JP4164904B2 - CURABLE RESIN COMPOSITION, SURFACE Roughening Treatment Method, AND ELECTRONIC DEVICE COMPONENT USING THE SAME - Google Patents
CURABLE RESIN COMPOSITION, SURFACE Roughening Treatment Method, AND ELECTRONIC DEVICE COMPONENT USING THE SAME Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は、優れた導体層密着強度が要求される電子機器部品全般に利用することが出来る樹脂組成物およびそれを用いた電子機器部品に関し、特に、ＰＷＢ（Ｐｒｉｎｔｅｄ Ｗｉｒｉｎｇ Ｂｏａｒｄ）、ＭＣＭ（Ｍｕｔｉ Ｃｈｉｐ Ｍｏｄｕｌｅ）などに代表される電子機器部品のうち、高密度化および特に高い導体層密着性が要求されるビルドアップ工法に好適に用いることができる技術に関するものである。
【０００２】
【従来の技術】
近年電子機器の軽薄短小化が進んでおり、これに搭載されるプリント基板などの電子機器部品においては高密度実装化が要求されている。この目的のために、最近、配線層と有機絶縁樹脂層を交互に積層することにより多層プリント基板を形成するビルドアップ工法が広く採用されてきている。
【０００３】
ビルドアップ工法においては、有機絶縁樹脂層上に無電解めっきを行った後電気めっきにより配線層を形成するため、無電解めっきを有機絶縁樹脂層上に密着性よく形成することが重要になる。しかし、有機絶縁樹脂層上に無電解めっきを密着性よく行うことは大変困難であり、これまでは導体層密着強度をあげるためにシリカなどのフィラーを樹脂に添加した樹脂硬化物に溶剤処理を行うことにより粗面化を行っていたが、従来の比較的粗面化の容易なエポキシ樹脂から、より高耐熱性で溶剤耐性の高い粗面化の困難な樹脂がプリント基板用絶縁樹脂として用いられてくるようになった。
このため、通常の過マンガン酸溶液処理等による粗面化工程の条件検討が困難になってきている。
【０００４】
【発明が解決しようとする課題】
本発明は、前記従来の技術が抱える問題点に鑑みてなされたものであり、その目的は、粗面化の困難な樹脂が用いられた電子機器部品および配線間隔の狭い高密度化された電子機器部品において、容易に、十分な導体層密着強度が得られる、信頼性の高い樹脂組成物、この樹脂組成物の表面粗化処理方法及びこの樹脂組成物と表面粗化処理方法を用いた電子機器部品を提供することである。
【０００５】
【課題を解決するための手段】
前記課題を解決するために本発明が提供する手段とは、まず、請求項１に記載の本発明は、加熱、紫外線または電子線で重合する樹脂と硬化剤又は触媒とフィラーからなる硬化された硬化樹脂組成物において、前記重合する樹脂が構造中に芳香環を有し、前記フィラーがプラズマ処理におけるエッチングレート（腐蝕速度）が芳香環を有する前記樹脂より速い芳香環を有しない樹脂の有機フィラーであり、硬化された硬化樹脂組成物の表面がプラズマ処理により粗面化されていることを特徴とする硬化樹脂組成物である。
【０００６】
芳香環を構造中に有する樹脂組成物に芳香環を構造中に含まない有機フィラーを混合した樹脂組成物は、プラズマ処理を行った際、エッチングレートが異なり芳香環を含まない有機フィラーの方がエッチングレート（腐蝕速度）が速いため、有機フィラーの部位が選択的にエッチングされ、粗面化される。
【０００７】
このエッチングされた部分が無電解めっきを行う際のアンカーとなり、導体層密着強度を大きく左右するものとなる。
また有機フィラーを用いた場合、無機フィラーを用いた場合に比べて誘電率を低く抑えることができ、高周波対応の基板にも好適である。
【０００８】
また、請求項２に記載の本発明は、前記構造中に芳香環を有する樹脂がビスフェノール型エポキシ、ノボラック型エポキシ、グリシジルエステル型エポキシ、グリシジルアミン型エポキシであり、硬化剤がアミン、酸無水物、フェノール樹脂であることを特徴とする請求項１に記載の硬化樹脂組成物である。
【００１３】
また、請求項３に記載の本発明は、前記有機フィラーが、架橋アクリル樹脂、ポリメチルメタクリル樹脂、フッ素樹脂、フッ化ビニリデン樹脂、ポリエチレン樹脂であることを特徴とする請求項１又は２に記載の硬化樹脂組成物である。
