JP2004296661A - Reduced pressure drying apparatus and reduced pressure drying method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress irregularities and fails in the drying of chemical liquid adhering to a substrate, and to shorten a treatment time in reduced pressure drying. <P>SOLUTION: Suction and stirring mechanisms 14, 16 are provided in a reduced pressure drying apparatus 13 for allowing the chemical liquid adhering to the substrate 90 subjected to reduced pressure drying. When reduced pressure treatment is applied to the substrate 90, the suction mechanism 14 sucks an atmosphere in a treatment space 132 for reducing pressure in the treatment space 132. After a specific time elapses, the stirring mechanism 16 stirs the atmosphere around the substrate 90, thus canceling the residence of an air current formed on the surface of the substrate 90, and stirring and eliminating the atmosphere, where the gas constituent concentration of the chemical liquid is high, from the atmosphere around the substrate 90. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a technique for drying a chemical solution present on a substrate under reduced pressure.
[0002]
[Prior art]
In the manufacturing process of a semiconductor substrate or a glass substrate for liquid crystal, various chemical liquids are used, for example, a process of forming a thin film by applying a resist liquid on the surface of the substrate, or a process of discharging a cleaning liquid onto the substrate to perform cleaning. Processing is performed. When a process using a chemical solution is performed on a substrate, it is necessary to perform a process of removing the chemical solution from the surface of the substrate after the process. Conventionally, as an apparatus for performing such a removal process, a device under a reduced pressure atmosphere is used. There has been proposed a reduced-pressure drying apparatus that holds a substrate on a substrate and volatilizes the attached chemical solution to dry and remove the substrate. For example, such a reduced-pressure drying device is described in Patent Document 1.
[0003]
In the reduced-pressure drying apparatus described in Patent Document 1, a substrate to be processed is held in a processing space sealed by a member such as a chamber, and the atmosphere in the processing space is suctioned by a suction device such as a vacuum pump to reduce the pressure. I do. By reducing the pressure in the atmosphere around the substrate in this way, the gas density in the atmosphere around the substrate decreases, so that the chemical solution attached to the substrate can be volatilized efficiently. The volatilized chemical is sucked by a vacuum pump and exhausted from the processing space to the outside of the apparatus. The chemical liquid dried and removed by such a conventional reduced pressure drying apparatus may be the processing liquid used for the substrate itself or a liquid component (solvent component) of the processing liquid. Good. The case where the solvent component of the processing liquid is removed by drying means, for example, when a resist liquid is used as the processing liquid, and the solid component of the resist liquid remains as a thin film on the surface of the substrate to form a resist film. Is formed.
[0004]
As described above, when a thin film is formed on the surface of a substrate, when an airflow hits an undried substrate, ripples or wind ripples are formed on the surface of the thin film due to the airflow, and the thickness of the thin film is uneven. Therefore, in the vacuum drying apparatus, a suction port for sucking the atmosphere is provided at a position relatively far from the surface of the substrate.
[0005]
[Patent Document 1]
JP-A-2002-263548
[0006]
[Problems to be solved by the invention]
However, when the suction port is provided at a position far away from the surface of the substrate (mainly on the back side) as in the above-described vacuum drying apparatus, a stagnant portion of the airflow is generated near the surface of the substrate, and the portion volatilizes from the surface of the substrate. There is a problem that the gaseous component of the chemical solution is not immediately exhausted. That is, there is a problem that the gas component of the chemical solution remains at a high concentration near the surface of the substrate. As described above, when the gas component of the chemical solution remains at a high concentration in the atmosphere around the substrate, the volatilization of the subsequent chemical solution is inhibited, and as a result, the drying process time is lengthened. Further, the remaining gas components are condensed at the time of restoring pressure and adhere to the substrate again.
[0007]
Further, in the vacuum drying apparatus, it is difficult to uniformly generate an airflow in the processing space due to the distribution state of the suction ports and the like, and particularly when the substrate is enlarged, unevenness of the airflow is generated near the surface of the substrate. Therefore, there is a problem that drying unevenness and drying failure of the substrate occur.
[0008]
The present invention has been made in view of the above problems, and has as its object to reduce processing time in reduced-pressure drying while suppressing drying unevenness and poor drying of a chemical solution attached to a substrate.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 is a reduced-pressure drying apparatus for drying a chemical solution present on a substrate under reduced pressure, wherein a reduced-pressure chamber forming a processing space for drying the substrate under reduced pressure; A holding table for holding the substrate in the processing space; a suction unit for sucking an atmosphere in the processing space; and a removing unit for removing a gas component of the chemical solution from a surrounding atmosphere of the substrate held by the holding table. .
[0010]
Further, the invention according to claim 2 is the reduced-pressure drying apparatus according to claim 1, wherein the removing means has a stirring means for generating an air flow in the processing space, and the stirring means is provided on the substrate. The gas component of the chemical solution is removed by stirring from the surrounding atmosphere.
[0011]
The invention according to claim 3 is the reduced-pressure drying apparatus according to claim 2, wherein the stirring means is rotated by the rotation mechanism for generating a rotational driving force, and is rotated by the rotational driving force. And a fan for generating airflow.
[0012]
The invention according to claim 4 is the reduced-pressure drying apparatus according to claim 2, wherein the agitating means comprises: a plate-shaped member that rotates around a predetermined rotation axis; A rotation mechanism for rotating around a predetermined rotation axis.
[0013]
Further, the invention of claim 5 is the reduced-pressure drying apparatus according to the invention of claim 1, wherein the removing means changes a relative distance between the substrate and the reduced-pressure chamber, thereby removing a main surface of the substrate. Changing means for changing a space volume between the pressure reducing chamber and the pressure changing chamber, wherein the changing means changes the relative distance in a direction in which the space volume decreases while a reduced pressure drying process is performed on the substrate. Let it.
[0014]
Further, the invention of claim 6 is the reduced-pressure drying apparatus according to the invention of claim 5, wherein the changing means has an elastic member that expands and contracts according to the pressure in the processing space, and the holding table is The holding table is attached to a telescopic member, and when the telescopic member contracts, the holding table moves in a direction to decrease the space volume.
[0015]
Further, the invention of claim 7 is the reduced-pressure drying apparatus according to the invention of claim 5, wherein the changing means comprises a moving mechanism for moving the substrate relatively to the decompression chamber, and the suction means. A control mechanism that drives and controls the moving mechanism in a direction to decrease the relative distance as the atmosphere in the processing space is sucked.
[0016]
The invention of claim 8 is the reduced-pressure drying apparatus according to the invention of claim 1, wherein the removing means has an auxiliary suction means for sucking an atmosphere in the processing space, and the auxiliary suction means has It is provided near a position facing the center of the main surface of the substrate, and sucks an atmosphere around the substrate.
[0017]
A ninth aspect of the present invention is the reduced-pressure drying apparatus according to the eighth aspect of the present invention, wherein the auxiliary suction unit starts the suction after a predetermined time has elapsed from the start of the suction by the suction unit. I do.
