JP4167094B2 - レーザ加工方法 - Google Patents
レーザ加工方法 Download PDFInfo
- Publication number
- JP4167094B2 JP4167094B2 JP2003063838A JP2003063838A JP4167094B2 JP 4167094 B2 JP4167094 B2 JP 4167094B2 JP 2003063838 A JP2003063838 A JP 2003063838A JP 2003063838 A JP2003063838 A JP 2003063838A JP 4167094 B2 JP4167094 B2 JP 4167094B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- region
- laser
- cutting
- modified region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003063838A JP4167094B2 (ja) | 2003-03-10 | 2003-03-10 | レーザ加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003063838A JP4167094B2 (ja) | 2003-03-10 | 2003-03-10 | レーザ加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004268104A JP2004268104A (ja) | 2004-09-30 |
JP2004268104A5 JP2004268104A5 (ru) | 2006-04-27 |
JP4167094B2 true JP4167094B2 (ja) | 2008-10-15 |
Family
ID=33125319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003063838A Expired - Lifetime JP4167094B2 (ja) | 2003-03-10 | 2003-03-10 | レーザ加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4167094B2 (ru) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100906543B1 (ko) * | 2004-12-08 | 2009-07-07 | 가부시키가이샤 레이져 솔루션즈 | 피분할체에 있어서의 분할 기점 형성 방법, 피분할체의 분할 방법, 및 펄스 레이저광에 의한 피가공물의 가공방법 |
JP4555092B2 (ja) * | 2005-01-05 | 2010-09-29 | 株式会社ディスコ | レーザー加工装置 |
US8153511B2 (en) | 2005-05-30 | 2012-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
JP4845592B2 (ja) * | 2005-05-30 | 2011-12-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4835830B2 (ja) * | 2005-12-22 | 2011-12-14 | 株式会社東京精密 | エキスパンド方法、装置及びダイシング装置 |
US8341976B2 (en) | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
US8327666B2 (en) * | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
JP2013503105A (ja) | 2009-08-28 | 2013-01-31 | コーニング インコーポレイテッド | 化学強化ガラス基板からガラス品をレーザ割断するための方法 |
WO2014030521A1 (ja) * | 2012-08-21 | 2014-02-27 | 旭硝子株式会社 | 複合シートの切断方法、ガラスシートの切断方法、複合シートの切断片 |
US9676167B2 (en) * | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
JP6260601B2 (ja) * | 2015-10-02 | 2018-01-17 | 日亜化学工業株式会社 | 半導体素子の製造方法 |
JP6991475B2 (ja) * | 2017-05-24 | 2022-01-12 | 協立化学産業株式会社 | 加工対象物切断方法 |
JP7339509B2 (ja) | 2019-08-02 | 2023-09-06 | 日亜化学工業株式会社 | 発光素子の製造方法 |
KR20210038335A (ko) | 2019-09-30 | 2021-04-07 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 소자의 제조 방법 |
-
2003
- 2003-03-10 JP JP2003063838A patent/JP4167094B2/ja not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11219966B1 (en) | 2018-12-29 | 2022-01-11 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US11826846B2 (en) | 2018-12-29 | 2023-11-28 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US11901181B2 (en) | 2018-12-29 | 2024-02-13 | Wolfspeed, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11911842B2 (en) | 2018-12-29 | 2024-02-27 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11034056B2 (en) | 2019-05-17 | 2021-06-15 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11654596B2 (en) | 2019-05-17 | 2023-05-23 | Wolfspeed, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
Also Published As
Publication number | Publication date |
---|---|
JP2004268104A (ja) | 2004-09-30 |
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