【００１４】
また、請求項４に記載の本発明は、前記有機フィラーの粒径が１μｍ以上１０μｍ以下であることを特徴とする請求項１〜３のいずれか１項に記載の硬化樹脂組成物である。その粒径が１０μｍより大きい場合には、請求項７のプラズマ処理における表面粗さが大きくなるため、配線密度が高い場合に障害となるばかりでなく有効なアンカー効果が得にくくなる。また、その粒径が１μｍより小さい場合にはアンカー効果を得るに充分な深さのアンカーが得られない。
【００１５】
また、請求項５に記載の本発明は、前記有機フィラーの添加量が硬化樹脂組成物に対し５〜５０重量部であることを特徴とする請求項１〜４のいずれか１項に記載の硬化樹脂組成物である。有機フィラーの添加量が５重量部より少ないと有効なアンカー効果が得られず、５０重量部より多いと樹脂が脆くなりめっき工程に耐えられなくなる。
【００１６】
また、請求項６に記載の本発明は、加熱、紫外線または電子線で重合する樹脂と硬化剤又は触媒とからなる硬化樹脂並びにフィラーからなる硬化樹脂組成物であって、前記樹脂が構造中に芳香環を有し、前記フィラーがプラズマ処理におけるエッチングレートが芳香環を有する樹脂より速い芳香環を有しない樹脂の有機フィラーである硬化樹脂組成物を硬化させた後、その表面をプラズマ処理を行うことを特徴とする硬化樹脂組成物の表面粗化処理方法である。
【００１７】
また、請求項７に記載の本発明は、前記プラズマ処理において、Ｈｅ、Ｎｅ、Ａｒ、Ｘｅ、Ｎ２、Ｏ２、Ｈ２、ＣＯ、ＣＯ２、ＮＯ２ 、Ｎ２Ｏ、ＳＯ２，ＮＨ３のうち少なくとも１種類以上含むガスを用いることを特徴とする請求項７に記載の硬化樹脂組成物の表面粗化処理方法である。
【００１８】
上記のガスの種類を選択することにより、各樹脂に適したエッチング状態が得られるようになる。更にこれらのガスを用いることにより樹脂表面の親水性が上がり、より強固な化学的な結合が得られるようになるため、安定した強い密着強度をもつめっきが形成されるようになる。
【００１９】
また、請求項８に記載の本発明は、請求項１〜５のいずれか１項に記載の硬化樹脂組成物を用いてセミアディティブ法、アディティブ法により配線層を形成することを特徴とする電子機器部品である。
【００２０】
本発明の主たる発明は、アディティブ法（Ａｄｄｉｔｉｖｅ Ｐｒｏｃｅｓｓ）に好適な硬化樹脂組成物とこの樹脂の表面粗化処理法であるので、アディティブ法に付いて詳細に記述しないが理解し易いように簡単に記述しておく。
図１は、アディティブ法による片面配線板の製造を説明する概略工程図を示す。基板（１）に硬化樹脂組成物（２）をコーティング、硬化させた後、この硬化樹脂組成物の表面を粗面化し、この粗面（４）上に回路設計に基づいて、めっきレジスト（３）を形成し導体パターン部（５）だけに、導電性材料をめっきによって析出固着させる方法である。この図では１層だけであるが同様の工程で多層の構成のものを作成できる。
【００２１】
また、請求項９に記載の本発明は、前記配線層を形成する電子機器部品として、プリント配線板、マルチチップモジュールである請求項９に記載の電子機器部品である。
【００２２】
【発明の実施の形態】
本発明においては、ベースとして用いる構造中に芳香環を含む樹脂としては、プリント基板用樹脂として広く用いられているエポキシ樹脂だけでなく、フェノール樹脂、粗面化の困難なイミド系樹脂等を広く用いることができ、本樹脂組成物に粒径１μｍ以上１０μｍ以下の有機フィラーを混合後、三本ローラーにて分散することにより調製を行う。
【００２３】
有機フィラーとしては芳香環を構造中に含まない樹脂で、例えば、架橋アクリル樹脂、ＰＭＭＡ、フッ素樹脂、フッ化ビニリデン樹脂、ポリエチレン樹脂などを用いるが、必ずしもこれらに限定するものではない。
【００２４】
本発明の化合物を、スピンコーター、浸漬、アプリケーター、バーコーター、スロットコーターなどを使用する塗布方法によりガラスエポキシ板、金属板、樹脂上などに塗布することで、ＰＷＢ、ＭＣＭ、層間絶縁材料として使用することができる。
【００２５】
【実施例】
＜実施例１＞
