unloaded by the transport shuttle of the transport mechanism 10 (step S20), and then ends the processing for the substrate 90. In addition, in the substrate processing apparatus 1, in order to continue processing with respect to the other board | substrate 90 sequentially, the reduced pressure drying apparatus 13 returns to step S11, and repeats a process.
[0049]
The substrate 90 carried out from the reduced-pressure drying apparatus 13 is transferred to the indexer 19 and the orientation of the substrate 90 is adjusted according to a transfer mechanism outside the apparatus (not shown), and then the substrate processing apparatus 1 is transferred by the transfer mechanism outside the apparatus. It is carried out from.
[0050]
As described above, the vacuum drying apparatus 13 in the present embodiment stirs and removes the gaseous component of the solvent (chemical solution) from the ambient atmosphere of the substrate 90 held on the base plate 133 by the stirring mechanism 16. Accordingly, it is possible to suppress an atmosphere having a high concentration of gas components of the solvent from staying in the vicinity of the surface of the substrate 90 during execution of the reduced pressure drying process, so that the time required for the reduced pressure drying process can be shortened. In addition, when the decompression drying process is finished and the processing space 132 is opened to the atmosphere, it is possible to prevent the solvent from condensing and reattaching to the substrate 90.
[0051]
Moreover, since the gas component concentration of the solvent in the ambient atmosphere of the substrate 90 can be made uniform by the stirring mechanism 16, uneven drying and poor drying can be suppressed.
[0052]
Furthermore, since the gas component of the solvent can be removed from the ambient atmosphere of the substrate 90 by the simple stirring mechanism 16 including the rotary motor 160 and the fan 162, the apparatus configuration of the vacuum drying apparatus 13 is not complicated. The increase in cost can be suppressed.
[0053]
<2. Second Embodiment>
In the first embodiment, the example in which the atmosphere in the processing space 132 is stirred by the stirring mechanism 16 including the rotation motor 160 and the fan 162 has been described. However, the configuration of the stirring mechanism 16 includes such a member. It is not limited to the mechanism that is configured. That is, any known mechanism may be used as long as an air flow is generated by moving an object in the processing space 132 and the atmosphere around the substrate 90 is stirred by the generated air flow.
[0054]
FIG. 4 is a partial cross-sectional view showing a vacuum drying apparatus 13a of the substrate processing apparatus 1 according to the second embodiment configured based on such a principle. The same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
[0055]
Substrate processing apparatus 1 in the present embodiment is substantially the same as substrate processing apparatus 1 in the first embodiment, except that reduced-pressure drying apparatus 13a is employed as an apparatus for performing reduced-pressure drying processing on substrate 90. Has function and configuration.
[0056]
The vacuum drying apparatus 13a includes a stirring mechanism 16a as a mechanism for stirring the atmosphere in the processing space 132. The stirring mechanism 16a includes a rotation mechanism 163 and a plurality of loopers 164.
[0057]
The rotation mechanism 163 includes a rotation motor that generates a rotational driving force and a member that limits the rotation amount to a predetermined amount (both not shown), and has a function of rotating each looper 164.
[0058]
Each looper 164 includes a rectangular plate-shaped portion and a cylindrical shaft portion. The shaft portion has a cylindrical central axis as a rotation axis, and each looper 164 is attached to the chamber 131 at a predetermined interval so that the rotation axis is parallel to the Y axis. 4 shows four loopers 164, the number of loopers is not limited to this.
[0059]
Each looper 164 has a length corresponding to almost the entire width of the substrate 90 in the Y-axis direction, and has a predetermined rotation amount around the rotation axis of the shaft portion by the rotation mechanism 163 as shown in FIG. Rotate in range. That is, the rotation mechanism 163 causes each looper 164 to perform a so-called swinging motion around each rotation axis.
[0060]
The operation of the substrate processing apparatus 1 in the present embodiment having the above configuration is substantially the same as that of the substrate processing apparatus 1 in the first embodiment. However, in step S16 shown in FIG. 3, when the stirring by the stirring mechanism 16a is started, the rotation mechanism 163 rotates each looper 164 until the stirring by the stirring mechanism 16a is stopped by executing step S18. The rotation drive of each looper 164 is continued.
[0061]
As described above, when the looper 164 is rotationally driven, an air flow is generated in the processing space 132, the atmosphere in the processing space 132 is stirred, and the gas component concentration of the solvent is made uniform.
[0062]
As described above, since the atmosphere in the processing space 132 can be agitated also by the agitation mechanism 16a constituted by the rotation mechanism 163 and the plurality of loopers 164 as in the reduced pressure drying apparatus 13a in the present embodiment, The same effect as that of the first embodiment can be obtained.