[0018]
The invention according to claim 10 is a reduced-pressure drying method for drying a chemical solution present on a substrate under reduced pressure, comprising: a holding step of holding a substrate in a processing space formed by a reduced-pressure chamber; A suction step of sucking an atmosphere, and a moving step of relatively moving the substrate and the decompression chamber in a direction to reduce a space volume between the main surface of the substrate held in the holding step and the decompression chamber. And
[0019]
An eleventh aspect of the present invention is a reduced-pressure drying method for drying a chemical solution present on a substrate under reduced pressure, comprising: a holding step of holding a substrate in a processing space formed by a reduced-pressure chamber; A suction step of sucking an atmosphere, and an auxiliary suction step of sucking an atmosphere around the substrate from near a position opposed to a central portion of the main surface of the substrate held in the holding step, wherein the auxiliary suction step is , After the start of the suction step.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0021]
<1. First Embodiment>
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 equipped with a reduced-pressure drying apparatus according to the present invention. The substrate processing apparatus 1 includes a transport mechanism 10 for transporting a substrate while holding the substrate between the apparatuses, an indexer 11 for receiving a substrate from a transport mechanism outside the apparatus (not shown), a coating apparatus 12 for coating a substrate with a resist solution, a coated resist. The apparatus includes a reduced-pressure drying device 13 for drying the liquid under reduced pressure, an indexer 19 for discharging the substrate to an external transport mechanism, and a control device 20. In FIG. 1, for convenience of illustration and description, the Z-axis direction is defined as a vertical direction, and the XY plane is defined as a horizontal plane. However, they are defined for convenience in order to grasp the positional relationship. The direction is not limited. The same applies to the following figures.
[0022]
In the present embodiment, the substrate processing apparatus 1 uses a square glass substrate for manufacturing a screen panel of a liquid crystal display device as the substrate to be processed 90. However, the substrate processing apparatus 1 is not limited to a glass substrate for a liquid crystal display device. In general, various substrates such as a semiconductor wafer, a flexible substrate for a film liquid crystal, a substrate for a photomask, and a substrate for a color filter can be used.
[0023]
The transport mechanism 10 includes a plurality of transport shuttles (not shown), and transports the substrate 90 in the X-axis direction. Note that the transport mechanism 10 in the present embodiment is a so-called one-axis drive type transport mechanism, but the mechanism for transporting the substrate 90 between the devices is not limited to this. For example, a transport robot that can move the substrate 90 three-dimensionally may be used.
[0024]
The indexers 11 and 19 have an interface function of transferring the substrate 90 between the substrate processing apparatus 1 and an external transfer mechanism. The indexers 11 and 19 rotate the substrate 90 in a horizontal plane by a rotation mechanism (not shown), thereby It also has the function of adjusting.
[0025]
The coating apparatus 12 holds the substrate 90 transported from the indexer 11 by the transport mechanism 10 at a predetermined position, and applies the resist liquid supplied from the resist liquid supply unit (not shown) to the surface of the substrate 90 from the slit nozzle. This is a so-called slit coater in which a resist solution is applied by ejecting the resist solution. Note that the coating device 12 in the present embodiment is configured as a device for coating a resist liquid on the surface of the substrate 90 in a process of selectively etching an electrode layer or the like formed on the surface of the substrate 90. Although the liquid is discharged, an apparatus for applying a material for a color filter, for example, may be used.
[0026]
FIG. 2 is a schematic sectional view of the reduced-pressure drying device 13 according to the first embodiment. The reduced-pressure drying device 13 includes a base 130 functioning as a base of each unit constituting the reduced-pressure drying device 13, a chamber 131 for covering the substrate 90, and a base plate 133 for holding the substrate 90. 132 is formed. Although not shown in FIG. 2, each component of the reduced-pressure drying device 13 is appropriately connected to the control device 20 as necessary, and can be controlled by the control device 20.
[0027]
The chamber 131 is moved in the Z-axis direction by a driving mechanism (not shown). When the substrate 90 is carried in and out of the reduced-pressure drying device 13 by the carrying mechanism 10, the chamber 131 moves to the carrying-in position (not shown) by moving in the (+ Z) direction, and is moved to the carrying mechanism 10 (and carried by the carrying mechanism 10). So as not to interfere with the substrate 90). Further, while the reduced-pressure drying device 13 performs the reduced-pressure drying process on the substrate 90, the chamber 131 moves to the processing position (the position shown in FIG. 2) by moving in the (−Z) direction, and is in close contact with the base 130. Thus, the processing space 132, which is a closed space, is formed.
[0028]
A plurality of support pins that advance and retreat in the Z-axis direction are provided on the (+ Z) side surface of the base plate 133, and the tips of the support pins abut on the back surface of the substrate 90 to move the substrate 90 into the processing space 132. Hold horizontally at a predetermined position. The base plate 133 is arranged at a predetermined position with respect to the base 130 by a support member (not shown).
[0029]
The vacuum drying device 13 further includes a suction mechanism 14 and a stirring mechanism 16 in addition to these components.
[0030]
The suction mechanism 14 is connected to a vacuum pump 140 driven in accordance with a control signal from the control device 20, a suction pipe 141 serving as a flow path for guiding the sucked atmosphere, and a suction port 142 to which the suction pipe 141 is connected. Be composed. The suction mechanism 14 has a function of driving the vacuum pump 140 to suck the atmosphere in the processing space 132 from the suction port 142 via the suction pipe 141. The atmosphere in the processing space 132 sucked by the suction mechanism 14 is further exhausted to the outside of the apparatus via an exhaust pipe (not shown). FIG. 2 illustrates a state in which only one suction port 142 is provided at the center of the base 130. However, the reduced-pressure drying device 13 in the present embodiment has a plurality of suction ports 142. The suction ports 142 are also arranged at positions other than the center of the base 130.
[0031]
The stirring mechanism 16 includes a rotation motor 160 driven in accordance with a control signal from the control device 20, a drive shaft 161 for transmitting a rotation driving force generated by the rotation motor 160, and a fan 162 attached to the drive shaft 161. , In a position facing the substrate 90 in the chamber 131.
[0032]
The stirring mechanism 16 drives the rotation motor 160 in response to a control signal from the control device 20 to rotate the fan 162 attached to the drive shaft 161 about the axis P. Since the rotation of the fan 162 generates an airflow in the processing space 132, the atmosphere in the processing space 132 is stirred. That is, the stirring mechanism 16 has a function of stirring the surrounding atmosphere of the substrate 90 to eliminate the stagnation of the airflow and to make the atmosphere in the processing space 132 uniform. Note that the stirring mechanism 16 in the present embodiment is arranged such that the position of the rotation axis P of the rotation motor 160 is near the center position of the substrate 90 held on the base plate 133 in order to stir the processing space 132 uniformly. Have been.
[0033]
Returning to FIG. 1, the control device 20 is a device having a function as a general microcomputer, and mainly includes an arithmetic device (CPU) and a storage device (RAM and ROM). Further, the control device 20 is connected in a state where signals can be exchanged between each device and each component of the substrate processing apparatus 1, and operates according to a program to appropriately control each component. Output control signals and control them. Although the control device 20 is shown outside the substrate processing apparatus 1 in FIG. 1, the control device 20 is actually provided inside the substrate processing apparatus 1.
