JP4131498B2 - 半導体放射線検出器 - Google Patents
半導体放射線検出器 Download PDFInfo
- Publication number
- JP4131498B2 JP4131498B2 JP2003397978A JP2003397978A JP4131498B2 JP 4131498 B2 JP4131498 B2 JP 4131498B2 JP 2003397978 A JP2003397978 A JP 2003397978A JP 2003397978 A JP2003397978 A JP 2003397978A JP 4131498 B2 JP4131498 B2 JP 4131498B2
- Authority
- JP
- Japan
- Prior art keywords
- cdte
- growth layer
- type
- radiation detector
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims description 117
- 239000004065 semiconductor Substances 0.000 title claims description 96
- 229910004613 CdTe Inorganic materials 0.000 claims description 118
- 239000000758 substrate Substances 0.000 claims description 90
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 47
- 229910004611 CdZnTe Inorganic materials 0.000 claims description 44
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims description 27
- 229910052785 arsenic Inorganic materials 0.000 claims description 18
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 143
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 37
- 238000000034 method Methods 0.000 description 27
- 239000013078 crystal Substances 0.000 description 24
- 238000012986 modification Methods 0.000 description 24
- 230000004048 modification Effects 0.000 description 24
- 239000000969 carrier Substances 0.000 description 14
- 238000001514 detection method Methods 0.000 description 12
- 239000011247 coating layer Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000926 separation method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- -1 for example Chemical compound 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910018885 Pt—Au Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- CEKJAYFBQARQNG-UHFFFAOYSA-N cadmium zinc Chemical compound [Zn].[Cd] CEKJAYFBQARQNG-UHFFFAOYSA-N 0.000 description 1
- VQNPSCRXHSIJTH-UHFFFAOYSA-N cadmium(2+);carbanide Chemical compound [CH3-].[CH3-].[Cd+2] VQNPSCRXHSIJTH-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- ILXWFJOFKUNZJA-UHFFFAOYSA-N ethyltellanylethane Chemical compound CC[Te]CC ILXWFJOFKUNZJA-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- QTQRGDBFHFYIBH-UHFFFAOYSA-N tert-butylarsenic Chemical compound CC(C)(C)[As] QTQRGDBFHFYIBH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02469—Group 12/16 materials
- H01L21/0248—Tellurides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02562—Tellurides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
- H01L31/118—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation of the surface barrier or shallow PN junction detector type, e.g. surface barrier alpha-particle detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
- H01L31/1836—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe comprising a growth substrate not being an AIIBVI compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Light Receiving Elements (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003397978A JP4131498B2 (ja) | 2003-11-27 | 2003-11-27 | 半導体放射線検出器 |
US10/580,833 US7355185B2 (en) | 2003-11-27 | 2004-11-24 | Semiconductor radiation detector and process for producing the same |
EP04819480A EP1691422B1 (de) | 2003-11-27 | 2004-11-24 | Herstellungsverfahren eines Halbleiter-Strahlungsdetektors |
PCT/JP2004/017891 WO2005053038A1 (ja) | 2003-11-27 | 2004-11-24 | 半導体放射線検出器及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003397978A JP4131498B2 (ja) | 2003-11-27 | 2003-11-27 | 半導体放射線検出器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007276652A Division JP4107616B2 (ja) | 2007-10-24 | 2007-10-24 | 半導体放射線検出器の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005159156A JP2005159156A (ja) | 2005-06-16 |
JP4131498B2 true JP4131498B2 (ja) | 2008-08-13 |
Family
ID=34631554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003397978A Expired - Fee Related JP4131498B2 (ja) | 2003-11-27 | 2003-11-27 | 半導体放射線検出器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7355185B2 (de) |
EP (1) | EP1691422B1 (de) |
JP (1) | JP4131498B2 (de) |
WO (1) | WO2005053038A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2433648A (en) * | 2005-12-21 | 2007-06-27 | Durham Scient Crystals Ltd | Radiation detector formed by deposition of bulk semiconductor crystal layers |
JP5662001B2 (ja) * | 2005-12-21 | 2015-01-28 | クロメック リミテッド | 半導体デバイス及びその製造方法 |
JP4881071B2 (ja) | 2006-05-30 | 2012-02-22 | 株式会社日立製作所 | 放射線検出器、及びこれを搭載した放射線撮像装置 |
GB0712618D0 (en) * | 2007-06-29 | 2007-08-08 | Durham Scient Crystals Ltd | Semiconductor device structure and method of manufacture thereof |
EP2028509A1 (de) * | 2007-08-09 | 2009-02-25 | European Organisation for Nuclear Research CERN | Strahlungsüberwachungsvorrichtung |