[0063]
<3. Third Embodiment>
In the above embodiment, the ambient atmosphere of the substrate 90 is stirred to remove the gas component of the solvent (solution) from the ambient atmosphere. However, as a technique for removing the solvent gas component, It is not limited.
[0064]
FIG. 5 is a partial cross-sectional view showing a vacuum drying apparatus 13b of the substrate processing apparatus 1 according to the third embodiment configured based on such a principle. Note that functions and configurations similar to those of the above-described embodiment are denoted by the same reference numerals and description thereof is omitted as appropriate.
[0065]
Substrate processing apparatus 1 in the present embodiment is substantially the same as substrate processing apparatus 1 in the first embodiment, except that reduced-pressure drying apparatus 13b is employed as an apparatus for performing reduced-pressure drying processing on substrate 90. Has function and configuration.
[0066]
The reduced pressure drying apparatus 13 b in the present embodiment includes a suction mechanism 15 and a change mechanism 17.
[0067]
The suction mechanism 15 includes a vacuum pump 150, suction ports 151 and 152, and suction pipes 153 and 154, and has substantially the same function as the suction mechanism 14 in the first embodiment.
[0068]
The change mechanism 17 includes a support member 170, a fixing member 171, a stopper 172, and a telescopic member 173.
[0069]
The column member 170, which is a columnar member, is disposed in the processing space 132 in the direction along the Z axis, and its (+ Z) side end is on the back surface of the base plate 133 (opposite to the holding surface of the substrate 90). Surface) It is attached to the center. Further, the column member 170 penetrates the base 130, and an end portion on the (−Z) side is fixed to the fixing member 171. A gap is provided between the support member 170 and the base 130 without being sealed, and the processing space 132 is connected to the inside of an elastic member 173 described later.
[0070]
The fixing member 171 is fitted in a hollow portion provided in the stopper 172 at both ends in the X-axis direction, and the movement range in the Z-axis direction is limited by the stopper 172. Further, a biasing member such as a spring (not shown) is attached to the fixing member 171 and is always biased in the (−Z) direction. As a result, the fixing member 171 is disposed at the extreme end in the (−Z) direction as shown in FIG. 5 in a state where the force in the (+ Z) direction does not act. Note that when the Z-axis is in the vertical direction as in the reduced pressure drying apparatus 13b in the present embodiment, gravity is always applied to the fixed member 171 in the (−Z) direction, so the change mechanism 17 is Such a configuration may not be provided.
[0071]
The stopper 172 is disposed so as to sandwich the fixing member 171, and the relative position to the base 130 is fixed by a member (not shown). As described above, the stopper 172 functions as a guide for restricting the movement range of the fixing member 171 in the Z-axis direction and guiding the movement direction so that the fixing member 171 does not move in the X-axis and Y-axis directions. have.
[0072]
The expansion / contraction member 173 is configured by a member that can be expanded and contracted in the Z-axis direction and blocked so that gas does not enter and exit between the inside and the outside of the expansion / contraction member 173. In addition, the (+ Z) side end of the elastic member 173 is fixed to the base 130, and the (−Z) side end is fixed to the fixing member 171.
[0073]
Thereby, in the reduced pressure drying apparatus 13b, the base plate 133 is attached to the expansion / contraction member 173 via the support member 170 and the fixing member 171, and the expansion / contraction member 173 expands / contracts in the Z-axis direction. Moves in the Z-axis direction. In addition, when the fixing member 171 is at the extreme end in the (−Z) direction, the expansion / contraction member 173 is in the maximum extension state (the state shown in FIG. 5), while the fixing member 171 is at the extreme end in the (+ Z) direction. In some cases, the elastic member 173 is in a maximum contracted state.
[0074]
FIG. 6 is a diagram showing the maximum contraction state of the elastic member 173. In the vacuum drying apparatus 13b, the position of the stopper 172 is determined in advance so that the substrate 90 held by the base plate 133 does not come into contact with the chamber 131 when the elastic member 173 is in the maximum contracted state.
[0075]
Next, the operation of the substrate processing apparatus 1 in the third embodiment will be described. The substrate processing apparatus 1 in the third embodiment performs substantially the same operation as the operation of the substrate processing apparatus 1 in the above embodiment except for the operation of the reduced pressure drying device 13b.