[0034]
The above is the description of the configuration and functions of the substrate processing apparatus 1 according to the present embodiment. Next, the operation of substrate processing in the substrate processing apparatus 1 will be described. In the substrate processing apparatus 1, the following operations are executed by the control device 20 controlling each device and each component unless otherwise specified.
[0035]
In the substrate processing apparatus 1, when the substrate 90 is loaded by an external transport mechanism (not shown), the orientation of the loaded substrate 90 is adjusted by the indexer 11, and then the substrate 90 is transported to the coating apparatus 12 by the transport mechanism 10. Is done.
[0036]
Next, the coating device 12 applies the resist liquid to the main surface of the substrate 90 by discharging the resist liquid from the slit nozzle while holding the transported substrate 90 at a predetermined position. The substrate 90 coated with the resist liquid is carried out of the coating device 12 by the transport mechanism 10 and transported to the reduced-pressure drying device 13.
[0037]
FIG. 3 is a flowchart showing the operation of the reduced-pressure drying device 13 in the present embodiment. In the reduced-pressure drying device 13, initial settings are first performed before processing the substrate 90 (step S11). In the initial setting, the chamber 131 is arranged at the loading position by a driving mechanism (not shown), and the support pins of the base plate 133 are retracted into the base plate 133.
[0038]
Next, the process waits until the substrate 90 coated with the resist liquid is carried in by the transport shuttle of the transport mechanism 10 (step S12). When the substrate 90 is carried in by the transport mechanism 10, the support pins of the base plate 133 are advanced in the (+ Z) direction, and the support pins are brought into contact with the back surface of the substrate 90, thereby holding the substrate 90 at a predetermined position ( Step S13). When the substrate 90 is held on the base plate 133, the transport shuttle of the transport mechanism 10 exits from the vacuum drying device 13.
[0039]
When the transport shuttle of the transport mechanism 10 exits, the reduced-pressure drying device 13 moves the chamber 131 to the processing position to form a processing space 132 (step S14), and starts suction by the suction mechanism 14 (step S15). Specifically, the suction mechanism 14 drives the vacuum pump 140 to suction the atmosphere in the processing space 132 from the suction port 142 via the suction pipe 141. In the reduced-pressure drying device 13, the processing space 132 is formed as a closed space. Therefore, the suction of the suction mechanism 14 starts to reduce the pressure in the processing space 132 (the reduced-pressure drying process for the substrate 90 starts). Is done).
[0040]
When a predetermined time has elapsed since the start of the reduced-pressure drying process, the stirring mechanism 16 drives the rotation motor 160 to start the rotation of the fan 162, thereby starting stirring by the stirring mechanism 16 (step S16). .
[0041]
As described above, in the reduced-pressure drying device 13, by stirring the atmosphere in the processing space 132 by the stirring mechanism 16 during the execution of the reduced-pressure drying process, the atmosphere in which the gas component concentration of the solvent is high is removed from the surrounding atmosphere of the substrate by stirring. In other words, by reducing the concentration of the gaseous component of the solvent in the surrounding atmosphere, the gaseous component of the solvent is removed from the surrounding atmosphere of the substrate 90. Can be shortened.
[0042]
In addition, since the concentration of the gas component of the volatilized solvent can be made uniform in the atmosphere around the substrate 90 by such stirring, uneven drying and poor drying can be prevented.
[0043]
Note that, like the reduced-pressure drying device 13 in the present embodiment, the stirring by the stirring mechanism 16 is performed after a predetermined time has elapsed since the start of the reduced-pressure drying process and after the resist liquid applied to the substrate 90 has dried to some extent. It is preferable to start. This is because, when the airflow generated by the stirring hits the undried resist film, application unevenness (uneven film pressure) occurs. Further, in a state where the reduced-pressure drying process is not sufficiently performed (a state before a predetermined time has elapsed), the concentration of the gas component of the solvent in the atmosphere around the substrate 90 is low, and the necessity of stirring is low. .
[0044]
In addition, the rotation motor 160 of the stirring mechanism 16 is driven at a sufficiently low rotation speed so as not to cause coating unevenness on the resist film due to the generated air current. Thus, even if the rotation motor 160 of the stirring mechanism 16 is rotated at a low speed, it is enough to eliminate the stagnation of the airflow, and the reduced-pressure drying device 13 in the present embodiment can obtain the above-described effects. .
[0045]
When the pressure in the processing space 132 is reduced to a predetermined pressure, the suction by the suction mechanism 14 is stopped (step S17). Further, after the reduced-pressure drying process at the predetermined pressure is continued for a predetermined time, the stirring by the stirring mechanism 16 is performed. Is stopped (step S18).
[0046]
Next, the reduced-pressure drying device 13 moves the chamber 131 to the loading position (Step S19), opens the processing space 132 to the atmosphere, and ends the reduced-pressure drying process for the substrate 90. In the reduced-pressure drying device 13, as described above, since the atmosphere in the processing space 132 is stirred by the stirring mechanism 16, the concentration of the solvent gas component in the surrounding atmosphere of the substrate 90 is lower than in the conventional device. Have been. Therefore, it is possible to suppress the solvent from condensing and re-adhering to the substrate 90 due to the double pressure (open to the atmosphere) accompanying the end of the reduced-pressure drying process.
[0047]
Further, when the transport shuttle of the transport mechanism 10 moves to the receiving position of the substrate 90, the reduced-pressure drying device 13 causes the support pins of the base plate 133 to retreat in the (-Z) direction and transfers the substrate 90 to the transport shuttle. .
[0048]
The reduced-pressure drying device 13 waits until the substrate 90 is unloaded by the transport shuttle of the transport mechanism 10 (Step S20), and ends the processing on the substrate 90. In addition, in the substrate processing apparatus 1, since the processing is sequentially continued on another substrate 90, the reduced-pressure drying apparatus 13 returns to step S11 and repeats the processing.
[0049]
The substrate 90 carried out of the reduced-pressure drying device 13 is transported to the indexer 19, the orientation of the substrate 90 is adjusted according to a transport mechanism (not shown) outside the device, and then the substrate processing apparatus 1 is transported by the transport mechanism outside the device. It is carried out from.
[0050]
As described above, the reduced-pressure drying device 13 in the present embodiment stirs and removes the gas component of the solvent (chemical solution) from the atmosphere around the substrate 90 held on the base plate 133 by the stirring mechanism 16. This can prevent the atmosphere having a high concentration of the gaseous component of the solvent from staying near the surface of the substrate 90 during the execution of the reduced-pressure drying process, so that the time required for the reduced-pressure drying process can be reduced. In addition, when the vacuum drying process is completed and the processing space 132 is opened to the atmosphere, the solvent can be prevented from condensing and re-adhering to the substrate 90.
[0051]
In addition, since the concentration of the gas component of the solvent in the atmosphere around the substrate 90 can be made uniform by the stirring mechanism 16, uneven drying and poor drying can be suppressed.
