JP4208083B2 - Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法 - Google Patents

Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法 Download PDF

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Publication number
JP4208083B2
JP4208083B2 JP2005179333A JP2005179333A JP4208083B2 JP 4208083 B2 JP4208083 B2 JP 4208083B2 JP 2005179333 A JP2005179333 A JP 2005179333A JP 2005179333 A JP2005179333 A JP 2005179333A JP 4208083 B2 JP4208083 B2 JP 4208083B2
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alloy
solder
film
layer
laminated
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Japanese (ja)
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JP2006110626A5 (enExample
JP2006110626A (ja
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元樹 小畑
功 水間
良彦 堀金
純二 土屋
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Citizen Finetech Miyota Co Ltd
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Citizen Finetech Miyota Co Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2005179333A 2004-09-16 2005-06-20 Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法 Expired - Lifetime JP4208083B2 (ja)

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JP2005179333A JP4208083B2 (ja) 2004-09-16 2005-06-20 Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法

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JP2004269300 2004-09-16
JP2005179333A JP4208083B2 (ja) 2004-09-16 2005-06-20 Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法

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JP2006110626A JP2006110626A (ja) 2006-04-27
JP2006110626A5 JP2006110626A5 (enExample) 2008-07-31
JP4208083B2 true JP4208083B2 (ja) 2009-01-14

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5188021B2 (ja) * 2005-12-16 2013-04-24 シチズンファインテックミヨタ株式会社 ハンダ膜及びその形成方法
EP2009971B1 (en) * 2006-04-17 2015-01-07 DOWA Electronics Materials Co., Ltd. Solder layer, substrate for device junction utilizing the same, and process for manufacturing the substrate
JP2010261094A (ja) * 2009-05-11 2010-11-18 Mitsubishi Materials Corp Ａｕ−Ｓｎ合金蒸着用粒状材およびその製造方法
JP6070927B2 (ja) * 2012-09-12 2017-02-01 三菱マテリアル株式会社 Ａｕ−Ｓｎ合金含有ペースト、Ａｕ−Ｓｎ合金薄膜及びその成膜方法
JP6927323B2 (ja) * 2017-12-01 2021-08-25 日本電信電話株式会社 平面光波路型光デバイス
CN112469207B (zh) * 2020-04-23 2024-06-21 苏州市杰煜电子有限公司 一种高质量锡膏印刷的高良率smt工艺
JP7532979B2 (ja) * 2020-07-22 2024-08-14 日本電気硝子株式会社 はんだ膜、光学デバイス用部品、及び光学デバイス
JP7508918B2 (ja) 2020-07-22 2024-07-02 日本電気硝子株式会社 はんだ膜及びその製造方法、光学デバイス用部品、並びに光学デバイス
JP7581684B2 (ja) * 2020-07-22 2024-11-13 日本電気硝子株式会社 はんだ膜、光学デバイス用部品、及び光学デバイス
JP7025074B1 (ja) * 2021-06-30 2022-02-24 株式会社半導体熱研究所 接合部材
US20230253359A1 (en) * 2022-02-04 2023-08-10 Wolfspeed, Inc. Semiconductor die including a metal stack
CN116673637A (zh) * 2023-03-06 2023-09-01 汕尾市栢林电子封装材料有限公司 一种用于生产超薄金锡预成型焊片的工艺

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