[0076]
  Figure7These are flowcharts which show operation | movement of the reduced pressure drying apparatus 13b in 3rd Embodiment. Also in the vacuum drying apparatus 13b, initial setting is first performed (step S21), similarly to the vacuum drying apparatuses 13 and 13a in the above embodiment. At this time, the chamber 131 is previously arranged at the loading position. Moreover, since the expansion / contraction member 173 is in the maximum extension state and no force in the (+ Z) direction acts on the fixing member 171, the fixing member 171 is disposed at the extreme end in the (−Z) direction ( FIG. 5).
[0077]
Next, when the substrate 90 is carried into the reduced pressure drying apparatus 13b by the transport mechanism 10 (Yes in step S22), the support pins of the base plate 133 advance in the (+ Z) direction, and the base plate 133 holds the substrate 90 (step). S23). Subsequently, the chamber 131 is moved to the processing position (step S24), the substrate 90 is shut off from the external atmosphere, and the processing space 132 is formed (the state shown in FIG. 5 is obtained).
[0078]
When the substrate 90 is shut off from the external atmosphere and placed in a sealed state, the suction mechanism 15 starts to suck the atmosphere of the processing space 132 (step S25). Thereby, the vacuum drying process by the vacuum dryer 13b is started.
[0079]
When the reduced-pressure drying process is started in the reduced-pressure drying apparatus 13b in the present embodiment, the processing space 132 and the inside of the expansion / contraction member 173 are connected to each other, so that the internal atmosphere of the expansion / contraction member 173 is directed toward the processing space 132. Sucked. That is, as the processing space 132 is depressurized, the internal pressure of the elastic member 173 decreases, and the elastic member 173 contracts due to the action of atmospheric pressure.
[0080]
Since the expansion / contraction member 173 can be expanded / contracted mainly in the Z-axis direction, the force generated by the contraction acts on the fixed member 171 as a force in the (+ Z) direction, thereby causing the base plate 133 to move in the (+ Z) direction. Move to. That is, in the vacuum drying apparatus 13b, the base plate 133 moves in the (+ Z) direction as the processing space 132 is depressurized.
[0081]
Here, when the space between the main surface of the substrate 90 and the chamber 131 is a space D, the volume of the space D is the relative distance between the substrate 90 and the chamber 131 (the distance in the direction along the Z axis, hereinafter “ (Referred to as “distance T”) and the area of the substrate 90. Accordingly, when the decompression proceeds in the decompression drying apparatus 13b and the base plate 133 moves in the (+ Z) direction as described above, the distance T changes in the decreasing direction according to the movement distance, so the volume of the space D decreases. To do. That is, assuming that the volume of the space D at the time of starting the vacuum drying process is V0 (FIG. 5) and the volume of the space D at the time of completing the vacuum drying process is V1 (FIG. 6), V0> V1.
[0082]
Since the space D is a space in which the ambient atmosphere of the substrate 90 exists, when the volume of the space D decreases, the ambient atmosphere of the substrate 90 flows out so as to be pushed out from the entire periphery of the end portion of the substrate 90. Thereby, since the reduced pressure drying device 13b can eliminate the stay of the air current, it is possible to suppress uneven drying and poor drying.
[0083]
In addition, the ambient atmosphere having a high concentration of the gaseous component of the solvent (the ambient atmosphere in the portion where the airflow is retained) itself flows out of the space D, whereby the gaseous component of the solvent is removed from the ambient atmosphere. Therefore, inhibition of volatilization of the solvent can be suppressed, and the time required for the reduced pressure drying process can be shortened. If the distance T is suddenly reduced, the space D is in a pressurized state during that time, causing a problem such as volatilization of the solvent. However, in the reduced pressure drying apparatus 13b, the pressure reduction in the processing space 132 proceeds. Accordingly, since the distance T gradually decreases, such a phenomenon does not occur in the space D.
[0084]
When a predetermined time elapses after the suction mechanism 15 starts suctioning in step S25, suction by the suction mechanism 15 is stopped (step S26), and a reduced-pressure drying process with a constant pressure is performed. Thereafter, when a predetermined time further elapses, the reduced pressure drying apparatus 13b moves the chamber 131 to the loading position (step S27), opens the processing space 132 to the atmosphere, and ends the reduced pressure drying process.
[0085]
In the reduced pressure drying apparatus 13b, when the processing space 132 is restored, the pressure difference between the inside and the outside of the expansion / contraction member 173 is eliminated, so that the expansion / contraction member 173 is extended by the urging force of the urging member (not shown). As a result, the fixing member 171 moves to the extreme end in the (−Z) direction, so that the volume of the space D increases. That is, since the base plate 133 moves in the direction in which the ambient atmosphere of the substrate 90 is depressurized during decompression, the solvent is condensed on the surface of the substrate 90 when the ambient atmosphere is suddenly decompressed. Reattachment can be suppressed.