[0052]
Further, since the gas component of the solvent can be removed from the atmosphere around the substrate 90 by the simple stirring mechanism 16 including the rotating motor 160 and the fan 162, the apparatus configuration of the reduced-pressure drying apparatus 13 is not complicated, and Cost can be suppressed.
[0053]
<2. Second Embodiment>
In the first embodiment, an example in which the atmosphere in the processing space 132 is agitated by the agitation mechanism 16 including the rotary motor 160 and the fan 162 has been described. It is not limited to the configured mechanism. That is, any known mechanism may be used as long as the mechanism moves the object in the processing space 132 to generate an air flow and agitates the atmosphere around the substrate 90 by the generated air flow.
[0054]
FIG. 4 is a partial cross-sectional view illustrating the reduced-pressure drying device 13a of the substrate processing apparatus 1 according to the second embodiment configured based on such a principle. The same functions and configurations as those in the first embodiment are denoted by the same reference numerals, and description thereof will not be repeated.
[0055]
The substrate processing apparatus 1 according to the present embodiment is substantially the same as the substrate processing apparatus 1 according to the first embodiment except that a reduced-pressure drying apparatus 13a is used as an apparatus that performs a reduced-pressure drying process on the substrate 90. Has functions and configurations.
[0056]
The reduced-pressure drying device 13a includes a stirring mechanism 16a as a mechanism for stirring the atmosphere in the processing space 132. The stirring mechanism 16a includes a rotation mechanism 163 and a plurality of loopers 164.
[0057]
The rotation mechanism 163 includes a rotation motor that generates a rotation driving force, and a member that limits the amount of rotation to a predetermined amount (both are not shown), and has a function of rotating each looper 164.
[0058]
Each looper 164 includes a rectangular plate portion and a cylindrical shaft portion. The shaft portion has a cylindrical central axis serving as a rotation axis, and the loopers 164 are attached to the chamber 131 at predetermined intervals so that the rotation axis is parallel to the Y axis. Although four loopers 164 are shown in FIG. 4, the number of loopers is not limited to this.
[0059]
Each looper 164 has a length corresponding to substantially the entire width of the substrate 90 in the Y-axis direction, and has a predetermined rotation amount around the rotation axis of the shaft portion by the rotation mechanism 163 as shown in FIG. Rotate in the range. That is, the rotation mechanism 163 causes each looper 164 to perform a so-called swinging motion about each rotation axis.
[0060]
The operation of the substrate processing apparatus 1 according to the present embodiment having the above configuration is substantially the same as that of the substrate processing apparatus 1 according to the first embodiment. However, in step S16 shown in FIG. 3, when stirring by the stirring mechanism 16a is started, the rotating mechanism 163 drives each looper 164 to rotate, and until the stirring by the stirring mechanism 16a is stopped by executing step S18. Then, the rotation drive of each looper 164 is continued.
[0061]
In this way, when the looper 164 is rotationally driven, an airflow is generated in the processing space 132, the atmosphere in the processing space 132 is stirred, and the concentration of the gas component of the solvent is made uniform.
[0062]
As described above, the atmosphere in the processing space 132 can be stirred by the stirring mechanism 16a including the rotating mechanism 163 and the plurality of loopers 164 as in the reduced-pressure drying apparatus 13a according to the present embodiment. The same effect as that of the first embodiment can be obtained.
[0063]
<3. Third Embodiment>
In the above-described embodiment, the gas atmosphere of the solvent (solution) is removed from the surrounding atmosphere by stirring the atmosphere around the substrate 90. It is not limited.
[0064]
FIG. 5 is a partial cross-sectional view illustrating a reduced-pressure drying device 13b of the substrate processing apparatus 1 according to the third embodiment configured based on such a principle. The same functions and configurations as those of the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
[0065]
Substrate processing apparatus 1 of the present embodiment is substantially the same as substrate processing apparatus 1 of the first embodiment, except that reduced-pressure drying apparatus 13b is used as an apparatus for performing reduced-pressure drying processing on substrate 90. Has functions and configurations.
[0066]
The reduced-pressure drying device 13b according to the present embodiment includes a suction mechanism 15 and a change mechanism 17.
[0067]
The suction mechanism 15 includes a vacuum pump 150, suction ports 151 and 152, suction pipes 153 and 154, and has almost the same functions as the suction mechanism 14 in the first embodiment.
[0068]
The change mechanism 17 includes a support member 170, a fixing member 171, a stopper 172, and a telescopic member 173.
[0069]
The column member 170, which is a columnar member, is disposed in the processing space 132 in a direction along the Z axis, and the (+ Z) side end of the column member 170 is located on the back surface of the base plate 133 (the opposite side to the holding surface of the substrate 90). Surface) attached to the center. The support member 170 penetrates the base 130, and the end on the (−Z) side is fixed to the fixing member 171. A gap is provided between the support member 170 and the base 130 without being sealed, and the processing space 132 is connected to the inside of an elastic member 173 described later.
[0070]
The fixing member 171 has both ends in the X-axis direction fitted into hollow portions provided in the stopper 172, and the stopper 172 limits the movement range in the Z-axis direction. An urging member such as a spring (not shown) is attached to the fixing member 171 and is always urged in the (-Z) direction. Thus, when no force in the (+ Z) direction acts on the fixing member 171, as shown in FIG. 5, the fixing member 171 is disposed at the end in the (−Z) direction. In addition, when the Z axis is set to the vertical direction as in the reduced-pressure drying device 13b according to the present embodiment, since the gravity always acts on the fixing member 171 in the (−Z) direction, the changing mechanism 17 Such a configuration may not be provided with the urging member.
[0071]
The stopper 172 is disposed so as to sandwich the fixing member 171, and the relative position with respect to the base 130 is fixed by a member (not shown). As described above, the stopper 172 functions as a guide that guides the moving direction of the fixing member 171 so as to limit the moving range in the Z-axis direction and prevent the fixing member 171 from moving in the X-axis and Y-axis directions. have.
[0072]
The elastic member 173 is configured of a member that can expand and contract in the Z-axis direction and that can shut off gas so as to prevent gas from entering and exiting between the inside and the outside of the elastic member 173. Further, the (+ Z) side end of the elastic member 173 is fixed to the base 130, and the (−Z) side end is fixed to the fixing member 171.
[0073]
Thus, in the reduced-pressure drying device 13b, the base plate 133 is attached to the elastic member 173 via the support member 170 and the fixing member 171, and the elastic member 173 expands and contracts in the Z-axis direction. Moves in the Z-axis direction. Note that when the fixing member 171 is at the extreme end in the (-Z) direction, the elastic member 173 is in the maximum extended state (the state shown in FIG. 5), while the fixing member 171 is at the extreme end in the (+ Z) direction. In some cases, the elastic member 173 is in a maximum contracted state.
[0074]
FIG. 6 is a diagram illustrating the maximum contraction state of the elastic member 173. In the reduced-pressure drying device 13b, the arrangement position of the stopper 172 is determined in advance so that the substrate 90 held on the base plate 133 does not contact the chamber 131 when the elastic member 173 is in the maximum contraction state.
