JP4113272B2 - 給配ノズルを洗浄液で洗浄する方法 - Google Patents
給配ノズルを洗浄液で洗浄する方法 Download PDFInfo
- Publication number
- JP4113272B2 JP4113272B2 JP35161097A JP35161097A JP4113272B2 JP 4113272 B2 JP4113272 B2 JP 4113272B2 JP 35161097 A JP35161097 A JP 35161097A JP 35161097 A JP35161097 A JP 35161097A JP 4113272 B2 JP4113272 B2 JP 4113272B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- cleaning liquid
- sog
- cleaning
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H10P72/0448—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3386396P | 1996-12-19 | 1996-12-19 | |
| US033863 | 1996-12-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10209136A JPH10209136A (ja) | 1998-08-07 |
| JPH10209136A5 JPH10209136A5 (OSRAM) | 2005-07-28 |
| JP4113272B2 true JP4113272B2 (ja) | 2008-07-09 |
Family
ID=21872893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35161097A Expired - Fee Related JP4113272B2 (ja) | 1996-12-19 | 1997-12-19 | 給配ノズルを洗浄液で洗浄する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5958517A (OSRAM) |
| EP (1) | EP0849774B1 (OSRAM) |
| JP (1) | JP4113272B2 (OSRAM) |
| DE (1) | DE69731934T2 (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5902399A (en) * | 1995-07-27 | 1999-05-11 | Micron Technology, Inc. | Method and apparatus for improved coating of a semiconductor wafer |
| KR100271759B1 (ko) * | 1997-07-25 | 2000-12-01 | 윤종용 | 포토레지스트코팅장치및방법 |
| US6248168B1 (en) | 1997-12-15 | 2001-06-19 | Tokyo Electron Limited | Spin coating apparatus including aging unit and solvent replacement unit |
| KR100314806B1 (ko) | 1998-10-29 | 2002-02-19 | 박종섭 | 스핀온글래스막형성방법 |
| US20080041488A1 (en) * | 2006-08-18 | 2008-02-21 | Integrated Designs L.P. | Fluid dispensing system for semiconductor manufacturing processes with self-cleaning dispense valve |
| CN101981619A (zh) * | 2008-03-31 | 2011-02-23 | 昭和电工株式会社 | 双面涂布装置和涂液的双面涂布方法、以及边缘清洗装置和边缘清洗方法 |
| JP5965729B2 (ja) * | 2012-05-31 | 2016-08-10 | 東京エレクトロン株式会社 | ノズル洗浄装置、ノズル洗浄方法および基板処理装置 |
| JP6077437B2 (ja) * | 2013-05-31 | 2017-02-08 | 東京エレクトロン株式会社 | 基板処理装置およびノズル洗浄方法 |
| EP3318334A1 (en) | 2016-11-04 | 2018-05-09 | Solar-Semi GmbH | Cleaning device for rinsing dispensing nozzles |
| JP7236318B2 (ja) * | 2019-04-26 | 2023-03-09 | 東京エレクトロン株式会社 | 液処理装置、及び液処理方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1622090A (en) * | 1921-05-28 | 1927-03-22 | American Moistening Co | Self-cleaning nozzle |
| US4607588A (en) * | 1984-04-04 | 1986-08-26 | Stants Richard O | Parts coating apparatus and method |
| US4886012A (en) * | 1987-06-30 | 1989-12-12 | Mitsubishi Denki Kabushiki Kaisha | Spin coating apparatus |
| US4823820A (en) * | 1987-07-28 | 1989-04-25 | Safety-Kleen Corp. | Solvent vapor collection and evacuation system |
| JP2504549B2 (ja) * | 1988-12-15 | 1996-06-05 | パイオニア株式会社 | 流体供給処理装置 |
| JP2665404B2 (ja) * | 1991-02-18 | 1997-10-22 | シャープ株式会社 | 半導体装置の製造方法 |
| US5360995A (en) * | 1993-09-14 | 1994-11-01 | Texas Instruments Incorporated | Buffered capped interconnect for a semiconductor device |
| US5565034A (en) * | 1993-10-29 | 1996-10-15 | Tokyo Electron Limited | Apparatus for processing substrates having a film formed on a surface of the substrate |
| US5779799A (en) * | 1996-06-21 | 1998-07-14 | Micron Technology, Inc. | Substrate coating apparatus |
| US5849084A (en) * | 1996-06-21 | 1998-12-15 | Micron Technology, Inc. | Spin coating dispense arm assembly |
-
1997
- 1997-12-19 JP JP35161097A patent/JP4113272B2/ja not_active Expired - Fee Related
- 1997-12-19 EP EP97310340A patent/EP0849774B1/en not_active Expired - Lifetime
- 1997-12-19 DE DE69731934T patent/DE69731934T2/de not_active Expired - Lifetime
- 1997-12-19 US US08/994,910 patent/US5958517A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0849774B1 (en) | 2004-12-15 |
| DE69731934D1 (de) | 2005-01-20 |
| EP0849774A3 (en) | 2002-10-30 |
| DE69731934T2 (de) | 2005-11-17 |
| EP0849774A2 (en) | 1998-06-24 |
| JPH10209136A (ja) | 1998-08-07 |
| US5958517A (en) | 1999-09-28 |
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