US8237126B2 (en) | 2007-08-17 | 2012-08-07 | Csem Centre Suisse D'electronique Et De Mictrotechnique Sa | X-ray imaging device and method for the manufacturing thereof |
US8742522B2 (en) | 2012-04-10 | 2014-06-03 | Ev Products, Inc. | Method of making a semiconductor radiation detector |
US9530902B2 (en) * | 2012-06-20 | 2016-12-27 | Oxford Instruments Analytical Oy | Two-dimensional guard structure and a radiation detector with the same |
KR20170097748A (ko) | 2014-12-19 | 2017-08-28 | 쥐-레이 스위츨란드 에스에이 | 모놀리식 cmos 통합된 픽셀 검출기와, 다양한 적용예를 포함하는 입자 검출 및 이미지화를 위한 시스템 및 방법 |
EP3345220B1 (de) | 2015-08-31 | 2022-03-30 | G-Ray Switzerland SA | Photonenzählender 3d-computertomograph mit monolithischen cmos-integrierten pixeldetektoren |
AU2018225659B2 (en) | 2017-02-24 | 2023-02-02 | First Solar, Inc. | Doped photovoltaic semiconductor layers and methods of making |
CN114447146B (zh) * | 2021-12-27 | 2023-05-26 | 江苏赛诺格兰医疗科技有限公司 | 一种sipm探测器的返修方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6070774A (ja) * | 1983-09-27 | 1985-04-22 | Yokogawa Hokushin Electric Corp | 放射線検出器 |
US5306386A (en) * | 1993-04-06 | 1994-04-26 | Hughes Aircraft Company | Arsenic passivation for epitaxial deposition of ternary chalcogenide semiconductor films onto silicon substrates |
US5382542A (en) * | 1993-07-26 | 1995-01-17 | Hughes Aircraft Company | Method of growth of II-VI materials on silicon using As passivation |
US5742089A (en) * | 1995-06-07 | 1998-04-21 | Hughes Electronics | Growth of low dislocation density HGCDTE detector structures |
US5646426A (en) * | 1995-12-12 | 1997-07-08 | Santa Barbara Research Center | Contact metal diffusion barrier for semiconductor devices |
US5838053A (en) * | 1996-09-19 | 1998-11-17 | Raytheon Ti Systems, Inc. | Method of forming a cadmium telluride/silicon structure |
DE19723677A1 (de) * | 1997-06-05 | 1998-12-10 | Siemens Ag | Optoelektronisches Halbleiterbauelement |
-
2003
- 2003-11-27 JP JP2003397978A patent/JP4131498B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-24 WO PCT/JP2004/017891 patent/WO2005053038A1/ja active Application Filing
- 2004-11-24 EP EP04819480A patent/EP1691422B1/de not_active Expired - Fee Related
- 2004-11-24 US US10/580,833 patent/US7355185B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1691422A1 (de) | 2006-08-16 |
US7355185B2 (en) | 2008-04-08 |
JP2005159156A (ja) | 2005-06-16 |
US20070090292A1 (en) | 2007-04-26 |
WO2005053038A1 (ja) | 2005-06-09 |
EP1691422A4 (de) | 2008-12-24 |
EP1691422B1 (de) | 2011-07-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4131498B2 (ja) | 半導体放射線検出器 | |
JP4086875B2 (ja) | 赤外線センサic、赤外線センサ及びその製造方法 | |
US10686090B2 (en) | Wafer bonded solar cells and fabrication methods | |
JPWO2018012076A1 (ja) | 電磁波検出器及び電磁波検出器アレイ | |
US20110079729A1 (en) | Megavoltage imaging with a photoconductor based sensor | |
JP2007081225A (ja) | 赤外線センサ、および、その製造方法 | |
US20070176200A1 (en) | Wide range radiation detector and manufacturing method | |
JP4107616B2 (ja) | 半導体放射線検出器の製造方法 | |
Reine | HgCdTe photodiodes for IR detection: a review | |
JPH0766981B2 (ja) | 赤外線センサ | |
US7589348B2 (en) | Thermal tunneling gap diode with integrated spacers and vacuum seal | |
JP2018013473A (ja) | 材料移動方法を用いる非解放型サーモパイル赤外線センサ | |
JPS63182870A (ja) | 積層型CdTe放射線検出素子 | |
JP6068954B2 (ja) | フォトダイオードアレイ | |
JP2021168332A (ja) | 光センサ、及びこれを用いた撮像装置 | |
US20200006591A1 (en) | Conductive isolation between phototransistors | |
JPS6167968A (ja) | GaAs太陽電池素子 | |
US20110203647A1 (en) | Methods to Improve Efficiency of a Solar Cell | |
JP2890441B2 (ja) | 半導体装置 | |
JP4138853B2 (ja) | 赤外線センサic | |
JP7123282B1 (ja) | 電磁波検出器および電磁波検出器アレイ | |
JP4200213B2 (ja) | 広域エネルギーレンジ放射線検出器 | |
Arai | Silicon-on-insulator monolithic pixel technology for radiation image sensors | |
JP2021077804A (ja) | 赤外線検出器 | |
JP2012242111A (ja) | 放射線検出器の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060926 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070619 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070723 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070904 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071024 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071023 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20071126 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20071228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080416 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080521 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110606 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4131498 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110606 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120606 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120606 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130606 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |