JP4134942B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP4134942B2 JP4134942B2 JP2004129587A JP2004129587A JP4134942B2 JP 4134942 B2 JP4134942 B2 JP 4134942B2 JP 2004129587 A JP2004129587 A JP 2004129587A JP 2004129587 A JP2004129587 A JP 2004129587A JP 4134942 B2 JP4134942 B2 JP 4134942B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- transparent plate
- optical module
- optical element
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Description
Cavity Surface Emitting Laser : VCSEL)である光素子32が、その発光領域に対応する電極パッド34に合うようにサブマウント39の上に形成された電極36に接合用金属33により実装されている。ここで、サブマウント39は、ガラス基板により屈折率分布を形成したマイクロレンズ38がアレイ化されている。電極34、36の接合により形成された空隙35には、そのまま又はレーザ光に対して吸収、散乱の少ない樹脂等を充填する。VCSEL32およびサブマウント39を、VCSEL32を光らせながらマイクロレンズ38を通して出力光をモニタすることで相互のアライメントを精度良く行うことを可能にしている。
前記光結合手段は、前記透明プレートよりも熱膨張係数の小さい材料とし、前記光結合手段の前記透明プレートとの接触面積を前記面型光素子の実装領域より大きくする光モジュール。
11、21 光結合系
12、22 面型光素子
13、23 バンプ(又は接合用金属)
14、16、24、26 電極
17、27 透明プレート
18、28 レンズ(又はマイクロレンズ)
Claims (3)
- 透明プレートの一面にひとつまたはアレイ状に配置された複数の面型光素子を実装し、前記透明プレートの前記面型光素子の実装面と反対面に前記面型光素子のひとつひとつに対して光軸結合をとることができる光結合手段を固着し、該光結合手段を介して前記面型光素子から又は該面型光素子へ光を入出力する光モジュールにおいて、
前記光結合手段は、ひとつまたは複数のレンズを備えたプレート状の部品であって、前記透明プレートとの接触面積が、少なくとも前記面型光素子の実装領域より大きくなるような大きさを有することを特徴とする光モジュール。 - 前記光結合手段は、レーザ光を透過する接着剤により前記透明プレートに固着されることを特徴とする請求項1に記載の光モジュール。
- 前記透明プレートへの前記光結合手段の固着は、塗布型ガラス、UV硬化樹脂、エポキシ系樹脂により行うことを特徴とする請求項2に記載の光モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004129587A JP4134942B2 (ja) | 2004-04-26 | 2004-04-26 | 光モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004129587A JP4134942B2 (ja) | 2004-04-26 | 2004-04-26 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005311236A JP2005311236A (ja) | 2005-11-04 |
JP4134942B2 true JP4134942B2 (ja) | 2008-08-20 |
Family
ID=35439615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004129587A Expired - Fee Related JP4134942B2 (ja) | 2004-04-26 | 2004-04-26 | 光モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4134942B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101430480B1 (ko) | 2008-05-08 | 2014-08-18 | 엘지전자 주식회사 | 웨이퍼 레벨 렌즈부 및 이를 이용한 발광 소자 패키지 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7526009B2 (en) * | 2005-05-07 | 2009-04-28 | Samsung Electronics Co., Ltd. | End-pumped vertical external cavity surface emitting laser |
US8952402B2 (en) * | 2011-08-26 | 2015-02-10 | Micron Technology, Inc. | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods |
JP2016092319A (ja) * | 2014-11-10 | 2016-05-23 | 株式会社リコー | 面発光型光源およびレーザー装置 |
-
2004
- 2004-04-26 JP JP2004129587A patent/JP4134942B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101430480B1 (ko) | 2008-05-08 | 2014-08-18 | 엘지전자 주식회사 | 웨이퍼 레벨 렌즈부 및 이를 이용한 발광 소자 패키지 |
Also Published As
Publication number | Publication date |
---|---|
JP2005311236A (ja) | 2005-11-04 |
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