JP4244778B2 - Device for measuring characteristics of chip-type electronic components - Google Patents

Description

  The present invention relates to a characteristic measuring apparatus, and more particularly to a characteristic measuring apparatus for measuring electrical characteristics of a chip-type electronic component having external electrodes at both ends.

  For example, Patent Document 1 discloses a widely used measuring apparatus that simultaneously measures electrical characteristics (capacitance, insulation resistance) of a plurality of chip-type electronic components. As shown in FIGS. 9 and 10, this measuring apparatus has a non-conductive plate 50 and a through hole 52 that is stacked on the conductive flat plate 50 and accommodates chip-type electronic components 60 arranged in a matrix. A conductive flat plate 51 and a plurality of measurement terminals 55 provided corresponding to the through holes 52 are provided. One external electrode 61a of the electronic component 60 accommodated in the through hole 52 is in electrical contact with the conductive flat plate 50, and the lowered measurement terminal 55 is in electrical contact with the other external electrode 61b. Is done.

  However, this measuring apparatus performs measurement with a two-terminal type, and when measuring the characteristics of the low-impedance electronic component 60 (for example, a large-capacitance capacitor or a low-resistance chip), the conductive flat plate 50 and the external electrode 61a. Or under the influence of contact resistance generated between the measurement terminal 55 and the external electrode 61b, there is a problem that the measurement cannot be performed accurately. Further, since the conductive flat plate 50 functions as a common terminal for all the electronic components 60, only one type of characteristic can be measured at the same time, and the problem of poor measurement efficiency remains.

  On the other hand, Patent Document 2 discloses a measuring device that is a four-terminal type and can measure characteristics with high accuracy. In this measuring apparatus, a pair of comb-like electrodes are arranged on the lower side, and a coaxial probe that can move up and down is arranged on the upper side.

However, in this measuring apparatus, the pair of comb-like electrodes are formed on the same substrate, and there is a possibility that the external electrodes of the chip-type electronic component do not completely contact each of the electrodes, and the electronic With the miniaturization of parts, it is difficult to arrange a pair of comb-like electrodes at high density.
JP-A-8-51048 JP-A-9-89951

  SUMMARY OF THE INVENTION An object of the present invention is to provide a characteristic measuring apparatus that can measure the electrical characteristics of a chip-type electronic component reliably and with high accuracy, and simultaneously measure a plurality of types of characteristics.

In order to achieve the above object, a first invention is a characteristic measuring apparatus for measuring electrical characteristics of a chip-type electronic component having external electrodes at both ends, wherein the electronic component is vertically aligned with the external electrodes positioned in the vertical direction. A receiving plate having a plurality of receiving holes arranged in a matrix for receiving in a matrix; a common electrode that contacts a lower external electrode of an electronic component received in the receiving hole; and a receiving hole upper probe having an insulating plate, a contact and separation can be two measurement terminals to the upper external electrode of the electronic component housed in the housing hole having a through hole penetrating through the common electrode communicated with is provided in the upper and measuring unit, and a lower measuring unit is detachably a lower probe provided through the through hole in the lower external electrode of the electronic component housed in the housing hole, the common electrode, the upper-flop Characterized by comprising measuring means for measuring the electrical characteristics of the electronic component, the via over blanking and lower probe.

  In the characteristic measuring apparatus according to the first invention having the above-described configuration, in order to measure the electric characteristics of an electronic component with a four-terminal type using a common electrode, an upper probe having two measurement terminals, and a lower probe, Even with low-impedance electronic components, the measurement accuracy is improved, and a plurality of types of characteristics such as capacitance and insulation resistance can be measured simultaneously, thereby improving measurement efficiency. Further, it is not necessary to provide a comb-like finely crafted electrode, which can eliminate the possibility of contact failure of the external electrode of the electronic component, and can cope with downsizing of the electronic component.

  In the characteristic measuring apparatus according to the first invention, the common electrode may be arranged corresponding to a predetermined group of the accommodation holes. The characteristics can be measured independently for each predetermined group.

  Moreover, it is preferable that the upper probe has a coaxial measuring terminal that can move up and down independently of each other. With the coaxial structure, the electrical contact with the upper external electrode of the electronic component becomes more reliable.

