JP4168880B2 - 液浸用溶液 - Google Patents

液浸用溶液 Download PDF

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Publication number
JP4168880B2
JP4168880B2 JP2003306015A JP2003306015A JP4168880B2 JP 4168880 B2 JP4168880 B2 JP 4168880B2 JP 2003306015 A JP2003306015 A JP 2003306015A JP 2003306015 A JP2003306015 A JP 2003306015A JP 4168880 B2 JP4168880 B2 JP 4168880B2
Authority
JP
Japan
Prior art keywords
immersion
wafer
immersion solution
solution
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003306015A
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English (en)
Japanese (ja)
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JP2005079238A5 (enExample
JP2005079238A (ja
Inventor
清晃 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2003306015A priority Critical patent/JP4168880B2/ja
Publication of JP2005079238A publication Critical patent/JP2005079238A/ja
Publication of JP2005079238A5 publication Critical patent/JP2005079238A5/ja
Application granted granted Critical
Publication of JP4168880B2 publication Critical patent/JP4168880B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003306015A 2003-08-29 2003-08-29 液浸用溶液 Expired - Fee Related JP4168880B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003306015A JP4168880B2 (ja) 2003-08-29 2003-08-29 液浸用溶液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003306015A JP4168880B2 (ja) 2003-08-29 2003-08-29 液浸用溶液

Publications (3)

Publication Number Publication Date
JP2005079238A JP2005079238A (ja) 2005-03-24
JP2005079238A5 JP2005079238A5 (enExample) 2005-12-15
JP4168880B2 true JP4168880B2 (ja) 2008-10-22

Family

ID=34409203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003306015A Expired - Fee Related JP4168880B2 (ja) 2003-08-29 2003-08-29 液浸用溶液

Country Status (1)

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JP (1) JP4168880B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE602004030481D1 (de) 2003-12-15 2011-01-20 Nippon Kogaku Kk Bühnensystem, belichtungsvorrichtung und belichtungsverfahren
JP4907596B2 (ja) * 2003-12-15 2012-03-28 カール・ツァイス・エスエムティー・ゲーエムベーハー 屈折性投影対物レンズ
TWI395069B (zh) * 2004-02-18 2013-05-01 尼康股份有限公司 投影光學系統、曝光裝置以及曝光方法
JP2006024692A (ja) 2004-07-07 2006-01-26 Toshiba Corp レジストパターン形成方法
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4616884B2 (ja) * 2005-04-26 2011-01-19 三井化学株式会社 液浸式露光用液体、液浸式露光用液体の精製方法および液浸式露光方法
JP4589809B2 (ja) * 2005-06-06 2010-12-01 パナソニック株式会社 バリア膜形成用材料及びそれを用いたパターン形成方法
EP1895571A4 (en) * 2005-06-21 2011-04-27 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD, MAINTENANCE METHOD AND COMPONENT MANUFACTURING METHOD
JP4804950B2 (ja) 2005-09-26 2011-11-02 東京応化工業株式会社 有機膜の液浸リソグラフィ溶解成分測定方法
US7903232B2 (en) * 2006-04-12 2011-03-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
JP2005079238A (ja) 2005-03-24

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