JP4248450B2 - 火炎加水分解により製造されるシリカ粉末、その製造方法およびその使用 - Google Patents
火炎加水分解により製造されるシリカ粉末、その製造方法およびその使用 Download PDFInfo
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- JP4248450B2 JP4248450B2 JP2004170191A JP2004170191A JP4248450B2 JP 4248450 B2 JP4248450 B2 JP 4248450B2 JP 2004170191 A JP2004170191 A JP 2004170191A JP 2004170191 A JP2004170191 A JP 2004170191A JP 4248450 B2 JP4248450 B2 JP 4248450B2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 239000000843 powder Substances 0.000 title claims abstract description 32
- 230000007062 hydrolysis Effects 0.000 title claims abstract description 15
- 238000006460 hydrolysis reaction Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000000377 silicon dioxide Substances 0.000 title claims description 50
- 230000008719 thickening Effects 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- 238000002485 combustion reaction Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 239000002243 precursor Substances 0.000 claims description 16
- 239000000567 combustion gas Substances 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 7
- 239000005049 silicon tetrachloride Substances 0.000 claims description 7
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 150000001805 chlorine compounds Chemical class 0.000 claims 1
- 150000001282 organosilanes Chemical class 0.000 claims 1
- 239000003570 air Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910003902 SiCl 4 Inorganic materials 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 150000001367 organochlorosilanes Chemical class 0.000 description 3
- -1 silicon halide Chemical class 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- WGLLSSPDPJPLOR-UHFFFAOYSA-N 2,3-dimethylbut-2-ene Chemical compound CC(C)=C(C)C WGLLSSPDPJPLOR-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- IUVCFHHAEHNCFT-INIZCTEOSA-N 2-[(1s)-1-[4-amino-3-(3-fluoro-4-propan-2-yloxyphenyl)pyrazolo[3,4-d]pyrimidin-1-yl]ethyl]-6-fluoro-3-(3-fluorophenyl)chromen-4-one Chemical compound C1=C(F)C(OC(C)C)=CC=C1C(C1=C(N)N=CN=C11)=NN1[C@@H](C)C1=C(C=2C=C(F)C=CC=2)C(=O)C2=CC(F)=CC=C2O1 IUVCFHHAEHNCFT-INIZCTEOSA-N 0.000 description 2
- PFEOZHBOMNWTJB-UHFFFAOYSA-N 3-methylpentane Chemical compound CCC(C)CC PFEOZHBOMNWTJB-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- BEQGRRJLJLVQAQ-UHFFFAOYSA-N trans-3-methyl-2-pentene Natural products CCC(C)=CC BEQGRRJLJLVQAQ-UHFFFAOYSA-N 0.000 description 2
- BEQGRRJLJLVQAQ-GQCTYLIASA-N (e)-3-methylpent-2-ene Chemical compound CC\C(C)=C\C BEQGRRJLJLVQAQ-GQCTYLIASA-N 0.000 description 1
- BEQGRRJLJLVQAQ-XQRVVYSFSA-N (z)-3-methylpent-2-ene Chemical compound CC\C(C)=C/C BEQGRRJLJLVQAQ-XQRVVYSFSA-N 0.000 description 1
- RYPKRALMXUUNKS-HYXAFXHYSA-N (z)-hex-2-ene Chemical compound CCC\C=C/C RYPKRALMXUUNKS-HYXAFXHYSA-N 0.000 description 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 1
- RYPKRALMXUUNKS-HWKANZROSA-N 2E-hexene Chemical compound CCC\C=C\C RYPKRALMXUUNKS-HWKANZROSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
- B01J21/06—Silicon, titanium, zirconium or hafnium; Oxides or hydroxides thereof
- B01J21/08—Silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/02—Impregnation, coating or precipitation
- B01J37/0238—Impregnation, coating or precipitation via the gaseous phase-sublimation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
-
- B01J35/30—
-
- B01J35/613—
-
- B01J35/615—