[0075]
Next, the operation of the substrate processing apparatus 1 according to the third embodiment will be described. The substrate processing apparatus 1 according to the third embodiment performs substantially the same operation as the operation of the substrate processing apparatus 1 according to the above embodiment except for the operation of the reduced-pressure drying device 13b.
[0076]
FIG. 6 is a flowchart showing the operation of the reduced-pressure drying device 13b according to the third embodiment. In the vacuum drying device 13b as well, similarly to the vacuum drying devices 13 and 13a in the above embodiment, first, initial settings are performed (step S21). At this time, the chamber 131 is previously arranged at the loading position. In addition, since the expansion and contraction member 173 is in the maximum extension state and no force in the (+ Z) direction is acting on the fixing member 171, the fixing member 171 is disposed at the extreme end in the (−Z) direction ( (Fig. 5).
[0077]
Next, when the substrate 90 is carried into the reduced-pressure drying device 13b by the transport mechanism 10 (Yes in step S22), the support pins of the base plate 133 advance in the (+ Z) direction, and the base plate 133 holds the substrate 90 (step S22). S23). Subsequently, the chamber 131 is moved to the processing position (Step S24), the substrate 90 is isolated from the external atmosphere, and the processing space 132 is formed (the state shown in FIG. 5).
[0078]
When the substrate 90 is shut off from the external atmosphere and kept in a sealed state, the suction mechanism 15 starts suctioning the atmosphere in the processing space 132 (step S25). Thereby, the reduced pressure drying process by the reduced pressure drying device 13b is started.
[0079]
When the reduced-pressure drying process is started in the reduced-pressure drying device 13b according to the present embodiment, since the processing space 132 and the inside of the elastic member 173 are connected to each other, the internal atmosphere of the elastic member 173 is directed toward the processing space 132. Is sucked. That is, as the pressure in the processing space 132 is reduced, the internal pressure of the elastic member 173 decreases, and the elastic member 173 contracts due to the effect of the atmospheric pressure.
[0080]
Since the expansion and contraction member 173 can be expanded and contracted mainly only in the Z-axis direction, the force generated by the contraction acts on the fixing member 171 as a force in the (+ Z) direction, whereby the base plate 133 moves in the (+ Z) direction. Move to That is, in the reduced-pressure drying device 13b, the base plate 133 moves in the (+ Z) direction as the reduced pressure in the processing space 132 advances.
[0081]
Here, assuming that a space between the main surface of the substrate 90 and the chamber 131 is a space D, the volume of the space D is a relative distance between the substrate 90 and the chamber 131 (a distance in a direction along the Z axis, hereinafter, “ Distance T ”) and the area of the substrate 90. Accordingly, when the decompression proceeds in the decompression drying device 13b and the base plate 133 moves in the (+ Z) direction as described above, the distance T changes in the decreasing direction according to the moving distance, and the volume of the space D decreases. I do. That is, assuming that the volume of the space D at the time of starting the reduced-pressure drying process is V0 (FIG. 5) and the volume of the space D at the time of finishing the reduced-pressure drying process is V1 (FIG. 6), a relationship of V0> V1 is established.
[0082]
Since the space D is a space in which the atmosphere around the substrate 90 exists, when the volume of the space D decreases, the atmosphere around the substrate 90 flows out so as to be pushed out from the entire periphery of the end of the substrate 90. Thereby, since the reduced-pressure drying device 13b can eliminate the stagnation of the airflow, it is possible to suppress drying unevenness and poor drying.
[0083]
Further, the gaseous component of the solvent is removed from the surrounding atmosphere by flowing out of the space D from the surrounding atmosphere itself (the surrounding atmosphere of the portion where the gas flow stays) in which the gaseous component concentration of the solvent is high. Therefore, inhibition of the volatilization of the solvent can be suppressed, and the time required for the drying under reduced pressure can be reduced. When the distance T is rapidly reduced, the space D is in a pressurized state during that time, which causes a problem that the evaporation of the solvent is inhibited. However, in the reduced-pressure drying device 13b, the pressure in the processing space 132 is reduced. , The distance T gradually decreases, so that such a phenomenon does not occur in the space D.
[0084]
When a predetermined time has elapsed since the start of suction by the suction mechanism 15 in step S25, the suction by the suction mechanism 15 is stopped (step S26), and a reduced-pressure drying process with a constant pressure is performed. Thereafter, after a further elapse of a predetermined time, the reduced-pressure drying device 13b moves the chamber 131 to the loading position (Step S27), opens the processing space 132 to the atmosphere, and ends the reduced-pressure drying process.
[0085]
In the reduced-pressure drying device 13b, when the pressure in the processing space 132 is restored, the pressure difference between the inside and the outside of the elastic member 173 is eliminated, and the elastic member 173 is extended by the urging force of the urging member (not shown). Thereby, since the fixing member 171 moves to the end in the (-Z) direction, the volume of the space D increases. That is, since the base plate 133 moves in a direction in which the peripheral atmosphere of the substrate 90 is depressurized when the pressure is restored, the solvent is condensed on the surface of the substrate 90 due to the sudden decompression of the peripheral atmosphere. Reattachment can be suppressed.
[0086]
When the reduced-pressure drying process is completed, the reduced-pressure drying device 13b waits until the transport shuttle of the transport mechanism 10 is arranged at the receiving position of the substrate 90, and then withdraws the support pins of the base plate 133 to move the substrate 90 to the transport mechanism 10b. Hand over to
[0087]
Further, after waiting for the transport mechanism 10 to exit the reduced-pressure drying device 13b (step S28), the processing for the substrate 90 is terminated. In addition, also in the reduced-pressure drying apparatus 13b in the present embodiment, when processing is performed on another substrate 90, the process returns to step S22 and the processing is repeated.
[0088]
As described above, the reduced-pressure drying device 13b according to the third embodiment reduces the volume of the space (space D) between the substrate 90 and the chamber 131 while performing the reduced-pressure drying process on the substrate 90. Thereby, the gas component of the solvent can be removed from the surrounding atmosphere of the substrate 90, so that the same effect as in the above embodiment can be obtained.
[0089]
Further, the reduced-pressure drying device 13b does not need to use a separate drive mechanism or the like as a mechanism for removing the gas component of the solvent from the atmosphere around the substrate 90, so that an increase in the cost of the apparatus can be suppressed. In addition, since there is no need to control such a driving mechanism in the reduced-pressure drying process, the process of the control device 20 does not become complicated.
[0090]
Further, by moving the base plate 133 in the direction in which the surrounding atmosphere of the substrate 90 is depressurized at the time of the pressure recovery, it is possible to alleviate the sudden pressure recovery of the surrounding atmosphere of the substrate 90, and to prevent the solvent from condensing on the substrate 90. It can be further suppressed.
[0091]
<4. Fourth embodiment>
In the reduced-pressure drying device 13b according to the third embodiment, the volume of the space D is reduced by moving the base plate 133 by a pressure difference between the internal space of the elastic member 173 and the outside, and the solvent is removed from the atmosphere around the substrate 90. Gas components are removed. However, the method of changing the volume of the space D during the drying under reduced pressure is not limited to this.
