JP4067523B2 - High frequency module - Google Patents

Description

  The present invention relates to a high-frequency module suitable for use in a voltage controlled oscillator and the like, and a measuring method thereof.

  FIG. 4 is a cross-sectional view of the main part of a conventional high-frequency module, FIG. 5 is an explanatory view showing a measurement method of the conventional high-frequency module, and the configuration of the conventional high-frequency module will now be described with reference to FIG. A rectangular circuit board 52 is mounted in a frame 51 having a shape, and a plurality of through holes 52 a are provided in the circuit board 52, and measurement lands are provided on both surfaces of the circuit board 52. A wiring pattern 53 having a portion 53a is provided, and although not shown here, various electronic components (not shown) are mounted on the wiring pattern 53 to form a desired electric circuit.

  The upper and lower covers 54 and 55 made of a metal plate are attached to the frame 51 so as to close the upper and lower openings of the frame 51, and the lower covers 54 and 55 are formed through the through holes 52 a of the circuit board 52. The conventional high-frequency module is formed with holes 54a and 55a provided at positions facing each other. (See Patent Document 1)

  However, the conventional high-frequency module requires the frame 51 and the upper and lower open portions of the frame 51, and requires the lower covers 54 and 55, which increases the number of parts, increases the cost, and increases the size. Since the holes 54a and 55a are provided in the upper and lower covers 54 and 55, the electrical shield is deteriorated.

  Next, a conventional method for measuring a high-frequency module will be described with reference to FIG. 5. First, after the high-frequency module is placed (set) on the holding table 56, the guide bar 58 attached to the support member 57 is moved upward. The guide rod 58 is inserted into the holes 54a and 55a of the upper and lower covers 54 and 55 and the through hole 52a of the circuit board 52, and the high-frequency module is positioned in the lateral direction.

  Next, the probe 59 attached to the support member 57 is brought into contact with the measurement land portion 53a through the hole 55b of the lower cover 55, and is electrically passed through a measuring instrument (not shown) connected to the probe 59. Measurement is to be performed. (See Patent Document 1)

However, in the conventional high frequency module measurement method, the high frequency module can be positioned in the lateral direction by the guide rod 58, but the inclination (set state) of the high frequency module with respect to the holding base 56 cannot be confirmed. A situation occurs in which measurement is performed in a state in which the land portion 53a is not in contact with the land portion 53a. Therefore, a measurement error occurs and accurate measurement cannot be performed.
In addition, since the upper and lower covers 54 and 55 are provided, a mounting error is likely to occur when the high-frequency module is set on the holding table 56.

JP-A-10-282172

  The conventional high-frequency module requires the frame 51 and the upper and lower open portions of the frame 51, and requires the lower covers 54 and 55, which increases the number of parts, increases the cost, and increases the size. Since the lower covers 54 and 55 are provided with holes 54a and 55a, there is a problem that the electrical shield is deteriorated.

  In the conventional high frequency module measurement method, the high frequency module can be positioned in the lateral direction by the guide rod 58, but the inclination (set state) of the high frequency module with respect to the holding base 56 cannot be confirmed. There is a situation in which measurement is performed without contacting the land portion 53a. Therefore, a measurement error occurs and accurate measurement cannot be performed, and the upper and lower covers 54 and 55 are provided. When setting on the base 56, there exists a problem that it becomes easy to make mounting mistake.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a high-frequency module that is inexpensive, can be miniaturized, has a good shielding effect, and can perform an accurate measurement, and a measuring method thereof.

  As a first means for solving the above problems, a circuit board comprising a multilayer substrate in which a wiring pattern having a land portion is provided and an electronic component is connected to the wiring pattern provided on the upper surface; A box-shaped cover attached to the circuit board in a state of covering the electronic component, and the lower surface of the circuit board has the land portion for external connection, a plurality of bottomed recesses, and the recesses A conductive land portion formed by a part of the wiring pattern is provided, and a plurality of conductive land portions or / and the conductive land portion and the land portion are electrically connected. It was.

As a second solving means, the circuit board has a square shape, the land portions are disposed along the four sides of the lower surface, and the cavity is provided in the cavity provided on the lower surface of the circuit board. The flip chip component is attached and the concave portion is provided between the land portion and the cavity.
As a third solution, the conductive land portion is connected to the land portion for a power supply terminal or a ground terminal.

  As a fourth solution, the high-frequency module according to any one of claims 1 to 3, a plurality of probes connectable to the land portion, and inserted into the recess and connectable to the conductive land portion A plurality of guide pins, a probe and a measuring instrument connected to the guide pins, and the plurality of guide pins are inserted into the recesses to position the high-frequency module, and between the guide pins, Alternatively, the measurement method is such that the conduction state is checked between the guide pin and the probe so that the set state at the start of measurement of the high-frequency module can be confirmed.

  As a fifth solution, the guide pin is connected to the conductive land portion before the probe is connected to the land portion.

