JP4166402B2 - 遠紫外線露光用ポジ型フォトレジスト組成物 - Google Patents
遠紫外線露光用ポジ型フォトレジスト組成物 Download PDFInfo
- Publication number
- JP4166402B2 JP4166402B2 JP2000051687A JP2000051687A JP4166402B2 JP 4166402 B2 JP4166402 B2 JP 4166402B2 JP 2000051687 A JP2000051687 A JP 2000051687A JP 2000051687 A JP2000051687 A JP 2000051687A JP 4166402 B2 JP4166402 B2 JP 4166402B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- alkyl group
- carbon atoms
- substituent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 C*N(*N(C)C(N1)O)C1=O Chemical compound C*N(*N(C)C(N1)O)C1=O 0.000 description 4
- VSHDEZHNJCSDFY-UHFFFAOYSA-N C(CC1C2)C2C2C1C1CC2CC1 Chemical compound C(CC1C2)C2C2C1C1CC2CC1 VSHDEZHNJCSDFY-UHFFFAOYSA-N 0.000 description 1
- YINDMWCWVAXTMU-UHFFFAOYSA-N C1C(C2)C=C3CC2C1C3 Chemical compound C1C(C2)C=C3CC2C1C3 YINDMWCWVAXTMU-UHFFFAOYSA-N 0.000 description 1
- BYBGSCXPMGPLFP-UHFFFAOYSA-N C1C(C2)CC3C2C13 Chemical compound C1C(C2)CC3C2C13 BYBGSCXPMGPLFP-UHFFFAOYSA-N 0.000 description 1
- AIGOAHIDIXDVAT-UHFFFAOYSA-N C1C2C3C2C3C1 Chemical compound C1C2C3C2C3C1 AIGOAHIDIXDVAT-UHFFFAOYSA-N 0.000 description 1
- FVNIIPIYHHEXQA-UHFFFAOYSA-N COc(c1c2cccc1)ccc2-c1nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n1 Chemical compound COc(c1c2cccc1)ccc2-c1nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n1 FVNIIPIYHHEXQA-UHFFFAOYSA-N 0.000 description 1
- JWKRKQYJIZLNFB-ZZXKWVIFSA-N ClC(c1nc(C(Cl)(Cl)Cl)nc(/C=C/c(cc2)ccc2Cl)n1)(Cl)Cl Chemical compound ClC(c1nc(C(Cl)(Cl)Cl)nc(/C=C/c(cc2)ccc2Cl)n1)(Cl)Cl JWKRKQYJIZLNFB-ZZXKWVIFSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000051687A JP4166402B2 (ja) | 2000-02-28 | 2000-02-28 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| TW090103791A TW594408B (en) | 2000-02-28 | 2001-02-20 | Positive photoresist composition for far-ultraviolet light exposure |
| KR1020010010251A KR100737253B1 (ko) | 2000-02-28 | 2001-02-28 | 원자외선 노광용 포지티브 포토레지스트 조성물 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000051687A JP4166402B2 (ja) | 2000-02-28 | 2000-02-28 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001242626A JP2001242626A (ja) | 2001-09-07 |
| JP2001242626A5 JP2001242626A5 (enExample) | 2005-12-22 |
| JP4166402B2 true JP4166402B2 (ja) | 2008-10-15 |
Family
ID=18573308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000051687A Expired - Fee Related JP4166402B2 (ja) | 2000-02-28 | 2000-02-28 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4166402B2 (enExample) |
| KR (1) | KR100737253B1 (enExample) |
| TW (1) | TW594408B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4610280B2 (ja) * | 2004-09-29 | 2011-01-12 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100330574B1 (ko) * | 1997-12-29 | 2002-11-29 | 주식회사 하이닉스반도체 | 2층레지스트용실리콘계공중합체수지와그의제조방법및이수지를이용한레지스트패턴의형성방법 |
| JP3847454B2 (ja) * | 1998-03-20 | 2006-11-22 | 富士写真フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物及びパターン形成方法 |
| JP3844322B2 (ja) * | 1998-07-02 | 2006-11-08 | 富士写真フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
| US6291130B1 (en) * | 1998-07-27 | 2001-09-18 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
-
2000
- 2000-02-28 JP JP2000051687A patent/JP4166402B2/ja not_active Expired - Fee Related
-
2001
- 2001-02-20 TW TW090103791A patent/TW594408B/zh not_active IP Right Cessation
- 2001-02-28 KR KR1020010010251A patent/KR100737253B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW594408B (en) | 2004-06-21 |
| JP2001242626A (ja) | 2001-09-07 |
| KR20010088366A (ko) | 2001-09-26 |
| KR100737253B1 (ko) | 2007-07-09 |
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