[0086]
When the decompression drying process is completed, the decompression drying apparatus 13b waits until the transport shuttle of the transport mechanism 10 is arranged at the receiving position of the substrate 90, and then retracts the support pins of the base plate 133 to transfer the substrate 90 to the transport mechanism 10. Pass to.
[0087]
Further, after waiting for the transport mechanism 10 to leave the reduced-pressure drying apparatus 13b (step S28), the processing for the substrate 90 is terminated. In the vacuum drying apparatus 13b in the present embodiment, when processing is performed on another substrate 90, the process returns to step S22 and is repeated.
[0088]
As described above, the vacuum drying apparatus 13b according to the third embodiment reduces the volume of the space (space D) between the substrate 90 and the chamber 131 while the vacuum drying process is performed on the substrate 90. As a result, the gaseous component of the solvent can be removed from the ambient atmosphere of the substrate 90, so that the same effect as in the above embodiment can be obtained.
[0089]
Further, since the vacuum drying apparatus 13b does not need to use a separate drive mechanism as a mechanism for removing the gaseous component of the solvent from the ambient atmosphere of the substrate 90, an increase in the cost of the apparatus can be suppressed. Further, since it is not necessary to control such a drive mechanism in the reduced-pressure drying process, the process of the control device 20 is not complicated.
[0090]
In addition, when the base plate 133 moves in a direction in which the ambient atmosphere around the substrate 90 is reduced during the decompression, the rapid decompression of the ambient atmosphere around the substrate 90 can be alleviated and the solvent is condensed on the substrate 90. Further suppression can be achieved.
[0091]
<4. Fourth Embodiment>
In the vacuum drying apparatus 13b according to the third embodiment, the volume of the space D is reduced by moving the base plate 133 due to the pressure difference between the internal space of the elastic member 173 and the outside, and the solvent is removed from the ambient atmosphere of the substrate 90. The gaseous component of is removed. However, the method of changing the volume of the space D during the vacuum drying process is not limited to this.
[0092]
FIG. 8 is a partial cross-sectional view showing a vacuum drying apparatus 13c of the substrate processing apparatus 1 according to the fourth embodiment configured based on such a principle. Note that functions and configurations similar to those of the above-described embodiment are denoted by the same reference numerals and description thereof is omitted as appropriate.
[0093]
Substrate processing apparatus 1 in the present embodiment is substantially the same as substrate processing apparatus 1 in the third embodiment, except that reduced-pressure drying apparatus 13c is employed as an apparatus for performing reduced-pressure drying processing on substrate 90. Has function and configuration.
[0094]
The reduced pressure drying apparatus 13c in the present embodiment includes a changing mechanism 17a. The change mechanism 17a is different from the change mechanism 17 in the third embodiment in that it has a drive mechanism 174 and a seal member 175 instead of the fixing member 171 and the expansion / contraction member 173.
[0095]
The drive mechanism 174 is driven by a control signal from the control device 20 and has a function of moving the base plate 133 in the Z-axis direction via the support member 170. As the drive mechanism 174 having such a function, for example, a ball screw arranged in parallel to the Z axis and a nut member fixed to the support member 170 are combined, and the ball member is rotated by a rotary motor so that the nut member is moved to Z. It can be realized using a mechanism that moves in the axial direction. As the drive mechanism 174, other known methods such as a mechanism using an air cylinder may be used. Further, the driving of the base plate 133 by the driving mechanism 174 is performed at a sufficiently low speed as in the third embodiment.
[0096]
The seal member 175 is a member for sealing the processing space 132 and the outside, and prevents the external atmosphere from flowing into the processing space 132 when the processing space 132 is decompressed by suction by the suction mechanism 15. It has a function.
[0097]
The control device 20 controls the drive of the drive mechanism 174 during the vacuum drying process. For example, when the drive mechanism 174 moves the base plate 133, control is performed so that the drive mechanism 174 does not move beyond a separation position or a proximity position preset as the position of the base plate 133. Note that the separation position is a position where the base plate 133 is shown in FIG. 8, and the position where the suction from the suction ports 151 and 152 provided in the base 130 is not hindered by the base plate 133 (the base plate 133 and the base position). 130). The proximity position is a position where the base plate 133 is moved by a predetermined distance in the (+ Z) direction from the separation position, and a sufficient interval is provided so that the substrate 90 held on the base plate 133 does not contact the chamber 131. It is a position that has been.
