JP4105622B2 - 研摩装置及び被研材の厚さ判定方法 - Google Patents
研摩装置及び被研材の厚さ判定方法 Download PDFInfo
- Publication number
- JP4105622B2 JP4105622B2 JP2003375100A JP2003375100A JP4105622B2 JP 4105622 B2 JP4105622 B2 JP 4105622B2 JP 2003375100 A JP2003375100 A JP 2003375100A JP 2003375100 A JP2003375100 A JP 2003375100A JP 4105622 B2 JP4105622 B2 JP 4105622B2
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- JP
- Japan
- Prior art keywords
- polishing
- thickness
- polished
- polishing member
- detection value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 257
- 239000000463 material Substances 0.000 title claims description 96
- 238000000034 method Methods 0.000 title claims description 20
- 238000001514 detection method Methods 0.000 claims description 85
- 230000033001 locomotion Effects 0.000 claims description 35
- 230000008859 change Effects 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 5
- 239000011435 rock Substances 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 241000501754 Astronotus ocellatus Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims (7)
- 第1研摩部材と、前記第1研摩部材に対して被研材を介して対向する第2研摩部材と、前記第1研摩部材と前記第2研摩部材とを相対的に回転若しくは揺動させる駆動手段とを有する、前記被研材を研摩するための研摩装置であって、
前記被研材の厚さの変化に伴って変化する装置構造部分の位置を測定し、前記被研材の厚さの目標値に対応する設定値以下の厚さに対応する厚さ検出値が得られているか否かを検出可能な検出手段と、研摩作用に伴う微振動に基づいて前記設定値以下の厚さに対応する前記厚さ検出値が継続的に得られている継続時間を求める計時手段とを有し、前記継続時間若しくはその積算値が既定の設定時間を越えた場合に研摩動作を停止するように構成されていることを特徴とする研摩装置。 - 前記設定時間は、前記微振動による前記厚さ検出値の振動周期以下の時間であることを特徴とする請求項1に記載の研摩装置。
- 前記駆動手段は、前記第1研摩部材を揺動させる揺動駆動手段と、前記第2研摩部材をその軸線周りに回転させる回転駆動手段とを有することを特徴とする請求項1又は2に記載の研摩装置。
- 前記第1研摩部材に固定された第1研摩軸を有し、前記揺動駆動手段は、前記第1研摩軸を所定の揺動中心の周りに回動させるように構成されていることを特徴とする請求項3に記載の研摩装置。
- 前記第1研摩部材に角度自在に連結された第1研摩軸を有し、該第1研摩軸の揺動動作によって前記第1研摩部材を前記被研材若しくは前記第2研摩部材に沿った曲面上で摺動させるように構成され、
前記検出手段は、前記第1研摩部材の前記曲面上の摺動に伴う研摩方向への往復動作の死点位置を測定することにより前記設定値以下の厚さに対応する前記厚さ検出値が得られているか否かを検出するように構成されていることを特徴とする請求項3に記載の研摩装置。 - 第1研摩部材と、前記第1研摩部材に対して被研材を介して対向する第2研摩部材と、前記第1研摩部材と前記第2研摩部材とを相対的に回転若しくは揺動させる駆動手段とを有する、前記被研材を研摩するための研摩装置における前記被研材の厚さ判定方法であって、
前記被研材の厚さの変化に伴って変化する装置構造部分の位置を測定し、前記被研材の厚さの目標値に対応する設定値以下の厚さに対応する厚さ検出値が得られているか否かを検出し、研摩作用に伴う微振動に基づいて前記設定値以下の厚さに対応する前記厚さ検出値が継続的に得られている継続時間を求め、前記継続時間若しくはその積算値が既定の設定時間を越えるか否かを判定することを特徴とする被研材の厚さ判定方法。 - 前記設定時間は、前記微振動による前記厚さ検出値の振動周期以下であることを特徴とする請求項6に記載の被研材の厚さ判定方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003375100A JP4105622B2 (ja) | 2003-11-05 | 2003-11-05 | 研摩装置及び被研材の厚さ判定方法 |
TW093131936A TWI275444B (en) | 2003-11-05 | 2004-10-21 | Polishing device and method for judgment of the thickness of polished member |
CNB2004100905842A CN100366385C (zh) | 2003-11-05 | 2004-11-04 | 研磨装置及被研材的厚度判定方法 |
KR1020040089170A KR100705848B1 (ko) | 2003-11-05 | 2004-11-04 | 연마장치 및 피연재의 두께판정방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003375100A JP4105622B2 (ja) | 2003-11-05 | 2003-11-05 | 研摩装置及び被研材の厚さ判定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005138199A JP2005138199A (ja) | 2005-06-02 |
JP4105622B2 true JP4105622B2 (ja) | 2008-06-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003375100A Expired - Lifetime JP4105622B2 (ja) | 2003-11-05 | 2003-11-05 | 研摩装置及び被研材の厚さ判定方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4105622B2 (ja) |
KR (1) | KR100705848B1 (ja) |
CN (1) | CN100366385C (ja) |
TW (1) | TWI275444B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120289127A1 (en) * | 2010-01-29 | 2012-11-15 | Kojima Engineering Co., Ltd. | Lens spherical surface grinding method using dish-shaped grindstone |
CN103097079B (zh) * | 2010-03-25 | 2016-01-06 | 埃西勒国际通用光学公司 | 用于控制光学元件的抛光处理的方法 |
CN109483394B (zh) * | 2018-09-13 | 2023-12-12 | 西安航晨机电科技股份有限公司 | 半球谐振子超精密球面加工装置及加工方法 |
CN109352431B (zh) * | 2018-09-17 | 2020-04-21 | 上海理工大学 | 超声振动磨削去除量在位检测装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1076464A (ja) * | 1996-08-30 | 1998-03-24 | Canon Inc | 研磨方法及びそれを用いた研磨装置 |
JP3558794B2 (ja) * | 1996-09-27 | 2004-08-25 | 株式会社荏原製作所 | 半導体ウエハーの研磨方法及び研磨装置 |
JP3292243B2 (ja) * | 1999-06-30 | 2002-06-17 | 日本電気株式会社 | 研磨終点検出装置 |
TW430594B (en) * | 1999-12-29 | 2001-04-21 | United Microelectronics Corp | Method for controlling polishing time in CMP process |
JP2001252868A (ja) * | 2000-03-09 | 2001-09-18 | Olympus Optical Co Ltd | レンズの加工方法および加工装置 |
-
2003
- 2003-11-05 JP JP2003375100A patent/JP4105622B2/ja not_active Expired - Lifetime
-
2004
- 2004-10-21 TW TW093131936A patent/TWI275444B/zh not_active IP Right Cessation
- 2004-11-04 KR KR1020040089170A patent/KR100705848B1/ko not_active IP Right Cessation
- 2004-11-04 CN CNB2004100905842A patent/CN100366385C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI275444B (en) | 2007-03-11 |
KR20050043661A (ko) | 2005-05-11 |
CN1613606A (zh) | 2005-05-11 |
KR100705848B1 (ko) | 2007-04-10 |
JP2005138199A (ja) | 2005-06-02 |
CN100366385C (zh) | 2008-02-06 |
TW200528231A (en) | 2005-09-01 |
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