JP4225162B2 - Sealing film - Google Patents

Description

  The present invention relates to a sealing film used for protecting and filling a semiconductor device, in particular, a semiconductor chip having a protruding electrode, having a protective function and filling properties.

  Conventionally, electronic devices have been reduced in size and weight, and accordingly, high-density mounting on a substrate has been required, and semiconductor packages mounted on electronic devices have been reduced in size, thickness, and weight. Yes. Conventionally, there are packages called LOC (Lead On Chip), QFP (Quad Flat Package) and the like, and CSP (Chip Size Package) and μBGA (Ball Grid) which are further downsized and lighter than packages such as LOC and QFP. Array) and the like have been developed. Recently, flip-chips and wafer level CSPs, which are so-called face-down packages, in which the circuit surface of a semiconductor element is directed to the semiconductor wiring substrate side have been developed.

  In the above-described package, a sealed package is obtained by molding a solid epoxy resin sealing material by a transfer molding method. However, molding when the package is thin or large is difficult. In addition, when the content of the inorganic filler increases, the melt viscosity at the time of transfer molding generally increases, resulting in a decrease in the quality of the molded product, such as residual voids in the molded product, poor filling of the mold, increased wire flow and stage shift. Problems occur.

In recent years, some flip-chips, wafer level CSPs, and the like have protruding electrodes, and a sealing material is sometimes used to protect the protrusions and fill the protrusions. Molding with a sealing material was difficult. Therefore, a film-like sealing sheet mainly composed of an epoxy resin and an inorganic filler has been proposed (for example, see Patent Documents 1 to 3).
JP-A-5-283456 Japanese Patent Laid-Open No. 5-190697 Japanese Patent Laid-Open No. 8-73621

  The film-like sealing sheet has problems such as an increase in warpage when a package or a wafer becomes large, and a sealing film having a smaller linear expansion coefficient has been desired. Usually, in order to reduce the linear expansion coefficient, a large amount of an inorganic filler such as silica having a smaller linear expansion coefficient than that of the resin is filled, but this method reduces the flexibility of the film. In addition, there is a problem that the melt viscosity is increased and the fluidity is also decreased.

  Until now, a sealing film having high flexibility, high fluidity, and low melt viscosity and low linear expansion coefficient has not been obtained. The present invention has been made in order to solve the above-mentioned problems, and has a feature that flexibility and fluidity are large in a B-stage state, and a linear expansion coefficient is small after curing. An object of the present invention is to provide a sealing film having excellent protective properties.

By using a thermosetting component with a softening point of −40 ° C. to 30 ° C., an inorganic filler, and a high molecular weight component that phase-separates into an island shape after curing, the handling property before curing is good, and the linear expansion after curing It has been found that a film having a small coefficient can be obtained. Furthermore, in order to achieve the above object, the present invention is configured as follows.
(1) A thermosetting component containing an epoxy resin and a curing agent, an epoxy group-containing acrylic rubber having a weight average molecular weight of 100,000 or more that dissolves with the thermosetting component before curing and phase-separates into an island shape after curing. A sealing film containing a molecular weight component and an inorganic filler, wherein the inorganic filler is 60 to 80% by volume of the whole, and the high molecular weight component is 5 to 30% by weight with respect to 100 parts by weight of the thermosetting component. Part of the film for sealing, characterized in that it is contained.
( 2 ) The sealing film according to (1 ), wherein a colorant is contained in an amount of 0.1 to 10% by weight.
( 3 ) The melt viscosity in the B stage state of the sealing film is 10 Pa · s or more and 10,000 Pa · s or less in the range of 100 ° C. or more and 200 ° C. or less, and the tack strength of at least one surface is 25 ° C. As mentioned above, the film for sealing in any one of (1)-( 2 ) which is 50 gf or more in the range of 120 degrees C or less, and the linear expansion coefficient after hardening is 1 or more and 20 ppm / degrees C or less.

  According to the present invention, it is possible to provide a sealing film that has a suitable tack before curing, good handleability, a low linear expansion coefficient after curing, and excellent protection characteristics on the surface of a semiconductor element.