[0092]
FIG. 8 is a partial cross-sectional view showing a reduced-pressure drying device 13c of the substrate processing apparatus 1 according to the fourth embodiment configured based on such a principle. The same functions and configurations as those of the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
[0093]
The substrate processing apparatus 1 according to the present embodiment is substantially the same as the substrate processing apparatus 1 according to the third embodiment, except that a reduced-pressure drying apparatus 13c is used as an apparatus that performs a reduced-pressure drying process on the substrate 90. Has functions and configurations.
[0094]
The reduced-pressure drying device 13c according to the present embodiment includes a change mechanism 17a. The change mechanism 17a is different from the change mechanism 17 in the third embodiment in that a drive mechanism 174 and a seal member 175 are provided instead of the fixed member 171 and the expandable member 173.
[0095]
The driving mechanism 174 is driven by a control signal from the control device 20 and has a function of moving the base plate 133 in the Z-axis direction via the support member 170. As the drive mechanism 174 having such a function, for example, a ball screw arranged parallel to the Z-axis and a nut member fixed to the support member 170 are combined, and the ball screw is rotated by a rotary motor to rotate the nut member. It can be realized by using a mechanism for moving in the axial direction. In addition, as the drive mechanism 174, another known method such as a mechanism using an air cylinder may be used. The driving of the base plate 133 by the driving mechanism 174 is performed at a sufficiently low speed, as in the third embodiment.
[0096]
The seal member 175 is a member for sealing the processing space 132 from the outside, and prevents the outside atmosphere from flowing into the processing space 132 when the processing space 132 is depressurized by suction by the suction mechanism 15. Has functions.
[0097]
The control device 20 controls the driving of the driving mechanism 174 during the reduced-pressure drying process. For example, when the drive mechanism 174 moves the base plate 133, the control is performed so that the base plate 133 is not moved beyond a preset separation position or a close position. The separated position is a position where the base plate 133 is shown in FIG. 8 and a position where the suction from the suction ports 151 and 152 provided on the base 130 is not hindered by the base plate 133 (the base plate 133 and the base (A position where a sufficient distance from 130 exists). The proximity position is a position where the base plate 133 is moved by a predetermined distance from the separation position in the (+ Z) direction, and a sufficient space is provided so that the substrate 90 held by the base plate 133 does not contact the chamber 131. It is the position that is set.
[0098]
Next, the operation of the reduced-pressure drying device 13c according to the fourth embodiment will be described. The substrate processing apparatus 1 according to the present embodiment performs substantially the same operation as the substrate processing apparatus 1 according to the first embodiment except for the operation of the reduced-pressure drying device 13c.
[0099]
FIG. 9 is a flowchart showing the operation of the reduced-pressure drying device 13c. Similarly to the reduced-pressure drying device 13 in the first embodiment, the reduced-pressure drying device 13c waits until the substrate 90 is carried in by the transfer mechanism 10 after performing the initial setting (step S31) in advance (step S32). . Then, when the substrate 90 is loaded, the base plate 133 holds the substrate 90 (Step S33) and lowers the chamber 131 (Step S34) to form the processing space 132, and then the suction by the suction mechanism 15 is performed. Start (step S35).
[0100]
When the reduced-pressure drying process is started in step S35, the control device 20 outputs a control signal to the drive mechanism 174 to control the base plate 133 to move in the (+ Z) direction. In this way, the relative distance T between the substrate 90 and the chamber 131 is reduced by the drive mechanism 174 moving the base plate 133, and the volume of the space D is reduced. Therefore, also in the reduced-pressure drying device 13c, the atmosphere around the substrate 90 can be removed, as in the reduced-pressure drying device 13b in the third embodiment.
[0101]
Next, the reduced-pressure drying device 13c performs decompression by suction until the pressure becomes a predetermined pressure, and when the decompression is completed, stops the suction by the suction mechanism 15 (step S37). In the reduced-pressure drying device 13c according to the present embodiment, when the suction by the suction mechanism 15 is stopped and the processing space 132 is in a constant pressure state, and the base plate 133 reaches a close position, the base plate 133 swings along the Z axis. The drive mechanism 174 is controlled to perform the operation (step S38).
[0102]
In the reduced-pressure drying device 13b according to the third embodiment, after the processing space 132 is in a constant pressure state, the volume of the space D does not change until the processing space 132 is opened to the atmosphere. May occur. However, the reduced-pressure drying device 13c according to the present embodiment increases or decreases the volume of the space D by swinging the base plate 133 along the Z-axis even after a constant pressure state is reached, so that the periphery of the substrate 90 The occurrence of stagnation of the airflow can be suppressed.
[0103]
When the predetermined processing time has elapsed, the drive mechanism 174 moves the base plate 133 to the separated position (step S39). When the movement of the base plate 133 to the separated position is completed, the chamber 131 is moved in the (+ Z) direction to open the processing space 132 to the atmosphere (step S40), and the reduced-pressure drying process ends. Furthermore, after waiting for the substrate 90 to be unloaded by the transport mechanism 10 (step S41), the process is terminated.
[0104]
As described above, also in the reduced-pressure drying apparatus 13c according to the fourth embodiment, the volume of the space D between the substrate 90 and the chamber 131 can be reduced during the reduced-pressure drying process. The atmosphere can be removed while suppressing the stagnation of the airflow. Therefore, the same effect as in the above embodiment can be obtained.
[0105]
In addition, in the reduced-pressure drying process, since the volume of the space D can be changed even after the pressure becomes constant, the stagnation of the airflow in the atmosphere around the substrate 90 can be further reduced.
[0106]
<5. Fifth Embodiment>
In the substrate processing apparatus 1 according to the above-described embodiment, during the drying under reduced pressure, the gas component of the solvent staying in the surrounding atmosphere of the substrate 90 is once contained in the surrounding atmosphere of the substrate 90 by being moved in the processing space 132. The purpose is to reduce the concentration of the gas component of the solvent. However, as a method of removing the gas component of the solvent from the surrounding atmosphere of the substrate 90, a method of directly sucking and removing the surrounding atmosphere may be used.
[0107]
FIG. 10 is a partial cross-sectional view illustrating a reduced-pressure drying device 13d of the substrate processing apparatus 1 according to the fifth embodiment configured based on such a principle. The same functions and configurations as those of the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
[0108]
The substrate processing apparatus 1 according to the present embodiment has substantially the same functions and functions as the substrate processing apparatus 1 according to the above-described embodiment, except that a reduced-pressure drying apparatus 13d is used as an apparatus that performs a reduced-pressure drying process on the substrate 90. It has a configuration.
[0109]
The reduced-pressure drying device 13d according to the present embodiment includes a suction mechanism 14a and an auxiliary suction mechanism 18, and the suction mechanism 141a can control opening and closing of a suction pipe 141 by an opening and closing valve 143. The auxiliary suction mechanism 18 includes a suction port 181, a suction pipe 182, and an open / close valve 183.
[0110]
As shown in FIG. 10, the suction port 181 is provided in the chamber 131 so as to face the vicinity of the center of the substrate 90 held on the base plate 133. One end of the suction pipe 182 is connected to the suction port 181 and the other end is connected to the vacuum pump 140. The opening and closing valve 183 opens and closes the suction pipe 182.