The high-frequency module according to the present invention includes a circuit board including a multilayer substrate in which a wiring pattern having a land portion is provided and an electronic component is connected to the wiring pattern provided on the upper surface, and a circuit in a state where the electronic component is covered. A box-shaped cover attached to the board, and the lower surface of the circuit board is provided with a land portion for external connection, a plurality of recessed portions with bottoms, and a bottom surface of the recessed portion, and is composed of a part of the wiring pattern. The conductive land portion is provided, and a plurality of conductive land portions or / and a conductive land portion and a land portion are electrically connected.
That is, since the high-frequency module of the present invention is composed of a circuit board and a single cover, the number of parts is less than that of the conventional structure, and the cost can be reduced, and the recess provided on the lower surface of the circuit board. Can be used for positioning at the time of measurement, and can provide a shield effect better than a conventional cover provided with a hole.
In addition, the configuration in which the conduction land portions or / and the conduction land portion and the land portion are conducted can confirm the set state (tilt state) of the high-frequency module at the start of measurement, and thus there is no measurement error. Accurate measurement is possible.

  In addition, the circuit board has a square shape, the land portion is disposed along the four sides of the lower surface, and the flip chip component is mounted in the cavity provided on the lower surface of the circuit board, and the concave portion is the land. Since it is provided between the cavity and the cavity, it can be miniaturized by storing the flip chip component in the cavity, and the recess is provided between the land and the cavity, so that an empty space is effective. It can be used for a small size.

  In addition, since the conduction land is connected to the land for the power supply terminal or the ground terminal, the conduction line for confirming the set state of the high frequency module is connected to the DC power supply terminal or / and the ground terminal. Therefore, accurate measurement can be performed without affecting the high-frequency line.

Also provided with a high frequency module, a plurality of probes connectable to the land portion, a plurality of guide pins inserted into the recesses and connectable to the conductive land portion, and a measuring instrument connected to the probe and the guide pins, The guide pin is inserted into the recess to position the high frequency module, and the conduction state between the guide pin and / or between the guide pin and the probe can be checked to confirm the set state at the start of measurement of the high frequency module. As a result, the high-frequency module can be positioned laterally with the guide pins, and the conduction state between the guide pins or / and between the guide pins and the probe is checked, and the set state at the start of measurement of the high-frequency module Can be measured accurately without measurement errors.
In addition, since the high-frequency module is configured with a circuit board on the lower side and a cover on the upper side, the mounting side on the holding table is clarified, and mounting errors can be eliminated as compared with the prior art.

  In addition, since the guide pin is connected to the conductive land before the probe is connected to the land, the set state at the start of measurement of the high frequency module is confirmed before the probe is connected to the land. Therefore, the measurement work is easy and a quick operation of the measurement work can be obtained.

  Referring to the drawings of the high-frequency module of the present invention and the measuring method thereof, FIG. 1 relates to the high-frequency module of the present invention, and is a partially cut front view, FIG. 2 is a bottom view of the high-frequency module of the present invention, FIG. It is explanatory drawing which shows the measuring method of the high frequency module of this invention.

  Next, the configuration of the high-frequency module according to the present invention will be described with reference to FIGS. 1 and 2. A quadrangular circuit board 1 made of a multilayer board has a plurality of elements provided from the upper surface 1a toward the lower surface 1b. Between the cavity 1d and the land portion 3a described later, between the cavity 1d and the side surface 1e, the bottom recessed portion 1c, the concave cavity 1d provided on the lower surface 1b, and the lower surface 1b are provided. And a plurality of bottomed recesses 1f.

  The circuit board 1 is made of a ceramic formed by low-temperature firing or the like, or a thermoplastic resin made of glass epoxy or the like. Between the upper surface 1a and the lower surface 1b of the circuit board 1 and between the layers, the wiring pattern 2 is formed. The wiring pattern 2 has a plurality of land portions 3a provided on the lower surface 1b along the four sides of the quadrangular shape and a conductive land portion 3b provided on the bottom surface of the recess 1f.

The land portion 3a provided on the lower surface 1b includes a power terminal and a ground terminal, and is used as an external connection terminal. The conductive land portion 3b provided on the bottom surface of the recess 1f is electrically connected. The land portions 3b are in a conductive state or / and the conductive land portion 3b and the land portion 3a are in a conductive state.
At this time, the land portion 3a connected to the conductive land portion 3b is preferably the land portion 3a for the power supply terminal or the ground terminal.
The land portion 3a is connected to the wiring pattern 2 by a connection conductor 4 such as a through hole, and is led out to the lower surface 1b for external connection.

  On the wiring pattern 2 provided on the upper surface 1a of the circuit board 1 having such a configuration, various electronic components 5 such as chip capacitors and resistors are soldered, and the flip chip component 6 is mounted on the lower surface 1b. A desired electric circuit is formed by being connected to the wiring pattern 2 by a bump or the like while being housed in the cavity 1d.