The film for sealing of the present invention contains a high molecular weight component having a weight average molecular weight of 100,000 or more, which is dissolved with a thermosetting component before curing and phase-separated into an island shape after curing. The film for sealing of the present invention contains a thermosetting component and a dissolved high molecular weight component in a B-stage state before curing in order to improve the handleability in a sheet form. Further, the high molecular weight component is phase-separated into an island shape after curing in order to reduce the linear expansion coefficient.

As the high molecular weight component which is dissolved with the thermosetting component before curing and phase-separates into an island shape after curing, specifically, those having a solubility parameter value of 1 or more from the thermosetting component can be mentioned. It is done. After curing is less than 1 even without phase separation, resulting in lowering of the modulus of elasticity is not preferable because an increase in linear expansion coefficient occurs. The solubility parameter is generally called SP (solubility parameter) and is a scale indicating the degree of hydrophilicity or hydrophobicity of the resin, and is an important scale for judging compatibility between resins. It will be. Solubility parameters are reported in Polym. Eng. Sci. , Vol. 14 [pp. 147 to 154] and a value [unit: (MJ / m ³ ) ^1/2 ] calculated in accordance with the Fedors method.

The high molecular weight component that can be used in the present invention is particularly limited as long as it is dissolved with the thermosetting component before curing, phase-separates into an island shape after curing, and the weight average molecular weight is 100,000 or more. There is no.

  In the present invention, the weight average molecular weight of the high molecular weight component used is 100,000 or more, particularly preferably 300,000 to 3,000,000, and more preferably 500,000 to 2,000,000. When the weight average molecular weight is 100,000 or more, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the circuit filling property of wiring can be ensured because the flow property is appropriate. In the present invention, the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

  Such high molecular weight components include polyimide resin, (meth) acrylic resin, urethane resin, polyphenylene ether resin, polyetherimide resin, phenoxy resin, modified polyphenylene ether resin, polystyrene resin, polyethylene resin, polyester resin, polyamide resin, butadiene Examples thereof include, but are not limited to, rubber, acrylic rubber, polycarbonate resin, polyphenylene ether resin, and mixtures thereof.

  Among them, the glass transition temperature (hereinafter referred to as “Tg”) of acrylic rubber (polymer), which is a high molecular weight component, is preferably from −50 ° C. to 10 ° C. This is because when the Tg is −50 ° C. or higher, the tackiness of the adhesive layer of the sealing film in the B-stage state is appropriate, and there is no problem in handleability. Moreover, when manufacturing high molecular weight components, such as an acrylic rubber (polymer), using a monomer, there is no restriction | limiting in particular as the polymerization method, For example, methods, such as pearl polymerization and solution polymerization, can be used.

  Moreover, the quantity of a high molecular weight component is 5-30 weight part with respect to 100 weight part of thermosetting components. If it is less than 5 parts by weight, the strength of the film before curing is low, the elongation of the film becomes small, and the handling property is lowered, which is not preferable. On the other hand, when the amount exceeds 30 parts by weight, the high molecular weight component does not phase-separate into islands, becomes a continuous phase, and fluidity decreases, which is not preferable.

  For the purpose of reducing the linear expansion coefficient of the sealing film, improving the mechanical strength, and improving the laser marking property, the sealing film of the present invention contains 60 to 80% by volume of an inorganic filler. As an inorganic filler, it is preferable that the linear expansion coefficient in room temperature (25 degreeC) is 10 ppm or less. For example, examples of the inorganic filler that can be used include crystalline silica, amorphous silica, aluminum oxide, calcium carbonate, magnesium carbonate, aluminum nitride, and boron nitride. Moreover, it is necessary to make content of an inorganic filler into 60-80 volume%, and it is preferable to set it as 65-75 volume%. When the content of the inorganic filler is less than 60% by volume, the linear expansion coefficient increases, which is not preferable. When the content of the inorganic filler exceeds 80% by volume, the sealing film becomes brittle and the moldability decreases, and silicon Problems such as a decrease in adhesive strength with the wafer occur.