エポキシ系樹脂（商品名ＨＰ−７２００、大日本インキ化学工業（株）製）１００ｇと２−エチル−４−メチルイミダゾール２．０ｇと架橋ポリメタクリル酸メチルフィラー（商品名：テクポリマーＭＢＸ−５、積水化成品工業（株）製）１５．３ｇを三本ローラーにて混練後、１０ｐｓにエチルカルビトールアセテートにて調整しスピンコータにてビスマレイミド・トリアジン（ＢＴ）基板にコートした。これを１７５℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た後、東京応化（株）製プラズマアッシング装置にてＯ2 ＝１００ｓｃｃｍ、０．５Ｔｏｒｒ、３００Ｗの条件で１０分間プラズマ処理を行った。その後無電解銅めっき、電解銅めっきを順次施した。
ここで、ｓｃｃｍ（ｓｔａｎｄａｒｄ ｃｕｂｉｃ ｃｅｎｔｉｍｅｔｅｒ ｍｉｎｕｔｅ）は１分間にガスを供給する体積を示す。
【００２６】
＜実施例２＞
カルド樹脂であるＶ−２５９ＰＡ（新日鐵化学（株）製）１００ｇと架橋ポリメタクリル酸メチルフィラー（商品名：テクポリマーＭＢＸ−５、積水化成品工業（株）製）１５．０ｇを三本ローラーにて混練後、スピンコータにてＢＴ基板にコートした。プリベークを８０℃で１５分行った後、２００ｍＪ／ｃｍ２で露光、１８０℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た。これにＯ２＝１００ｓｃｃｍにて実施例１と同様にしてプラズマ処理を行い、その後無電解銅めっき、電解銅めっきを順次施した。
【００２７】
＜比較例１＞
カルド樹脂であるＶ−２５９ＰＡ（新日鐵化学（株）製）１００ｇとシリカフィラー（商品名：サイリシア５５０、富士シリシア化学（株）製）１５．０ｇを、実施例１と同様にして混練、スピンコータにて塗布後、プリベークを８０℃で１５分行った。その後２００ｍＪ／ｃｍ２で露光、１８０℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た。これを７０ｇ／Ｌの過マンガン酸溶液に７０℃で７分間浸漬することにより粗化を行った。その後無電解銅めっき、電解銅めっきを順次施した。
【００２８】
＜比較例２＞
カルド樹脂であるＶ−２５９ＰＡ（新日鐵化学（株）製）１００ｇと架橋ポリメタクリル酸メチルフィラー（商品名：テクポリマーＭＢＸ−５、積水化成品工業（株）製）６０．０ｇを三本ローラーにて混練後、スピンコータにてＢＴ基板にコートした。プリベークを８０℃で１５分行った後、２００ｍＪ／ｃｍ２で露光、１８０℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た。これにＯ２＝１００ｓｃｃｍにて実施例１と同様にしてプラズマ処理を行い、その後無電解銅めっき、電解銅めっきを順次施した。
【００２９】
＜比較例３＞
カルド樹脂であるＶ−２５９ＰＡ（新日鐵化学（株）製）１００ｇと架橋ポリメタクリル酸メチルフィラー（商品名：テクポリマーＭＢＸ−５、積水化成品工業（株）製）１．５ｇを三本ローラーにて混練後、スピンコータにてＢＴ基板にコートした。プリベークを８０℃で１５分行った後、２００ｍＪ／ｃｍ２で露光、１８０℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た。これにＯ２＝１００ｓｃｃｍにて実施例１と同様にしてプラズマ処理を行い、その後無電解銅めっき、電解銅めっきを順次施した。
【００３０】
＜比較例４＞
カルド樹脂であるＶ−２５９ＰＡ（新日鐵化学（株）製）１００ｇと架橋ポリスチレンフィラー（商品名：テクポリマーＳＢＸ−６、積水化成品工業（株）製）１５．０ｇを三本ローラーにて混練後、スピンコータにてＢＴ基板にコートした。プリベークを８０℃で１５分行った後、２００ｍＪ／ｃｍ２で露光、１８０℃で１時間ベークすることにより３０μｍ厚の硬化樹脂膜を得た。これにＯ２＝１００ｓｃｃｍにて実施例１と同様にしてプラズマ処理を行い、その後無電解銅めっき、電解銅めっきを順次施した。
【００３１】
以上の＜実施例１＞〜＜実施例２＞、および＜比較例１＞〜＜比較例４＞で得られためっきを施した樹脂硬化膜を試料として用いて、ＪＩＳ−Ｃ−６１８４に規定された方法に従って、めっきピール強度の測定を行った。その結果を表１に示す。
【００３２】
【表１】
【発明の効果】
以上のように、本発明の樹脂組成物および粗面化手段により優れた導体層密着強度を得ることができるため、電子機器部品へ広く使用することが可能である。特には、ＰＷＢ、ＭＣＭのビルドアップ工法を採用したものの層間絶縁性樹脂として好適である。
このように本発明によれば、容易に、且つ安定して、信頼性の高い導体層密着強度をもつ電子機器部品を提供することが出来る。
【図面の簡単な説明】
【図１】図１は、アディティブ法による片面配線板製造を説明する概略工程図。