[0111]
Note that a plurality of suction ports 181 of the auxiliary suction mechanism 18 may be provided. Further, in the reduced-pressure drying apparatus 13d according to the present embodiment, the suction pipe 182 is connected to the vacuum pump 140, so that the suction mechanism 14a and the auxiliary suction mechanism 18 share the vacuum pump 140. The auxiliary suction mechanism 18 may have a separate vacuum pump.
[0112]
The control device 20 in the present embodiment controls the opening / closing operation of the opening / closing valve 143 and the opening / closing valve 183.
[0113]
Next, an operation of the reduced-pressure drying device 13d according to the fifth embodiment will be described. The substrate processing apparatus 1 according to the present embodiment performs substantially the same operation as the substrate processing apparatus 1 according to the first embodiment except for the operation of the reduced-pressure drying device 13d, and a description thereof will be omitted.
[0114]
FIG. 11 is a flowchart showing the operation of the reduced-pressure drying device 13d. Like the reduced-pressure drying device 13 in the first embodiment, the reduced-pressure drying device 13d waits until the substrate 90 is carried in by the transfer mechanism 10 after performing the initial setting (step S51) in advance (step S52). . Then, when the substrate 90 is carried in, the base plate 133 holds the substrate 90 (Step S53), and moves the chamber 131 in the (-Z) direction (Step S54), thereby forming the processing space 132.
[0115]
Further, the control device 20 drives the vacuum pump 140 and opens the opening / closing valve 143 to start the suction by the suction mechanism 14a (step S55). Thus, the reduced-pressure drying process for the substrate 90 is started.
[0116]
When a predetermined time has elapsed after the suction by the suction mechanism 14a has started, the control device 20 sets the open / close valve 183 to the open state and starts suction by the auxiliary suction mechanism 18 (step S56).
[0117]
As described above, the reduced-pressure drying apparatus 13d according to the present embodiment eliminates the airflow and removes the atmosphere around the substrate 90 by performing suction by the auxiliary suction mechanism 18 during the reduced-pressure drying process. Can be.
[0118]
If a sudden airflow is generated on the surface of the substrate 90 by suction in a state where the resist film on the substrate 90 is not dried, the resist film becomes non-uniform due to the influence of the airflow. Therefore, in the reduced-pressure drying device 13d according to the present embodiment, the control device 20 provides a time difference between the opening and closing timing of the opening and closing valve 143 and the opening and closing valve 183. After that, the suction by the auxiliary suction mechanism 18 is performed. However, the suction by the auxiliary suction mechanism 18 is not limited to being started after the suction by the suction mechanism 14a. For example, when performing gentle suction that does not affect the resist film, the auxiliary suction The suction by the mechanism 18 may be started before the suction by the suction mechanism 14a.
[0119]
When the pressure in the processing space 132 reaches a predetermined value, the control device 20 closes the on-off valve 143 and stops the suction by the suction mechanism 14a (step S57). Further, after continuing the reduced-pressure drying process until a predetermined time elapses, the open / close valve 183 is closed, and the suction by the auxiliary suction mechanism 18 is stopped (step S58). Further, by moving the chamber 131 in the (-Z) direction (step S59), the processing space 132 is opened to the atmosphere, and the reduced-pressure drying process ends.
[0120]
The reduced-pressure drying apparatus 13d in the present embodiment removes the atmosphere containing the gas component of the solvent at a high concentration from the surrounding atmosphere of the substrate 90 by the auxiliary suction mechanism 18 during the execution of the reduced-pressure drying process. Similarly, it is possible to suppress the solvent from re-adhering when the processing space 132 is opened to the atmosphere.
[0121]
Next, after waiting until the transport shuttle of the transport mechanism 10 is disposed at a predetermined position, the reduced-pressure drying device 13d transfers the substrate 90 to the transport shuttle by separating the support pins of the base plate 133 from the substrate 90. Further, after waiting for the transport shuttle to exit the reduced-pressure drying device 13d (step S60), the processing for the substrate 90 is terminated.
[0122]
As described above, in the reduced-pressure drying apparatus 13d according to the fifth embodiment, the auxiliary suction mechanism 18 sucks the surrounding atmosphere of the substrate 90 during the execution of the reduced-pressure drying process on the substrate 90, thereby reducing the surrounding atmosphere of the substrate 90. Removes gaseous components of the solvent therein. Thus, the same effect as in the above-described embodiment can be obtained also in the reduced-pressure drying device 13d according to the present embodiment.
[0123]
Further, since the auxiliary suction mechanism 18 also serves as the vacuum pump 140 included in the suction mechanism 14a, the cost of the apparatus can be reduced.
[0124]
<6. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0125]
For example, in the above-described embodiment, the substrate conveyed to the reduced-pressure drying device is a substrate that has been slit-coated by the coating device 12, but the substrate processed by the reduced-pressure drying device is not limited to this. Alternatively, the substrate may be a substrate coated with a chemical solution by spin coating, or may be a substrate after edge rinsing.
[0126]
Further, the operation order in the substrate processing apparatus 1 is not limited to the order shown in the above embodiment, but may be any order as long as a similar effect is obtained.
[0127]
In addition, the control by the control device 20 in the above embodiment has been described as being realized as software control in which the CPU operates by a program. However, all or a part of the control may be realized as hardware control by a dedicated circuit. Good.
[0128]
Further, in the reduced-pressure drying apparatus 13c according to the fourth embodiment, it has been described that the driving mechanism 174 is provided to move the base plate 133 in the Z-axis direction during the execution of the reduced-pressure drying processing. In the case where has an adjusting mechanism for adjusting the position of the base plate 133 in the Z-axis direction when the substrate 90 is loaded or unloaded, these adjusting mechanisms may be used also as the driving mechanism 174.
[0129]
【The invention's effect】
According to the first to ninth aspects of the present invention, it is possible to prevent the chemical solution from re-adhering to the substrate by removing the gas component of the chemical solution from the surrounding atmosphere of the substrate held by the holding table. Further, it is possible to suppress the inhibition of the volatilization of the chemical solution.
[0130]
According to the second aspect of the invention, the gas component of the chemical solution is stirred and removed from the atmosphere around the substrate, so that the concentration of the gas component of the chemical solution in the atmosphere around the substrate can be made uniform. Therefore, the chemical solution can be removed from the surrounding atmosphere by reducing the concentration of the chemical solution in the surrounding atmosphere.
[0131]
According to the third aspect of the present invention, the surrounding atmosphere can be easily agitated by having the rotating mechanism that generates the rotational driving force and the fan that is rotated by the rotational driving force and generates the airflow in the processing space. it can.
[0132]
According to the fourth aspect of the present invention, the surrounding atmosphere is provided by having the plate-like member that rotates around the predetermined rotation axis and the rotation mechanism that rotates the plate-like member around the predetermined rotation axis. Can be easily stirred.