[0098]
Next, the operation of the reduced pressure drying device 13c in the fourth embodiment will be described. In addition, the substrate processing apparatus 1 in this Embodiment performs the operation | movement substantially the same as the substrate processing apparatus 1 in 1st Embodiment except operation | movement of the reduced pressure drying apparatus 13c.
[0099]
FIG. 9 is a flowchart showing the operation of the vacuum drying apparatus 13c. The vacuum drying apparatus 13c, like the vacuum drying apparatus 13 in the first embodiment, waits until the substrate 90 is carried in by the transport mechanism 10 after executing the initial setting (step S31) in advance (step S32). . When the substrate 90 is carried in, the base plate 133 holds the substrate 90 (step S33), and lowers the chamber 131 (step S34) to form the processing space 132, and then the suction by the suction mechanism 15 is performed. Start (step S35).
[0100]
When the reduced-pressure drying process is started in step S35, the control device 20 outputs a control signal to the drive mechanism 174 and controls the base plate 133 to move in the (+ Z) direction. Thus, when the drive mechanism 174 moves the base plate 133, the relative distance T between the substrate 90 and the chamber 131 decreases, and the volume of the space D decreases. Therefore, the atmosphere around the substrate 90 can be removed also in the vacuum drying apparatus 13c, as in the vacuum drying apparatus 13b in the third embodiment.
[0101]
Next, the reduced pressure drying device 13c performs pressure reduction by suction until a predetermined pressure is reached, and stops suction by the suction mechanism 15 when the pressure reduction is completed (step S37). In the vacuum drying apparatus 13c according to the present embodiment, when the suction by the suction mechanism 15 is stopped and the processing space 132 is in a constant pressure state, the base plate 133 swings along the Z axis when the base plate 133 reaches a close position. The drive mechanism 174 is controlled to do so (step S38).
[0102]
In the vacuum drying apparatus 13b according to the third embodiment, after the processing space 132 is in a constant pressure state, the volume of the space D does not change until the processing space 132 is opened to the atmosphere, and the airflow is retained during that time. May occur. However, the vacuum drying apparatus 13c according to the present embodiment increases or decreases the volume of the space D by swinging the base plate 133 along the Z axis even after the constant pressure state is reached, so that the substrate 90 is moved around the substrate 90. It is possible to suppress the stagnation of the airflow.
[0103]
When the predetermined processing time has elapsed, the drive mechanism 174 moves the base plate 133 to the separation position (step S39). When the movement of the base plate 133 to the separation position is completed, the chamber 131 is moved in the (+ Z) direction to release the processing space 132 to the atmosphere (step S40), and the decompression drying process is terminated. Further, after waiting for the substrate 90 to be carried out by the transport mechanism 10 (step S41), the processing is terminated.
[0104]
As described above, also in the vacuum drying apparatus 13c according to the fourth embodiment, the volume of the space D between the substrate 90 and the chamber 131 can be reduced during the vacuum drying process. The atmosphere can be removed while suppressing the stay of airflow. Therefore, the same effect as the above embodiment can be obtained.
[0105]
Further, since the volume of the space D can be changed even after the constant pressure state in the reduced pressure drying process, the stagnation of the airflow in the atmosphere around the substrate 90 can be further reduced.
[0106]
<5. Fifth embodiment>
In the substrate processing apparatus 1 in the above-described embodiment, the gas component of the solvent staying in the surrounding atmosphere of the substrate 90 is once moved in the processing space 132 during the reduced-pressure drying, and is included in the surrounding atmosphere of the substrate 90. This is intended to reduce the gas component concentration of the solvent. However, as a method for removing the gaseous component of the solvent from the ambient atmosphere of the substrate 90, a method for directly removing the ambient atmosphere by suction may be used.
[0107]
FIG. 10 is a partial cross-sectional view showing a reduced-pressure drying device 13d of the substrate processing apparatus 1 according to the fifth embodiment configured based on such a principle. Note that functions and configurations similar to those of the above-described embodiment are denoted by the same reference numerals and description thereof is omitted as appropriate.
[0108]
The substrate processing apparatus 1 according to the present embodiment has substantially the same functions and functions as those of the substrate processing apparatus 1 according to the above-described embodiment, except that the reduced-pressure drying apparatus 13d is used as an apparatus for performing a reduced-pressure drying process on the substrate 90. It has a configuration.
[0109]
The reduced-pressure drying apparatus 13d in the present embodiment includes a suction mechanism 14a and an auxiliary suction mechanism 18, and the suction mechanism 14a can be controlled to open and close the suction pipe 141 by an opening / closing valve 143. The auxiliary suction mechanism 18 includes a suction port 181, a suction pipe 182, and an opening / closing valve 183.