  Further, the accommodation hole may be a rectangular hole slightly larger than the cross-sectional shape of the electronic component, or may be a circular hole having a diameter slightly larger than the diagonal dimension of the cross-sectional shape of the electronic component. If it is a circular hole, processing is easy.

According to a second aspect of the present invention, there is provided a characteristic measuring apparatus for measuring electrical characteristics of a chip-type electronic component having external electrodes at both ends thereof, and a matrix for accommodating the electronic components in a horizontal position in which the external electrodes are positioned in the horizontal direction. A receiving plate having a plurality of receiving holes arranged in a shape, a common electrode and an individual electrode that are in contact with each external electrode of the electronic component housed in the receiving hole are arranged on the surface and communicated with the receiving hole In addition, an insulating plate having a through hole penetrating each of the common electrode and the individual electrode, and a pair of probes that can be brought into and out of contact with each external electrode of the electronic component housed in each housing hole are provided. a lower measurement units, the common electrode, and further comprising a, a measuring means for measuring the electrical characteristics of the electronic component via the individual electrodes and the pair of the probes That.

  Even in the characteristic measuring apparatus according to the second invention configured as described above, the same effect as that of the characteristic measuring apparatus according to the first invention is obtained in order to measure the electric characteristics of the electronic component with the four-terminal type. Play.

  Embodiments of a characteristic measuring apparatus according to the present invention will be described below with reference to the accompanying drawings. In the embodiment described below, a multilayer capacitor is exemplified as the chip-type electronic component, but it goes without saying that it may be an inductor, an LC noise filter, a common mode choke coil, a high-frequency composite electronic component, or the like.

(Refer to the first embodiment, FIGS. 1 to 4)
As shown in FIG. 1, the characteristic measuring apparatus 1 generally includes a housing unit 10 for housing chip-type electronic components, a lower measuring unit 20, an upper measuring unit 30, a control unit 41, and a measuring unit 42. And a calculation unit 43 and a display unit 44.

  The chip-type electronic component that is the object to be measured is a multilayer capacitor 60 shown in FIG. 2, for example, and has external electrodes 61a and 61b at both ends of the multilayer body. By applying a voltage between the external electrodes 61a and 61b, the capacitance and the insulation resistance are measured.

  The housing unit 10 includes an insulating bottom plate 11 and an insulating housing plate 15 that is fixed on the bottom plate 11 in an overlapping manner. A large number of receiving holes 16 are formed in the receiving plate 15 in a matrix. The accommodation hole 16 is for accommodating the electronic component (multilayer capacitor 60) in a vertical position in which the external electrodes 61a and 61b are positioned in the vertical direction, and the depth thereof corresponds to the thickness of the accommodation plate 15. It is slightly larger than the length of the multilayer capacitor 60. Further, the upper edge portion of the accommodation hole 16 has a tapered shape that spreads upward so that the multilayer capacitor 60 can be easily transferred.

  Further, the horizontal cross-sectional shape of the accommodation hole 16 is a rectangular shape slightly larger than the cross-sectional shape of the multilayer capacitor 60 as shown in FIG. Alternatively, as shown in FIG. 3B, a circular shape having a diameter slightly larger than the diagonal dimension of the cross-sectional shape of the multilayer capacitor 60 may be used. The receiving hole 16 is easier to process if it is circular.

  A common electrode 12 is formed on the surface of the bottom plate 11, and the common electrode 12 is arranged corresponding to the two groups in the horizontal direction of the receiving holes 16. Further, through holes 13 are formed in the bottom plate 11 at positions corresponding to the respective accommodation holes 16, and the through holes 13 also penetrate the common electrode 12.

  The lower measurement unit 20 is provided with a plurality of lower probes 22 on an insulating holding plate 21, and is installed so as to be moved up and down by a drive mechanism (not shown). The lower probe 22 includes a single measurement terminal, is disposed at a position facing the accommodation hole 16, and is externally connected to the multilayer capacitor 60 accommodated in the accommodation hole 16 through the through hole 13 of the insulating plate 11 when raised. 61a is in electrical contact.