  There is no restriction | limiting in particular as a thermosetting component of the resin composition used for the film for sealing of this invention, if a softening point is -40 degreeC-30 degreeC. Examples of the thermosetting component that can be used include an epoxy resin, a cyanate resin, a phenol resin, and a curing agent thereof, and an epoxy resin is preferable in terms of high heat resistance. As the epoxy resin, a bifunctional epoxy resin such as bisphenol A type epoxy, a novolac type epoxy resin such as a phenol novolac type epoxy resin or a cresol novolak type epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be applied.

  As the bisphenol A type epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 807, 815, 825, 827, 828, 834, 1001, 1004, 1007, 1009, Dow Chemical Co., trade name: DER- 330, 301, 361, manufactured by Tohto Kasei Co., Ltd., trade names: YD8125, YDF8170, and the like.

  As the phenol novolac type epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 152,154, Nippon Kayaku Co., Ltd., trade name: EPPN-201, Dow Chemical Company, trade name: DEN-438, etc. However, as an o-cresol novolak type epoxy resin, Nippon Kayaku Co., Ltd., trade name: EOCN-102S, 103S, 104S, 1012, 1025, 1027, Toto Kasei Co., Ltd., trade name: YDCN701,702 , 703, 704 and the like.

  As the polyfunctional epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epon 1031S, Ciba Specialty Chemicals, trade name: Araldite 0163, Nagase Kasei Co., Ltd., trade name: Denacol EX-611, 614 614B, 622, 512, 521, 421, 411, 321 and the like. As amine type epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 604, Toto Kasei Co., Ltd., trade name: YH-434, Mitsubishi Gas Chemical Co., Ltd., trade names: TETRAD-X, TETRAD- C, manufactured by Sumitomo Chemical Co., Ltd., trade name: ELM-120 and the like.

  Examples of the heterocyclic ring-containing epoxy resin include a product name: ERL4234, 4299, 4221, 4206, etc., manufactured by UCC, such as a product name: Araldite PT810 manufactured by Ciba Specialty Chemicals.

  These epoxy resins can be used alone or in combination of two or more. When two or more types of epoxy resins are used in combination, even if an epoxy resin having a softening point exceeding 30 ° C. is included, the softening point of the thermosetting component that is a mixture of these resins should be −40 ° C. or higher and lower than 30 ° C. Can be used.

  Moreover, as the hardening | curing agent of the epoxy resin contained in a thermosetting component, the well-known hardening | curing agent used normally can be used. For example, bisphenols having two or more phenolic hydroxyl groups in one molecule such as amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, and bisphenol S, phenol novolac resins, bisphenol A Examples thereof include phenolic resins such as novolak resin or cresol novolak resin.

  Phenol resins such as phenol novolac resin, bisphenol A novolak resin, and cresol novolac resin are particularly preferable in terms of excellent electric corrosion resistance when absorbing moisture. Preferable phenol resin curing agents include, for example, Dainippon Ink & Chemicals, Inc., trade names: Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite Light VH4170 etc. are mentioned.

  Moreover, the film for sealing of this invention may contain a hardening accelerator, a catalyst, an additive, a coupling agent, etc. other than said thermosetting component and high molecular weight component. Further, the sealing film preferably has a transmittance of 10% or less in a wavelength region of 300 to 1100 nm. For that purpose, it preferably has a fine phase separation structure and is opaque. Therefore, the sealing film preferably contains a colorant, and as the colorant, for example, carbon black, graphite, titanium carbon, manganese dioxide, phthalocyanine-based pigments and dyes can be used. As for content of the coloring agent contained in the film for sealing, 0.1 to 10 weight% is preferable, More preferably, it is 0.5 to 2.0 weight%. When the content of the colorant is less than 0.1% by weight, the film is not colored and the visibility of the laser marking part is deteriorated. Conversely, when the content of the colorant exceeds 10% by weight, ionic impurities This causes problems such as an increase in film thickness, a decrease in film ductility, or a decrease in adhesive strength with semiconductor elements.

  Further, since the laser used for laser marking is often a YAG laser, it is preferable to use carbon black that is easily volatilized by the YAG laser as a colorant.