[0110]
As shown in FIG. 10, the suction port 181 is provided in the chamber 131 so as to face the vicinity of the center of the substrate 90 held by the base plate 133. One end of the suction pipe 182 is connected to the suction port 181 and the other end is connected to the vacuum pump 140. The opening / closing valve 183 opens and closes the suction pipe 182.
[0111]
A plurality of suction ports 181 of the auxiliary suction mechanism 18 may be provided. Further, in the reduced pressure drying apparatus 13d in the present embodiment, the suction pipe 182 is connected to the vacuum pump 140, so that the suction mechanism 14a and the auxiliary suction mechanism 18 share the vacuum pump 140. The auxiliary suction mechanism 18 may have a separate vacuum pump.
[0112]
The control device 20 in the present embodiment controls the opening / closing operation of the opening / closing valve 143 and the opening / closing valve 183.
[0113]
Next, the operation of the reduced pressure drying apparatus 13d in the fifth embodiment will be described. The substrate processing apparatus 1 in the present embodiment performs substantially the same operation as the substrate processing apparatus 1 in the first embodiment except for the operation of the reduced-pressure drying apparatus 13d, and thus the description thereof is omitted.
[0114]
FIG. 11 is a flowchart showing the operation of the vacuum drying apparatus 13d. The vacuum drying apparatus 13d, like the vacuum drying apparatus 13 in the first embodiment, waits until the substrate 90 is carried in by the transport mechanism 10 after executing the initial setting (step S51) in advance (step S52). . When the substrate 90 is loaded, the base plate 133 holds the substrate 90 (step S53), and the chamber 131 is moved in the (−Z) direction (step S54), thereby forming the processing space 132.
[0115]
Further, the controller 20 drives the vacuum pump 140 and opens the open / close valve 143 to start suction by the suction mechanism 14a (step S55). Thereby, the reduced-pressure drying process for the substrate 90 is started.
[0116]
When a predetermined time elapses after the suction by the suction mechanism 14a is started, the control device 20 opens the open / close valve 183 and starts the suction by the auxiliary suction mechanism 18 (step S56).
[0117]
As described above, the reduced-pressure drying device 13d according to the present embodiment performs suction by the auxiliary suction mechanism 18 during the reduced-pressure drying process, thereby eliminating the stagnation of the air current and sucking and removing the ambient atmosphere of the substrate 90. Can do.
[0118]
If an abrupt air flow is generated on the surface of the substrate 90 by suction while the resist film of the substrate 90 is undried, the resist film becomes non-uniform due to the influence of the air flow. Therefore, in the reduced-pressure drying apparatus 13d in the present embodiment, the control device 20 provides a time difference in the opening / closing timing of the opening / closing valve 143 and the opening / closing valve 183, the pressure reduction in the processing space 132 proceeds, and the resist film is sufficiently dried. After that, suction by the auxiliary suction mechanism 18 is performed. However, the suction by the auxiliary suction mechanism 18 is not limited to being started after the suction by the suction mechanism 14a. For example, in the case of performing gentle suction that does not affect the resist film, the auxiliary suction is performed. The suction by the mechanism 18 may be started prior to the suction by the suction mechanism 14a.
[0119]
When the pressure in the processing space 132 reaches a predetermined value, the control device 20 closes the open / close valve 143 and stops the suction by the suction mechanism 14a (step S57). Further, after the vacuum drying process is continued until a predetermined time elapses, the open / close valve 183 is closed, and the suction by the auxiliary suction mechanism 18 is stopped (step S58). Further, by moving the chamber 131 in the (−Z) direction (step S59), the processing space 132 is opened to the atmosphere, and the reduced-pressure drying process ends.
[0120]
The vacuum drying apparatus 13d in the present embodiment removes the atmosphere containing the solvent gas component at a high concentration from the ambient atmosphere of the substrate 90 by the auxiliary suction mechanism 18 during execution of the vacuum drying process. Similarly, reattachment of the solvent when the processing space 132 is opened to the atmosphere can be suppressed.
[0121]
Next, the reduced-pressure drying device 13d waits until the transport shuttle of the transport mechanism 10 is disposed at a predetermined position, and then separates the support pins of the base plate 133 from the substrate 90 and transfers the substrate 90 to the transport shuttle. Further, after waiting for the transport shuttle to leave the reduced-pressure drying device 13d (step S60), the processing for the substrate 90 is terminated.
