JP4144886B2 - 回路基板保持治具 - Google Patents
回路基板保持治具 Download PDFInfo
- Publication number
- JP4144886B2 JP4144886B2 JP2005010561A JP2005010561A JP4144886B2 JP 4144886 B2 JP4144886 B2 JP 4144886B2 JP 2005010561 A JP2005010561 A JP 2005010561A JP 2005010561 A JP2005010561 A JP 2005010561A JP 4144886 B2 JP4144886 B2 JP 4144886B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- holding
- surface roughness
- fluororesin
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003746 surface roughness Effects 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 description 53
- 229920005989 resin Polymers 0.000 description 42
- 239000011347 resin Substances 0.000 description 42
- 239000010410 layer Substances 0.000 description 33
- 229910052731 fluorine Inorganic materials 0.000 description 24
- 239000011737 fluorine Substances 0.000 description 24
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 238000004132 cross linking Methods 0.000 description 14
- 239000000178 monomer Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229920005862 polyol Polymers 0.000 description 9
- 150000003077 polyols Chemical class 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000006071 cream Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- IRVXMVSXMSXNLD-UHFFFAOYSA-N fluoromethoxyethene Chemical compound FCOC=C IRVXMVSXMSXNLD-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005010561A JP4144886B2 (ja) | 2005-01-18 | 2005-01-18 | 回路基板保持治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005010561A JP4144886B2 (ja) | 2005-01-18 | 2005-01-18 | 回路基板保持治具 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006202843A JP2006202843A (ja) | 2006-08-03 |
| JP2006202843A5 JP2006202843A5 (enrdf_load_stackoverflow) | 2008-01-17 |
| JP4144886B2 true JP4144886B2 (ja) | 2008-09-03 |
Family
ID=36960594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005010561A Expired - Lifetime JP4144886B2 (ja) | 2005-01-18 | 2005-01-18 | 回路基板保持治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4144886B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5158932B2 (ja) * | 2007-07-05 | 2013-03-06 | 藤倉ゴム工業株式会社 | 基板搬送治具用粘着シートおよび基板搬送治具 |
| JP7731622B1 (ja) | 2025-01-25 | 2025-09-01 | 株式会社ユー・エム・アイ | 搬送具とそれを用いた搬送方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210998A (ja) * | 2000-01-21 | 2001-08-03 | Denso Corp | フレキシブル基板の実装方法とそれに使用する補強板 |
| JP3585904B2 (ja) * | 2002-11-01 | 2004-11-10 | 株式会社 大昌電子 | 保持搬送用治具 |
| JP3794693B2 (ja) * | 2003-02-07 | 2006-07-05 | 松下電器産業株式会社 | 基板保持具、基板保持具の製造方法、および、金型の製造方法 |
| JP2004363438A (ja) * | 2003-06-06 | 2004-12-24 | Umi:Kk | 回路基板保持治具 |
-
2005
- 2005-01-18 JP JP2005010561A patent/JP4144886B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006202843A (ja) | 2006-08-03 |
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