  The sealing film of the present invention is preferably prepared by applying and drying a resin varnish containing the thermosetting component, the high molecular weight component, the colorant and the inorganic filler on the base material layer. As a base material layer used, a conventionally well-known thing can be used without being restrict | limited in particular. The resin varnish can be obtained by adding a solvent such as cyclohexanone and stirring and mixing.

  For example, as a base material layer used, plastic films, such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyimide film, etc. are mentioned. Further, surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, etching treatment, mold release treatment and the like may be performed on the surface of the base material layer as necessary.

  The base material layer may have adhesiveness, and an adhesive layer may be provided on one side of the base material layer. The pressure-sensitive adhesive layer can be formed by applying and drying a resin varnish having an appropriate tack strength including a low molecular weight component (tackifier such as a terpene compound) and a high molecular weight component adjusted for Tg.

  Although there is no restriction | limiting in particular in the thickness of the film for sealing, 5-1000 micrometers is preferable for both a resin layer and a base material layer. If the thickness is less than 5 μm, the stress relaxation effect tends to be poor. If the thickness is more than 1000 μm, it is not economical, and the demand for miniaturization of the semiconductor device cannot be met.

  Moreover, it is preferable to use a protective film for the sealing film, and examples of the protective film include plastics such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, and polyimide film. A film etc. are mentioned. Further, surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, etching treatment, mold release treatment and the like may be performed as necessary. In addition, you may use the said base material layer as a protective film, and you may install a protective film in the single side | surface of the film for sealing, ie, the other side of a base material layer.

  The sealing film of the present invention has a melt viscosity in the B-stage state of 10 Pa · s or more and 10000 Pa · s or less in the range of 100 ° C. or more and 200 ° C. or less, such as flip chip or wafer level CSP. It is preferable for the protection of the protruding portion of the protruding electrode and the filling between the protrusions, and that the linear expansion coefficient after curing is 1 or more and 20 ppm or less, even when used for a package or wafer, the warp of the sealing film Is preferable in that it becomes smaller. The melt viscosity was measured by a parallel plate plastometer method. If the melt viscosity exceeds 10000 Pa · s, voids remain, poorly charged, etc., and connection reliability decreases. On the other hand, if the melt viscosity is less than 10 Pa · s, the fluidity is too high, the thickness of the sealing resin of the molded product varies, and the connection reliability is lowered.

  In addition, the sealing film of the present invention can be easily laminated to a wafer or the like if the tack strength at 25 to 120 ° C. is 50 gf or more as measured by a probe measurement with a diameter of either 5.1 mm or both. preferable. 80 gf is more preferable, and 100 gf or more is further preferable.

  As a method for using the sealing film, a method similar to that used for a conventional solid or liquid sealing material can be considered. For example, a sealing film with a base material layer (base material film) is laminated on a substrate on which a semiconductor chip or component is mounted using a hot plate press or a laminator, and then heated and cured. The material film) is peeled off or the base material layer (base material film) is peeled off, followed by heat curing. At this time, it is possible to stack the layers so that no gaps remain around the semiconductor chip. However, in the case of flip chip mounting for high-frequency applications, etc., it is also possible to laminate so as to leave a gap at the bottom of the semiconductor chip or component. FIG. 1 shows a cross section of a semiconductor device manufactured by the above method using the sealing film of the present invention.

  A method of laminating using a hot plate press, a laminator, etc., and heat-curing with a sealing film sandwiched so that the surfaces on which two substrates on which semiconductor chips and components are mounted are opposed may be taken. FIG. 2 shows a cross section of a semiconductor device manufactured by the above method using the sealing film of the present invention.

  Moreover, as shown in FIG. 3, it is also possible to laminate | stack the sealing film on the surface in which the circuit of a semiconductor chip is not formed.