  The upper measurement unit 30 is provided with a plurality of upper probes 32 on an insulating holding plate 31, and is installed so as to be moved up and down by a drive mechanism (not shown). The upper probe 32 includes two measurement terminals 32a and 32b as shown in FIG. 2, and is arranged at a position facing the accommodation hole 16. When the upper probe 32 is lowered, the outer electrode of the multilayer capacitor 60 is accommodated in the accommodation hole 16. 61b is in electrical contact. The positional relationship between the external electrode 61b and the probe 32 (measurement terminals 32a and 32b) at the time of contact is shown in FIGS. 3 (A) and 3 (B).

  Further, a measurement probe 33 is provided on the side of the upper measurement unit 30. The measurement probe 33 is in electrical contact with one end of the common electrode 12 when lowered.

  Incidentally, the relationship among the diameter of the lower probe 22, the diameter of the through-hole 13, the opening diameter a of the common electrode 12, and the size of the multilayer capacitor 60 on the plane is as shown in FIG. In FIG. 4, the hatched portion indicates the common electrode 12.

  The control unit 41 is configured by a known microcomputer, and controls the operation of each unit of the characteristic measurement device 1 based on a preset program.

  The measurement unit 42 is configured by a known capacitance measuring instrument or insulation resistance meter, and is accommodated in the accommodation hole 16 according to a predetermined procedure by switching an electronic switch (not shown) by a control signal from the control unit 41. The capacitance and insulation resistance of the multilayer capacitor 60 are measured, and the measurement result is sent to the calculation unit 43.

  The calculation unit 43 is configured by a known microcomputer, determines the quality of each multilayer capacitor 60 based on the measurement value obtained by the measurement unit 42, and displays the measurement / determination result on the display 44.

  Next, a method for measuring the characteristics of the multilayer capacitor 60 using the characteristic measuring apparatus 1 having the above configuration will be described.

  First, as shown in FIG. 2, the multilayer capacitor 60 is transferred into each of the accommodation holes 16 in a vertically placed state in which the external electrodes 61a and 61b are positioned in the vertical direction. This transfer is performed, for example, by applying vibration to the multilayer capacitor 60 by a well-known method. In the transferred multilayer capacitor 60, the external electrode 61a provided at one end is in electrical contact with the common electrode 12. Is accommodated in the accommodation hole 16.

  Next, the upper measurement unit 30 is lowered, the measurement terminals 32 a and 32 b of the upper probe 32 are in electrical contact with the external electrode 61 b of the multilayer capacitor 60, and the measurement probe 33 is electrically connected to one end of the common electrode 12. To touch.

  Thereafter, the lower measurement unit 20 is raised, and the lower probe 22 is in electrical contact with the external electrode 61 a of the multilayer capacitor 60 through the through hole 13. As shown in FIG. 4, the common electrode 12 and the through hole 13 are formed so as not to contact each other, and the lower probe 22 and the common electrode 12 are in an insulated state.

  The measurement setting is thus completed, and a measurement voltage is applied between the upper probe 32 and the common electrode 12, or a measurement voltage is applied between the upper probe 32 and the lower probe 22, and each multilayer capacitor is sequentially applied. A capacitance of 60 is measured. Further, the insulation resistance of the multilayer capacitor 60 is measured for each common electrode 12 (in other words, for each multilayer capacitor 60 accommodated in the two rows of accommodation holes 16). Alternatively, the insulation resistance may be measured for each multilayer capacitor 60 between the upper probe 32 and the lower probe 22.

  When all the measurements are completed, an end signal is output from the control unit 41, and the upper measurement unit 30 and the lower measurement unit 20 are moved up and down to return to their original positions. Thereafter, the multilayer capacitor 60 is taken out from the respective accommodation holes 16 by a method such as blowing air from the through holes 13. In addition, the multilayer capacitor 60 having a poor measurement result is excluded for each lot or individually by an air suction method or the like.