The box-shaped cover 7 made of a metal plate includes an upper surface plate 7a, four side surface plates 7b bent downward from four sides of the upper surface plate 7a, and four projecting portions 7c extending downward from the side surface plate 7b. .
The cover 7 covers the upper surface 1a of the circuit board 1 and the electronic component 5, and the protrusion 7c is inserted into the recess 1c and the cover 7 is positioned. The pattern 2 is attached to the circuit board 1 by soldering or the like.

  In the high-frequency module of the present invention having such a configuration, the lower surface 1b of the circuit board 1 is placed on the mother substrate 8, and the external connection land portion 3a provided on the lower surface 1b is a circuit (see FIG. (Not shown) is connected by soldering.

  Next, the high-frequency module measurement method of the present invention will be described with reference to FIG. 3. First, as shown in FIG. 3, as a measuring device 11, a holding base 12 made of an insulating material for holding the high-frequency module; A plurality of probes 13 connectable to the land portion 3a, a plurality of guide pins 14 inserted into the recess 1f and connectable to the conductive land portion 3b, and a measuring instrument 15 to which the probe 13 and the guide pins 14 are connected prepare.

  Then, the high-frequency module is placed (set) on the holding base 12 with the circuit board 1 side of the high-frequency module facing down. In this process, first, a plurality of guide pins 14 are inserted into the recess 1f. As a result, the high-frequency module is positioned in the lateral direction.

Next, the high-frequency module is placed (set) on the holding table 12, the guide pin 14 comes into contact with the conduction land portion 3 b, and the measurement state is confirmed by measuring the conduction state between the guide pins 14. It is possible to confirm that the set state at the start, that is, the high-frequency module is not inclined with respect to the holding table 12 and is in a normal state.
As a result, even if the next operation, that is, the movement of the probe 13 is performed, it can be determined that the probe 13 can accurately contact the land portion 3a.

The relationship between the guide pin 14 and the recess 1f may be such that the guide pin 14 is inserted into the recess 1f after the high-frequency module is placed (set) on the holding table 12.
Next, the probe 13 is brought into contact with the land portion 3a, and electrical measurement is performed through the measuring device 15 connected to the probe 13.

  In the above embodiment, the set state at the start of measurement is confirmed by conduction between the guide pins 14, but the guide pin 1 is brought into contact with the conduction land portion 3b and the probe 13 is brought into contact with the land portion 3a. The contact state between the probe 13 and the guide pin 14 in the contacted state is used to check the set state at the start of measurement, or the conduction between the guide pin 14 and the conduction between the probe 13 and the guide pin 14 are combined. Thus, the set state at the start of measurement may be confirmed.

The front view which concerns on the high frequency module of this invention, and cut | disconnected a part. The bottom view of the high frequency module of the present invention. Explanatory drawing which shows the measuring method of the high frequency module of this invention. Sectional drawing of the principal part of the conventional high frequency module. Explanatory drawing which shows the measuring method of the conventional high frequency module.

Explanation of symbols

1: Circuit board 1a: Upper surface 1b: Lower surface 1c: Recessed portion 1d: Cavity 1e: Side surface 1f: Recessed portion 2: Wiring pattern 3a: Land portion 3b: Conductive land portion 4: Connection conductor 5: Electronic component 6: Flip chip component 7 : Cover 7a: Top plate 7b: Side plate 7c: Projection 8: Mother board 11: Measuring device 12: Holding stand 13: Probe 14: Guide pin 15: Measuring instrument

Claims (5)

A wiring board having a land portion is provided, and a circuit board configured by a multilayer board in which electronic components are connected to the wiring pattern provided on the upper surface, and attached to the circuit board in a state of covering the electronic parts. A box-shaped cover, and the lower surface of the circuit board is provided on the land portion for external connection, a plurality of bottomed concave portions, and a bottom surface of the concave portion, and is configured by a part of the wiring pattern. The high-frequency module is characterized in that a conductive land portion is provided, and a plurality of the conductive land portions, or / and the conductive land portion and the land portion are electrically connected. The circuit board has a square shape, the land portion is disposed along the four sides of the lower surface, and a flip chip component is attached in a cavity provided on the lower surface of the circuit board, The high frequency module according to claim 1, wherein the concave portion is provided between the land portion and the cavity. The high-frequency module according to claim 1, wherein the conductive land portion is connected to the land portion for a power supply terminal or a ground terminal. 4. The high-frequency module according to claim 1, a plurality of probes connectable to the land portion, a plurality of guide pins inserted into the recess and connectable to the conductive land portion, and the probe A measuring instrument connected to the guide pin, and a plurality of the guide pins are inserted into the recesses to position the high-frequency module, and between the guide pins and / or between the guide pins and the probe. A method for measuring a high-frequency module, wherein the conduction state is checked to confirm a set state at the start of measurement of the high-frequency module. 5. The method of measuring a high frequency module according to claim 4, wherein the guide pin is connected to the conductive land portion before the probe is connected to the land portion.

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