  Also, as shown in FIG. 4, a sealing film with a base layer (base film) is laminated on a semiconductor chip on which bumps are formed using a hot plate press, and then the base layer (base film) is peeled off. Then, a method such as heat curing at a temperature of 140 to 170 ° C. for 1 to 5 hours can be taken, and a step such as surface polishing can be taken as necessary. In this case, it is necessary to appropriately set the temperature, pressure, and time for filling the unevenness. For example, in order to fill the 100 μm unevenness with the 130 μm sealing film of the present invention, the temperature 100 to 150 ° C., pressure 0.4 to 1 MPa, 1 to 10 s are preferable, and 4 to 6 s are more preferable. The sealing film may be laminated using a laminator or the like, and after heat curing, the base material layer (base material film) may be peeled off.

  Hereinafter, although the film for sealing of the present invention will be specifically described with reference to examples, the present invention is not limited thereto.

Bisphenol F type epoxy resin (epoxy equivalent 175, YD-8170 manufactured by Toto Kasei Co., Ltd.) 60 parts by weight as thermosetting component (epoxy resin), bisphenol A novolac resin (large) as thermosetting component (curing agent) 35 parts by weight of LF-2882 manufactured by Nippon Ink Chemical Co., Ltd., 500 parts by weight of silica filler (using TSS-6 manufactured by Tatsumori Co., Ltd.) as an inorganic filler, 2 parts by weight of carbon black as a colorant, high As molecular weight component, epoxy group-containing acrylic rubber ( weight average molecular weight 700,000, HTR-860P-3 manufactured by Teikoku Chemical Industry Co., Ltd.) 10 parts by weight, 1-cyanoethyl-2-phenylimidazole (Curesol 2PZ-CN) as curing accelerator 170) cyclohexanone as a solvent in a component consisting of 0.5 parts by weight It stirred mixed with parts by weight to obtain a resin varnish.

  The obtained resin varnish was coated on a base film with a release agent as a base material layer (Purex A31 manufactured by Teijin Limited), dried at 90 ° C., 10 minutes, 120 ° C., 20 minutes, and a thickness of 130 μm. A film for sealing was obtained. In this case, the volume fraction of the inorganic filler was 69%. In addition, the cross section of hardened | cured material was observed with SEM, the sea island structure was investigated, and it confirmed that an island component was a rubber phase.

(Comparative Example 1)
A sealing film was produced in the same manner as in Example 1 except that the amount of the filler was 250 parts by weight. In this case, the volume fraction of the inorganic filler was 54%.

(Comparative Example 2)
Bisphenol F type epoxy resin (epoxy equivalent 175, using YD-8170 manufactured by Tohto Kasei Co., Ltd.) 50 parts by weight as a thermosetting component (epoxy resin), bisphenol A novolak resin (large) as a thermosetting component (curing agent) Example 1 except that 25 parts by weight of LF-2882 made by Nippon Ink and 30 weights of epoxy group-containing acrylic rubber ( weight average molecular weight 700,000, HTR-860P-3 made by Teikoku Chemical Industry Co., Ltd.) were used. Similarly, a sealing film was produced. In addition, as a result of observing the cross section of hardened | cured material with SEM and investigating the sea-island structure, it confirmed that the rubber phase did not isolate | separate into an island shape but was a continuous phase.

(Fabrication of semiconductor devices)
The sealing film with the base material layer (base material film) produced in Example 1, Comparative Example 1 and Comparative Example 2 was applied to the semiconductor chip on which the bump was formed under the conditions of a temperature of 130 ° C., a pressure of 0.7 MPa, and 5 s. After laminating using a hot plate press, the base material layer (base material film) was peeled off and then heat-cured at 170 ° C. for 1 hour to produce a semiconductor device.