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- B01J35/617—
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
Description
ラムダ=バーナーに供給される酸素/化学量論的に必要とされる酸素量、
ガンマ=バーナーに供給される水素/化学量論的に必要とされる水素量。
ベータ=過剰の水/形成されたシリカ。
四塩化ケイ素5.2kg/h(0.0306kmol/h)を、水素2.32m3/h(0.104kmol/h)および空気7.3m3/h(0.068kmol/h)と一緒に、しかし付加的な水蒸気を添加しないで燃焼させた。四塩化ケイ素の加水分解のために化学量論的に必要な量の水は2×0.0306kmol/h=0.0612kmol/hである。水蒸気および酸素の反応から、水0.104kmol/hが生じる。従って過剰の水は(0.104〜0.0612)kmol/h=0.0428kmol/hである。従ってベータ値はベータ=0.0428/0.0306=1.39である。
ケイ素ハロゲン化物、オルガノクロロケイ素化合物、有機ケイ素化合物。特にSiCl4、CH3SiCl3、(CH3)2SiCl2、(CH3)3SiCl、(CH3)4Si、HSiCl3、(CH3)2HSiCl、CH3C2H5SiCl2、一般式RnCl3−nSiSiRmCl3−m(式中、R=CH3およびn+m=2、3、4、5および6を表す)のジシランならびに前記の化合物の混合物を使用することができる。
蒸気の形のSiCl44.00kg/h、水素2.10m3/hおよび空気7.00m3/hからなる混合物に点火し、かつバーナーの出口開口部から燃焼室中へ、およびさらに冷却される燃焼管中へと燃焼させた。生じるシリカ粉末を気体から分離し、かつ脱酸性化する。シリカ粉末の物理的−化学的データを第1表に記載する。
Claims (3)
- 火炎加水分解により製造され、10〜600m 2 /gのBET表面積を有し、少なくとも3000mPasの増粘作用および40μmより小さいグラインドメーター値を有するシリカ粉末の製造方法において、少なくとも1種の蒸気の形のシリカ前駆物質を、遊離酸素を含有する気体、燃焼ガスおよび水蒸気の存在下に反応させ、その際、バーナーの中心に設置された管を介して、蒸気の形のシリカ前駆物質、遊離酸素を含有するガスおよび燃焼ガスを含有する前混合された気体混合物中に水蒸気を導入し、かつ冷却される燃焼管が接続された燃焼室中で反応混合物を反応させ、その際、ラムダ値は1〜2であり、ガンマ値は1〜2であり、かつベータ値は2.2〜3.2である、火炎加水分解により製造され、10〜600m 2 /gのBET表面積を有し、少なくとも3000mPasの増粘作用および40μmより小さいグラインドメーター値を有するシリカ粉末の製造方法。
- シリカ前駆物質として四塩化ケイ素、有機塩化ケイ素化合物および/またはオルガノシランを使用する、請求項1記載の方法。
- さらに空気および/または水素を燃焼室に供給する、請求項1または2記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10326049A DE10326049A1 (de) | 2003-06-10 | 2003-06-10 | Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005001990A JP2005001990A (ja) | 2005-01-06 |
JP4248450B2 true JP4248450B2 (ja) | 2009-04-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004170191A Active JP4248450B2 (ja) | 2003-06-10 | 2004-06-08 | 火炎加水分解により製造されるシリカ粉末、その製造方法およびその使用 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040253164A1 (ja) |
EP (1) | EP1486461B1 (ja) |
JP (1) | JP4248450B2 (ja) |
KR (1) | KR100644313B1 (ja) |
CN (1) | CN1301903C (ja) |
AT (1) | ATE369315T1 (ja) |
DE (2) | DE10326049A1 (ja) |
ES (1) | ES2290585T3 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012177694A (ja) * | 2011-02-25 | 2012-09-13 | Wacker Chemie Ag | 流動ガス混合物中のガス濃度を測定するための装置及び方法 |
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DE10239144A1 (de) * | 2002-08-27 | 2004-03-18 | Degussa Ag | Dispersion |
DE10258857A1 (de) | 2002-12-17 | 2004-07-08 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxid und Dispersion hiervon |
DE10258858A1 (de) | 2002-12-17 | 2004-08-05 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxid |
DE10312970A1 (de) * | 2003-03-24 | 2004-10-14 | Degussa Ag | Pyrogenes Siliciumdioxidpulver und Dispersion hiervon |
DE102005001409A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und dieses Pulver enthaltene Silikondichtmasse |
DE102005001408A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver |
DE102005001410A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und Dispersion hiervon |
DE102005001414A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver |
WO2006084390A1 (en) * | 2005-02-11 | 2006-08-17 | Eth Zurich | Antimicrobial and antifungal powders made by flame spray pyrolysis |
CN100369803C (zh) * | 2005-05-31 | 2008-02-20 | 昆明理工大学 | 一种制备气相法纳米氧化物的方法和装置 |
EP1801073B1 (de) * | 2005-12-20 | 2011-05-18 | Evonik Degussa GmbH | Pyrogen hergestelltes Siliciumdioxid |
DE102007025685A1 (de) * | 2007-06-01 | 2008-12-04 | Evonik Degussa Gmbh | RTV-Zweikomponenten-Silikonkautschuk |