[0122]
As described above, in the reduced pressure drying apparatus 13d according to the fifth embodiment, the auxiliary suction mechanism 18 sucks the ambient atmosphere of the substrate 90 during the execution of the reduced pressure drying process on the substrate 90, whereby the ambient atmosphere of the substrate 90 is obtained. Remove the gaseous component of the solvent. Thereby, also in the reduced pressure drying apparatus 13d in this Embodiment, the effect similar to the said embodiment can be acquired.
[0123]
Further, the auxiliary suction mechanism 18 also serves as the vacuum pump 140 provided in the suction mechanism 14a, whereby the cost of the apparatus can be reduced.
[0124]
<6. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.
[0125]
For example, in the above embodiment, the substrate transported to the vacuum drying apparatus is a substrate on which slit coating has been performed by the coating apparatus 12, but the substrate processed by the vacuum drying apparatus is not limited to this. Further, it may be a substrate coated with a chemical solution by spin coating, or a substrate after edge rinsing.
[0126]
In addition, the operation order in the substrate processing apparatus 1 is not limited to the order shown in the above-described embodiment, and may be any order as long as the same effect can be obtained.
[0127]
Further, the control by the control device 20 in the above embodiment has been described as being realized as software control in which the CPU operates by a program. However, all or a part of these may be realized as hardware control by a dedicated circuit. Good.
[0128]
Further, in the vacuum drying apparatus 13c according to the fourth embodiment, it has been described that the drive mechanism 174 is provided to move the base plate 133 in the Z-axis direction during the execution of the vacuum drying process, but for example, the vacuum drying apparatus 13c May have an adjustment mechanism for adjusting the position of the base plate 133 in the Z-axis direction when the substrate 90 is carried in and out, these adjustment mechanisms may also be used as the drive mechanism 174.
[0129]
【The invention's effect】
  Claim 1 to6In the invention described in (2), it is possible to suppress the chemical solution from reattaching to the substrate by removing the gas component of the chemical solution from the ambient atmosphere of the substrate held on the holding table. Moreover, it can suppress that volatilization of a chemical | medical solution is inhibited.
[0130]
  Claim1In the invention described in (1), the gas component concentration of the chemical solution in the ambient atmosphere of the substrate can be made uniform by stirring and removing the gas component of the chemical solution from the ambient atmosphere of the substrate. Therefore, the chemical solution can be removed from the surrounding atmosphere by reducing the concentration of the chemical solution in the surrounding atmosphere.
[0131]
  Claim2In the invention described in (1), the surrounding atmosphere can be easily agitated by including the rotation mechanism that generates the rotation driving force and the fan that rotates by the rotation driving force and generates the airflow in the processing space.
[0132]
  Claim3In the invention described in (1), the surrounding atmosphere is facilitated by having a plate-like member that rotates about a predetermined rotation axis and a rotation mechanism that rotates the plate-shaped member about the predetermined rotation axis. Can be stirred.
[0133]
  Claim4In the invention described in the above, the chemical solution is changed by changing the relative distance between the substrate and the decompression chamber in a direction in which the space volume between the substrate and the decompression chamber decreases while the decompression drying process is performed on the substrate. The atmosphere having a high gas component concentration can be moved from the periphery of the substrate, and the gas component of the chemical solution can be removed from the ambient atmosphere.
[0134]
  Claim5In the invention described in (1), the holding table is attached to an elastic member that expands and contracts according to the pressure in the processing space, and the elastic member contracts to reduce the space volume between the substrate and the decompression chamber. By moving in the direction to be moved, it is not necessary to separately provide a drive mechanism, and the surrounding atmosphere can be easily moved.
[0135]
  Claim6In the invention described in the above, as the atmosphere in the processing space is sucked by the suction means, the surrounding atmosphere is easily moved by driving and controlling the moving mechanism in a direction that reduces the relative distance between the substrate and the decompression chamber. be able to.
[0138]
  According to the seventh aspect of the present invention, the gas component concentration of the chemical solution in the ambient atmosphere of the substrate can be made uniform by stirring and removing the gas component of the chemical solution from the ambient atmosphere of the substrate. Therefore, it is possible to suppress the chemical liquid from reattaching to the substrate, and it is possible to suppress the volatilization of the chemical liquid from being inhibited.
  Claim8In the invention described in the above, an atmosphere having a high gas component concentration of the chemical solution is obtained by relatively moving the substrate and the decompression chamber in a direction to reduce the space volume between the main surface of the substrate and the decompression chamber. The gas component of the chemical solution can be removed from the ambient atmosphere.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 equipped with a reduced-pressure drying apparatus according to the present invention.
FIG. 2 is a partial cross-sectional view showing a vacuum drying apparatus according to the first embodiment.