  In the first embodiment, since the electrical characteristics of the multilayer capacitor 60 are measured by a four-terminal type using the upper probe 32 and the lower probe 22 having the common electrode 12 and the two measurement terminals 32a and 32b, a low impedance component is used. Even in such a case, the measurement accuracy is improved, and a plurality of types of characteristics such as capacitance and insulation resistance can be measured at the same time, thereby improving the measurement efficiency. Since the common electrode 12 contacts the external electrode 61a of the multilayer capacitor 60 in a ring shape, there is no possibility of causing a contact failure.

  In addition, since the common electrode 12 is installed independently for every two rows of the accommodation holes 16, it is possible to simultaneously perform different types of measurements for each of the two rows of multilayer capacitors 60, thereby increasing the measurement efficiency. It becomes.

(Refer 2nd Example and FIGS. 5-7)
As shown in FIG. 5, the characteristic measuring apparatus 2 according to the second embodiment is the same as the characteristic measuring apparatus 1 according to the first embodiment, as shown in FIG. , 32d. Other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are used in FIG.

  The characteristic measuring apparatus 2 has the same effect as that of the characteristic measuring apparatus 1 according to the first embodiment. However, by adopting a coaxial structure with respect to the upper probe 32, the upper probe 32 further includes the multilayer capacitor 60. The effect of being in stable electrical contact with the external electrode 61b is obtained.

  That is, as shown in FIG. 6, when the position of the multilayer capacitor 60 is shifted to the state indicated by the dotted line in the accommodation hole 16, either of the contacts may be insufficient at the measurement terminals 32 a and 32 b of the first embodiment. (See FIG. 6A). However, in the measurement terminals 32c and 32d having the coaxial structure, a sufficient contact area can be ensured because the measurement terminal 32d on the outer peripheral side as well as the measurement terminal 32c on the inner peripheral side are annular. (See FIG. 6B). In FIG. 6, the contact portion is hatched. The same applies to FIG. 7 shown below.

  Further, as shown in FIG. 7, even when the multilayer capacitor 60 rotates in the state indicated by the dotted line in the accommodation hole 16 and the positional deviation occurs, the contact area is reduced in the measurement terminals 32a and 32b ( The contact area does not decrease at the measurement terminals 32c and 32d (see FIG. 7A) (see FIG. 7B).

(Refer to the third embodiment, FIG. 8)
As shown in FIG. 8, the characteristic measuring apparatus 3 according to the third embodiment is configured such that the multilayer capacitor 60 is transferred into the receiving hole 16 in a state in which the external electrodes 61a and 61b are horizontally positioned. .

  Specifically, the characteristic measuring device 3 includes a housing unit 10 including an insulating bottom plate 11 and an insulating housing plate 15, a lifting jig 45 that can be raised and lowered, and probes 35 and 36 that can be raised and lowered. .

  A large number of receiving holes 16 are formed in the receiving plate 15 in a matrix. Electrodes 12 a and 12 b are formed on the bottom plate 11, and a through hole 13 is formed at a position corresponding to the accommodation hole 16. The electrodes 12a and 12b are electrically insulated and are in an independent state. For example, the electrode 12a functions as a common electrode and the electrode 12b functions as an individual electrode.

  Further, as described in the first embodiment, the control unit 41, the measurement unit 42, the calculation unit 43, and the display 44 are provided.

  The measurement is performed as follows. First, when the multilayer capacitor 60 is horizontally placed into the accommodation hole 16 and pressed by the holding jig 45, the external electrodes 61a and 61b are in a state of being in electrical contact with the electrodes 12a and 12b. Retained. Next, the probes 35 and 36 are raised through the through hole 13 and are in electrical contact with the external electrodes 61a and 61b.

  In this state, a measurement voltage is applied to the external electrodes 61a and 61b from the electrodes 12a and 12b and the probes 35 and 36, and the capacitance and insulation resistance of the multilayer capacitor 60 are measured.

  Also in the characteristic measuring apparatus 3 which is the third embodiment, the electric characteristic of the multilayer capacitor is measured with a four-terminal type. Accordingly, the function and effect are the same as those of the characteristic measuring apparatus 1 according to the first embodiment.

(Other examples)
In addition, this invention is not limited to the said Example, It can change variously within the range of the summary.