EP2070992A1 (de) * | 2007-12-11 | 2009-06-17 | Evonik Degussa GmbH | Lacksysteme |
DE102008000499A1 (de) * | 2008-03-04 | 2009-09-10 | Evonik Degussa Gmbh | Kieselsäure sowie Epoxidharze |
CN102115082B (zh) * | 2011-03-10 | 2013-05-01 | 上海竟茨环保科技有限公司 | 气相法二氧化硅生产装置 |
CN102115081B (zh) * | 2011-03-10 | 2013-09-25 | 上海竟茨环保科技有限公司 | 用于生产气相法二氧化硅的燃烧炉 |
EP3019269B1 (de) | 2013-07-11 | 2018-08-08 | Evonik Degussa GmbH | Verfahren zur herstellung von kieselsäure mit variabler verdickung |
CN108698880B (zh) | 2015-12-18 | 2023-05-02 | 贺利氏石英玻璃有限两合公司 | 不透明石英玻璃体的制备 |
US11492282B2 (en) | 2015-12-18 | 2022-11-08 | Heraeus Quarzglas Gmbh & Co. Kg | Preparation of quartz glass bodies with dew point monitoring in the melting oven |
WO2017103120A1 (de) | 2015-12-18 | 2017-06-22 | Heraeus Quarzglas Gmbh & Co. Kg | Herstellung einer synthetischen quarzglaskörnung |
EP3390308A1 (de) | 2015-12-18 | 2018-10-24 | Heraeus Quarzglas GmbH & Co. KG | Glasfasern und vorformen aus quarzglas mit geringem oh-, cl- und al-gehalt |
KR20180095879A (ko) | 2015-12-18 | 2018-08-28 | 헤래우스 크바르츠글라스 게엠베하 & 컴파니 케이지 | 상승된 온도에서 탄소-도핑된 실리카 과립을 처리하여 실리카 과립의 알칼리 토금속 함량의 감소 |
TWI808933B (zh) | 2015-12-18 | 2023-07-21 | 德商何瑞斯廓格拉斯公司 | 石英玻璃體、二氧化矽顆粒、光導、施照體、及成型體及其製備方法 |
KR20180095618A (ko) | 2015-12-18 | 2018-08-27 | 헤래우스 크바르츠글라스 게엠베하 & 컴파니 케이지 | 다중-챔버 가열로에서 실리카 유리체의 제조 |
JP6940235B2 (ja) | 2015-12-18 | 2021-09-22 | ヘレウス クワルツグラス ゲーエムベーハー ウント コンパニー カーゲー | 高融点金属の溶融坩堝内での石英ガラス体の調製 |
JP6984897B2 (ja) | 2015-12-18 | 2021-12-22 | ヘレウス クワルツグラス ゲーエムベーハー ウント コンパニー カーゲー | 石英ガラス調製時のケイ素含有量の増大 |
KR20180094087A (ko) | 2015-12-18 | 2018-08-22 | 헤래우스 크바르츠글라스 게엠베하 & 컴파니 케이지 | 실리카 과립으로부터 실리카 유리 제품의 제조 |
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DE2904199A1 (de) * | 1979-02-05 | 1980-08-07 | Degussa | Verfahren zur gelenkten herstellung von kieselsaeure mittels flammenhydrolyse |
DE3016010C2 (de) * | 1980-04-25 | 1985-01-10 | Degussa Ag, 6000 Frankfurt | Verfahren zur pyrogenen Herstellung von Kieselsäure |
DE3028364C2 (de) * | 1980-07-26 | 1983-07-21 | Degussa Ag, 6000 Frankfurt | Verfahren und Vorrichtung zur pyrogenen Herstellung von Siliciumdioxid |
US6322765B1 (en) * | 1996-02-15 | 2001-11-27 | Wacker-Chemie Gmbh | Process for preparing silicon dioxide |
FR2749576B1 (fr) * | 1996-06-06 | 1998-09-04 | Rhone Poulenc Chimie | Procede de preparation de silice susceptible d'etre utilisee dans les compositions dentifrices |
DE19650500A1 (de) * | 1996-12-05 | 1998-06-10 | Degussa | Dotierte, pyrogen hergestellte Oxide |
DE19756840A1 (de) * | 1997-01-23 | 1998-07-30 | Degussa | Pyrogene Oxide und Verfahren zu ihrer Herstellung |
US6331055B1 (en) * | 1999-08-30 | 2001-12-18 | Hewlett-Packard Company | Inkjet printhead with top plate bubble management |
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JP2012177694A (ja) * | 2011-02-25 | 2012-09-13 | Wacker Chemie Ag | 流動ガス混合物中のガス濃度を測定するための装置及び方法 |
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DE502004004552D1 (de) | 2007-09-20 |
CN1301903C (zh) | 2007-02-28 |
JP2005001990A (ja) | 2005-01-06 |
KR20040111003A (ko) | 2004-12-31 |
CN1572725A (zh) | 2005-02-02 |
DE10326049A1 (de) | 2004-12-30 |
US20040253164A1 (en) | 2004-12-16 |
ES2290585T3 (es) | 2008-02-16 |
ATE369315T1 (de) | 2007-08-15 |
KR100644313B1 (ko) | 2006-11-10 |
EP1486461A1 (de) | 2004-12-15 |
EP1486461B1 (de) | 2007-08-08 |
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