Various characteristics of the sealing film in the B stage state and C stage state and the characteristics of the semiconductor device were measured. In the measurement, the following method was used. The evaluation results are shown in Table 1.
(Measuring method)
(1) Elastic modulus (storage elastic modulus)
The storage elastic modulus of the sealing film heated and cured at 170 ° C. for 1 hour was measured using a dynamic viscoelasticity measuring device (DVE-V4, manufactured by Rheology) (sample size: length 20 mm, width 4 mm, film thickness). 80 μm, heating rate 5 ° C./min, tensile mode, 10 Hz, automatic static load).
(2) Tack strength The tack strength of the sealing film in the B-stage state is measured according to the method described in JISZ0237-1991 (probe diameter 5.1 mm, peeling speed 10 mm / s, It was measured at 80 ° C. with a contact load of 100 gf / cm ² and a contact time of 1 s.
(3) Chip peel strength (adhesive properties)
On a hot plate at 120 ° C., a chip (5 mm square) and a gold plating substrate (flexible substrate electrolytic gold plating with copper foil (Ni: 5 μm, Au: 0.3 μm)) are laminated on a sealing film, 130 ° C., Cured for 30 min + 170 ° C. for 1 h. The peel strength at 260 ° C. was measured for this sample.
(4) Linear expansion coefficient The linear expansion coefficient was determined by measuring the elongation of a sample at a heating rate of 5 ° C. per minute using a thermomechanical analyzer for a sealing film heated and cured at 170 ° C. for 1 hour. From the elongation at 150 ° C., the average coefficient of linear expansion was determined.
(5) Solder heat resistance The prepared semiconductor device was treated at 85 ° C. and humidity 85% for 48 hours, and then floated on a soldering iron at 265 ° C. for 1 minute to examine whether blistering or peeling occurred.
(6) Melt viscosity The melt viscosity of the film for sealing was a value measured and calculated by the following parallel plate plastometer method. That is, eight adhesive sheets are laminated to produce a film having a thickness of about 400 μm. This was punched into a circle having a diameter of 11.3 mm, and the sample was pressurized at 160 ° C. with a load of 2.5 kgf for 5 seconds. The melt viscosity was calculated using Equation 1 from the thickness of the sample before and after pressing.

（式中、Ｚ０は荷重を加える前の接着シートの厚さ、Ｚは荷重を加えた後の接着シートの厚さ、Ｖは接着シートの体積、Ｆは加えた荷重、tは荷重を加えた時間を表す。）

(In the formula, Z0 is the thickness of the adhesive sheet before the load is applied, Z is the thickness of the adhesive sheet after the load is applied, V is the volume of the adhesive sheet, F is the applied load, and t is the applied load. Represents time.)

  As shown in Table 1, the linear expansion coefficient of Comparative Example 1 in which the volume fraction of the inorganic filler is 54% is greatly different from the linear expansion coefficient (4 ppm) of the semiconductor chip. For this reason, warpage is likely to occur, and the heat resistance of the solder is reduced, such as chipping and chipping of the substrate (semiconductor device). Further, the linear expansion coefficient of Comparative Example 2 in which the high molecular weight component is excessive with respect to the thermosetting component (40 weight parts of the high molecular weight component with respect to 100 weight parts of the epoxy resin) is large, and the chip and the substrate (semiconductor device) are swollen. Reliability such as solder heat resistance of the semiconductor device decreased due to peeling. In contrast, the linear expansion coefficient of Example 1 was small, and the reliability of the semiconductor device was good.

Sectional drawing of the semiconductor device using the film for sealing of this invention. Sectional drawing of the semiconductor device using the film for sealing of this invention. Sectional drawing after sticking the film for sealing of this invention on a semiconductor chip. (A)-(e) is sectional drawing of the manufacturing process of the semiconductor device using the sealing film with the base material layer (base material film) of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Component 2 ... Wiring board 3 ... Film for sealing 4 ... Die bond material 5 ... Semiconductor chip 6 ... Wire 7 ... Connection bump 8 ... Space | gap 9 ... Solder ball 10 ... Semiconductor chip 11 with bump ... Base material layer (base material film) )
12 ... Hot plate

Claims (2)

A thermosetting component including an epoxy resin and a curing agent , a high molecular weight component which is an epoxy group-containing acrylic rubber having a weight average molecular weight of 100,000 or more, which is dissolved with the thermosetting component before curing and phase-separated into an island shape after curing; And an inorganic filler, wherein the inorganic filler is 60 to 80% by volume of the whole, and the high molecular weight component is contained in an amount of 5 to 30 parts by weight with respect to 100 parts by weight of the thermosetting component. A sealing film characterized by comprising: The sealing film according to claim 1, wherein the colorant is contained in an amount of 0.1 to 10% by weight.

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