JP4113272B2 - 給配ノズルを洗浄液で洗浄する方法 - Google Patents

給配ノズルを洗浄液で洗浄する方法 Download PDF

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Publication number
JP4113272B2
JP4113272B2 JP35161097A JP35161097A JP4113272B2 JP 4113272 B2 JP4113272 B2 JP 4113272B2 JP 35161097 A JP35161097 A JP 35161097A JP 35161097 A JP35161097 A JP 35161097A JP 4113272 B2 JP4113272 B2 JP 4113272B2
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JP
Japan
Prior art keywords
nozzle
cleaning liquid
sog
cleaning
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP35161097A
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English (en)
Japanese (ja)
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JPH10209136A5 (cg-RX-API-DMAC7.html
JPH10209136A (ja
Inventor
ディー．ポアグ フランク
エル．ガルディ リチャード
イー．パラディス ダグラス
シー．ハシム ポール
Original Assignee
テキサス インスツルメンツ インコーポレイテツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テキサス インスツルメンツ インコーポレイテツド filed Critical テキサス インスツルメンツ インコーポレイテツド
Publication of JPH10209136A publication Critical patent/JPH10209136A/ja
Publication of JPH10209136A5 publication Critical patent/JPH10209136A5/ja
Application granted granted Critical
Publication of JP4113272B2 publication Critical patent/JP4113272B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP35161097A 1996-12-19 1997-12-19 給配ノズルを洗浄液で洗浄する方法 Expired - Fee Related JP4113272B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3386396P 1996-12-19 1996-12-19
US033863 1996-12-19

Publications (3)

Publication Number Publication Date
JPH10209136A JPH10209136A (ja) 1998-08-07
JPH10209136A5 JPH10209136A5 (cg-RX-API-DMAC7.html) 2005-07-28
JP4113272B2 true JP4113272B2 (ja) 2008-07-09

Family

ID=21872893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35161097A Expired - Fee Related JP4113272B2 (ja) 1996-12-19 1997-12-19 給配ノズルを洗浄液で洗浄する方法

Country Status (4)

Country Link
US (1) US5958517A (cg-RX-API-DMAC7.html)
EP (1) EP0849774B1 (cg-RX-API-DMAC7.html)
JP (1) JP4113272B2 (cg-RX-API-DMAC7.html)
DE (1) DE69731934T2 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5902399A (en) * 1995-07-27 1999-05-11 Micron Technology, Inc. Method and apparatus for improved coating of a semiconductor wafer
KR100271759B1 (ko) * 1997-07-25 2000-12-01 윤종용 포토레지스트코팅장치및방법
US6248168B1 (en) 1997-12-15 2001-06-19 Tokyo Electron Limited Spin coating apparatus including aging unit and solvent replacement unit
KR100314806B1 (ko) 1998-10-29 2002-02-19 박종섭 스핀온글래스막형성방법
US20080041488A1 (en) * 2006-08-18 2008-02-21 Integrated Designs L.P. Fluid dispensing system for semiconductor manufacturing processes with self-cleaning dispense valve
WO2009123126A1 (ja) * 2008-03-31 2009-10-08 昭和電工株式会社 両面塗布装置および塗液の両面塗布方法、並びエッジリンス装置およびエッジリンス方法
JP5965729B2 (ja) * 2012-05-31 2016-08-10 東京エレクトロン株式会社 ノズル洗浄装置、ノズル洗浄方法および基板処理装置
JP6077437B2 (ja) * 2013-05-31 2017-02-08 東京エレクトロン株式会社 基板処理装置およびノズル洗浄方法
EP3318334A1 (en) 2016-11-04 2018-05-09 Solar-Semi GmbH Cleaning device for rinsing dispensing nozzles
JP7236318B2 (ja) * 2019-04-26 2023-03-09 東京エレクトロン株式会社 液処理装置、及び液処理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1622090A (en) * 1921-05-28 1927-03-22 American Moistening Co Self-cleaning nozzle
US4607588A (en) * 1984-04-04 1986-08-26 Stants Richard O Parts coating apparatus and method
US4886012A (en) * 1987-06-30 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Spin coating apparatus
US4823820A (en) * 1987-07-28 1989-04-25 Safety-Kleen Corp. Solvent vapor collection and evacuation system
JP2504549B2 (ja) * 1988-12-15 1996-06-05 パイオニア株式会社 流体供給処理装置
JP2665404B2 (ja) * 1991-02-18 1997-10-22 シャープ株式会社 半導体装置の製造方法
US5360995A (en) * 1993-09-14 1994-11-01 Texas Instruments Incorporated Buffered capped interconnect for a semiconductor device
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US5849084A (en) * 1996-06-21 1998-12-15 Micron Technology, Inc. Spin coating dispense arm assembly

Also Published As

Publication number Publication date
EP0849774A3 (en) 2002-10-30
EP0849774B1 (en) 2004-12-15
EP0849774A2 (en) 1998-06-24
JPH10209136A (ja) 1998-08-07
DE69731934D1 (de) 2005-01-20
US5958517A (en) 1999-09-28
DE69731934T2 (de) 2005-11-17

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