【符号の説明】
１…基板 ２…硬化樹脂組成物
３…めっきレジスト ４…粗面
５…導体パターン部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin composition that can be used for all electronic device parts that require excellent conductor layer adhesion strength and electronic device parts using the same, and in particular, PWB (Printed Wiring Board), MCM (Muti Chip). The present invention relates to a technique that can be suitably used for a build-up method in which high density and particularly high conductor layer adhesion are required among electronic device parts typified by Module).
[0002]
[Prior art]
In recent years, electronic devices are becoming lighter, thinner, and smaller, and electronic device parts such as printed boards mounted thereon are required to have high-density mounting. For this purpose, recently, a build-up method for forming a multilayer printed board by alternately laminating wiring layers and organic insulating resin layers has been widely adopted.
[0003]
In the build-up method, since the wiring layer is formed by electroplating after performing electroless plating on the organic insulating resin layer, it is important to form the electroless plating on the organic insulating resin layer with good adhesion. However, it is very difficult to perform electroless plating on the organic insulating resin layer with good adhesion. So far, in order to increase the adhesion strength of the conductor layer, solvent treatment is applied to the cured resin obtained by adding a filler such as silica to the resin. Roughening was performed, but a resin with higher heat resistance and higher resistance to solvents, which is difficult to roughen, was used as an insulating resin for printed circuit boards, compared to the conventional relatively easy roughening epoxy resin. Came to be.
For this reason, it has become difficult to examine the conditions of the roughening step by a normal permanganic acid solution treatment or the like.