[0133]
According to the fifth aspect of the present invention, the relative distance between the substrate and the decompression chamber is changed in a direction in which the space volume between the substrate and the decompression chamber decreases while the substrate is subjected to the decompression drying process. Accordingly, the atmosphere having a high concentration of the gas component of the chemical can be moved from the periphery of the substrate, and the gas component of the chemical can be removed from the surrounding atmosphere.
[0134]
According to the invention described in claim 6, the holding table is attached to an elastic member that expands and contracts in accordance with the pressure in the processing space, and the elastic member contracts, so that the holding table is placed in the space between the substrate and the decompression chamber. By moving in the direction in which the volume is reduced, there is no need to separately provide a drive mechanism, and the surrounding atmosphere can be easily moved.
[0135]
According to the seventh aspect of the present invention, as the atmosphere in the processing space is sucked by the suction means, the moving mechanism is driven and controlled in a direction to decrease the relative distance between the substrate and the decompression chamber, so that the ambient atmosphere can be easily controlled. Can be moved.
[0136]
According to the eighth aspect of the present invention, the auxiliary suction means is provided in the vicinity of a position opposed to the central portion of the main surface of the substrate, and depressurizes the gas component of the chemical solution in the peripheral atmosphere by sucking the peripheral atmosphere of the substrate. It can be easily removed out of the chamber.
[0137]
According to the ninth aspect of the present invention, the auxiliary suction means starts suction after a predetermined time has elapsed from the start of suction by the suction means. It is possible to suppress the occurrence of sticking.
[0138]
According to the tenth aspect of the present invention, the substrate and the decompression chamber are relatively moved in a direction in which the volume of space between the main surface of the substrate and the decompression chamber is reduced, so that the concentration of the gas component of the chemical solution is high. The atmosphere can be moved from the periphery of the substrate, and the gas component of the chemical solution can be removed from the surrounding atmosphere.
[0139]
According to the eleventh aspect of the present invention, the gaseous component of the chemical solution in the peripheral atmosphere is reduced by depressurizing the peripheral atmosphere of the substrate by sucking the peripheral atmosphere of the substrate from near the position opposed to the central portion of the main surface of the substrate held in the holding step. Can be easily removed outside.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 equipped with a reduced-pressure drying apparatus according to the present invention.
FIG. 2 is a partial cross-sectional view illustrating a reduced-pressure drying device according to the first embodiment.
FIG. 3 is a flowchart showing an operation of a reduced-pressure drying apparatus according to a second embodiment.
FIG. 4 is a partial cross-sectional view illustrating a reduced-pressure drying device according to a second embodiment.
FIG. 5 is a partial cross-sectional view illustrating a reduced-pressure drying apparatus according to a third embodiment.
FIG. 6 is a diagram illustrating a maximum contraction state of the elastic member.
FIG. 7 is a flowchart showing the operation of the reduced-pressure drying device.
FIG. 8 is a partial cross-sectional view illustrating a reduced-pressure drying apparatus according to a fourth embodiment.
FIG. 9 is a flowchart showing the operation of the reduced-pressure drying device.
FIG. 10 is a partial cross-sectional view illustrating a reduced-pressure drying device according to a fifth embodiment.
FIG. 11 is a flowchart showing the operation of the reduced-pressure drying device.
[Explanation of symbols]
1 Substrate processing equipment
13, 13a, 13b, 13c, 13d Vacuum drying device
131 chambers
132 processing space
133 base plate (holding table)
14, 14a, 15 suction mechanism
16, 16a stirring mechanism
160 rotation motor (rotation mechanism)
162 fans
163 Rotating mechanism
164 looper (plate member)
17, 17a Change mechanism
173 Telescopic member
174 drive mechanism (moving mechanism)
18 Auxiliary suction mechanism
20 Control device
90 substrate
D space
T distance

Claims (11)

A vacuum drying device for drying the chemical solution present on the substrate by reduced pressure,
A decompression chamber for forming a processing space for drying the substrate under reduced pressure;
A holding table for holding a substrate in the processing space,
Suction means for suctioning the atmosphere in the processing space,
Removing means for removing the gas component of the chemical solution from the surrounding atmosphere of the substrate held by the holding table,
A vacuum drying device comprising: The reduced-pressure drying device according to claim 1,
The removing means,
A stirring means for generating an air flow in the processing space,
The stirring means,
A reduced pressure drying apparatus, wherein a gas component of the chemical solution is removed by stirring from an atmosphere around the substrate. The reduced-pressure drying device according to claim 2,
The stirring means,
A rotation mechanism for generating a rotation driving force;
A fan that is rotated by the rotational driving force and generates an airflow in the processing space;
A vacuum drying device comprising: The reduced-pressure drying device according to claim 2,
The stirring means,
A plate-shaped member that rotates around a predetermined rotation axis,
A rotation mechanism for rotating the plate-shaped member about the predetermined rotation axis,
A vacuum drying device comprising: The reduced-pressure drying device according to claim 1,
The removing means,
By changing the relative distance between the substrate and the decompression chamber, has a changing means for changing the space volume between the main surface of the substrate and the decompression chamber,
The change means,
A reduced-pressure drying apparatus, wherein the relative distance is changed in a direction in which the space volume decreases while the reduced-pressure drying process is being performed on the substrate. The reduced-pressure drying device according to claim 5, wherein
The change means,
Having an elastic member that expands and contracts according to the pressure in the processing space,
The reduced-pressure drying device, wherein the holding table is attached to the elastic member, and the holding table moves in a direction to reduce the space volume when the elastic member contracts. The reduced-pressure drying device according to claim 5, wherein
The change means,
A moving mechanism for moving the substrate relative to the decompression chamber,
As the atmosphere in the processing space is sucked by the suction means, a control mechanism that drives and controls the moving mechanism in a direction to decrease the relative distance;
A vacuum drying device comprising: The reduced-pressure drying device according to claim 1,
The removing means,
Having auxiliary suction means for suctioning the atmosphere in the processing space,
The auxiliary suction means,
A reduced-pressure drying apparatus, which is provided near a position facing a central portion of the main surface of the substrate and sucks an atmosphere around the substrate. The reduced-pressure drying device according to claim 8, wherein
The auxiliary suction means,
A vacuum drying apparatus characterized in that the suction is started after a predetermined time has passed since the suction by the suction means was started. A vacuum drying method of drying a chemical solution present on a substrate by reduced pressure,
A holding step of holding the substrate in a processing space formed by the decompression chamber,
A suction step of suctioning an atmosphere in the processing space,
A moving step of relatively moving the substrate and the decompression chamber in a direction to reduce the volume of space between the main surface of the substrate held in the holding step and the decompression chamber;
A method for drying under reduced pressure, comprising: A vacuum drying method of drying a chemical solution present on a substrate by reduced pressure,
A holding step of holding the substrate in a processing space formed by the decompression chamber,
A suction step of suctioning an atmosphere in the processing space,
An auxiliary suction step of sucking a peripheral atmosphere of the substrate from near a position opposed to a central portion of the main surface of the substrate held in the holding step,
Has,
The auxiliary suction step,
A reduced-pressure drying method, which is performed after the start of the suction step.

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