FIG. 3 is a flowchart showing the operation of the vacuum drying apparatus according to the second embodiment.
FIG. 4 is a partial cross-sectional view showing a reduced pressure drying apparatus according to a second embodiment.
FIG. 5 is a partial cross-sectional view showing a reduced pressure drying apparatus according to a third embodiment.
FIG. 6 is a diagram showing a maximum contracted state of the elastic member.
FIG. 7 is a flowchart showing the operation of the vacuum drying apparatus.
FIG. 8 is a partial cross-sectional view showing a reduced pressure drying apparatus according to a fourth embodiment.
FIG. 9 is a flowchart showing the operation of the vacuum drying apparatus.
FIG. 10 is a partial cross-sectional view showing a reduced pressure drying apparatus according to a fifth embodiment.
FIG. 11 is a flowchart showing the operation of the vacuum drying apparatus.
[Explanation of symbols]
1 Substrate processing equipment
13, 13a, 13b, 13c, 13d Vacuum dryer
131 chamber
132 processing space
133 Base plate (holding base)
14, 14a, 15 Suction mechanism
16, 16a stirring mechanism
160 Rotating motor (Rotating mechanism)
162 fans
163 Rotating mechanism
164 Looper (plate member)
17, 17a Change mechanism
173 Elastic member
174 Drive mechanism (moving mechanism)
18 Auxiliary suction mechanism
20 Control device
90 substrates
D space
T distance

Claims (8)

A vacuum drying apparatus for drying a chemical solution present on a substrate under reduced pressure,
A decompression chamber that forms a processing space for drying the substrate under reduced pressure;
A holding table for holding a substrate in the processing space;
Suction means for sucking the atmosphere in the processing space;
Removing means for removing a gas component of the chemical solution from the ambient atmosphere of the substrate held by the holding table;
Equipped with a,
The removing means is
A stirring means for generating an air flow in the processing space;
The stirring means is
A reduced-pressure drying apparatus that stirs and removes the gas component of the chemical solution from the atmosphere around the substrate . The vacuum drying apparatus according to claim 1,
The stirring means is
A rotation mechanism that generates a rotational driving force;
A fan that rotates by the rotational driving force and generates an air flow in the processing space;
A reduced-pressure drying apparatus comprising: The vacuum drying apparatus according to claim 1,
The stirring means is
A plate-like member that rotates about a predetermined rotation axis;
A rotation mechanism for rotating the plate-shaped member around the predetermined rotation axis;
A reduced-pressure drying apparatus comprising: A vacuum drying apparatus for drying a chemical solution present on a substrate under reduced pressure,
A decompression chamber that forms a processing space for drying the substrate under reduced pressure;
A holding table for holding a substrate in the processing space;
Suction means for sucking the atmosphere in the processing space;
Removing means for removing a gas component of the chemical solution from the ambient atmosphere of the substrate held by the holding table;
With
The removing means is
Changing means for changing a spatial volume between the main surface of the substrate and the decompression chamber by changing a relative distance between the substrate and the decompression chamber;
The changing means is
A reduced-pressure drying apparatus that changes the relative distance in a direction in which the space volume decreases while a reduced-pressure drying process is performed on the substrate. The vacuum drying apparatus according to claim 4,
The changing means is
It has an elastic member that expands and contracts according to the pressure in the processing space,
The reduced-pressure drying apparatus, wherein the holding table is attached to the elastic member, and the holding table moves in a direction to reduce the space volume when the elastic member contracts. The vacuum drying apparatus according to claim 4,
The changing means is
A moving mechanism for moving the substrate relative to the decompression chamber;
A control mechanism that drives and controls the moving mechanism in a direction that reduces the relative distance as the atmosphere in the processing space is sucked by the suction means;
A reduced-pressure drying apparatus comprising: A vacuum drying method for drying a chemical solution present on a substrate under reduced pressure,
A holding step of holding the substrate in a processing space formed by the decompression chamber;
A suction step of sucking the atmosphere in the processing space;
Said processing to generate an airflow by moving the Oite object in the space, the air stream which is generated, a stirring step of stirring the atmosphere around the substrate held in said holding step,
A reduced-pressure drying method comprising: A vacuum drying method for drying a chemical solution present on a substrate under reduced pressure,
A holding step of holding the substrate in a processing space formed by the decompression chamber;
A suction step of sucking the atmosphere in the processing space;
A moving step of relatively moving the substrate and the decompression chamber in a direction to reduce a space volume between the main surface of the substrate held in the holding step and the decompression chamber;
A reduced-pressure drying method comprising:

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