[0004]
[Problems to be solved by the invention]
The present invention has been made in view of the problems of the prior art, and the object thereof is an electronic device component using a resin whose surface is difficult to be roughened and a high-density electronic with a narrow wiring interval. Reliable resin composition capable of easily obtaining sufficient conductor layer adhesion strength in equipment parts, surface roughening treatment method of this resin composition, and electron using this resin composition and surface roughening treatment method It is to provide equipment parts.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the means provided by the present invention is as follows. First, the present invention according to
[0006]
Resin composition comprising a mixture of organic filler containing no aromatic ring in the structure in the resin composition having an aromatic ring in the structure, the time of performing the flop plasma treatment, towards the organic filler containing no aromatic ring is different etching rate However, since the etching rate (corrosion rate) is high, the portion of the organic filler is selectively etched and roughened.
[0007]
This etched portion serves as an anchor when performing electroless plating, and greatly affects the adhesion strength of the conductor layer.
In addition, when an organic filler is used, the dielectric constant can be suppressed lower than when an inorganic filler is used, which is suitable for a high-frequency compatible substrate.
[0008]
Further, in the present invention according to claim 2, the resin having an aromatic ring in the structure is bisphenol type epoxy, novolac type epoxy, glycidyl ester type epoxy, glycidyl amine type epoxy, and the curing agent is amine, acid anhydride. The cured resin composition according to
[0013]
Further, the invention of claim 3, wherein the organic filler is, crosslinked acrylic resin, polymethyl methacrylate resin, a fluorine resin, vinylidene fluoride resin, according to
[0014]
Moreover, this invention of Claim 4 is a cured resin composition of any one of Claims 1-3 whose particle size of the said organic filler is 1 micrometer or more and 10 micrometers or less. If the particle size is larger than 10 μm, the surface roughness in the plasma treatment of claim 7 becomes large, which not only becomes an obstacle when the wiring density is high, but also makes it difficult to obtain an effective anchor effect. Further, when the particle diameter is smaller than 1 μm, an anchor having a depth sufficient to obtain the anchor effect cannot be obtained.
[0015]
Moreover, this invention of Claim 5 is 5-50 weight part with respect to the cured resin composition, and the addition amount of the said organic filler is any one of Claims 1-4 characterized by the above-mentioned. It is a cured resin composition. If the addition amount of the organic filler is less than 5 parts by weight, an effective anchor effect cannot be obtained, and if it is more than 50 parts by weight, the resin becomes brittle and cannot withstand the plating process.
[0016]
Further, the present invention according to claim 6 is a cured resin composition comprising a cured resin comprising a resin that is polymerized by heating, ultraviolet rays or an electron beam, and a curing agent or a catalyst, and a filler, wherein the resin is in the structure. After curing the cured resin composition, which is an organic filler of a resin having an aromatic ring and the filler having a faster etching rate in the plasma treatment than the resin having an aromatic ring , the surface is subjected to plasma treatment This is a surface roughening treatment method for a cured resin composition.
[0017]
Further, in the present invention according to claim 7 , in the plasma treatment, He, Ne, Ar, Xe, N 2 , O 2 , H 2 , CO, CO 2 , NO 2 , N 2 O, SO 2 , NH The surface roughening treatment method for a cured resin composition according to claim 7, wherein a gas containing at least one of 3 is used.
[0018]
By selecting the type of gas, an etching state suitable for each resin can be obtained. Further, by using these gases, the hydrophilicity of the resin surface is increased and a stronger chemical bond can be obtained, so that a plating having a stable and strong adhesion strength is formed.
[0019]
Moreover, the present invention described in claim 8 is characterized in that a wiring layer is formed by a semi-additive method or an additive method using the cured resin composition according to any one of
[0020]
Since the main invention of the present invention is a cured resin composition suitable for the additive process and a surface roughening treatment method for this resin, the additive process will not be described in detail, but it will be easy to understand. Describe it.
FIG. 1 is a schematic process diagram illustrating the production of a single-sided wiring board by an additive method. After coating and curing the cured resin composition (2) on the substrate (1), the surface of the cured resin composition is roughened, and a plating resist (3) is formed on the rough surface (4) based on the circuit design. ) And the conductive material is deposited and fixed only on the conductor pattern portion (5) by plating. Although only one layer is shown in this figure, a multi-layer structure can be created by the same process.