  For example, in the first embodiment, the common electrode 12 is electrically provided independently for each group of the two rows of the accommodation holes 16, but may be one row or every group of three or more rows. May be provided electrically independently.

It is a schematic block diagram which shows the characteristic measuring apparatus which is 1st Example of this invention. It is sectional drawing which shows the principal part of the said 1st Example. (A), (B) is explanatory drawing which shows the positional relationship of an accommodation hole, a multilayer capacitor, and a probe in the said 1st Example. It is explanatory drawing which shows the positional relationship of a through-hole, a common electrode, a multilayer capacitor, and a probe in the said 1st Example. It is sectional drawing which shows the principal part of the characteristic measuring apparatus which is 2nd Example of this invention. It is explanatory drawing which shows the position shift of the multilayer capacitor in an accommodation hole, and the contact state of a probe, (A) is related with 1st Example, (B) is related with 2nd Example. It is explanatory drawing which shows the position shift of the multilayer capacitor in an accommodation hole, and the contact state of a probe, (A) is related with 1st Example, (B) is related with 2nd Example. It is sectional drawing which shows the principal part of the characteristic measuring apparatus which is 3rd Example of this invention. It is a disassembled perspective view of the tray for a measurement used for the conventional characteristic measuring apparatus. It is sectional drawing which shows the measurement state in the conventional characteristic measuring apparatus.

Explanation of symbols

1, 2, 3 ... Characteristic measuring device 10 ... Housing unit 11 ... Bottom plate (insulating plate)
12 ... Common electrode
12a ... Common electrode
12b ... Individual electrode 13 ... Through hole 15 ... Housing plate 16 ... Housing hole
20 ... Lower measurement unit 22 ... Lower probe
30 ... Upper measurement unit 32 ... Upper probe 32a to 32d ... Measurement terminal 60 ... Multilayer capacitor 61a, 61b ... External electrode

Claims (6)

In a characteristic measuring device for measuring the electrical characteristics of a chip-type electronic component having external electrodes at both ends,
A receiving plate having a large number of receiving holes arranged in a matrix for receiving the electronic component in a vertical position in which the external electrodes are positioned in the vertical direction;
An insulating plate having a through hole penetrating the common electrode while being arranged on the surface with a common electrode in contact with a lower external electrode of the electronic component housed in the housing hole;
An upper measurement unit provided with an upper probe having two measurement terminals capable of contacting and separating from the upper external electrode of the electronic component housed in each housing hole;
A lower measurement unit provided with a lower probe that can be contacted and separated through the through hole to the lower external electrode of the electronic component housed in each housing hole;
Measuring means for measuring electrical characteristics of the electronic component via the common electrode, upper probe and lower probe;
A characteristic measuring apparatus comprising:   The characteristic measuring apparatus according to claim 1, wherein the common electrode is arranged corresponding to a predetermined group of the accommodation holes.   The characteristic measurement apparatus according to claim 1, wherein the upper probe includes a coaxial measurement terminal that can move up and down independently of each other.   The characteristic measuring device according to claim 1, wherein the housing hole is a rectangular hole that is slightly larger than a cross-sectional shape of the electronic component.   4. The characteristic measuring apparatus according to claim 1, wherein the housing hole is a circular hole having a diameter slightly larger than a diagonal dimension of a cross-sectional shape of the electronic component. In a characteristic measuring device for measuring the electrical characteristics of a chip-type electronic component having external electrodes at both ends,
A receiving plate having a large number of receiving holes arranged in a matrix for receiving the electronic component in a horizontal orientation in which the external electrodes are positioned in the horizontal direction;
A common electrode and an individual electrode that are in contact with each external electrode of the electronic component housed in the housing hole are arranged on the surface, and a through-hole that communicates with the housing hole and penetrates the common electrode and the individual electrode, respectively. An insulating plate having
A lower measurement unit provided with a pair of probes that can be brought into and out of contact with each external electrode of the electronic component accommodated in each accommodation hole;
Measuring means for measuring electrical characteristics of the electronic component via the common electrode, the individual electrode and a pair of probes;
A characteristic measuring apparatus comprising:

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