JP4122159B2 - ビルドアップ基板の製造方法 - Google Patents
ビルドアップ基板の製造方法 Download PDFInfo
- Publication number
- JP4122159B2 JP4122159B2 JP2002017616A JP2002017616A JP4122159B2 JP 4122159 B2 JP4122159 B2 JP 4122159B2 JP 2002017616 A JP2002017616 A JP 2002017616A JP 2002017616 A JP2002017616 A JP 2002017616A JP 4122159 B2 JP4122159 B2 JP 4122159B2
- Authority
- JP
- Japan
- Prior art keywords
- via hole
- conductor foil
- wiring pattern
- plating
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000004020 conductor Substances 0.000 claims description 35
- 239000011888 foil Substances 0.000 claims description 34
- 239000012212 insulator Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- 239000010419 fine particle Substances 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 44
- 239000011889 copper foil Substances 0.000 description 34
- 238000007747 plating Methods 0.000 description 29
- 239000000758 substrate Substances 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000005553 drilling Methods 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002017616A JP4122159B2 (ja) | 2002-01-25 | 2002-01-25 | ビルドアップ基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002017616A JP4122159B2 (ja) | 2002-01-25 | 2002-01-25 | ビルドアップ基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003218533A JP2003218533A (ja) | 2003-07-31 |
| JP2003218533A5 JP2003218533A5 (enExample) | 2005-08-18 |
| JP4122159B2 true JP4122159B2 (ja) | 2008-07-23 |
Family
ID=27653243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002017616A Expired - Fee Related JP4122159B2 (ja) | 2002-01-25 | 2002-01-25 | ビルドアップ基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4122159B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6963414B2 (ja) * | 2017-05-29 | 2021-11-10 | 株式会社図研 | 設計支援装置、設計支援方法およびプログラム |
-
2002
- 2002-01-25 JP JP2002017616A patent/JP4122159B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003218533A (ja) | 2003-07-31 |
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