[0021]
Further, the invention according to claim 9, as electronic components for forming the wiring layer, the printed wiring board, an electronic device component according to claim 9 which is a multi-chip module.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, as a resin containing an aromatic ring in the structure used as a base, not only an epoxy resin widely used as a resin for printed circuit boards, but also a phenol resin, an imide resin that is difficult to roughen, and the like are widely used. It can be used, and is prepared by mixing the resin composition with an organic filler having a particle size of 1 μm or more and 10 μm or less and then dispersing the mixture with a three-roller.
[0023]
As the organic filler, a resin that does not contain an aromatic ring in the structure, for example, a cross-linked acrylic resin, PMMA, fluororesin, vinylidene fluoride resin, polyethylene resin, or the like is used. However, the organic filler is not necessarily limited thereto.
[0024]
The compounds of the present invention can be used as PWB, MCM, and interlayer insulation materials by applying them onto glass epoxy plates, metal plates, resins, etc. by a coating method using a spin coater, dipping, applicator, bar coater, slot coater, etc. can do.
[0025]
【Example】
<Example 1>
Epoxy resin (trade name HP-7200, manufactured by Dainippon Ink & Chemicals, Inc.) 100 g, 2-ethyl-4-methylimidazole 2.0 g, and crosslinked polymethyl methacrylate filler (trade name: Techpolymer MBX-5, Sekisui Plastics Co., Ltd. (15.3 g) was kneaded with three rollers, adjusted to 10 ps with ethyl carbitol acetate, and coated on a bismaleimide-triazine (BT) substrate with a spin coater. This was baked at 175 ° C. for 1 hour to obtain a cured resin film having a thickness of 30 μm, and then plasma treatment for 10 minutes under the conditions of O 2 = 100 sccm, 0.5 Torr, 300 W using a plasma ashing apparatus manufactured by Tokyo Ohka Co., Ltd. Went. Thereafter, electroless copper plating and electrolytic copper plating were sequentially performed.
Here, sccm (standard cubic center minute) indicates a volume for supplying gas per minute.
[0026]
<Example 2>
Cardo resin and a V-259PA (manufactured by Nippon Steel Chemical Co., Ltd.) 100 g and crosslinked polymethyl methacrylate filler (trade name: Techpolymer MBX-5, manufactured by Sekisui Plastics Co.) three to 15.0g After kneading with a roller, the BT substrate was coated with a spin coater. After prebaking at 80 ° C. for 15 minutes, exposure was performed at 200 mJ / cm 2 and baking was performed at 180 ° C. for 1 hour to obtain a cured resin film having a thickness of 30 μm. This was subjected to plasma treatment in the same manner as in Example 1 at O 2 = 100 sccm, and then electroless copper plating and electrolytic copper plating were sequentially performed.
[0027]
<Comparative Example 1>
100 g of V-259PA (manufactured by Nippon Steel Chemical Co., Ltd.) which is a cardo resin and 15.0 g of silica filler (trade name: Cylicia 550, manufactured by Fuji Silysia Chemical Co., Ltd.) are kneaded in the same manner as in Example 1. After coating with a spin coater, pre-baking was performed at 80 ° C. for 15 minutes. Then, the cured resin film having a thickness of 30 μm was obtained by exposure at 200 mJ / cm 2 and baking at 180 ° C. for 1 hour. This was roughened by immersing it in a 70 g / L permanganate solution at 70 ° C. for 7 minutes. Thereafter, electroless copper plating and electrolytic copper plating were sequentially performed.
[0028]
<Comparative example 2>
Cardo resin and a V-259PA (Nippon Steel Chemical Co., Ltd.) 100 g and crosslinked polymethyl methacrylate filler (trade name: Techpolymer MBX-5, manufactured by Sekisui Plastics Co., Ltd.) three to 60.0g After kneading with a roller, the BT substrate was coated with a spin coater. After prebaking at 80 ° C. for 15 minutes, exposure was performed at 200 mJ / cm 2 and baking was performed at 180 ° C. for 1 hour to obtain a cured resin film having a thickness of 30 μm. This was subjected to plasma treatment in the same manner as in Example 1 at O 2 = 100 sccm, and then electroless copper plating and electrolytic copper plating were sequentially performed.
