JP4194844B2 - 複数の光学活性領域を備える半導体レーザ - Google Patents
複数の光学活性領域を備える半導体レーザ Download PDFInfo
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- JP4194844B2 JP4194844B2 JP2002566808A JP2002566808A JP4194844B2 JP 4194844 B2 JP4194844 B2 JP 4194844B2 JP 2002566808 A JP2002566808 A JP 2002566808A JP 2002566808 A JP2002566808 A JP 2002566808A JP 4194844 B2 JP4194844 B2 JP 4194844B2
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 239000010410 layer Substances 0.000 claims description 48
- 238000002347 injection Methods 0.000 claims description 29
- 239000007924 injection Substances 0.000 claims description 29
- 230000003287 optical effect Effects 0.000 claims description 29
- 238000005253 cladding Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 239000012792 core layer Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 9
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical group [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 4
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 2
- 230000011218 segmentation Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
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- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001687 destabilization Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- -1 gallium ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000000103 photoluminescence spectrum Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/11—Comprising a photonic bandgap structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1057—Comprising an active region having a varying composition or cross-section in a specific direction varying composition along the optical axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1225—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers with a varying coupling constant along the optical axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1228—DFB lasers with a complex coupled grating, e.g. gain or loss coupling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2036—Broad area lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3413—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers comprising partially disordered wells or barriers
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Lasers (AREA)
Description
(1)第1の光クラッド層60を基板80の上に形成し、コア層55を第1の光クラッド層60の上に形成し、コア層55は量子井戸(QW)構造77を与えられ、第2の光クラッド層65をコア層55の上に形成する工程と、
(2)複数の受動領域245をコア層55内に形成する工程と、
を有する。
アルゴン雰囲気内でダイオード・スパッタリング装置の使用によって、シリカ(SiO2)などの誘電体層を、点構造欠陥を少なくとも誘電体層に隣接する材料の一部分にもたらすように、半導体レーザ装置10の表面255の少なくとも一部上に堆積することと、
プラズマ強化(エンハンスト)化学気相成長法(PECVD)のような非スパッタリング技術によって、更なる誘電体層を装置10の表面の少なくとも一部に随意に堆積することと、及び
装置10をアニールし、それによって、ガリウムイオン又は原子を装置材料から誘電体層へ転移させること、
を有する。
(イ)量子井戸混合(QWI)に対するフォトレジスト・パターニング
(ロ)シリカ・スパッタリング
(ハ)シリカはく離(リフトオフ)
(ニ)シリカの電子ビーム蒸発
(ホ)急速熱アニーリング
(ヘ)シリカ除去
(ト)p型接触金属化
(チ)薄膜化
(リ)n型接触金属化
活性及び受動の導波路の整列と、
単純な製造手順と、
活性/受動の境界面での無視できる反射率と、
を含む。
Claims (16)
- レーザの光軸に沿って実質的に直線的な関係で配置される、複数の光学活性領域と、複数の光学受動領域と、を備える半導体広範囲レーザ装置であって、
それぞれの光学活性領域は量子井戸構造を含み、互いに隣接する光学活性領域は、それぞれ量子井戸混合された光学受動領域によって互いに一定の間隔で隔てられ、
それぞれの光学受動領域は空間モードフィルタとして働く回折領域を形成し、より高次のモードの回折損失によって実質的単一横モードの出力を選択的に生じる半導体広範囲レーザ装置。 - それぞれの光学活性領域は対応する電流注入領域と機能的に関係することを特徴とする請求項1に記載の半導体レーザ装置。
- 前記電流注入領域は、前記装置の表面上で互いに実質的に直線的な関係で配置されることを特徴とする請求項2に記載の半導体レーザ装置。
- 前記電流注入領域は、隣接領域に対し実質的に間隔をあけられていることを特徴とする請求項2又は3に記載の半導体レーザ装置。
- 前記複数の電流注入領域の最初領域及び最終領域はそれぞれ前記装置の第1及び第2の端から離されていることを特徴とする請求項3又は4に記載の半導体レーザ装置。
- 前記光学活性領域は、量子井戸構造を含む活性なレーザ光放出材料を有する光学活性層内に設けられていることを特徴とする請求項2に記載の半導体レーザ装置。
- 前記量子井戸構造は電流注入領域に対応する前記光学活性層の領域内に維持され、一方、前記電流注入領域間の光学活性層の領域は量子井戸混合されていることを特徴とする請求項6に記載の半導体レーザ装置。
- 前記複数の電流注入領域の最初領域と前記装置の前記第1の端との間及び前記複数の電流注入領域の最終領域と前記装置の前記第2の端との間の前記光学活性層の領域は量子井戸混合されていることを特徴とする請求項6又は7に記載の半導体レーザ装置。
- 前記複数の電流注入領域に境を接する前記光学活性層の領域は量子井戸混合されていることを特徴とする請求項7又は8に記載の半導体レーザ装置。
- 前記光学活性及び光学受動領域は第1の光クラッド層と第2の光クラッド層との間の光ガイド層内に設けられることを特徴とする請求項1から9のいずれか一項に記載の半導体レーザ装置。
- 峰部が少なくとも前記第2の光クラッド層内に形成され、前記装置の前記第1の端から前記装置の前記第2の端へ縦方向に延びることを特徴とする請求項6に記載の半導体レーザ装置。
- 前記量子井戸混合された領域は前記光学活性領域よりも大きな禁制帯幅を有することを特徴とする請求項1から11のいずれか一項に記載の半導体レーザ装置。
- 前記装置は一体構造であり、前記装置は基板を含み、該基板上に前記第1の光クラッド層、コア層及び前記第2の光クラッド層がそれぞれ設けられることを特徴とする請求項1から12のいずれか一項に記載の半導体レーザ装置。
- 前記半導体レーザ装置はIII―V族の半導体材料系で製造されることを特徴とする請求項1から13のいずれか一項に記載の半導体レーザ装置。
- 前記III―V族の半導体材料系はガリウム-砒素(GaAs)、アルミニウム-ガリウム-砒素(AlGaAs)、アルミニウム-ガリウム-インジウム-燐(AlGaInP)及びインジウム-燐(InP)から選ばれることを特徴とする請求項14に記載の半導体レーザ装置。
- 前記第1及び第2の組成的に乱雑にされた材料は実質的にインジウム-ガリウム-砒素(InGaAs)を有することを特徴とする請求項14に記載の半導体レーザ装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0103838.9A GB0103838D0 (en) | 2001-02-16 | 2001-02-16 | Improvements in or relating to semiconductor lasers |
PCT/GB2002/000808 WO2002067392A1 (en) | 2001-02-16 | 2002-02-15 | Semiconductor laser comprising a plurality of optically active regions |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004523120A JP2004523120A (ja) | 2004-07-29 |
JP2004523120A5 JP2004523120A5 (ja) | 2005-12-22 |
JP4194844B2 true JP4194844B2 (ja) | 2008-12-10 |
Family
ID=9908889
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Application Number | Title | Priority Date | Filing Date |
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JP2002566808A Expired - Fee Related JP4194844B2 (ja) | 2001-02-16 | 2002-02-15 | 複数の光学活性領域を備える半導体レーザ |
Country Status (9)
Country | Link |
---|---|
US (1) | US20040120377A1 (ja) |
EP (1) | EP1362395B1 (ja) |
JP (1) | JP4194844B2 (ja) |
CN (1) | CN1262053C (ja) |
AT (1) | ATE293302T1 (ja) |
DE (1) | DE60203701T2 (ja) |
ES (1) | ES2241986T3 (ja) |
GB (1) | GB0103838D0 (ja) |
WO (1) | WO2002067392A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7865470B2 (en) * | 2004-09-09 | 2011-01-04 | Microsoft Corporation | Method, system, and apparatus for translating logical information representative of physical data in a data protection system |
US7496445B2 (en) * | 2005-04-27 | 2009-02-24 | Proxemics, Llc | Wayfinding |
US7567603B2 (en) * | 2006-09-20 | 2009-07-28 | Jds Uniphase Corporation | Semiconductor laser diode with advanced window structure |
DE102007051315B4 (de) | 2007-09-24 | 2018-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
US7723139B2 (en) * | 2007-10-01 | 2010-05-25 | Corning Incorporated | Quantum well intermixing |
US8396091B2 (en) | 2011-01-31 | 2013-03-12 | Technische Universitat Berlin | Device comprising a laser |
CN104540582A (zh) * | 2011-04-12 | 2015-04-22 | 康宁公司 | 包含量子阱混合(qwi)输出窗和波导区域的激光二极管与制造方法 |
CN103124046B (zh) * | 2013-01-18 | 2015-05-13 | 西安卓铭光电科技有限公司 | 一种半导体激光器 |
CN113574750A (zh) | 2018-12-31 | 2021-10-29 | 恩耐公司 | 用于差分电流注入的方法、系统、设备 |
TWI818580B (zh) * | 2022-06-09 | 2023-10-11 | 國立清華大學 | 半導體元件的製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0656906B2 (ja) * | 1984-09-28 | 1994-07-27 | 株式会社日立製作所 | 半導体レ−ザ装置 |
JPS61218190A (ja) * | 1985-03-25 | 1986-09-27 | Agency Of Ind Science & Technol | 半導体レ−ザ装置 |
US4751194A (en) * | 1986-06-27 | 1988-06-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Structures including quantum well wires and boxes |
JPS63263788A (ja) * | 1987-04-22 | 1988-10-31 | Mitsubishi Electric Corp | 半導体レ−ザ |
US4875216A (en) * | 1987-11-30 | 1989-10-17 | Xerox Corporation | Buried waveguide window regions for improved performance semiconductor lasers and other opto-electronic applications |
US5657157A (en) * | 1995-06-23 | 1997-08-12 | Sdl, Inc. | Semiconductor optical amplifying media with reduced self-focusing |
-
2001
- 2001-02-16 GB GBGB0103838.9A patent/GB0103838D0/en not_active Ceased
-
2002
- 2002-02-15 AT AT02700475T patent/ATE293302T1/de not_active IP Right Cessation
- 2002-02-15 EP EP02700475A patent/EP1362395B1/en not_active Expired - Lifetime
- 2002-02-15 ES ES02700475T patent/ES2241986T3/es not_active Expired - Lifetime
- 2002-02-15 WO PCT/GB2002/000808 patent/WO2002067392A1/en active IP Right Grant
- 2002-02-15 CN CNB02805119XA patent/CN1262053C/zh not_active Expired - Fee Related
- 2002-02-15 US US10/468,173 patent/US20040120377A1/en not_active Abandoned
- 2002-02-15 JP JP2002566808A patent/JP4194844B2/ja not_active Expired - Fee Related
- 2002-02-15 DE DE60203701T patent/DE60203701T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1262053C (zh) | 2006-06-28 |
JP2004523120A (ja) | 2004-07-29 |
GB0103838D0 (en) | 2001-04-04 |
DE60203701D1 (de) | 2005-05-19 |
CN1528036A (zh) | 2004-09-08 |
ES2241986T3 (es) | 2005-11-01 |
EP1362395A1 (en) | 2003-11-19 |
US20040120377A1 (en) | 2004-06-24 |
EP1362395B1 (en) | 2005-04-13 |
ATE293302T1 (de) | 2005-04-15 |
DE60203701T2 (de) | 2006-03-02 |
WO2002067392A1 (en) | 2002-08-29 |
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