[0029]
<Comparative Example 3>
Three pieces of V-259PA (manufactured by Nippon Steel Chemical Co., Ltd.) 100 g and 1.5 g of a crosslinked polymethyl methacrylate filler (trade name: Techpolymer MBX-5, manufactured by Sekisui Plastics Co., Ltd.) as a cardo resin After kneading with a roller, the BT substrate was coated with a spin coater. After prebaking at 80 ° C. for 15 minutes, exposure was performed at 200 mJ / cm 2 and baking was performed at 180 ° C. for 1 hour to obtain a cured resin film having a thickness of 30 μm. This was subjected to plasma treatment in the same manner as in Example 1 at O 2 = 100 sccm, and then electroless copper plating and electrolytic copper plating were sequentially performed.
[0030]
<Comparative example 4>
Three-roller 100g V-259PA (manufactured by Nippon Steel Chemical Co., Ltd.) and 15.0g of a crosslinked polystyrene filler (trade name: Techpolymer SBX-6, manufactured by Sekisui Plastics Co., Ltd.), a cardo resin , are used. After kneading, the BT substrate was coated with a spin coater. After prebaking at 80 ° C. for 15 minutes, exposure was performed at 200 mJ / cm 2 and baking was performed at 180 ° C. for 1 hour to obtain a cured resin film having a thickness of 30 μm. This was subjected to plasma treatment in the same manner as in Example 1 at O 2 = 100 sccm, and then electroless copper plating and electrolytic copper plating were sequentially performed.
[0031]
Using the resin cured film plated in the above <Example 1> to <Example 2> and <Comparative Example 1> to <Comparative Example 4> as a sample, specified in JIS-C-6184. The plating peel strength was measured according to the method described above. The results are shown in Table 1.
[0032]
[Table 1]
【The invention's effect】
As described above, since excellent conductor layer adhesion strength can be obtained by the resin composition and the roughening means of the present invention, it can be widely used for electronic equipment parts. In particular, the PWB and MCM build-up methods are suitable as interlayer insulating resins.
As described above, according to the present invention, it is possible to provide an electronic device component having a highly reliable conductor layer adhesion strength easily and stably.
[Brief description of the drawings]
FIG. 1 is a schematic process diagram for explaining single-sided wiring board production by an additive method.
[Explanation of symbols]
DESCRIPTION OF
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22077998A JP4164904B2 (en) | 1998-08-04 | 1998-08-04 | CURABLE RESIN COMPOSITION, SURFACE Roughening Treatment Method, AND ELECTRONIC DEVICE COMPONENT USING THE SAME |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22077998A JP4164904B2 (en) | 1998-08-04 | 1998-08-04 | CURABLE RESIN COMPOSITION, SURFACE Roughening Treatment Method, AND ELECTRONIC DEVICE COMPONENT USING THE SAME |
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| Publication Number | Publication Date |
|---|---|
| JP2000053868A JP2000053868A (en) | 2000-02-22 |
| JP4164904B2 true JP4164904B2 (en) | 2008-10-15 |
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| JP22077998A Expired - Fee Related JP4164904B2 (en) | 1998-08-04 | 1998-08-04 | CURABLE RESIN COMPOSITION, SURFACE Roughening Treatment Method, AND ELECTRONIC DEVICE COMPONENT USING THE SAME |
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|---|---|---|---|---|
| JP4156913B2 (en) | 2002-12-04 | 2008-09-24 | 東京エレクトロン株式会社 | Processing method of workpiece |
| JP5092391B2 (en) * | 2006-12-22 | 2012-12-05 | 富士通株式会社 | Resin casing and manufacturing method thereof |
| JP5325399B2 (en) * | 2007-06-28 | 2013-10-23 | 東京応化工業株式会社 | Coating method |
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